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TW200632146A - Immersion process for electroplating applications - Google Patents

Immersion process for electroplating applications

Info

Publication number
TW200632146A
TW200632146A TW095103955A TW95103955A TW200632146A TW 200632146 A TW200632146 A TW 200632146A TW 095103955 A TW095103955 A TW 095103955A TW 95103955 A TW95103955 A TW 95103955A TW 200632146 A TW200632146 A TW 200632146A
Authority
TW
Taiwan
Prior art keywords
substrate
immersion process
waveform
electroplating applications
plating solution
Prior art date
Application number
TW095103955A
Other languages
Chinese (zh)
Inventor
Hooman Hafezi
Joseph Behnke
Aron Rosenfeld
Timothy R Webb
Joseph Yahalom
Christopher Reiss Mcguirk
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW200632146A publication Critical patent/TW200632146A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Electrochemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

A method for immersing a substrate into a plating solution. In one embodiment, the method includes applying a first waveform to the substrate as the substrate is being immersed into the plating solution, stopping the application of the first waveform to the substrate as soon as the substrate is fully immersed inside the plating solution, and applying a second waveform to the substrate prior to the substrate being situated into a plating position.
TW095103955A 2005-02-07 2006-02-06 Immersion process for electroplating applications TW200632146A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/052,443 US20060175201A1 (en) 2005-02-07 2005-02-07 Immersion process for electroplating applications

Publications (1)

Publication Number Publication Date
TW200632146A true TW200632146A (en) 2006-09-16

Family

ID=36778835

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095103955A TW200632146A (en) 2005-02-07 2006-02-06 Immersion process for electroplating applications

Country Status (3)

Country Link
US (1) US20060175201A1 (en)
TW (1) TW200632146A (en)
WO (1) WO2006086169A2 (en)

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JP6113154B2 (en) * 2011-06-24 2017-04-12 エーシーエム リサーチ （シャンハイ） インコーポレーテッド Method and apparatus for forming a uniform metal film on a substrate
US10508358B2 (en) * 2012-09-17 2019-12-17 Government Of The United States Of America, As Represented By The Secretary Of Commerce Process for forming a transition zone terminated superconformal filling
US11579344B2 (en) 2012-09-17 2023-02-14 Government Of The United States Of America, As Represented By The Secretary Of Commerce Metallic grating
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US12012667B2 (en) 2018-04-09 2024-06-18 Lam Research Corporation Copper electrofill on non-copper liner layers
US11814743B2 (en) * 2020-06-15 2023-11-14 Taiwan Semiconductor Manufacturing Company, Ltd. Plating membrane

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Also Published As

Publication number Publication date
WO2006086169A3 (en) 2007-11-15
US20060175201A1 (en) 2006-08-10
WO2006086169A2 (en) 2006-08-17

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