TW200639259A - Lead-free soldering alloy composition resistant to vibration fatigue - Google Patents
Lead-free soldering alloy composition resistant to vibration fatigueInfo
- Publication number
- TW200639259A TW200639259A TW094115221A TW94115221A TW200639259A TW 200639259 A TW200639259 A TW 200639259A TW 094115221 A TW094115221 A TW 094115221A TW 94115221 A TW94115221 A TW 94115221A TW 200639259 A TW200639259 A TW 200639259A
- Authority
- TW
- Taiwan
- Prior art keywords
- lead
- soldering
- composition
- vibration fatigue
- alloy composition
- Prior art date
Links
- 238000005476 soldering Methods 0.000 title abstract 5
- 239000000203 mixture Substances 0.000 title abstract 4
- 239000000956 alloy Substances 0.000 title 1
- 229910045601 alloy Inorganic materials 0.000 title 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 abstract 2
- 150000001875 compounds Chemical class 0.000 abstract 2
- 229910052802 copper Inorganic materials 0.000 abstract 2
- 239000010949 copper Substances 0.000 abstract 2
- 229910052733 gallium Inorganic materials 0.000 abstract 2
- 229910052761 rare earth metal Inorganic materials 0.000 abstract 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 239000004332 silver Substances 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Conductive Materials (AREA)
Abstract
A lead-free soldering composition is disclosed. It consists of 0.01 wt% to 4.0 wt% silver, 1.0 wt% to 1.7 wt% copper, 0.01 wt% to 1.0 wt% rare earth elements, 0.01 wt% to 1.0 wt% gallium and the balance of tin to form 100 wt% of the composition. A proper amount of copper in the composition may increase vibration fatigue resistance of the soldering compound while the addition of the rare earth elements and gallium may reduce roughness of the solidified surface structure of the micro sized solder ball. In this way, soldering spot formed from the soldering compound of this invention used for electronic hardwares will gives better adhesion strength and reliability.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW94115221A TWI271437B (en) | 2005-05-11 | 2005-05-11 | Lead-free soldering alloy composition resistant to vibration fatigue |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW94115221A TWI271437B (en) | 2005-05-11 | 2005-05-11 | Lead-free soldering alloy composition resistant to vibration fatigue |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200639259A true TW200639259A (en) | 2006-11-16 |
| TWI271437B TWI271437B (en) | 2007-01-21 |
Family
ID=38435177
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW94115221A TWI271437B (en) | 2005-05-11 | 2005-05-11 | Lead-free soldering alloy composition resistant to vibration fatigue |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI271437B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI460046B (en) * | 2012-11-12 | 2014-11-11 | Accurus Scient Co Ltd | High strength silver-free lead-free solder |
-
2005
- 2005-05-11 TW TW94115221A patent/TWI271437B/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TWI271437B (en) | 2007-01-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |