TW200635992A - Thermally conductive compositions and methods of making thereof - Google Patents
Thermally conductive compositions and methods of making thereofInfo
- Publication number
- TW200635992A TW200635992A TW094110521A TW94110521A TW200635992A TW 200635992 A TW200635992 A TW 200635992A TW 094110521 A TW094110521 A TW 094110521A TW 94110521 A TW94110521 A TW 94110521A TW 200635992 A TW200635992 A TW 200635992A
- Authority
- TW
- Taiwan
- Prior art keywords
- composition
- making
- liquid metal
- methods
- thermally conductive
- Prior art date
Links
Classifications
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- H—ELECTRICITY
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- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
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| CN104031600B (zh) * | 2013-03-04 | 2016-03-23 | 中国科学院理化技术研究所 | 一种绝缘的导热金属胶及其制造方法 |
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| US10431522B2 (en) | 2013-08-12 | 2019-10-01 | Samsung Electronics Co., Ltd. | Thermal interface material layer and package-on-package device including the same |
| CN105453255A (zh) * | 2013-08-12 | 2016-03-30 | 三星电子株式会社 | 热界面材料层及包括热界面材料层的层叠封装件器件 |
| TWI558969B (zh) * | 2014-01-07 | 2016-11-21 | 恩特日安 | 傳熱結構及其製造方法 |
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| TWI613843B (zh) * | 2015-07-17 | 2018-02-01 | 神戶製鋼所股份有限公司 | 散熱基板、具有散熱基板的裝置及散熱基板的製造方法 |
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| CN107513377A (zh) * | 2017-08-11 | 2017-12-26 | 深圳市大材液态金属科技有限公司 | 高导热低流动性液态金属 |
| CN114561110A (zh) * | 2022-03-26 | 2022-05-31 | 常州大学 | 用于制备硅橡胶复合材料的硅包覆液态金属纳米填料 |
| CN114525117A (zh) * | 2022-03-31 | 2022-05-24 | 四川大学 | 一种高导热液态金属/氮化硼复合材料及其制备方法 |
| CN114525117B (zh) * | 2022-03-31 | 2023-02-28 | 四川大学 | 一种高导热液态金属/氮化硼复合材料及其制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1754235A2 (en) | 2007-02-21 |
| US20050228097A1 (en) | 2005-10-13 |
| WO2005096320A3 (en) | 2006-04-06 |
| WO2005096320A2 (en) | 2005-10-13 |
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