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TW200604217A - Radiation-sensitive resin composition, spacer, and method of forming the same - Google Patents

Radiation-sensitive resin composition, spacer, and method of forming the same

Info

Publication number
TW200604217A
TW200604217A TW094105668A TW94105668A TW200604217A TW 200604217 A TW200604217 A TW 200604217A TW 094105668 A TW094105668 A TW 094105668A TW 94105668 A TW94105668 A TW 94105668A TW 200604217 A TW200604217 A TW 200604217A
Authority
TW
Taiwan
Prior art keywords
radiation
resin composition
sensitive resin
spacer
forming
Prior art date
Application number
TW094105668A
Other languages
Chinese (zh)
Other versions
TWI365196B (en
Inventor
Toru Kajita
Daigo Ichinohe
Hiroshi Shiho
Original Assignee
Jsr Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsr Corp filed Critical Jsr Corp
Publication of TW200604217A publication Critical patent/TW200604217A/en
Application granted granted Critical
Publication of TWI365196B publication Critical patent/TWI365196B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/32—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals
    • C08F220/325—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals containing glycidyl radical, e.g. glycidyl (meth)acrylate
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Nonlinear Science (AREA)
  • Optics & Photonics (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Materials For Photolithography (AREA)
  • Liquid Crystal (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Macromonomer-Based Addition Polymer (AREA)

Abstract

A radiation-sensitive resin composition which has high sensitivity and high resolution, can readily form a patterned thin film excellent in various performances including pattern shape, compression strength, rubbing resistance, and adhesion to transparent substrates, and is inhibited from emitting sublimates upon burning; a spacer formed from the composition; and a method of forming the spacer. The radiation-sensitive resin composition is characterized by comprising (A) a polymer which has carboxy and epoxy groups and in which the ratio of the weight-average molecular weight (Mw) in terms of polystyrene to the number-average molecular weight (Mn) in terms of polystyrene both measured by gel permeation chromatography, (Mw/Mn), is 1.7 or lower, (B) a polymerizable unsaturated compound, and (C) a radiation-sensitive polymerization initiator.
TW094105668A 2004-05-06 2005-02-24 Radiation-sensitive resin composition, spacer, and method of forming the same TW200604217A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004137257 2004-05-06

Publications (2)

Publication Number Publication Date
TW200604217A true TW200604217A (en) 2006-02-01
TWI365196B TWI365196B (en) 2012-06-01

Family

ID=35320360

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094105668A TW200604217A (en) 2004-05-06 2005-02-24 Radiation-sensitive resin composition, spacer, and method of forming the same

Country Status (5)

Country Link
JP (1) JP4650638B2 (en)
KR (1) KR101084384B1 (en)
CN (1) CN1950751A (en)
TW (1) TW200604217A (en)
WO (1) WO2005109100A1 (en)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4923496B2 (en) * 2005-02-18 2012-04-25 Ｊｓｒ株式会社 Radiation sensitive resin composition for color filter and color filter
KR101250733B1 (en) * 2005-03-15 2013-04-03 제이에스알 가부시끼가이샤 Radiation Sensitive Resin Composition, Protrusion and Spacer Made Therefrom, and Liquid Crystal Display Device Comprising Them
JP4705426B2 (en) * 2005-07-14 2011-06-22 互応化学工業株式会社 Alkali development type photosensitive resist ink composition for printed wiring board production, cured product thereof and printed wiring board
JP4895034B2 (en) * 2006-05-24 2012-03-14 Ｊｓｒ株式会社 Radiation-sensitive resin composition, spacer and method for forming the same
JP4748321B2 (en) * 2007-01-18 2011-08-17 Ｊｓｒ株式会社 Radiation sensitive resin composition and spacer for liquid crystal display element
JP5234715B2 (en) * 2007-03-07 2013-07-10 凸版印刷株式会社 Photosensitive resin composition for photospacer, substrate for liquid crystal display device using the same, and liquid crystal display device
TWI501027B (en) * 2008-11-18 2015-09-21 Sumitomo Chemical Co Photosensitive resin composition and display device
JP5505066B2 (en) * 2010-04-28 2014-05-28 Ｊｓｒ株式会社 Radiation-sensitive resin composition, interlayer insulating film of display element, protective film and spacer, and method for forming them
JP5765049B2 (en) * 2010-05-27 2015-08-19 Jsr株式会社 Radiation-sensitive resin composition for forming cured film, method for producing radiation-sensitive resin composition for forming cured film, cured film, method for forming cured film, and display element
JPWO2012067107A1 (en) * 2010-11-17 2014-05-12 日立化成株式会社 Photosensitive resin composition, photosensitive element, resist pattern forming method and printed wiring board manufacturing method
JP5834630B2 (en) * 2011-02-04 2015-12-24 日立化成株式会社 Resin composition, photosensitive element, resist pattern forming method and printed wiring board manufacturing method
JP5853588B2 (en) * 2011-10-26 2016-02-09 日立化成株式会社 Photosensitive resin composition, photosensitive element, resist pattern forming method and printed wiring board manufacturing method
JP6098063B2 (en) * 2012-08-01 2017-03-22 日立化成株式会社 Resin composition, photosensitive element, resist pattern forming method and printed wiring board manufacturing method
JP6079277B2 (en) * 2013-02-04 2017-02-15 日本ゼオン株式会社 Radiation sensitive resin composition and electronic component
CN103336390B (en) * 2013-06-21 2015-09-09 合肥京东方光电科技有限公司 Chock insulator matter and preparation method thereof, substrate and display device
KR102028477B1 (en) 2013-07-19 2019-10-04 동우 화인켐 주식회사 Photosensitive resin composition for transparent pixel
KR102093759B1 (en) 2013-07-19 2020-03-26 동우 화인켐 주식회사 Photosensitive resin composition for transparent pixel
KR102069199B1 (en) 2013-09-05 2020-02-11 동우 화인켐 주식회사 Photosensitive resin composition for transparent pixel
KR102218948B1 (en) 2014-09-23 2021-02-23 동우 화인켐 주식회사 Black photosensitive resin composition, and black matrix and column spacer for liquid crystal display manufactured thereby

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11133600A (en) * 1997-10-30 1999-05-21 Jsr Corp Radiation-sensitive resin composition for display panel spacer
JP2000081701A (en) * 1998-09-03 2000-03-21 Jsr Corp Radiation-sensitive resin composition for color filter protective film
JP4269115B2 (en) 1999-05-10 2009-05-27 Ｊｓｒ株式会社 Radiation sensitive resin composition, interlayer insulating film and spacer
JP2001261761A (en) * 2000-03-22 2001-09-26 Jsr Corp Radiation-sensitive resin composition and spacer for display panel
JP2003041224A (en) * 2001-07-31 2003-02-13 Kanegafuchi Chem Ind Co Ltd Adhesive composition
JP3734436B2 (en) * 2001-09-19 2006-01-11 奇美実業股▲分▼有限公司 Photosensitive resin composition for liquid crystal display spacers
JP3967947B2 (en) * 2002-03-29 2007-08-29 富士フイルム株式会社 Dye-containing negative curable composition, color filter and method for producing the same

Also Published As

Publication number Publication date
CN1950751A (en) 2007-04-18
KR101084384B1 (en) 2011-11-18
WO2005109100A1 (en) 2005-11-17
TWI365196B (en) 2012-06-01
JPWO2005109100A1 (en) 2008-03-21
JP4650638B2 (en) 2011-03-16
KR20070007895A (en) 2007-01-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees