SU562399A1 - Solderless Flux Soldering - Google Patents

Description

This invention relates to soldering. Known solders for non-effusion soldering containing copper, bismuth, lead, indium, cadmium, gallium. The icy point of the known solders is that they do not provide sufficient corrosion resistance of the solder joint. The purpose of the invention is to increase the corrosion resistance of the solder joint. This is achieved by the fact that the solder additionally contains tin at the following with respect to the components, weight,%: copper 45-65; bismuth 14.1-22.2; lead 7.0-11.0; tin 3.9-6.1; indium 7.0-11.0; cadmium, 2; gallium 1.0-1.5. In order for the solder to have the required qualities, a certain sequence is needed in its preparation. First, an alloy of bismuth, tin, cadmium, and gallium is prepared, having a melting point of 39.7-40.4 ° C, which in the melt state is mixed with copper powder in a vibrating mixer for 8-12 seconds in the following ratio Research institutes, wt.%: Copper 45-65, alloy - the rest. After mixing the powder and copper powder, a ready solder of the pasty consistency is obtained, which is maintained for 1.5-2 hours. To test the mechanical properties of the solder, samples were made with a diameter of 3 mm and a length of 25 mm. After hardening of the specimens on a tensile machine, they are tested for shear strength (l W). The mechanical strength data for different compositions are given in the table. As SPECIFIED from the table, solders containing 55–6O% copper have the best mechanical properties, and the solidification takes place at a temperature below 100 ° C. For testing the corrosion resistance, samples connected to boiling gallium and high solids containing and samples connected by npeonaraehUjiM solder. The destruction of the first occurs in 15-4 minutes, the second - in 8-10 hours.

The temperature of operation of products from adyuminyoshkhplavov opredopa ea-s-shmieratu): oi yla yno-i and the main material. The temperature of the solidification solder was determined by heating the spades with copper brazets solder. At a sample speed of 8 degrees / juice and a thinning voltage of 0.2 1 / mm, the temperature of the rasin is 740 1.

  Thus, the use of the supposed solder makes it possible to reduce the soldering temperature of products from aluminum and its alloys to 421-100 С, significantly increasing

Content of components in solder

the corrosion resistance of a steam foot seam preserving the well-being of tolny michaichnoy strength,

Irina can also apply for DRU1-IH MaTepiuinOB, ishrtse) stainless steel and ceramics (bond strength 1.5 kg / mm), porous 6epiuuiHH and stainless steel (1.2-1.7 kg / mm), copper (2.5-3.5 kg / mm).

Priion can be used in the radio and electrotechnical industry, semiconductor and electric 4) Kuu..1i technology.

Shear strength at hardening temperature (kg / mm)

10A

70

Si 45} Bi22,2; Pb 11.0; JH 11.0; SH 6.1; Cd 3.2; C, a 1.5;

C 55; Bi18.1; Pb 9.0; Hz 9.0;

Srt 5.0; Cd2.6; (Vo 1, 3;

C 60; Bi 16.1; Pb in, 0; Jn 8.0;

Su4,4; Cd2.5; Qa 1.1;

Cu Bi 14.1; Pb 7.0; 3n 7.0; Su 3.9; Cd 2.0; C, a 1, O

one.:

1.5

2.8

2.5

3.0

2.8

2.1

2.0