SU264140A1 - PIECES OF DETAILS - Google Patents

Description

Known solder on Aut. St. No. 228507 for soldering parts, consisting of 5-65% aluminum, the rest is gallium.

To improve the quality of the solder compound, magnesium in the amount of 0.5-8.5% is introduced into the composition of lipos.

In the proposed solder, as a result of the diffusion exchange of liquid gallium with aluminum and magnesium, a solid solution is formed without the participation of brittle chemical compounds.

Increasing the concentration of magnesium in the bath more than 8.5% leads to the formation of chemical compounds.

The joints made by the proposed solder can operate at temperatures of 350–370 ° C and withstand ten times thermocyclic loads from –196 to + 100 ° C without loss of physical and mechanical properties.

Testing of A1-Mg-Ga Prio showed that the tensile strength of joints, butt-joint (CGV) is not less than 5 kg / mm. The electrical conductivity is 19.5-21.0 m / ohm-mm; the thermal coefficient of linear expansion in the temperature range from 50 to 300 ° C is 22.2-27.8 to 10-6 / deg. The use of A1-Mg-Ga solder allowed

to combine aluminum and its alloys, magnesium and its alloys, alloys based on Fe – Ni – Co and Fe – Ni – Co – A1, stainless steel, steel, titanium, brass, bronze, ceramic and semiconductor materials without the use of flaos.

Exposure of A1-Mg-Ga prioem.m paired samples in various aggressive media (Na / NaCl solution + 0, lo / o H202; solution of salts imitating seawater, floats of these solutions) showed that the solder

possesses satisfactory corrosion resistance. The tensile strength after five days of exposure in aggressive media is at least 3.0 kg / mm.

Subject matter

Solder on auth. St. No. 228507, which differs from that.m., In order to improve the quality of the solder compound, magnesium in the amount of 0.5-8.5Vo is additionally introduced into its composition