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SU1618538A1 - Arrangement for electromechanical polishing and bringing parts to specified size - Google Patents

Arrangement for electromechanical polishing and bringing parts to specified size Download PDF

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Publication number
SU1618538A1
SU1618538A1 SU884480092A SU4480092A SU1618538A1 SU 1618538 A1 SU1618538 A1 SU 1618538A1 SU 884480092 A SU884480092 A SU 884480092A SU 4480092 A SU4480092 A SU 4480092A SU 1618538 A1 SU1618538 A1 SU 1618538A1
Authority
SU
USSR - Soviet Union
Prior art keywords
cathode
parts
gasket
washer
interelectrode
Prior art date
Application number
SU884480092A
Other languages
Russian (ru)
Inventor
Владимир Ильич Дружкин
Original Assignee
Предприятие П/Я А-1067
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Предприятие П/Я А-1067 filed Critical Предприятие П/Я А-1067
Priority to SU884480092A priority Critical patent/SU1618538A1/en
Application granted granted Critical
Publication of SU1618538A1 publication Critical patent/SU1618538A1/en

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  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)

Abstract

Изобретение относитс  к электрохимической обработке деталей. Цель изобрете- ни  - расширение функциональных возможностей устройства путем взаимозамен емости анодно и катодно обрабатываемых деталей. Детали 14 размещают в гнездах диска-трафарета 13 (анод) и укрепл ют их с помощью кле щего состава. Дисктрафарет 7 (катод) устанавливают на фланец 1 шпиндел  2. На шайбу 6 кладут межэлектродную прокладку 8, обеспечива  соприкосновение внутренней поверхности оправы 9 с роликом 10. С помощью патрубка 19 смачивают межэлектродную прокладку раствором электролита. Став т диск-трафарет 13 с детал ми обрабатываемой поверхностью на межэлектродную прокладку и прижимают ее с помощью центра 17, который смещен относительно оси катода. Включают подачу электролита и источник тока 5. Одновременно с анодным формообразованием, при котором ионы переход т в раствор, происходит восстановление перешедших ионов, равномерно осаждающихс  на катоде за счет перемещени  прокладки в межэлектродном промежутке. 1 з.п. ф-лы, 1 ил. ел о 00 ел GO 00This invention relates to the electrochemical machining of parts. The purpose of the invention is to expand the functionality of the device by interchangeable anodic and cathodically machined parts. Parts 14 are placed in the slots of the stencil disc 13 (anode) and strengthened with an adhesive composition. Diskgraph 7 (cathode) is installed on the flange 1 of the spindle 2. On the washer 6 put the interelectrode gasket 8, ensuring the contact of the inner surface of the frame 9 with the roller 10. With the help of pipe 19 moistened the interelectrode gasket with electrolyte solution. Place the stencil disc 13 with the parts of the treated surface on the electrode pad and press it with the help of the center 17, which is offset from the axis of the cathode. The electrolyte supply and current source are switched on. Simultaneously with the anodic shaping, in which the ions pass into solution, the transferred ions are restored, which are uniformly deposited on the cathode by moving the strip in the interelectrode gap. 1 hp f-ly, 1 ill. ate about 00 ate GO 00

Description

Изобретение относитс  к электрохимической обработке, а именно к конструкци м станков.This invention relates to electrochemical machining, in particular to machine tool structures.

Цель изобретени  - расширение функциональных возможностей устройства путем взаимозамен емости анодно и катодно обрабатываемых деталей.The purpose of the invention is to expand the functionality of the device by interchangeable anodic and cathodically machined parts.

На чертеже представлена схема устройства .The drawing shows a diagram of the device.

На фланце 1 катодного шпиндел  2, подключенного через контактное кольцо 3 и щетки 4 к отрицательному полюсу регулируемого источника 5 тока, укреплена шайба 6 из изол ционного материала, на которой со- осно со шпинделем установлен катод, выполненный в виде диска-трафарета 7. На кольцевом бурте шайбы размещена пориста  межэлектродна  прокладка 8, закрепленна  в оправе 9. Оправа установлена асимметрично относительно шпиндел  и соприкасаетс  с роликом 10, наход щимс  на неподвижной оси 11, закрепленной на станине .12. Положительный полюс источника тока соединен с анодно обрабатываемой деталью - полируемыми диском-трафаретом 13 и детал ми 1 посредством щеток 15, контактного кольца 16 и центра 17. Центр присоединен к валу электродвигател  18. Над межэлектродной прокладкой расположен патрубок 19.On the flange 1 of the cathode spindle 2, connected via the slip ring 3 and the brush 4 to the negative pole of the adjustable current source 5, a washer 6 of insulating material is mounted, on which a cathode is mounted in the form of a stencil disc 7. an annular collar of the washer is placed a porous interelectrode gasket 8 fixed in the frame 9. The frame is mounted asymmetrically with respect to the spindle and comes into contact with the roller 10 on the fixed axis 11 fixed on the frame .12. The positive pole of the current source is connected to the anodically processed part - polished stencil disc 13 and parts 1 by means of brushes 15, slip ring 16 and center 17. The center is connected to the motor shaft 18. A nozzle 19 is located above the electrode gap.

Устройство работает следующим образом ..The device works as follows.

Детали 14 размещают в гнездах диска- трафарета 13 и укрепл ют их с помощью кле щего состава. Диск -трафарет 7 устанавливают на фланец 1 шпиндел  2 обрабатываемой поверхностью кверху. На шайбу 6 кладут межэлектродную прокладку 8, обеспечива  соприкосновение внутренней поверхности оправы 9 с роликом 10. Кратковременным включением насоса с помощью патрубка 19 смачивают межэлектродную прокладку раствором электролита. Став т диск-трафарет 13 с укреплен ными на нем детал ми 14 обрабатываемой поверхностью на ,межэлектродную прокладку и прижимают его с помощью центра 17. При этом прижимной центр 17 смещен относительно оси катода. Включают подачу электролита на межэлектродную прокладку. С помощью магнитного пускател  одновременно включают электродвигатель и привод вращени  шпиндел  2. Затем включают источник 5 тока. Одновременно с анодным формообразованием, при котором в раствор переход т ионы анода, производитс  катодное формообразование, при котором наход щиес  в растворе ионы анода равномерно осаждаютс  на поверхность катода, образу  слой, достаточный дл  последующего его сполировывани  на анодном режиме этого устройства. Катодный диск-трафарет и полируемый диск-трафаретParts 14 are placed in the nests of the stencil 13 and strengthened with an adhesive composition. Disk-stencil 7 is installed on the flange 1 of the spindle 2 with the treated surface upwards. On the washer 6 put the interelectrode gasket 8, providing contact between the inner surface of the frame 9 with the roller 10. Briefly turning on the pump using the pipe 19 moisten the electrode electrode gasket with electrolyte solution. Place the stencil disc 13 with the parts 14 on the surface to be treated on to the inter-electrode gasket and press it with the help of center 17. At the same time, the pressing center 17 is offset relative to the cathode axis. Include the flow of electrolyte on the interelectrode gasket. Using a magnetic starter, the motor and the rotation drive of the spindle 2 are simultaneously turned on. Then the current source 5 is turned on. Simultaneously with anodic shaping, in which anode ions are transferred to the solution, cathodic shaping is performed, in which the anode ions in solution are deposited evenly on the cathode surface, forming a layer sufficient for subsequent polishing on the anode mode of this device. Cathodic disc stencil and polished disc stencil

выполн ют из одного и того же металла, в частности из меди, а непрерывное линейное перемещение прокладки в межэлектродном промежутке устран ет вли ние ее структуры на равномерность осаждаемого на катоде сло .They are made of the same metal, in particular copper, and the continuous linear displacement of the strip in the interelectrode gap eliminates the influence of its structure on the uniformity of the layer deposited on the cathode.

Claims (2)

1. Устройство дл  электрохимикомеха- нического полировани  и доводки деталей, содержащее катодный и анодный шпиндели1. Device for electrochemical polishing and finishing parts containing cathode and anode spindles с закрепленными в них плоскими электродами , разделенными проницаемой дл  электролита прокладкой, закрепленной в оправе, систему подачи электролита на поверхность прокладки, уравнитель угловых скоростейwith flat electrodes fixed in them, separated by an electrolyte-permeable gasket fixed in a frame, an electrolyte supply system to the gasket surface, an angular velocity equalizer катодного и анодного шпинделей, отличающеес  тем, что, с целью расширени  его функциональных возможностей за счет восстановлени  электродов, электроды выполнены одинаковыми по форме, катодныйcathode and anode spindles, characterized in that, in order to expand its functionality by restoring electrodes, the electrodes are made identical in shape, the cathode шпиндель снабжен фланцем, на котором установлена шайба из изолирующего материала с посадочным сквозным отверстием дл  электрода, а между оправой и шайбой на неподвижной оси установлен введенный вthe spindle is provided with a flange on which a washer of insulating material with a mounting through-hole for the electrode is installed, and inserted into the fixed axis between the rim and the washer on a fixed axis устройство ролик, предназначенный дл  взаимодействи  с ними.device roller designed to interact with them. 2. Устройство поп.1,отличающее- с   тем, что, с целью повышени  качества обработки, торцова  поверхность шайбы снабжена кольцевым буртом, высота которого равна суммарной толщине прокладки и выступающей из посадочного гнезда части электрода.2. The device is pop.1, characterized in that, in order to improve the quality of processing, the end surface of the washer is provided with an annular shoulder, the height of which is equal to the total thickness of the gasket and the part of the electrode protruding from the seat.
SU884480092A 1988-09-13 1988-09-13 Arrangement for electromechanical polishing and bringing parts to specified size SU1618538A1 (en)

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Cited By (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002075804A3 (en) * 2001-03-14 2003-06-26 Applied Materials Inc Planarization of substrates using electrochemical mechanical polishing
US6863797B2 (en) 2001-12-21 2005-03-08 Applied Materials, Inc. Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMP
US6979248B2 (en) 2002-05-07 2005-12-27 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US6988942B2 (en) 2000-02-17 2006-01-24 Applied Materials Inc. Conductive polishing article for electrochemical mechanical polishing
US6991528B2 (en) 2000-02-17 2006-01-31 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7014538B2 (en) 1999-05-03 2006-03-21 Applied Materials, Inc. Article for polishing semiconductor substrates
US7029365B2 (en) 2000-02-17 2006-04-18 Applied Materials Inc. Pad assembly for electrochemical mechanical processing
US7077721B2 (en) 2000-02-17 2006-07-18 Applied Materials, Inc. Pad assembly for electrochemical mechanical processing
US7084064B2 (en) 2004-09-14 2006-08-01 Applied Materials, Inc. Full sequence metal and barrier layer electrochemical mechanical processing
US7125477B2 (en) 2000-02-17 2006-10-24 Applied Materials, Inc. Contacts for electrochemical processing
US7128825B2 (en) 2001-03-14 2006-10-31 Applied Materials, Inc. Method and composition for polishing a substrate
US7137879B2 (en) 2001-04-24 2006-11-21 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7232514B2 (en) 2001-03-14 2007-06-19 Applied Materials, Inc. Method and composition for polishing a substrate
US7278911B2 (en) 2000-02-17 2007-10-09 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7303462B2 (en) 2000-02-17 2007-12-04 Applied Materials, Inc. Edge bead removal by an electro polishing process
US7303662B2 (en) 2000-02-17 2007-12-04 Applied Materials, Inc. Contacts for electrochemical processing
US7323095B2 (en) 2000-12-18 2008-01-29 Applied Materials, Inc. Integrated multi-step gap fill and all feature planarization for conductive materials
US7323416B2 (en) 2001-03-14 2008-01-29 Applied Materials, Inc. Method and composition for polishing a substrate
US7344432B2 (en) 2001-04-24 2008-03-18 Applied Materials, Inc. Conductive pad with ion exchange membrane for electrochemical mechanical polishing
US7374644B2 (en) 2000-02-17 2008-05-20 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7390429B2 (en) 2003-06-06 2008-06-24 Applied Materials, Inc. Method and composition for electrochemical mechanical polishing processing
US7427340B2 (en) 2005-04-08 2008-09-23 Applied Materials, Inc. Conductive pad
US7520968B2 (en) 2004-10-05 2009-04-21 Applied Materials, Inc. Conductive pad design modification for better wafer-pad contact
US7582564B2 (en) 2001-03-14 2009-09-01 Applied Materials, Inc. Process and composition for conductive material removal by electrochemical mechanical polishing
US7670468B2 (en) 2000-02-17 2010-03-02 Applied Materials, Inc. Contact assembly and method for electrochemical mechanical processing
US7678245B2 (en) 2000-02-17 2010-03-16 Applied Materials, Inc. Method and apparatus for electrochemical mechanical processing
CN102744674A (en) * 2012-07-26 2012-10-24 上海宏力半导体制造有限公司 Chemical-mechanical polishing device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Авторское свидетельство СССР № 659343, кл. В 23 Н 5/06, 1976. *

Cited By (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7014538B2 (en) 1999-05-03 2006-03-21 Applied Materials, Inc. Article for polishing semiconductor substrates
US7285036B2 (en) 2000-02-17 2007-10-23 Applied Materials, Inc. Pad assembly for electrochemical mechanical polishing
US7137868B2 (en) 2000-02-17 2006-11-21 Applied Materials, Inc. Pad assembly for electrochemical mechanical processing
US7374644B2 (en) 2000-02-17 2008-05-20 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7678245B2 (en) 2000-02-17 2010-03-16 Applied Materials, Inc. Method and apparatus for electrochemical mechanical processing
US6988942B2 (en) 2000-02-17 2006-01-24 Applied Materials Inc. Conductive polishing article for electrochemical mechanical polishing
US6991528B2 (en) 2000-02-17 2006-01-31 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7344431B2 (en) 2000-02-17 2008-03-18 Applied Materials, Inc. Pad assembly for electrochemical mechanical processing
US7029365B2 (en) 2000-02-17 2006-04-18 Applied Materials Inc. Pad assembly for electrochemical mechanical processing
US7066800B2 (en) 2000-02-17 2006-06-27 Applied Materials Inc. Conductive polishing article for electrochemical mechanical polishing
US7077721B2 (en) 2000-02-17 2006-07-18 Applied Materials, Inc. Pad assembly for electrochemical mechanical processing
US7670468B2 (en) 2000-02-17 2010-03-02 Applied Materials, Inc. Contact assembly and method for electrochemical mechanical processing
US7125477B2 (en) 2000-02-17 2006-10-24 Applied Materials, Inc. Contacts for electrochemical processing
US7303462B2 (en) 2000-02-17 2007-12-04 Applied Materials, Inc. Edge bead removal by an electro polishing process
US7278911B2 (en) 2000-02-17 2007-10-09 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7303662B2 (en) 2000-02-17 2007-12-04 Applied Materials, Inc. Contacts for electrochemical processing
US7207878B2 (en) 2000-02-17 2007-04-24 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7569134B2 (en) 2000-02-17 2009-08-04 Applied Materials, Inc. Contacts for electrochemical processing
US7323095B2 (en) 2000-12-18 2008-01-29 Applied Materials, Inc. Integrated multi-step gap fill and all feature planarization for conductive materials
US7232514B2 (en) 2001-03-14 2007-06-19 Applied Materials, Inc. Method and composition for polishing a substrate
US7582564B2 (en) 2001-03-14 2009-09-01 Applied Materials, Inc. Process and composition for conductive material removal by electrochemical mechanical polishing
WO2002075804A3 (en) * 2001-03-14 2003-06-26 Applied Materials Inc Planarization of substrates using electrochemical mechanical polishing
US7128825B2 (en) 2001-03-14 2006-10-31 Applied Materials, Inc. Method and composition for polishing a substrate
US7323416B2 (en) 2001-03-14 2008-01-29 Applied Materials, Inc. Method and composition for polishing a substrate
US6811680B2 (en) 2001-03-14 2004-11-02 Applied Materials Inc. Planarization of substrates using electrochemical mechanical polishing
US6899804B2 (en) 2001-04-10 2005-05-31 Applied Materials, Inc. Electrolyte composition and treatment for electrolytic chemical mechanical polishing
US7137879B2 (en) 2001-04-24 2006-11-21 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7311592B2 (en) 2001-04-24 2007-12-25 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7344432B2 (en) 2001-04-24 2008-03-18 Applied Materials, Inc. Conductive pad with ion exchange membrane for electrochemical mechanical polishing
US7384534B2 (en) 2001-12-21 2008-06-10 Applied Materials, Inc. Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMP
US7229535B2 (en) 2001-12-21 2007-06-12 Applied Materials, Inc. Hydrogen bubble reduction on the cathode using double-cell designs
US6863797B2 (en) 2001-12-21 2005-03-08 Applied Materials, Inc. Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMP
US6979248B2 (en) 2002-05-07 2005-12-27 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7390429B2 (en) 2003-06-06 2008-06-24 Applied Materials, Inc. Method and composition for electrochemical mechanical polishing processing
US7446041B2 (en) 2004-09-14 2008-11-04 Applied Materials, Inc. Full sequence metal and barrier layer electrochemical mechanical processing
US7084064B2 (en) 2004-09-14 2006-08-01 Applied Materials, Inc. Full sequence metal and barrier layer electrochemical mechanical processing
US7520968B2 (en) 2004-10-05 2009-04-21 Applied Materials, Inc. Conductive pad design modification for better wafer-pad contact
US7427340B2 (en) 2005-04-08 2008-09-23 Applied Materials, Inc. Conductive pad
CN102744674A (en) * 2012-07-26 2012-10-24 上海宏力半导体制造有限公司 Chemical-mechanical polishing device
CN102744674B (en) * 2012-07-26 2016-10-26 上海华虹宏力半导体制造有限公司 Chemical-mechanical grinding device

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