SU1696450A1 - Sealing compound - Google Patents

Abstract

The invention relates to polymeric materials for sealing semiconductor devices, in particular optoelectronic devices (light guides, indicators, displays and the like). The invention makes it possible to accelerate the turnover of the casting molds, to reduce the curing time while maintaining the optical and operational properties due to its use in a sealing compound, including May. including: diglycidyl ester of D, L-camphoric acid 100; methyl hexa- or isomethyl tetrahydrophthalic anhydride 80.2-95.2; plasticizer and accelerator, as a plasticizer-epoxidized reaction product of glycerol and butylglycidyl ether 15-30, and as an accelerator - mixtures of dialkyl mercaptide and onium salt of PsMe X, where R is CeHs. СТН; Me - Se, S; X-BF4, PFe, in a weight ratio of (0.5-1) - (1-0.5) in an amount of 1.95-3.38. 3 tab.

Description

SP

with

The invention relates to polymeric materials for sealing semiconductor devices, in particular optoelectronic devices, such as light emitting diodes, indicators and displays on light emitting diodes, matrix emitters and photodetectors.

The aim of the invention is to accelerate the turnover of the casting molds and reduce curing while maintaining optical and operational properties.

To prepare the proposed compound, D, L-camphoric acid diglycid ester, methyl hexahydrophthalic anhydride, isomethyl tetrahydrophthalic anhydride, epoxidized reaction product of glycerol and butyl glycidyl ester (FOU-15 resin, onium salts, and mercaptidide dichloride glyphene dihydrogen / hydrogen chloride) are used. ) WSQ032- 0009101 produced by the GDR. Dibutyltin mercaptide is a weak, oily, yellowish liquid with a refractive index of 1.505-1.515 and static heat resistance at 180 ° C for at least 70 minutes. For experimental verification of the sealing compositions, 16 compositions are prepared with different content of ingredients (Table 1), six of which (Examples 1-6) show optimal results (Examples 7-10 - controls). The compositions are prepared by mixing the components, weighted in a certain ratio, at room temperature. The sequence of introduction of the components in the manufacture of the compound is irrelevant.

The proposed compound is a low viscosity, colorless or slightly yellow liquid. Properties of the proposed cured sealing compound and a known composition are presented in table 2.

about

YU

four

sl o

The total polymerization time at a given temperature is considered the time during which the material gains strength sufficient to ensure the integrity of the structures under operating conditions, and also reaches stable dielectric properties. In the compositions under consideration, when applying the curing regimes mentioned above, the integrity of the structure under the conditions of thermocycling is maintained (Yt / cycle, from –60 to 120 ° C). During this time, the dielectric constant of the cured material, measured at a frequency of 106 Hz, reaches a value of no more than 2, and the specific volume electrical resistance of at least 2 -1015 ohms cm.

Additional data on the light transmission of the compositions after exposure to elevated temperature and humidity, as well as the strength of the compositions at break, are given in Table. 3

Claims (1)

Claims of the Sealing Compound comprising D, L-camphoric acid diglycidyl ester, methylhexa- or isomethyltetrandrophthalic anhydride, plasticizer and organotin accelerator, characterized in that, in order to accelerate the turn-around of the molding forms and shorten the flow time of the template, there is no time to set the flow time. as a plasticizer, it contains an epoxidized reaction product of glycerol and butylglycidyl ether, and as an accelerator, a mixture of mercaptil dibutyl tin, and howl salt RzMe + X, where R - CeHs or Me -Se, S; X-VG-4, PFe, in a mass ratio (0.5-1.0): 1.0: 0.5 in the following ratio of components, May, hours: Diglycidyl ester of D, L-camphoric acid100 Methylhexa- or isomethyltetrahydrophophic anhydride 80.2-95.2 Epoxidized reaction product of glycerol and butylglycidyl ether15-30 The specified accelerator 1.95-3.38. 70 2k Gelling time at 12–12 ° С, min Holding time a form, min Full polymerization time at 125 ± 2 С, min. Light transmission,% at 1 mm thickness And wavelength, nm: Ш88 56093 76096 Resistance to thermal cycling (10 thermocyclo from -60 to 120 ° C, 30 minutes at each temperature) + 39 20 12 kk 38 k7 62 52 5 7 42 37 M 52 35 32 120 60 (SO 120 120 120 180 120 120 180 12Q 180 12.0 120 120 120 15 15 15 15 15 15 20 20. 18 20 20 15 18 15 h15 88.288.1 88.0 88.0 88.0 88S2 88.0 88.0 88.0 88.0 81.8 88.0 88.3 88.1 8A.2 9M 93, 93.1 93.1 93 , 6 93.2 93, Ь 93,993.0 85.0 93.1 93.0 93.5 96.5 81.3 96.396.1 96.0 96.0 96.3 96.2 96.0 96.0 96.0 96.1 87.3 96.0 96.3 96.0 90.2 85.8 -, - withstand thermal cycles; f. - do not maintain thermal cycles 15 15 20 20. 18 20 20 15 18 15 15 hP rupture strength, MPA. 40.0 40.3 30.1 41.0 40.2 40.4 41.1 40.2 40.3 29.8 40.1 40.1 21.2 28.4 27.9 40.1 41.0 Operational properties of sealing compounds