SU1508947A1 - Process of manufacture of multilayer printed circuit board - Google Patents
Process of manufacture of multilayer printed circuit boardInfo
- Publication number
- SU1508947A1 SU1508947A1 SU4255133/21A SU4255133A SU1508947A1 SU 1508947 A1 SU1508947 A1 SU 1508947A1 SU 4255133/21 A SU4255133/21 A SU 4255133/21A SU 4255133 A SU4255133 A SU 4255133A SU 1508947 A1 SU1508947 A1 SU 1508947A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- printed circuit
- circuit board
- multilayer printed
- fusion
- sided
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 abstract 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 abstract 2
- 230000004927 fusion Effects 0.000 abstract 2
- 229910052751 metal Inorganic materials 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 2
- 238000004870 electrical engineering Methods 0.000 abstract 1
- 238000007590 electrostatic spraying Methods 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 229920000647 polyepoxide Polymers 0.000 abstract 1
- 239000000843 powder Substances 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- 239000004408 titanium dioxide Substances 0.000 abstract 1
Landscapes
- Laminated Bodies (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
FIELD: electrical engineering, radio electronics. SUBSTANCE: powdery composition including, parts by mass: epoxy resin 51.2-59.2; polyarylamine based on toludiene and formaldehyde 3.5-6.8; titanium dioxide 35.0-40.0; polyvinylbutiral being the balance, is deposited by electrostatic spraying on surfaces and into holes of metal base. After fusion of powder at temperature 165-175 C base is pressed together with package of dielectric layers with one-sided or two-sided pattern of multilayer printed circuit board. Pressing is performed for the course of 0.5-1.5 h under pressure 15-20 kgf/sq. cm at fusion temperature. Manufactured multilayer printed circuit board has enhanced thermal conductivity 0.40 W/m.deg and adhesion of coat to metal amounts to 2.5-3.0 kg/sq.cm. EFFECT: improved electrical and mechanical characteristics with simultaneous increase of thermophysical parameters of printed circuit boards. 1 tbl
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU4255133/21A SU1508947A1 (en) | 1987-04-17 | 1987-04-17 | Process of manufacture of multilayer printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU4255133/21A SU1508947A1 (en) | 1987-04-17 | 1987-04-17 | Process of manufacture of multilayer printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SU1508947A1 true SU1508947A1 (en) | 1995-04-20 |
Family
ID=60527022
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SU4255133/21A SU1508947A1 (en) | 1987-04-17 | 1987-04-17 | Process of manufacture of multilayer printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| SU (1) | SU1508947A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2617164C1 (en) * | 2016-02-05 | 2017-04-21 | Акционерное общество "Научно-исследовательский институт "Полюс" им. М.Ф. Стельмаха" | Device for removing dissolved gases from insulating compound |
| RU2820925C1 (en) * | 2023-08-07 | 2024-06-11 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Казанский национальный исследовательский технический университет им. А.Н. Туполева - КАИ" | Current-conducting powder binder based on epoxy composition and method of producing prepreg and reinforced carbon composite based on it (versions) |
-
1987
- 1987-04-17 SU SU4255133/21A patent/SU1508947A1/en active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2617164C1 (en) * | 2016-02-05 | 2017-04-21 | Акционерное общество "Научно-исследовательский институт "Полюс" им. М.Ф. Стельмаха" | Device for removing dissolved gases from insulating compound |
| RU2820925C1 (en) * | 2023-08-07 | 2024-06-11 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Казанский национальный исследовательский технический университет им. А.Н. Туполева - КАИ" | Current-conducting powder binder based on epoxy composition and method of producing prepreg and reinforced carbon composite based on it (versions) |
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