[go: up one dir, main page]

SI3095075T1 - Postopek in naprava za obdelavo substrata - Google Patents

Postopek in naprava za obdelavo substrata

Info

Publication number
SI3095075T1
SI3095075T1 SI201432025T SI201432025T SI3095075T1 SI 3095075 T1 SI3095075 T1 SI 3095075T1 SI 201432025 T SI201432025 T SI 201432025T SI 201432025 T SI201432025 T SI 201432025T SI 3095075 T1 SI3095075 T1 SI 3095075T1
Authority
SI
Slovenia
Prior art keywords
machining
substrate
Prior art date
Application number
SI201432025T
Other languages
English (en)
Inventor
Bernhard Baist
Original Assignee
Melzer Maschinenbau Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=52394020&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=SI3095075(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Melzer Maschinenbau Gmbh filed Critical Melzer Maschinenbau Gmbh
Publication of SI3095075T1 publication Critical patent/SI3095075T1/sl

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38—Cutting-out; Stamping-out
    • B26F1/40—Cutting-out; Stamping-out using a press, e.g. of the ram type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D28/00—Shaping by press-cutting; Perforating
    • B21D28/02—Punching blanks or articles with or without obtaining scrap; Notching
    • B21D28/06—Making more than one part out of the same blank; Scrapless working
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/01—Means for holding or positioning work
    • B26D7/02—Means for holding or positioning work with clamping means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38—Cutting-out; Stamping-out
    • B26F1/44—Cutters therefor; Dies therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
SI201432025T 2014-01-13 2014-12-04 Postopek in naprava za obdelavo substrata SI3095075T1 (sl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102014000133.4A DE102014000133B4 (de) 2014-01-13 2014-01-13 Verfahren und Einrichtung zur Bearbeitung eines Substrats
EP14828443.3A EP3095075B1 (de) 2014-01-13 2014-12-04 Verfahren und einrichtung zur bearbeitung eines substrats
PCT/DE2014/000619 WO2015104011A1 (de) 2014-01-13 2014-12-04 Verfahren und einrichtung zur bearbeitung eines substrats

Publications (1)

Publication Number Publication Date
SI3095075T1 true SI3095075T1 (sl) 2023-06-30

Family

ID=52394020

Family Applications (1)

Application Number Title Priority Date Filing Date
SI201432025T SI3095075T1 (sl) 2014-01-13 2014-12-04 Postopek in naprava za obdelavo substrata

Country Status (15)

Country Link
US (1) US20160257019A1 (sl)
EP (1) EP3095075B1 (sl)
JP (1) JP6490085B2 (sl)
KR (1) KR101941932B1 (sl)
CN (1) CN105980076B (sl)
CA (1) CA2929057C (sl)
DE (1) DE102014000133B4 (sl)
ES (1) ES2943338T3 (sl)
HU (1) HUE061643T2 (sl)
MY (1) MY185383A (sl)
PL (1) PL3095075T3 (sl)
PT (1) PT3095075T (sl)
RS (1) RS64178B1 (sl)
SI (1) SI3095075T1 (sl)
WO (1) WO2015104011A1 (sl)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101513723B1 (ko) * 2014-05-20 2015-04-22 주식회사 범천정밀 이종 소재의 단조 성형방법 및 단조 성형장치
US20160325868A1 (en) * 2015-05-08 2016-11-10 Alkar-Rapidpak, Inc. Contour cutting station for web packaging machine
FR3045432B1 (fr) * 2015-12-17 2018-07-06 Idemia France Realisation d'une fenetre dans une couche en plastique mince
DE102016201976B3 (de) * 2016-02-10 2017-02-16 Bundesdruckerei Gmbh Vorrichtung und Verfahren zur Bearbeitung eines Substrats
DE102016109654A1 (de) 2016-05-25 2017-11-30 Ovd Kinegram Ag Bogen für ein Sicherheitsdokument, Verfahren zur Herstellung des Bogens und daraus hergestelltes Sicherheitsdokument
DE102016112672A1 (de) 2016-07-11 2017-03-09 Bundesdruckerei Gmbh Verfahren zum Herstellen einer Schichtanordnung für ein Sicherheitsdokument und Sicherheitsdokument
DE102016112675A1 (de) 2016-07-11 2018-01-11 Bundesdruckerei Gmbh Verfahren zum Herstellen einer Schichtanordnung für ein Sicherheitsdokument und Sicherheitsdokument
CN106113153B (zh) * 2016-08-23 2018-02-16 领胜城科技（江苏）有限公司 一种十字走料模切机
DE102016217044B4 (de) 2016-09-07 2023-04-20 Bundesdruckerei Gmbh Verfahren zur Bearbeitung eines Substrats mit einem Stanzstempel
GB2563187B (en) 2017-02-03 2020-07-22 De La Rue Int Ltd Method of forming a security sheet substrate
GB2562699B (en) 2017-02-03 2020-07-22 De La Rue Int Ltd Method of forming a security device
GB2567165B (en) 2017-10-04 2020-08-26 De La Rue Int Ltd Improvements in security sheets comprising security elements
US11347993B2 (en) 2019-08-12 2022-05-31 Federal Card Services, LLC Dual interface metal cards and methods of manufacturing
US11113593B2 (en) 2019-08-15 2021-09-07 Federal Card Services; LLC Contactless metal cards with fingerprint sensor and display
US12277462B2 (en) 2019-08-14 2025-04-15 Federal Card Services, LLC Metal-containing dual interface smartcards
DE102019122128B4 (de) 2019-08-16 2021-10-14 Bundesdruckerei Gmbh Wert- oder sicherheitsprodukt und verfahren zu dessen herstellung
CN110757578B (zh) * 2019-09-16 2021-10-01 领胜城科技（江苏）有限公司 一种多块棉十字走料异步模切工艺
GB2587806B (en) 2019-09-30 2022-12-21 De La Rue Int Ltd A method for manufacturing a security substrate
US11341385B2 (en) 2019-11-16 2022-05-24 Federal Card Services, LLC RFID enabled metal transaction card with shaped opening and shaped slit
GB2592235B (en) 2020-02-20 2023-02-01 De La Rue Int Ltd A security sheet
CN111731623B (zh) * 2020-06-22 2022-02-18 深圳市鸿富诚屏蔽材料有限公司 一种单面贴片的加工工艺及单面贴片的加工设备
KR102298567B1 (ko) * 2020-07-29 2021-09-06 최승재 필러 제조방법 및 이를 이용하여 제조되는 필러
DE102021100319A1 (de) * 2021-01-11 2022-07-14 Mühlbauer Gmbh & Co. Kg Verfahren zum herstellen eines mehrschichtigen laminierten dokumentensubstrats mit einem einlegekörper
DE102021114246A1 (de) 2021-06-01 2022-12-01 Bundesdruckerei Gmbh Karte und Verfahren zur Herstellung einer Karte
GB2613016B (en) 2021-11-22 2024-03-13 De La Rue Int Ltd A method of manufacturing a security sheet
DE102022104827A1 (de) 2022-01-13 2023-07-13 Bundesdruckerei Gmbh Vorrichtung und Verfahren zum Herstellen einer gefügten Karte mit einem lichttransparenten Fenster
EP4219183B1 (de) 2022-01-13 2024-05-15 Bundesdruckerei GmbH Vorrichtung und verfahren zum herstellen einer gefügten karte mit einem lichttransparenten fenster
DE102022128541A1 (de) 2022-10-27 2024-05-02 Bundesdruckerei Gmbh Stanzanordnung und Verfahren zum Betreiben einer Stanzanordnung

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3122981A1 (de) * 1981-06-10 1983-01-05 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Verfahren zum einbau von ic-bausteinen in ausweiskarten
FR2580416B1 (fr) * 1985-04-12 1987-06-05 Radiotechnique Compelec Procede et dispositif pour fabriquer une carte d'identification electronique
US4823660A (en) * 1986-02-20 1989-04-25 Stelron Components Inc Label cutting device and method
AU2906289A (en) * 1987-12-29 1989-08-01 Walker Scientific Europe B.V. Apparatus and method for punching a foil or such sheet-like material
DE3913604A1 (de) 1989-04-25 1990-12-06 Gao Ges Automation Org Verfahren und vorrichtung zum aufbringen von unterschriftsstreifen auf ausweiskarten
JP2904899B2 (ja) * 1990-09-29 1999-06-14 大日本印刷株式会社 Ｉｃカード用接着シート供給装置
GB2267247A (en) 1992-05-07 1993-12-01 Robotec Ltd Implanting a shape of one material into a shaped hole in another.
NL9300888A (nl) 1993-05-25 1994-12-16 Dorned Bv Geplastificeerd, van pasfoto voorzien veiligheidsdokument.
DE4403513A1 (de) * 1994-02-04 1995-08-10 Giesecke & Devrient Gmbh Chipkarte mit einem elektronischen Modul und Verfahren zur Herstellung einer solchen Chipkarte
JPH0852966A (ja) * 1994-07-28 1996-02-27 Solaic Sa メモリ・カード等へのマイクロ回路の埋め込み方法及びその方法により埋め込まれたマイクロ回路を備えたカード
KR19980015325A (ko) * 1995-08-25 1998-05-25 게브하르트 코흐 칩 카드를 제조하는 방법 및 장치
DE19620597C2 (de) * 1996-05-22 2001-08-30 Bielomatik Leuze & Co Vorrichtung zur Bearbeitung von Lagenmaterial
AU3433697A (en) * 1996-07-11 1998-02-09 David Finn Method and device for manufacturing a chip card as well as chip card
DE19634473C2 (de) * 1996-07-11 2003-06-26 David Finn Verfahren zur Herstellung einer Chipkarte
JP4439598B2 (ja) * 1997-01-24 2010-03-24 大日本印刷株式会社 フィルムキャリアテープの搬送装置
JP2002015294A (ja) * 2000-06-28 2002-01-18 Mitsubishi Materials Corp 情報担持カードおよびその製造方法
US20030024636A1 (en) * 2001-07-17 2003-02-06 Andy Lin Method of manufacturing anti-counterfeit card label
JP4336164B2 (ja) * 2003-04-24 2009-09-30 京セラ株式会社 複合シートの製造方法、複合積層体の製造方法及びセラミック基板の製造方法
JP2005044059A (ja) * 2003-07-25 2005-02-17 Konica Minolta Photo Imaging Inc Ｉｃカードの製造方法
WO2005089143A2 (en) * 2004-03-12 2005-09-29 A K Stamping Co. Inc. Manufacture of rfid tags and intermediate products therefor
JP2006324542A (ja) * 2005-05-20 2006-11-30 Cmk Corp プリント配線板とその製造方法
BRPI0505689A (pt) 2005-12-09 2007-09-18 Juliana Cardoso Vicente Macedo dispositivo para sistema de marchetaria automática em pisos laminados de madeira
ATE496347T1 (de) * 2006-09-26 2011-02-15 Feinics Amatech Teoranta Verfahren für den anschluss einer antenne an einen transponderchip und entsprechendes einlagensubstrat
EP1983808A1 (en) * 2007-04-17 2008-10-22 Tibc Corporation Method for manufacturing tape carrier for contact type IC card
CN101499403A (zh) * 2008-01-31 2009-08-05 志圣工业股份有限公司 芯片切膜装置
JP5163526B2 (ja) 2008-02-15 2013-03-13 セイコーエプソン株式会社 スケールの製造方法、およびスケール
DE102008018491B3 (de) * 2008-04-11 2009-09-17 Giesecke & Devrient Gmbh Verfahren und Vorrichtung zum Implantieren eines Chipmoduls in einen Chipkartenkörper
CN201233609Y (zh) * 2008-05-05 2009-05-06 北京握奇数据系统有限公司 身份识别卡、智能卡和铳切卡的装置
TWI448370B (zh) * 2009-06-04 2014-08-11 Au Optronics Corp 沖切機台及定位沖切方法
KR20140068109A (ko) * 2011-09-28 2014-06-05 게말토 테크놀로지 아시아 엘티디 마이크로회로가 제공된 데이터 캐리어의 제조 방법
JP5679944B2 (ja) * 2011-09-30 2015-03-04 株式会社東芝 Ｉｃカードのｉｃモジュール、これを備えたｉｃカード、およびｉｃモジュールの製造方法
EP2886267A1 (fr) 2013-12-17 2015-06-24 Gemalto SA Procédé et dispositif de mise en place d'un insert dans une cavité formée dans un produit en feuille mince

Also Published As

Publication number Publication date
DE102014000133B4 (de) 2015-10-15
RS64178B1 (sr) 2023-05-31
KR101941932B1 (ko) 2019-01-24
JP6490085B2 (ja) 2019-03-27
EP3095075A1 (de) 2016-11-23
JP2017504970A (ja) 2017-02-09
CN105980076B (zh) 2018-02-13
ES2943338T3 (es) 2023-06-12
US20160257019A1 (en) 2016-09-08
CA2929057C (en) 2022-05-17
WO2015104011A1 (de) 2015-07-16
PT3095075T (pt) 2023-04-26
DE102014000133A1 (de) 2015-07-16
PL3095075T3 (pl) 2023-07-03
KR20160110376A (ko) 2016-09-21
MY185383A (en) 2021-05-16
CA2929057A1 (en) 2015-07-16
HUE061643T2 (hu) 2023-07-28
HK1223886A1 (zh) 2017-08-11
EP3095075B1 (de) 2023-03-01
CN105980076A (zh) 2016-09-28

Similar Documents

Publication Publication Date Title
PT3095075T (pt) Processo e dispositivo para o tratamento de um substrato
PT2960016T (pt) Um sistema de processamento e método para uma superfície de peça de trabalho
SG11201606136UA (en) Method and device for bonding substrates
EP3204787A4 (en) Device and method for orientation and positioning
PT3123975T (pt) Corpo digitalizador
PL3174650T3 (pl) Urządzenie wykrawające oraz sposób wykrawania elementu obrabianego
SG11201607363TA (en) Methods and apparatus for rapidly cooling a substrate
GB201505042D0 (en) Methods and apparatus for cutting a substrate
EP3187301A4 (en) Tool changing method and tool changing device
SG11201704557PA (en) Method and device for prefixing substrates
EP3203791A4 (en) Method and device for enhancing positioning
PL3362261T3 (pl) Sposób i urządzenie do wytwarzania przedmiotu obrabianego
PL3218149T3 (pl) Urządzenie uchwytowe, urządzenie do obróbki i sposób obróbki
PT3167989T (pt) Dispositivo de fresagem bem como método para a realização de uma fresagem no interior de uma ranhura
PL3215326T3 (pl) Urządzenie obróbcze do przedmiotów obrabianych oraz odpowiedni sposób
EP3103576A4 (en) Machining device and machining method
PL3237183T3 (pl) Sposób i urządzenie do wytwarzania komponentu wielowarstwowego
EP3182773A4 (en) Positioning method and electronic device
PL3385198T3 (pl) Urządzenie i sposób pozycjonowania produktów
EP3115638A4 (en) Vibration-damping device and method for manufacturing vibration-damping device
EP3211945A4 (en) Positioning method and device
EP3110214A4 (en) Positioning device and method
GB2535206B (en) A device and method for retaining a nut
GB2539611B (en) Belt-finishing device and method for operating a belt-finishing device
GB2537546B (en) Method and device for activating and deactivating a gs-tool