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SG184233A1 - HIGH-PURITY Cu BONDING WIRE - Google Patents

HIGH-PURITY Cu BONDING WIRE Download PDF

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Publication number
SG184233A1
SG184233A1 SG2012070769A SG2012070769A SG184233A1 SG 184233 A1 SG184233 A1 SG 184233A1 SG 2012070769 A SG2012070769 A SG 2012070769A SG 2012070769 A SG2012070769 A SG 2012070769A SG 184233 A1 SG184233 A1 SG 184233A1
Authority
SG
Singapore
Prior art keywords
wire
bonding
high purity
ball
alloy wire
Prior art date
Application number
SG2012070769A
Other languages
English (en)
Inventor
Tsutomu Yamashita
Takeshi Kuwahara
Junichi Okazaki
Original Assignee
Tanaka Densi Kogyo K K
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Densi Kogyo K K filed Critical Tanaka Densi Kogyo K K
Publication of SG184233A1 publication Critical patent/SG184233A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • H—ELECTRICITY
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05599—Material
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    • H01L2224/05617—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/05624—Aluminium [Al] as principal constituent
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    • H01L2224/852—Applying energy for connecting
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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Wire Bonding (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
SG2012070769A 2010-03-25 2010-03-25 HIGH-PURITY Cu BONDING WIRE SG184233A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2010/055281 WO2011118009A1 (ja) 2010-03-25 2010-03-25 高純度Ｃｕボンディングワイヤ

Publications (1)

Publication Number Publication Date
SG184233A1 true SG184233A1 (en) 2012-10-30

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Family Applications (1)

Application Number Title Priority Date Filing Date
SG2012070769A SG184233A1 (en) 2010-03-25 2010-03-25 HIGH-PURITY Cu BONDING WIRE

Country Status (4)

Country Link
KR (1) KR101280053B1 (ja)
MY (1) MY166908A (ja)
SG (1) SG184233A1 (ja)
WO (1) WO2011118009A1 (ja)

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JP5998758B2 (ja) 2012-08-31 2016-09-28 三菱マテリアル株式会社 荒引銅線及び巻線、並びに、荒引銅線の製造方法
JP5680773B1 (ja) * 2014-01-29 2015-03-04 千住金属工業株式会社 Ｃｕ核ボール、はんだ継手、フォームはんだおよびはんだペースト
PT3103565T (pt) 2014-02-04 2018-12-19 Senju Metal Industry Co Esfera de cu, esfera de núcleo de cu, junta de solda, pasta de solda e espuma de solda
JP6361194B2 (ja) 2014-03-14 2018-07-25 三菱マテリアル株式会社 銅鋳塊、銅線材、及び、銅鋳塊の製造方法
WO2016189752A1 (ja) 2015-05-26 2016-12-01 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
KR101688080B1 (ko) * 2015-09-09 2016-12-20 앰코 테크놀로지 코리아 주식회사 반도체 패키지
CN109763015A (zh) * 2019-03-25 2019-05-17 杭州辰卓科技有限公司 一种电子封装用阻尼型高导热耐脆断银键合线用材料

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* Cited by examiner, † Cited by third party
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JPH01291435A (ja) * 1988-05-18 1989-11-24 Mitsubishi Metal Corp 半導体装置用銅合金極細線及び半導体装置
JPH01290231A (ja) * 1988-05-18 1989-11-22 Mitsubishi Metal Corp 半導体装置用銅合金極細線及び半導体装置
JP2004064033A (ja) 2001-10-23 2004-02-26 Sumitomo Electric Wintec Inc ボンディングワイヤー
US7820913B2 (en) * 2005-01-05 2010-10-26 Nippon Steel Materials Co., Ltd. Bonding wire for semiconductor device
KR100702662B1 (ko) 2005-02-18 2007-04-02 엠케이전자 주식회사 반도체 패키징용 구리 본딩 와이어
JP4349641B1 (ja) * 2009-03-23 2009-10-21 田中電子工業株式会社 ボールボンディング用被覆銅ワイヤ

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Publication number Publication date
WO2011118009A1 (ja) 2011-09-29
KR20130004912A (ko) 2013-01-14
MY166908A (en) 2018-07-24
CN102859672A (zh) 2013-01-02
KR101280053B1 (ko) 2013-06-28

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