SG11201401464UA - Copper alloy and copper alloy forming material - Google Patents
Copper alloy and copper alloy forming materialInfo
- Publication number
- SG11201401464UA SG11201401464UA SG11201401464UA SG11201401464UA SG11201401464UA SG 11201401464U A SG11201401464U A SG 11201401464UA SG 11201401464U A SG11201401464U A SG 11201401464UA SG 11201401464U A SG11201401464U A SG 11201401464UA SG 11201401464U A SG11201401464U A SG 11201401464UA
- Authority
- SG
- Singapore
- Prior art keywords
- copper alloy
- forming material
- alloy forming
- copper
- forming
- Prior art date
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title 2
- 239000000463 material Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/05—Alloys based on copper with manganese as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
- C22C1/03—Making non-ferrous alloys by melting using master alloys
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011248731A JP5903842B2 (en) | 2011-11-14 | 2011-11-14 | Copper alloy, copper alloy plastic working material, and method for producing copper alloy plastic working material |
| PCT/JP2012/078688 WO2013073412A1 (en) | 2011-11-14 | 2012-11-06 | Copper alloy and copper alloy forming material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201401464UA true SG11201401464UA (en) | 2014-09-26 |
Family
ID=48429476
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201401464UA SG11201401464UA (en) | 2011-11-14 | 2012-11-06 | Copper alloy and copper alloy forming material |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US10458003B2 (en) |
| EP (1) | EP2781611B1 (en) |
| JP (1) | JP5903842B2 (en) |
| KR (1) | KR101727376B1 (en) |
| CN (1) | CN103890205B (en) |
| IN (1) | IN2014DN03051A (en) |
| MY (1) | MY167792A (en) |
| PH (1) | PH12014500974B1 (en) |
| SG (1) | SG11201401464UA (en) |
| TW (1) | TWI547571B (en) |
| WO (1) | WO2013073412A1 (en) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5045784B2 (en) * | 2010-05-14 | 2012-10-10 | 三菱マテリアル株式会社 | Copper alloy for electronic equipment, method for producing copper alloy for electronic equipment, and rolled copper alloy material for electronic equipment |
| TWI441931B (en) * | 2010-05-14 | 2014-06-21 | Mitsubishi Materials Corp | Copper alloy for electronic device, method for manufacturing copper alloy for electronic device, and rolled copper alloy for electronic device |
| JP5903838B2 (en) | 2011-11-07 | 2016-04-13 | 三菱マテリアル株式会社 | Copper alloy for electronic equipment, copper material for electronic equipment, copper alloy manufacturing method for electronic equipment, copper alloy plastic working material for electronic equipment, and electronic equipment parts |
| JP5903842B2 (en) | 2011-11-14 | 2016-04-13 | 三菱マテリアル株式会社 | Copper alloy, copper alloy plastic working material, and method for producing copper alloy plastic working material |
| JP5962707B2 (en) * | 2013-07-31 | 2016-08-03 | 三菱マテリアル株式会社 | Copper alloy for electronic / electric equipment, copper alloy plastic working material for electronic / electric equipment, manufacturing method of copper alloy plastic working material for electronic / electric equipment, electronic / electric equipment parts and terminals |
| JP5983589B2 (en) * | 2013-12-11 | 2016-08-31 | 三菱マテリアル株式会社 | Rolled copper alloy for electronic and electrical equipment, electronic and electrical equipment parts and terminals |
| JP6497186B2 (en) * | 2015-04-13 | 2019-04-10 | 日立金属株式会社 | Alloying element additive and method for producing copper alloy material |
| CN105112719A (en) * | 2015-09-08 | 2015-12-02 | 张超 | Copper alloy |
| CN105344741A (en) * | 2015-12-02 | 2016-02-24 | 芜湖楚江合金铜材有限公司 | Copper alloy wire with excellent processing plasticity and processing technology of copper alloy wire |
| CN106834789A (en) * | 2015-12-03 | 2017-06-13 | 黄波 | A kind of Gu-Ce-Au-B alloy lead wires and preparation method thereof |
| CN106834790A (en) * | 2015-12-03 | 2017-06-13 | 黄波 | A kind of Gu-Gd-Au-B alloy lead wires and preparation method thereof |
| CN106834787A (en) * | 2015-12-03 | 2017-06-13 | 黄波 | A kind of Gu-Pm-Au-B alloy lead wires and preparation method thereof |
| US11319615B2 (en) | 2016-03-30 | 2022-05-03 | Mitsubishi Materials Corporation | Copper alloy for electronic and electrical equipment, copper alloy plate strip for electronic and electrical equipment, component for electronic and electrical equipment, terminal, busbar, and movable piece for relay |
| US11203806B2 (en) | 2016-03-30 | 2021-12-21 | Mitsubishi Materials Corporation | Copper alloy for electronic and electrical equipment, copper alloy plate strip for electronic and electrical equipment, component for electronic and electrical equipment, terminal, busbar, and movable piece for relay |
| JP2018077942A (en) * | 2016-11-07 | 2018-05-17 | 住友電気工業株式会社 | Covered wire, wire with terminal, copper alloy wire, and copper alloy twisted wire |
| KR102452709B1 (en) * | 2017-05-30 | 2022-10-11 | 현대자동차주식회사 | Alloy for garnish of vehicle and garnish for vehicle |
| CN107904432B (en) * | 2017-11-07 | 2019-08-30 | 江西理工大学 | A Method for Steadily Controlling Composition of Continuously Cast Copper-Chromium-Titanium-Zirconium Alloy Rods in Atmospheric Environment |
| MX2020009869A (en) | 2018-03-30 | 2020-10-12 | Mitsubishi Materials Corp | Copper alloy for electronic/electric device, copper alloy sheet/strip material for electronic/electric device, component for electronic/electric device, terminal, and busbar. |
| JP6780187B2 (en) | 2018-03-30 | 2020-11-04 | 三菱マテリアル株式会社 | Copper alloys for electronic / electrical equipment, copper alloy strips for electronic / electrical equipment, parts for electronic / electrical equipment, terminals, and busbars |
| JP2021127495A (en) * | 2020-02-13 | 2021-09-02 | 三菱マテリアル株式会社 | Copper alloy rods, electronic and electrical equipment parts, terminals and coil springs |
| CN112575213A (en) * | 2020-10-14 | 2021-03-30 | 陕西斯瑞新材料股份有限公司 | Metal processing technology for preparing laser coating nozzle from copper alloy material |
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| JP5045783B2 (en) * | 2010-05-14 | 2012-10-10 | 三菱マテリアル株式会社 | Copper alloy for electronic equipment, method for producing copper alloy for electronic equipment, and rolled copper alloy material for electronic equipment |
| JP5712585B2 (en) | 2010-12-03 | 2015-05-07 | 三菱マテリアル株式会社 | Copper alloy for electronic equipment, method for producing copper alloy for electronic equipment, and rolled copper alloy material for electronic equipment |
| CN102206766B (en) | 2011-05-03 | 2012-11-21 | 中国西电集团公司 | Method for controlling magnesium content in copper-magnesium alloy casting process |
| JP5703975B2 (en) | 2011-06-06 | 2015-04-22 | 三菱マテリアル株式会社 | Copper alloy for electronic equipment, method for producing copper alloy for electronic equipment, and rolled copper alloy material for electronic equipment |
| JP5903832B2 (en) | 2011-10-28 | 2016-04-13 | 三菱マテリアル株式会社 | Copper alloy for electronic equipment, method for producing copper alloy for electronic equipment, rolled copper alloy material for electronic equipment, and electronic equipment parts |
| JP5910004B2 (en) * | 2011-11-07 | 2016-04-27 | 三菱マテリアル株式会社 | Copper alloy for electronic equipment, method for producing copper alloy for electronic equipment, copper alloy plastic working material for electronic equipment and electronic equipment parts |
| JP5903838B2 (en) | 2011-11-07 | 2016-04-13 | 三菱マテリアル株式会社 | Copper alloy for electronic equipment, copper material for electronic equipment, copper alloy manufacturing method for electronic equipment, copper alloy plastic working material for electronic equipment, and electronic equipment parts |
| JP5903842B2 (en) | 2011-11-14 | 2016-04-13 | 三菱マテリアル株式会社 | Copper alloy, copper alloy plastic working material, and method for producing copper alloy plastic working material |
| JP2013104095A (en) | 2011-11-14 | 2013-05-30 | Mitsubishi Materials Corp | Copper alloy for electronic equipment, method of manufacturing copper alloy for electronic equipment, plastically worked material of copper alloy for electronic equipment, and component for electronic equipment |
| JP5962707B2 (en) | 2013-07-31 | 2016-08-03 | 三菱マテリアル株式会社 | Copper alloy for electronic / electric equipment, copper alloy plastic working material for electronic / electric equipment, manufacturing method of copper alloy plastic working material for electronic / electric equipment, electronic / electric equipment parts and terminals |
-
2011
- 2011-11-14 JP JP2011248731A patent/JP5903842B2/en active Active
-
2012
- 2012-11-06 EP EP12849153.7A patent/EP2781611B1/en active Active
- 2012-11-06 US US14/353,924 patent/US10458003B2/en active Active
- 2012-11-06 MY MYPI2014700927A patent/MY167792A/en unknown
- 2012-11-06 SG SG11201401464UA patent/SG11201401464UA/en unknown
- 2012-11-06 IN IN3051DEN2014 patent/IN2014DN03051A/en unknown
- 2012-11-06 CN CN201280049749.4A patent/CN103890205B/en active Active
- 2012-11-06 PH PH1/2014/500974A patent/PH12014500974B1/en unknown
- 2012-11-06 WO PCT/JP2012/078688 patent/WO2013073412A1/en not_active Ceased
- 2012-11-06 KR KR1020147009375A patent/KR101727376B1/en active Active
- 2012-11-07 TW TW101141342A patent/TWI547571B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| JP5903842B2 (en) | 2016-04-13 |
| TWI547571B (en) | 2016-09-01 |
| PH12014500974A1 (en) | 2014-06-09 |
| KR101727376B1 (en) | 2017-04-14 |
| EP2781611B1 (en) | 2018-01-03 |
| US20140290805A1 (en) | 2014-10-02 |
| PH12014500974B1 (en) | 2019-12-06 |
| KR20140092811A (en) | 2014-07-24 |
| CN103890205A (en) | 2014-06-25 |
| CN103890205B (en) | 2016-01-20 |
| JP2013104101A (en) | 2013-05-30 |
| MY167792A (en) | 2018-09-26 |
| TW201341545A (en) | 2013-10-16 |
| WO2013073412A1 (en) | 2013-05-23 |
| IN2014DN03051A (en) | 2015-05-08 |
| EP2781611A4 (en) | 2015-05-20 |
| EP2781611A1 (en) | 2014-09-24 |
| US10458003B2 (en) | 2019-10-29 |
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