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SG10201407704TA - Device and method for inspecting moving semiconductor wafers - Google Patents

Device and method for inspecting moving semiconductor wafers

Info

Publication number
SG10201407704TA
SG10201407704TA SG10201407704TA SG10201407704TA SG10201407704TA SG 10201407704T A SG10201407704T A SG 10201407704TA SG 10201407704T A SG10201407704T A SG 10201407704TA SG 10201407704T A SG10201407704T A SG 10201407704TA SG 10201407704T A SG10201407704T A SG 10201407704TA
Authority
SG
Singapore
Prior art keywords
semiconductor wafers
detecting
inspecting
wafer
moving semiconductor
Prior art date
Application number
SG10201407704TA
Inventor
Philippe Gastaldo
Frédéric Pernot
Olivier Piffard
Original Assignee
Altatech Semiconductor
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Altatech Semiconductor filed Critical Altatech Semiconductor
Publication of SG10201407704TA publication Critical patent/SG10201407704TA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/47—Scattering, i.e. diffuse reflection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9503—Wafer edge inspection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

DEVICE AND METHOD FOR INSPECTING MOVING SEMICONDUCTOR WAFERS Device for inspecting defects in semiconductor wafers, comprising a member for detecting surface defects using variations in the slope of a surface of the wafer, a member for detecting surface defects using variations in the light intensity reflected by a surface of the wafer, at a plurality of points, a member for detecting light intensity scattered by the surface of the wafer, a light source, and a detecting and classifying mechanism connected upstream of said detecting members. FIG. 1
SG10201407704TA 2010-05-06 2011-05-04 Device and method for inspecting moving semiconductor wafers SG10201407704TA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1001958A FR2959864B1 (en) 2010-05-06 2010-05-06 DEVICE AND METHOD FOR INSPECTING SEMICONDUCTOR MOVING PLATELETS.

Publications (1)

Publication Number Publication Date
SG10201407704TA true SG10201407704TA (en) 2014-12-30

Family

ID=43086412

Family Applications (2)

Application Number Title Priority Date Filing Date
SG2012077640A SG184943A1 (en) 2010-05-06 2011-05-04 Device and method for inspecting moving semiconductor wafers
SG10201407704TA SG10201407704TA (en) 2010-05-06 2011-05-04 Device and method for inspecting moving semiconductor wafers

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG2012077640A SG184943A1 (en) 2010-05-06 2011-05-04 Device and method for inspecting moving semiconductor wafers

Country Status (6)

Country Link
US (1) US8817249B2 (en)
JP (1) JP5840677B2 (en)
FR (1) FR2959864B1 (en)
IL (1) IL222480A (en)
SG (2) SG184943A1 (en)
WO (1) WO2011138524A1 (en)

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CN111238392B (en) * 2018-11-28 2021-11-02 Oppo（重庆）智能科技有限公司 Carrier and detection device of electronic equipment
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TWI718594B (en) * 2019-07-19 2021-02-11 和淞科技股份有限公司 Wafer inspection machine and wafer inspection method
CN110617771B (en) * 2019-10-18 2024-07-12 杭州中为光电技术有限公司 Device for automatically detecting thickness of sapphire wafer
KR102453258B1 (en) * 2020-01-15 2022-10-11 주식회사 커미조아 Apparatus and Method for Detecting of Awafer Edge
CN111156931A (en) * 2020-02-25 2020-05-15 成都威博恩科技有限公司 A high-precision flatness detection device and method
WO2021202029A1 (en) * 2020-04-02 2021-10-07 Applied Materials, Inc. Inspection system
CN112040123B (en) * 2020-08-26 2021-09-28 浙江中烟工业有限责任公司 Automatic all-round collection system of piece cigarette package vision of angle regulation
US11686690B2 (en) * 2020-11-12 2023-06-27 Kla Corporation System and method for inspection and metrology of four sides of semiconductor devices
CN112304957A (en) * 2020-11-20 2021-02-02 天津朗硕机器人科技有限公司 Machine vision-based intelligent detection method and system for appearance defects
CN112730460A (en) * 2020-12-08 2021-04-30 北京航天云路有限公司 Welding defect and intensive rosin joint detection technology for communication IC chip
CN113092500A (en) * 2021-03-30 2021-07-09 福建晶安光电有限公司 Device for detecting substrate and using method thereof
CN113720853B (en) * 2021-09-07 2024-06-25 中国烟草总公司郑州烟草研究院 A device for rapid detection of cigar appearance with continuous relay between belts
CN114420581A (en) * 2021-12-10 2022-04-29 浙江大学杭州国际科创中心 Device and method for detecting microcracks inside wafer
CN115078402B (en) * 2022-06-15 2025-02-11 西安奕斯伟材料科技股份有限公司 System for detecting silicon wafer
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Also Published As

Publication number Publication date
US8817249B2 (en) 2014-08-26
IL222480A (en) 2016-12-29
IL222480A0 (en) 2012-12-31
FR2959864B1 (en) 2013-01-18
WO2011138524A1 (en) 2011-11-10
US20130044316A1 (en) 2013-02-21
WO2011138524A9 (en) 2011-12-29
JP2013527925A (en) 2013-07-04
JP5840677B2 (en) 2016-01-06
FR2959864A1 (en) 2011-11-11
SG184943A1 (en) 2012-12-28

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