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PH12011000187A1 - Wafer converying device and location sensing system and vision inspecting system having the same - Google Patents

Wafer converying device and location sensing system and vision inspecting system having the same

Info

Publication number
PH12011000187A1
PH12011000187A1 PH1/2011/000187A PH12011000187A PH12011000187A1 PH 12011000187 A1 PH12011000187 A1 PH 12011000187A1 PH 12011000187 A PH12011000187 A PH 12011000187A PH 12011000187 A1 PH12011000187 A1 PH 12011000187A1
Authority
PH
Philippines
Prior art keywords
wafer
same
converying
location sensing
sensing system
Prior art date
Application number
PH1/2011/000187A
Inventor
Chang Hyun Kim
Kyung Shik Lee
Jai Young Lim
Original Assignee
Hanmi Semiconductor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hanmi Semiconductor Co Ltd filed Critical Hanmi Semiconductor Co Ltd
Publication of PH12011000187A1 publication Critical patent/PH12011000187A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G23/00—Driving gear for endless conveyors; Belt- or chain-tensioning arrangements
    • B65G23/02—Belt- or chain-engaging elements
    • B65G23/04—Drums, rollers, or wheels
    • B65G23/08—Drums, rollers, or wheels with self-contained driving mechanisms, e.g. motors and associated gearing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B65G49/065—Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Nonlinear Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

A wafer conveying device to stably convey a wafer during inspection of the wafer, thereby improving reliability of total thickness variation measurement, and a location sensing system having the same are disclosed.
PH1/2011/000187A 2010-05-25 2011-05-25 Wafer converying device and location sensing system and vision inspecting system having the same PH12011000187A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020100048360A KR20110128988A (en) 2010-05-25 2010-05-25 Wafer Transfer Device, Position Measuring System and Vision Inspection System

Publications (1)

Publication Number Publication Date
PH12011000187A1 true PH12011000187A1 (en) 2012-12-10

Family

ID=45009718

Family Applications (1)

Application Number Title Priority Date Filing Date
PH1/2011/000187A PH12011000187A1 (en) 2010-05-25 2011-05-25 Wafer converying device and location sensing system and vision inspecting system having the same

Country Status (4)

Country Link
KR (1) KR20110128988A (en)
CN (1) CN102263160B (en)
PH (1) PH12011000187A1 (en)
TW (1) TWI440120B (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130140135A1 (en) * 2011-12-02 2013-06-06 Lian Hok Tan Belt conveyor for conveying solar wafers during fabrication
CN102679890A (en) * 2012-04-28 2012-09-19 亚亚科技股份有限公司 Crystal column detection device
TWI472767B (en) * 2014-01-22 2015-02-11 Utechzone Co Ltd Detection device
CN106062974A (en) * 2014-02-20 2016-10-26 应用材料意大利有限公司 Solar cell processing system, conveyor belt system, solar cell production installation and method
TWI559423B (en) * 2014-11-04 2016-11-21 梭特科技股份有限公司 Die image capture device
CN104392949B (en) * 2014-12-16 2017-11-10 北京中电科电子装备有限公司 A kind of remote chip Transmission system
AU2018247224B2 (en) 2017-10-17 2022-07-14 Joy Global Underground Mining Llc Sensor systems and methods for detecting conveyor tension in a mining system
CN108580330A (en) * 2018-04-25 2018-09-28 嘉兴能发电子科技有限公司 A kind of solar energy polycrystalline silicon sheet quality apparatus for automatically sorting and sorting technique
KR102232290B1 (en) 2018-12-31 2021-03-25 주식회사 포휴 Foldable Apparatus for Flexible Display with Vision Inspection Apparatus
CN110108716A (en) * 2019-05-06 2019-08-09 华侨大学 A kind of automation substrate wafer defect and thickness detecting system
CN111077161A (en) * 2020-01-18 2020-04-28 广东捷创智能装备有限公司 Automatic capacitor full-detection machine and detection method
KR102840202B1 (en) 2020-07-31 2025-07-31 삼성전자주식회사 Semiconductor substrate processing apparatus and semiconductor substrate measuring apparatus using the same
KR102412936B1 (en) * 2020-09-28 2022-06-24 주식회사 알티넷 Image printing device of Respiratory protection mask
JP7657043B2 (en) * 2020-12-07 2025-04-04 株式会社ディスコ Wafer Generation Equipment
KR102438398B1 (en) * 2021-01-15 2022-08-31 주식회사 엘에이티 Conveyor module for transferring wafers and wafer transfer system including the same
CN114093801A (en) * 2021-12-21 2022-02-25 张家港市德昶自动化科技有限公司 Silicon wafer slicing device
CN117104775B (en) * 2023-10-20 2023-12-26 江苏希太芯科技有限公司 Infrared detection device for detecting thickness of semiconductor wafer
EP4640588A1 (en) * 2024-04-25 2025-10-29 Movu An inspection system for inspecting goods entering or leaving an automated storage

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH085561B2 (en) * 1988-04-01 1996-01-24 富士写真フイルム株式会社 Sheet body transport method and mechanism
JPH0618230A (en) * 1991-07-22 1994-01-25 Hitachi Ltd Thickness measuring device
JPH1197489A (en) * 1997-09-18 1999-04-09 Hitachi Electron Eng Co Ltd IC chip mounting device
WO2007008944A1 (en) * 2005-07-11 2007-01-18 Asyst Technologies, Inc. Belt conveyor for use with semiconductor containers
KR20100046601A (en) * 2008-10-27 2010-05-07 엘지전자 주식회사 Apparatus for transferring object for inspecting both sides of the object and inspection system by using the apparatus and method for manufacturing pcb by using the system

Also Published As

Publication number Publication date
CN102263160A (en) 2011-11-30
KR20110128988A (en) 2011-12-01
TWI440120B (en) 2014-06-01
TW201201314A (en) 2012-01-01
CN102263160B (en) 2014-01-29

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