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RU2018105135A - HOUSING FOR ELECTRICAL DEVICE - Google Patents

HOUSING FOR ELECTRICAL DEVICE Download PDF

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Publication number
RU2018105135A
RU2018105135A RU2018105135A RU2018105135A RU2018105135A RU 2018105135 A RU2018105135 A RU 2018105135A RU 2018105135 A RU2018105135 A RU 2018105135A RU 2018105135 A RU2018105135 A RU 2018105135A RU 2018105135 A RU2018105135 A RU 2018105135A
Authority
RU
Russia
Prior art keywords
housing
cooling channel
preceding paragraphs
primarily
heat sink
Prior art date
Application number
RU2018105135A
Other languages
Russian (ru)
Other versions
RU2018105135A3 (en
Inventor
Роберт ДЕНТ
Original Assignee
Штего-Холдинг Гмбх
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Штего-Холдинг Гмбх filed Critical Штего-Холдинг Гмбх
Publication of RU2018105135A publication Critical patent/RU2018105135A/en
Publication of RU2018105135A3 publication Critical patent/RU2018105135A3/ru

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20127Natural convection
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1422Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427Housings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06Thermal details
    • H05K2201/066Heatsink mounted on the surface of the printed circuit board [PCB]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Claims (15)

1. Корпус (1) для электрического устройства, причем по меньшей мере одна первая часть (15) нижней внешней стенки корпуса (1) смещена назад относительно второй части нижней внешней стенки (10) корпуса (1) для образования охлаждающего канала (20) на нижней стороне корпуса (1), и причем в корпусе (1), гранича с охлаждающим каналом (20), является располагаемым теплоотвод (70) электрического устройства таким образом, что отдаваемое теплоотводом (70) тепло является отводимым посредством охлаждающего канала (20).1. A housing (1) for an electrical device, wherein at least one first part (15) of the lower outer wall of the housing (1) is offset backward relative to the second part of the lower outer wall (10) of the housing (1) to form a cooling channel (20) by the lower side of the housing (1), and moreover, in the housing (1), bordering the cooling channel (20), there is an available heat sink (70) of the electrical device so that the heat provided by the heat sink (70) is removed through the cooling channel (20). 2. Корпус (1) по п. 1, причем охлаждающий канал (20) выполнен открытым в направлении окружающей среды.2. The housing (1) according to claim 1, wherein the cooling channel (20) is made open in the direction of the environment. 3. Корпус (1) по п. 1 или 2, причем охлаждающий канал (20) в поперечном сечении перпендикулярно нижней внешней стенке (10) корпуса (1) имеет по существу трапециевидную форму, прежде всего по существу форму равнобедренной трапеции.3. The housing (1) according to claim 1 or 2, wherein the cooling channel (20) in cross section perpendicular to the lower outer wall (10) of the housing (1) has a substantially trapezoidal shape, primarily a substantially isosceles trapezoid shape. 4. Корпус (1) по одному из предшествующих пунктов, причем охлаждающий канал (20) имеет проходящие, прежде всего, перпендикулярно наибольшей продольной протяженности (продольному направлению) корпуса (1) охлаждающие ребра.4. The housing (1) according to one of the preceding paragraphs, wherein the cooling channel (20) has cooling fins extending primarily perpendicularly to the greatest longitudinal extent (longitudinal direction) of the housing (1). 5. Корпус (1) по одному из предшествующих пунктов, причем корпус (1) в области охлаждающего канала (20) имеет первые отверстия (30) для соединения охлаждающего канала (20) с внутренней стороной корпуса (1).5. The housing (1) according to one of the preceding paragraphs, and the housing (1) in the area of the cooling channel (20) has first openings (30) for connecting the cooling channel (20) with the inside of the housing (1). 6. Корпус (1) по одному из предшествующих пунктов, прежде всего по п. 5, причем первые отверстия (30) проходят под острым углом к наибольшей продольной протяженности (продольному направлению) охлаждающего канала (20), прежде всего под углом в диапазоне приблизительно от 35° приблизительно до 70°, преимущественным образом под углом около 45°, к наибольшей продольной протяженности (продольному направлению) охлаждающего канала (20).6. The housing (1) according to one of the preceding paragraphs, primarily according to claim 5, wherein the first holes (30) extend at an acute angle to the greatest longitudinal extent (longitudinal direction) of the cooling channel (20), primarily at an angle in the range of approximately from 35 ° to about 70 °, mainly at an angle of about 45 °, to the greatest longitudinal extent (longitudinal direction) of the cooling channel (20). 7. Корпус (1) по одному из предшествующих пунктов, причем охлаждающий канал (20) выполнен в нижней внешней стенке (10) корпуса (1) по существу посредине.7. The housing (1) according to one of the preceding paragraphs, and the cooling channel (20) is made in the lower outer wall (10) of the housing (1) essentially in the middle. 8. Корпус (1) по одному из предшествующих пунктов, причем охлаждающий канал (20) простирается по существу по всей длине корпуса (1).8. The housing (1) according to one of the preceding paragraphs, and the cooling channel (20) extends essentially along the entire length of the housing (1). 9. Корпус (1) по одному из предшествующих пунктов, причем по меньшей мере одна боковая стенка (40, 40'), прежде всего обе боковые стенки (40, 40'), охлаждающего канала (20) имеет вторые отверстия (35, 35') для соединения охлаждающего канала (20) с внутренней стороной корпуса (1).9. The housing (1) according to one of the preceding paragraphs, wherein at least one side wall (40, 40 ′), especially both side walls (40, 40 ′) of the cooling channel (20) has second openings (35, 35 ') for connecting the cooling channel (20) to the inside of the housing (1). 10. Корпус (1) по одному из предшествующих пунктов, причем охлаждающий канал (20) имеет ширину, которая соответствует по меньшей мере приблизительно одной трети от общей ширины корпуса (1), прежде всего приблизительно половине общей ширины корпуса (1).10. The housing (1) according to one of the preceding paragraphs, wherein the cooling channel (20) has a width that corresponds to at least about one third of the total width of the housing (1), especially about half of the total width of the housing (1). 11. Корпус (1) по одному из предшествующих пунктов, включающий также электрическое устройство, причем электрическое устройство расположено в корпусе (1), и причем в корпусе (1), гранича с охлаждающим каналом (20), расположен теплоотвод (70) электрического устройства таким образом, что отдаваемое теплоотводом (70) тепло является отводимым посредством охлаждающего канала (20).11. The housing (1) according to one of the preceding paragraphs, which also includes an electrical device, the electrical device being located in the housing (1), and moreover, in the housing (1), adjacent to the cooling channel (20), a heat sink (70) of the electrical device is located so that the heat given off by the heat sink (70) is removed through the cooling channel (20). 12. Корпус (1) по одному из предшествующих пунктов, прежде всего по п. 11, причем электрическое устройство содержит печатную плату (60), и причем теплоотвод (70) является теплоотводом печатной платы (60) электрического устройства.12. The housing (1) according to one of the preceding paragraphs, primarily according to claim 11, wherein the electrical device comprises a printed circuit board (60), and wherein the heat sink (70) is the heat sink of the printed circuit board (60) of the electrical device. 13. Корпус (1) по одному из предшествующих пунктов, прежде всего по п. 12, причем теплоотвод (70) расположен между печатной платой (60) и охлаждающим каналом (20).13. The housing (1) according to one of the preceding paragraphs, primarily according to claim 12, wherein the heat sink (70) is located between the printed circuit board (60) and the cooling channel (20). 14. Корпус (1) по одному из предшествующих пунктов, прежде всего по одному из пп. 11-13, причем теплоотвод (70) содержит соединенные с печатной платой (60) провода, прежде всего соединенные с печатной платой (60) медные провода, для отведения тепла в охлаждающий канал (20).14. The building (1) according to one of the preceding paragraphs, primarily according to one of paragraphs. 11-13, and the heat sink (70) contains wires connected to the printed circuit board (60), primarily copper wires connected to the printed circuit board (60), to remove heat into the cooling channel (20). 15. Корпус (1) по одному из предшествующих пунктов, прежде всего по одному из пп. 12-14, причем печатная плата (60) расположена в корпусе (1) таким образом, что охлаждаемой является как верхняя сторона, так и находящаяся напротив верхней стороны нижняя сторона печатной платы (60).15. The building (1) according to one of the preceding paragraphs, primarily according to one of paragraphs. 12-14, the printed circuit board (60) being located in the housing (1) in such a way that both the upper side and the lower side of the printed circuit board (60) opposite the upper side are cooled.
RU2018105135A 2015-07-13 2016-07-07 HOUSING FOR ELECTRICAL DEVICE RU2018105135A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102015111298.1A DE102015111298B3 (en) 2015-07-13 2015-07-13 Housing for an electrical device and arrangement comprising such a housing with an electrical device disposed therein
DE102015111298.1 2015-07-13
PCT/EP2016/066071 WO2017009159A1 (en) 2015-07-13 2016-07-07 Housing for an electrical device

Publications (2)

Publication Number Publication Date
RU2018105135A true RU2018105135A (en) 2019-08-13
RU2018105135A3 RU2018105135A3 (en) 2019-08-13

Family

ID=56550844

Family Applications (1)

Application Number Title Priority Date Filing Date
RU2018105135A RU2018105135A (en) 2015-07-13 2016-07-07 HOUSING FOR ELECTRICAL DEVICE

Country Status (6)

Country Link
US (1) US20180206360A1 (en)
EP (1) EP3323279A1 (en)
JP (1) JP2018522420A (en)
DE (1) DE102015111298B3 (en)
RU (1) RU2018105135A (en)
WO (1) WO2017009159A1 (en)

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Also Published As

Publication number Publication date
JP2018522420A (en) 2018-08-09
WO2017009159A1 (en) 2017-01-19
DE102015111298B3 (en) 2016-10-13
EP3323279A1 (en) 2018-05-23
RU2018105135A3 (en) 2019-08-13
US20180206360A1 (en) 2018-07-19

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Legal Events

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FA92 Acknowledgement of application withdrawn (lack of supplementary materials submitted)

Effective date: 20200214