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PT787348E - Composicao de moldagem de resina epoxica - Google Patents

Composicao de moldagem de resina epoxica

Info

Publication number
PT787348E
PT787348E PT95924261T PT95924261T PT787348E PT 787348 E PT787348 E PT 787348E PT 95924261 T PT95924261 T PT 95924261T PT 95924261 T PT95924261 T PT 95924261T PT 787348 E PT787348 E PT 787348E
Authority
PT
Portugal
Prior art keywords
epoxy resin
glycidyl
beta
resin molding
components
Prior art date
Application number
PT95924261T
Other languages
English (en)
Inventor
Werner Hollstein
Werner Pfander
Irene Jennrich
Rolf Grebenstein
Original Assignee
Bosch Gmbh Robert
Vantico Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert, Vantico Ag filed Critical Bosch Gmbh Robert
Publication of PT787348E publication Critical patent/PT787348E/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4223—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12528—Semiconductor component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Insulating Of Coils (AREA)
  • Organic Insulating Materials (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
  • Acyclic And Carbocyclic Compounds In Medicinal Compositions (AREA)
  • Medicines Containing Plant Substances (AREA)
PT95924261T 1994-07-01 1995-06-17 Composicao de moldagem de resina epoxica PT787348E (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH211994 1994-07-01

Publications (1)

Publication Number Publication Date
PT787348E true PT787348E (pt) 2003-12-31

Family

ID=4226319

Family Applications (1)

Application Number Title Priority Date Filing Date
PT95924261T PT787348E (pt) 1994-07-01 1995-06-17 Composicao de moldagem de resina epoxica

Country Status (11)

Country Link
US (2) US5872163A (pt)
EP (1) EP0787348B1 (pt)
JP (1) JP3896529B2 (pt)
KR (1) KR100366481B1 (pt)
AT (1) ATE247326T1 (pt)
AU (1) AU692890B2 (pt)
DE (1) DE69531500T2 (pt)
ES (1) ES2203643T3 (pt)
HU (1) HU220297B (pt)
PT (1) PT787348E (pt)
WO (1) WO1996001481A1 (pt)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6103157A (en) * 1997-07-02 2000-08-15 Ciba Specialty Chemicals Corp. Process for impregnating electrical coils
JP3422252B2 (ja) * 1998-04-22 2003-06-30 株式会社日立製作所 高電圧トランスおよびそれを用いた点火トランス
DE19910711A1 (de) * 1999-03-10 2000-09-14 Bakelite Ag Imprägniervergußmassen, ihre Verwendung sowie ein Verfahren zur Imprägnierung von Zündspulen
US6758993B2 (en) * 2002-04-17 2004-07-06 Delphi Technologies, Inc. System and method for minimizing cure-induced residual stress in an epoxy impregnated ignition coil
DE10247411B4 (de) * 2002-10-11 2012-12-20 Robert Bosch Gmbh Verfahren zur Herstellung einer bauraumoptimierten Primärdrahtwicklung für eine Stabzündspule
US7671114B2 (en) * 2004-01-26 2010-03-02 Henkel Corporation Adhesive of substituted oxirane or oxetane compound with silver-based, lead-free solder
DE102005060860A1 (de) * 2005-12-20 2007-06-28 Robert Bosch Gmbh Elektronikkomponente mit Vergussmasse
WO2007119763A1 (ja) * 2006-04-13 2007-10-25 Ntn Corporation 封孔処理剤、溶射被膜被覆部材および軸受
ES2341375T3 (es) * 2007-04-03 2010-06-18 Abb Research Ltd Composicion de resina epoxi curable.
JP5256795B2 (ja) * 2008-03-14 2013-08-07 住友ベークライト株式会社 熱硬化性樹脂成形材料
US7982133B2 (en) * 2008-08-29 2011-07-19 Pratt & Whitney Canada Corp. Crack controlled resin insulated electrical coil
KR101555191B1 (ko) * 2009-02-11 2015-09-24 삼성전자 주식회사 카본/에폭시 수지 조성물 및 이를 이용한 카본-에폭시 유전막의 제조방법
DE102009012195A1 (de) * 2009-03-06 2010-09-09 Siemens Aktiengesellschaft Gießharzsystem für Isolatoren mit erhöhter Wärmeformbeständigkeit
JP5483696B2 (ja) * 2010-01-07 2014-05-07 株式会社Ａｄｅｋａ 硬化性樹脂組成物
US9751107B2 (en) 2012-03-21 2017-09-05 Valspar Sourcing, Inc. Two-coat single cure powder coating
WO2013142149A1 (en) * 2012-03-21 2013-09-26 Valspar Sourcing, Inc. Application package for powder coating
EP4079935A3 (en) 2012-03-21 2023-01-25 Swimc Llc Two-coat single cure powder coating
CN105229078A (zh) * 2013-03-15 2016-01-06 等离子系统控股公司 多功能环氧浇注树脂体系
JP6318518B2 (ja) * 2013-09-26 2018-05-09 住友ベークライト株式会社 エポキシ樹脂成形材料、モールドコイルの製造方法及びモールドコイル
EP2933019A1 (en) 2014-04-15 2015-10-21 Henkel AG&Co. KGAA Storage stable heat activated quaternary ammonium catalysts for epoxy cure
JP6657566B2 (ja) * 2015-02-24 2020-03-04 三菱ケミカル株式会社 低粘度樹脂組成物
WO2016013622A1 (ja) * 2014-07-24 2016-01-28 三菱化学株式会社 熱硬化性樹脂組成物及びその成形体
WO2016039232A1 (ja) * 2014-09-11 2016-03-17 株式会社カネカ 注型用エポキシ樹脂組成物
KR101900640B1 (ko) 2015-03-27 2018-09-19 도레이 카부시키가이샤 섬유 강화 복합재료용 2액형 에폭시 수지 조성물 및 섬유 강화 복합재료
FR3091406B1 (fr) 2018-12-31 2021-01-15 Centre National De Recherche Scient Cnrs Matériau pour l’isolation électrique et procédé de fabrication
JP2021161310A (ja) * 2020-04-01 2021-10-11 株式会社東芝 注型樹脂、および密閉型絶縁装置
CN117682796A (zh) * 2023-12-20 2024-03-12 华能中天节能科技集团有限责任公司 一种防水岩棉保温板及其制备方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0008048B1 (en) * 1978-07-31 1984-01-18 Sumitomo Bakelite Company Limited A method of manufacturing an electrical article
DE3006491C2 (de) * 1980-02-21 1983-01-05 Streif AG, 5461 Vettelschoß Versetzbares, an einem Bauwerk verankertes Gerüst
CA1154895A (en) * 1980-02-21 1983-10-04 Dieter Skudelny Flowable mixture and use of synthetic calcium silicate
CA1164124A (en) * 1980-07-15 1984-03-20 Kurt Munk Pourable solid mixture
DE3229558C2 (de) * 1982-08-07 1984-11-08 Robert Bosch Gmbh, 7000 Stuttgart Imprägniervergußmasse für elektrische Bauteile
JPS61106618A (ja) * 1984-10-31 1986-05-24 Nippon Soda Co Ltd 複合エポキシ樹脂の製造方法
DE3762348D1 (de) * 1986-05-07 1990-05-23 Ciba Geigy Ag Glasfaserverstaerkte epoxidharzformmasse und deren verwendung.
JPH0660294B2 (ja) * 1986-06-05 1994-08-10 ソマ−ル株式会社 エポキシ樹脂系粉体塗料組成物
EP0348193A3 (en) * 1988-06-24 1990-09-12 Somar Corporation Epoxy resin composition
US5064881A (en) * 1989-01-18 1991-11-12 Mitsui Petrochemical Industries, Ltd. Epoxy resin composition and semiconductor sealing material comprising same based on spherical silica
JPH0799915B2 (ja) * 1989-08-26 1995-10-25 株式会社日立製作所 回転電機の回転子及びその絶縁方法
EP0540467A1 (de) * 1991-10-29 1993-05-05 Ciba-Geigy Ag Stabilisierte Epoxidharz-Zusammensetzungen

Also Published As

Publication number Publication date
US6030713A (en) 2000-02-29
DE69531500D1 (de) 2003-09-18
DE69531500T2 (de) 2004-04-08
ES2203643T3 (es) 2004-04-16
KR100366481B1 (ko) 2005-01-25
WO1996001481A1 (en) 1996-01-18
EP0787348A1 (en) 1997-08-06
US5872163A (en) 1999-02-16
AU692890B2 (en) 1998-06-18
AU2884395A (en) 1996-01-25
ATE247326T1 (de) 2003-08-15
HU9603545D0 (en) 1997-02-28
HUT75581A (en) 1997-05-28
JP2000510497A (ja) 2000-08-15
JP3896529B2 (ja) 2007-03-22
HU220297B (hu) 2001-11-28
EP0787348B1 (en) 2003-08-13

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