PL3483307T3 - Kompozycje powlekające do elektrolitycznego osadzania miedzi, ich zastosowanie i sposób elektrolitycznego osadzania warstwy miedzi lub stopu miedzi na co najmniej jednej powierzchni podłoża - Google Patents
Kompozycje powlekające do elektrolitycznego osadzania miedzi, ich zastosowanie i sposób elektrolitycznego osadzania warstwy miedzi lub stopu miedzi na co najmniej jednej powierzchni podłożaInfo
- Publication number
- PL3483307T3 PL3483307T3 PL17200836T PL17200836T PL3483307T3 PL 3483307 T3 PL3483307 T3 PL 3483307T3 PL 17200836 T PL17200836 T PL 17200836T PL 17200836 T PL17200836 T PL 17200836T PL 3483307 T3 PL3483307 T3 PL 3483307T3
- Authority
- PL
- Poland
- Prior art keywords
- copper
- substrate
- alloy layer
- layer onto
- electrolytically depositing
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09B—ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES, e.g. PIGMENTS; MORDANTS; LAKES
- C09B17/00—Azine dyes
- C09B17/02—Azine dyes of the benzene series
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP17200836.9A EP3483307B1 (en) | 2017-11-09 | 2017-11-09 | Plating compositions for electrolytic copper deposition, its use and a method for electrolytically depositing a copper or copper alloy layer onto at least one surface of a substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL3483307T3 true PL3483307T3 (pl) | 2020-11-16 |
Family
ID=60293883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL17200836T PL3483307T3 (pl) | 2017-11-09 | 2017-11-09 | Kompozycje powlekające do elektrolitycznego osadzania miedzi, ich zastosowanie i sposób elektrolitycznego osadzania warstwy miedzi lub stopu miedzi na co najmniej jednej powierzchni podłoża |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US10982343B2 (pl) |
| EP (1) | EP3483307B1 (pl) |
| JP (1) | JP6836016B2 (pl) |
| KR (1) | KR102161944B1 (pl) |
| CN (1) | CN111295468B (pl) |
| BR (1) | BR112020003856B1 (pl) |
| ES (1) | ES2800292T3 (pl) |
| MX (1) | MX2020004882A (pl) |
| PL (1) | PL3483307T3 (pl) |
| PT (1) | PT3483307T (pl) |
| WO (1) | WO2019091721A1 (pl) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110438531B (zh) * | 2019-08-12 | 2021-12-24 | 湖北中一科技股份有限公司 | 一种应用于锂电池的超薄铜箔制备方法及系统 |
| CN110396704B (zh) * | 2019-08-12 | 2021-07-20 | 湖北中一科技股份有限公司 | 一种超薄电解铜箔及制备方法 |
| CN114250489B (zh) * | 2022-01-05 | 2023-09-22 | 三门峡宏鑫新材料科技有限公司 | 一种基于电沉积法制备铜铁合金的方法 |
| CN114351195A (zh) * | 2022-03-19 | 2022-04-15 | 深圳市创智成功科技有限公司 | 一种脉冲通孔填孔的电镀铜配方及其电镀工艺 |
| CN115142113B (zh) * | 2022-08-08 | 2023-10-13 | 哈尔滨工业大学 | 一种用于镍基合金的电解抛光液添加剂、抛光液及抛光方法 |
| KR20250022205A (ko) | 2022-08-31 | 2025-02-14 | 가부시끼가이샤 제이씨유 | 도금액 |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE520209A (pl) | 1952-05-26 | |||
| US3328273A (en) * | 1966-08-15 | 1967-06-27 | Udylite Corp | Electro-deposition of copper from acidic baths |
| DE2039831C3 (de) | 1970-06-06 | 1979-09-06 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Saures Bad zur galvanischen Abscheidung glänzender Kupferüberzüge |
| US4347108A (en) * | 1981-05-29 | 1982-08-31 | Rohco, Inc. | Electrodeposition of copper, acidic copper electroplating baths and additives therefor |
| DE4344387C2 (de) | 1993-12-24 | 1996-09-05 | Atotech Deutschland Gmbh | Verfahren zur elektrolytischen Abscheidung von Kupfer und Anordnung zur Durchführung des Verfahrens |
| DE19545231A1 (de) | 1995-11-21 | 1997-05-22 | Atotech Deutschland Gmbh | Verfahren zur elektrolytischen Abscheidung von Metallschichten |
| JP2000248397A (ja) * | 1999-02-26 | 2000-09-12 | Electroplating Eng Of Japan Co | 硫酸銅めっき液及びそれを用いた電解めっき方法 |
| US6444110B2 (en) * | 1999-05-17 | 2002-09-03 | Shipley Company, L.L.C. | Electrolytic copper plating method |
| KR100659544B1 (ko) | 1999-11-12 | 2006-12-19 | 에바라 유지라이토 코포레이션 리미티드 | 비아 필링 방법 |
| JP2003129274A (ja) * | 2001-10-29 | 2003-05-08 | Applied Materials Inc | 電解めっき方法 |
| DE10261852B3 (de) * | 2002-12-20 | 2004-06-03 | Atotech Deutschland Gmbh | Gemisch oligomerer Phenaziniumverbindungen und dessen Herstellungsverfahren, saures Bad zur elektrolytischen Abscheidung eines Kupferniederschlages, enthaltend die oligomeren Phenaziniumverbindungen, sowie Verfahren zum elektrolytischen Abscheiden eines Kupferniederschlages mit einem das Gemisch enthaltenden Bad |
| US20050133376A1 (en) * | 2003-12-19 | 2005-06-23 | Opaskar Vincent C. | Alkaline zinc-nickel alloy plating compositions, processes and articles therefrom |
| US7442286B2 (en) * | 2004-02-26 | 2008-10-28 | Atotech Deutschland Gmbh | Articles with electroplated zinc-nickel ternary and higher alloys, electroplating baths, processes and systems for electroplating such alloys |
| JP4499502B2 (ja) * | 2004-08-05 | 2010-07-07 | 荏原ユージライト株式会社 | めっき用レベリング剤、酸性銅めっき浴用添加剤組成物、酸性銅めっき浴および該めっき浴を用いるめっき方法 |
| JP5442188B2 (ja) * | 2007-08-10 | 2014-03-12 | ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． | 銅めっき液組成物 |
| JP2009041097A (ja) | 2007-08-10 | 2009-02-26 | Rohm & Haas Electronic Materials Llc | 銅めっき方法 |
| US8691987B2 (en) | 2010-09-24 | 2014-04-08 | Andrew M. Krol | Method of producing polymeric phenazonium compounds |
| RU2013133648A (ru) | 2010-12-21 | 2015-01-27 | Басф Се | Композиция для электролитического осаждения металлов, содержащая выравнивающий агент |
| JP5864161B2 (ja) | 2011-08-23 | 2016-02-17 | 石原ケミカル株式会社 | 銅フィリング方法及び当該方法を適用した電子部品の製造方法 |
| JP5903706B2 (ja) | 2011-08-25 | 2016-04-13 | 石原ケミカル株式会社 | 銅フィリング方法及び当該方法を適用した電子部品の製造方法 |
| CN103179806B (zh) * | 2011-12-21 | 2019-05-28 | 奥特斯有限公司 | 组合的通孔镀覆和孔填充的方法 |
| US9243339B2 (en) | 2012-05-25 | 2016-01-26 | Trevor Pearson | Additives for producing copper electrodeposits having low oxygen content |
| US20140238868A1 (en) | 2013-02-25 | 2014-08-28 | Dow Global Technologies Llc | Electroplating bath |
| CN106637311A (zh) * | 2017-02-09 | 2017-05-10 | 济南德锡科技有限公司 | 一种凹印制版电镀硬铜镀液的制备方法 |
-
2017
- 2017-11-09 PT PT172008369T patent/PT3483307T/pt unknown
- 2017-11-09 EP EP17200836.9A patent/EP3483307B1/en active Active
- 2017-11-09 ES ES17200836T patent/ES2800292T3/es active Active
- 2017-11-09 PL PL17200836T patent/PL3483307T3/pl unknown
-
2018
- 2018-10-16 BR BR112020003856-3A patent/BR112020003856B1/pt active IP Right Grant
- 2018-10-16 JP JP2020518643A patent/JP6836016B2/ja active Active
- 2018-10-16 MX MX2020004882A patent/MX2020004882A/es unknown
- 2018-10-16 US US16/642,932 patent/US10982343B2/en active Active
- 2018-10-16 KR KR1020207008219A patent/KR102161944B1/ko active Active
- 2018-10-16 CN CN201880072482.8A patent/CN111295468B/zh active Active
- 2018-10-16 WO PCT/EP2018/078281 patent/WO2019091721A1/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| PT3483307T (pt) | 2020-07-03 |
| BR112020003856A2 (pt) | 2020-09-08 |
| MX2020004882A (es) | 2020-08-06 |
| KR102161944B1 (ko) | 2020-10-06 |
| KR20200035317A (ko) | 2020-04-02 |
| JP2020536168A (ja) | 2020-12-10 |
| WO2019091721A1 (en) | 2019-05-16 |
| CN111295468A (zh) | 2020-06-16 |
| US10982343B2 (en) | 2021-04-20 |
| US20200347504A1 (en) | 2020-11-05 |
| BR112020003856B1 (pt) | 2024-01-09 |
| CN111295468B (zh) | 2021-03-30 |
| EP3483307B1 (en) | 2020-04-01 |
| EP3483307A1 (en) | 2019-05-15 |
| ES2800292T3 (es) | 2020-12-29 |
| JP6836016B2 (ja) | 2021-02-24 |
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