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PT3356579T - Banho de galvanoplastia para deposição eletroquímica de uma camada de liga de cu-sn-zn-pd, método para a deposição eletroquímica da referida camada de liga, substrato que compreende a referida camada de liga e utilizações do substrato revestido - Google Patents

Banho de galvanoplastia para deposição eletroquímica de uma camada de liga de cu-sn-zn-pd, método para a deposição eletroquímica da referida camada de liga, substrato que compreende a referida camada de liga e utilizações do substrato revestido

Info

Publication number
PT3356579T
PT3356579T PT167782846T PT16778284T PT3356579T PT 3356579 T PT3356579 T PT 3356579T PT 167782846 T PT167782846 T PT 167782846T PT 16778284 T PT16778284 T PT 16778284T PT 3356579 T PT3356579 T PT 3356579T
Authority
PT
Portugal
Prior art keywords
alloy
substrate
electrochemical deposition
electroplating bath
electrochemical
Prior art date
Application number
PT167782846T
Other languages
English (en)
Original Assignee
Coventya S P A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=54249387&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=PT3356579(T) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Coventya S P A filed Critical Coventya S P A
Publication of PT3356579T publication Critical patent/PT3356579T/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/005—Jewels; Clockworks; Coins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
PT167782846T 2015-09-30 2016-09-30 Banho de galvanoplastia para deposição eletroquímica de uma camada de liga de cu-sn-zn-pd, método para a deposição eletroquímica da referida camada de liga, substrato que compreende a referida camada de liga e utilizações do substrato revestido PT3356579T (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP15187511.9A EP3150744B1 (en) 2015-09-30 2015-09-30 Electroplating bath for electrochemical deposition of a cu-sn-zn-pd alloy layer, method for electrochemical deposition of said alloy layer, substrate comprising said alloy layer and uses of the coated substrate

Publications (1)

Publication Number Publication Date
PT3356579T true PT3356579T (pt) 2020-06-16

Family

ID=54249387

Family Applications (2)

Application Number Title Priority Date Filing Date
PT151875119T PT3150744T (pt) 2015-09-30 2015-09-30 Banho de galvanoplastia para deposição eletroquímica de uma camada de liga de cu-sn-zn-pd, método para a deposição eletroquímica da referida camada de liga, substrato que compreende a referida camada de liga e utilizações do substrato revestido
PT167782846T PT3356579T (pt) 2015-09-30 2016-09-30 Banho de galvanoplastia para deposição eletroquímica de uma camada de liga de cu-sn-zn-pd, método para a deposição eletroquímica da referida camada de liga, substrato que compreende a referida camada de liga e utilizações do substrato revestido

Family Applications Before (1)

Application Number Title Priority Date Filing Date
PT151875119T PT3150744T (pt) 2015-09-30 2015-09-30 Banho de galvanoplastia para deposição eletroquímica de uma camada de liga de cu-sn-zn-pd, método para a deposição eletroquímica da referida camada de liga, substrato que compreende a referida camada de liga e utilizações do substrato revestido

Country Status (5)

Country Link
EP (2) EP3150744B1 (pt)
CN (1) CN108138346B (pt)
ES (2) ES2790583T3 (pt)
PT (2) PT3150744T (pt)
WO (1) WO2017055553A1 (pt)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2790583T3 (es) 2015-09-30 2020-10-28 Coventya S P A Baño de galvanoplastia para el depósito electroquímica de una aleación de Cu-Sn-Zn-Pd, procedimiento para el depósito electroquímica de dicha aleación, sustrato que comprende dicha aleación y usos del sustrato
IT201700014377A1 (it) * 2017-02-09 2018-08-09 Bluclad S R L Bronzo giallo/rosa inox e suo impiego in prodotti galvanizzati
EP3540097A1 (en) 2018-03-13 2019-09-18 COVENTYA S.p.A. Electroplated products and electroplating bath for providing such products
IT201800004235A1 (it) * 2018-04-05 2019-10-05 Lega di bronzo bianco, bagno galvanico e procedimento al fine di produrre la lega di bronzo bianco tramite deposizione elettrogalvanica
CN108864200B (zh) * 2018-08-06 2020-12-11 金川集团股份有限公司 电镀用硫酸乙二胺钯的一步制备方法
IT202000011203A1 (it) * 2020-05-15 2021-11-15 Bluclad S P A Lega di bronzo inossidabile e suo impiego in prodotti galvanizzati
FR3118067B1 (fr) * 2020-12-18 2023-05-26 Linxens Holding Procédé de dépôt d’un alliage de bronze sur un circuit imprimé et circuit imprimé obtenu par ce procédé
CN119776940B (zh) * 2024-12-31 2025-11-14 西安理工大学 一种交错氧化亚铜微米立方体的电化学制备方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2916423A (en) 1957-06-19 1959-12-08 Metal & Thermit Corp Electrodeposition of copper and copper alloys
US3440151A (en) 1965-06-02 1969-04-22 Robert Duva Electrodeposition of copper-tin alloys
BE805602A (en) 1973-10-03 1974-02-01 Johnson Matthey Co Ltd Cyanide-free gold electroplating bath - contg alkali metal gold complex and complexing agent and additives
CH662583A5 (fr) 1985-03-01 1987-10-15 Heinz Emmenegger Bain galvanique pour le depot electrolytique d'alliages d'or-cuivre-cadmium-zinc.
JP3029948B2 (ja) 1993-04-07 2000-04-10 シチズン時計株式会社 Ｓｎ−Ｃｕ−Ｐｄ合金めっき部材、その製造に用いるめっき浴
JPH0827590A (ja) 1994-07-13 1996-01-30 Okuno Chem Ind Co Ltd 光沢銅−錫合金めっき浴
DE69523950T2 (de) 1995-12-07 2002-06-20 Citizen Watch Co., Ltd. Dekoratives element
CN1097644C (zh) 1995-12-07 2003-01-01 西铁城钟表有限公司 装饰件
JP2977503B2 (ja) 1997-02-13 1999-11-15 株式会社ビクトリア 銅−パラジウム系合金メッキ液及びメッキ基材
CN1257996C (zh) * 2000-06-27 2006-05-31 西铁城钟表股份有限公司 有白色镀层的个人装饰件及其制造方法
CN101096769A (zh) 2006-06-26 2008-01-02 比亚迪股份有限公司 一种电镀方法
EP1930478B1 (en) 2006-12-06 2013-06-19 Enthone, Inc. Electrolyte composition and method for the deposition of quaternary copper alloys
JP5642928B2 (ja) 2007-12-12 2014-12-17 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 青銅の電気めっき
EP2497841B1 (de) 2011-03-09 2015-09-02 Umicore AG & Co. KG Sn-Ag-Cu-Legierungen
EP2757180B1 (en) 2013-01-18 2015-08-12 Valmet Plating S.R.L. A process for electrolytically depositing a tin- and ruthenium-based alloy, the electrolytic bath that permits said alloy to deposit and the alloy obtained by means of said process
EP2799595A1 (de) 2013-05-03 2014-11-05 Delphi Technologies, Inc. Elektrisches Kontaktelement
AT514818B1 (de) 2013-09-18 2015-10-15 W Garhöfer Ges M B H Ing Abscheidung von Cu, Sn, Zn-Beschichtungen auf metallischen Substraten
ITUB20152876A1 (it) * 2015-08-05 2017-02-05 Bluclad S R L Leghe stagno/rame contenenti palladio, metodo per la loro preparazione e loro uso.
ES2790583T3 (es) 2015-09-30 2020-10-28 Coventya S P A Baño de galvanoplastia para el depósito electroquímica de una aleación de Cu-Sn-Zn-Pd, procedimiento para el depósito electroquímica de dicha aleación, sustrato que comprende dicha aleación y usos del sustrato

Also Published As

Publication number Publication date
WO2017055553A1 (en) 2017-04-06
ES2791197T3 (es) 2020-11-03
PT3150744T (pt) 2020-05-12
ES2790583T3 (es) 2020-10-28
EP3356579B1 (en) 2020-03-11
EP3150744B1 (en) 2020-02-12
CN108138346B (zh) 2021-03-05
EP3356579A1 (en) 2018-08-08
CN108138346A (zh) 2018-06-08
EP3150744A1 (en) 2017-04-05

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