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PL3256906T3 - Sposób teksturowania dyskretnych podłoży i elastyczny stempel - Google Patents

Sposób teksturowania dyskretnych podłoży i elastyczny stempel

Info

Publication number
PL3256906T3
PL3256906T3 PL16704585T PL16704585T PL3256906T3 PL 3256906 T3 PL3256906 T3 PL 3256906T3 PL 16704585 T PL16704585 T PL 16704585T PL 16704585 T PL16704585 T PL 16704585T PL 3256906 T3 PL3256906 T3 PL 3256906T3
Authority
PL
Poland
Prior art keywords
discreet
texturing
substrates
flexible punch
punch
Prior art date
Application number
PL16704585T
Other languages
English (en)
Inventor
Meulen Jan Matthijs Ter
Bram Johannes Titulaer
Erven Adrianus Johannes Van
Original Assignee
Morphotonics Holding Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Morphotonics Holding Bv filed Critical Morphotonics Holding Bv
Publication of PL3256906T3 publication Critical patent/PL3256906T3/pl

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B30PRESSES
    • B30BPRESSES IN GENERAL
    • B30B11/00Presses specially adapted for forming shaped articles from material in particulate or plastic state, e.g. briquetting presses, tabletting presses
    • B30B11/20Roller-and-ring machines, i.e. with roller disposed within a ring and co-operating with the inner surface of the ring
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16Coating processes; Apparatus therefor
    • G03F7/168Finishing the coated layer, e.g. drying, baking, soaking
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2791/00Shaping characteristics in general
    • B29C2791/004Shaping under special conditions
    • B29C2791/006Using vacuum
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93Batch processes
    • H01L2224/95Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/951Supplying the plurality of semiconductor or solid-state bodies
    • H01L2224/95115Supplying the plurality of semiconductor or solid-state bodies using a roll-to-roll transfer technique

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Electroluminescent Light Sources (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Photovoltaic Devices (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
PL16704585T 2015-02-13 2016-02-11 Sposób teksturowania dyskretnych podłoży i elastyczny stempel PL3256906T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP15155039 2015-02-13
PCT/EP2016/052872 WO2016128493A1 (en) 2015-02-13 2016-02-11 Method for texturing discrete substrates ii
EP16704585.5A EP3256906B1 (en) 2015-02-13 2016-02-11 Method for texturing discrete substrates and flexible stamp

Publications (1)

Publication Number Publication Date
PL3256906T3 true PL3256906T3 (pl) 2019-10-31

Family

ID=52595064

Family Applications (1)

Application Number Title Priority Date Filing Date
PL16704585T PL3256906T3 (pl) 2015-02-13 2016-02-11 Sposób teksturowania dyskretnych podłoży i elastyczny stempel

Country Status (10)

Country Link
US (1) US10996559B2 (pl)
EP (1) EP3256906B1 (pl)
JP (1) JP6720199B2 (pl)
KR (1) KR102566639B1 (pl)
CN (1) CN107430329B (pl)
DK (1) DK3256906T3 (pl)
ES (1) ES2733809T3 (pl)
PL (1) PL3256906T3 (pl)
TR (1) TR201909874T4 (pl)
WO (1) WO2016128493A1 (pl)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6612439B2 (ja) 2015-09-23 2019-11-27 カール・ツァイス・エスエムティー・ゲーエムベーハー 圧電装置を備える光学結像装置
WO2018027073A1 (en) * 2016-08-03 2018-02-08 Board Of Regents, The University Of Texas System Wafer-scale programmable films for semiconductor planarization and for imprint lithography
KR102448904B1 (ko) * 2017-07-31 2022-09-29 삼성디스플레이 주식회사 임프린트 장치 및 임프린트 방법
US10580659B2 (en) * 2017-09-14 2020-03-03 Canon Kabushiki Kaisha Planarization process and apparatus
KR102775942B1 (ko) * 2018-01-26 2025-03-07 모포토닉스 홀딩 비.브이. 개별 기판을 텍스처링하기 위한 공정 및 장비
JP7417600B2 (ja) * 2018-10-12 2024-01-18 モーフォトニクス ホールディング ベスローテン フェノーツハップ 調整可能な高い寸法安定性を有するフレキシブルスタンプ
EP3693714A1 (en) 2019-02-11 2020-08-12 Fresh Strips B.V. Optical sensor based on shape memory between scattering and transparent modes
US12145308B2 (en) 2019-11-12 2024-11-19 Morphotonics Holding B.V. Apparatus for a roll-to-plate imprinting process comprising a plate carrier with compensating material
WO2022023090A1 (en) * 2020-07-31 2022-02-03 Morphotonics Holding B.V. Apparatus and process for replicating a texture
CN113189840A (zh) * 2021-04-16 2021-07-30 深圳先进技术研究院 微纳结构制作方法及微纳结构制作装置
WO2023069739A1 (en) * 2021-10-22 2023-04-27 Worcester Polytechnic Institute Microchannel printing
CA3237104A1 (en) 2021-11-15 2023-05-19 Jan Matthijs Ter Meulen Imprinting process

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1362682A1 (en) * 2002-05-13 2003-11-19 ZBD Displays Ltd, Method and apparatus for liquid crystal alignment
US20080160129A1 (en) * 2006-05-11 2008-07-03 Molecular Imprints, Inc. Template Having a Varying Thickness to Facilitate Expelling a Gas Positioned Between a Substrate and the Template
JP4536148B2 (ja) * 2006-04-03 2010-09-01 モレキュラー・インプリンツ・インコーポレーテッド リソグラフィ・インプリント・システム
TW200819546A (en) 2006-10-30 2008-05-01 Jinn P Chu In-air micro and nanoimprint of bulk metallic glasses and a method for making the same
JP4840668B2 (ja) 2007-11-30 2011-12-21 綜研化学株式会社 熱インプリント用モールドおよびこのモールドを用いた光学素子の製造方法
JP5693445B2 (ja) * 2008-04-18 2015-04-01 マサチューセッツ インスティテュート オブ テクノロジー 不規則表面のウェッジインプリントパターニング
CN101852986A (zh) * 2009-03-30 2010-10-06 鸿富锦精密工业(深圳)有限公司 压印模具
TW201228807A (en) * 2011-01-13 2012-07-16 Moser Baer India Ltd Method of imprinting a texture on a rigid substrate using flexible stamp
KR101910974B1 (ko) * 2011-12-13 2018-10-24 삼성전자주식회사 임프린팅 스탬프 및 이를 이용한 나노 임프린트 방법
WO2015069538A1 (en) * 2013-11-06 2015-05-14 3M Innovative Properties Company Microcontact printing stamps with functional features

Also Published As

Publication number Publication date
CN107430329B (zh) 2021-02-12
JP2018512263A (ja) 2018-05-17
US20180017862A1 (en) 2018-01-18
US10996559B2 (en) 2021-05-04
JP6720199B2 (ja) 2020-07-08
EP3256906A1 (en) 2017-12-20
KR20170122186A (ko) 2017-11-03
DK3256906T3 (da) 2019-07-15
WO2016128493A1 (en) 2016-08-18
KR102566639B1 (ko) 2023-08-16
CN107430329A (zh) 2017-12-01
TR201909874T4 (tr) 2019-07-22
ES2733809T3 (es) 2019-12-03
EP3256906B1 (en) 2019-04-10

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