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PL2157205T3 - Proces impulsowego rozpylania magnetronowego o dużej mocy oraz źródło energii elektrycznej o dużej mocy - Google Patents

Proces impulsowego rozpylania magnetronowego o dużej mocy oraz źródło energii elektrycznej o dużej mocy

Info

Publication number
PL2157205T3
PL2157205T3 PL09159717T PL09159717T PL2157205T3 PL 2157205 T3 PL2157205 T3 PL 2157205T3 PL 09159717 T PL09159717 T PL 09159717T PL 09159717 T PL09159717 T PL 09159717T PL 2157205 T3 PL2157205 T3 PL 2157205T3
Authority
PL
Poland
Prior art keywords
pulse
power
time
energy source
electrical energy
Prior art date
Application number
PL09159717T
Other languages
English (en)
Inventor
Jones Alami
Georg Erkens
Jürgen Müller
Jörg Vetter
Original Assignee
Sulzer Metaplas Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sulzer Metaplas Gmbh filed Critical Sulzer Metaplas Gmbh
Publication of PL2157205T3 publication Critical patent/PL2157205T3/pl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3485—Sputtering using pulsed power to the target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3464—Operating strategies
    • H01J37/3467—Pulsed operation, e.g. HIPIMS
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/026—Means for avoiding or neutralising unwanted electrical charges on tube components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3444—Associated circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Plasma Technology (AREA)
  • Electrodes Of Semiconductors (AREA)
PL09159717T 2008-07-29 2009-05-08 Proces impulsowego rozpylania magnetronowego o dużej mocy oraz źródło energii elektrycznej o dużej mocy PL2157205T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP08161322 2008-07-29
EP09159717A EP2157205B1 (en) 2008-07-29 2009-05-08 A high-power pulsed magnetron sputtering process as well as a high-power electrical energy source

Publications (1)

Publication Number Publication Date
PL2157205T3 true PL2157205T3 (pl) 2012-04-30

Family

ID=39892270

Family Applications (1)

Application Number Title Priority Date Filing Date
PL09159717T PL2157205T3 (pl) 2008-07-29 2009-05-08 Proces impulsowego rozpylania magnetronowego o dużej mocy oraz źródło energii elektrycznej o dużej mocy

Country Status (5)

Country Link
US (1) US9551066B2 (pl)
EP (1) EP2157205B1 (pl)
JP (2) JP6042048B2 (pl)
AT (1) ATE535629T1 (pl)
PL (1) PL2157205T3 (pl)

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BRPI1102336B1 (pt) * 2011-05-27 2021-01-12 Mahle Metal Leve S/A elemento dotado de pelo menos uma superfície de deslizamento para uso em um motor de combustão
BRPI1102335A2 (pt) 2011-05-27 2013-06-25 Mahle Metal Leve Sa elemento dotado de pelo menos uma superfÍcie de deslizamento com um revestimento para uso em um motor de combustço interna ou em um compressor
US20150184284A1 (en) * 2012-06-29 2015-07-02 Oerlikon Advanced Technologies Ag Method of coating by pulsed bipolar sputtering
DE102012107163A1 (de) 2012-08-03 2014-05-15 INI Coatings Ltd. Verfahren zur Beschichtung eines Substrats mittels Hochenergieimpulsmagnetronsputtern
CN105102671B (zh) 2013-02-08 2020-08-07 瑞士艾发科技 Hipims溅射的方法和hipims溅射系统
DE102013106351A1 (de) 2013-06-18 2014-12-18 Innovative Ion Coatings Ltd. Verfahren zur Vorbehandlung einer zu beschichtenden Oberfläche
PL3013996T3 (pl) 2013-06-26 2017-10-31 Oerlikon Surface Solutions Ag Pfaeffikon Sposób wytwarzania dekoracyjnych warstw twardego materiału za pomocą HIPIMS
ES2630316T5 (es) * 2013-07-03 2021-06-18 Oerlikon Surface Solutions Ag Pfaeffikon Procedimiento para la producción de capas de TixSi1-xN
JP2016084508A (ja) * 2014-10-27 2016-05-19 株式会社アルバック 金属膜成膜方法
US9812305B2 (en) * 2015-04-27 2017-11-07 Advanced Energy Industries, Inc. Rate enhanced pulsed DC sputtering system
US11049702B2 (en) 2015-04-27 2021-06-29 Advanced Energy Industries, Inc. Rate enhanced pulsed DC sputtering system
TWI575119B (zh) * 2015-04-28 2017-03-21 遠東科技大學 鋁基鍋具之導磁層加工方法
US10566177B2 (en) * 2016-08-15 2020-02-18 Applied Materials, Inc. Pulse shape controller for sputter sources
RU2649904C1 (ru) * 2016-11-18 2018-04-05 Федеральное государственное бюджетное образовательное учреждение высшего образования "Московский государственный технологический университет "СТАНКИН" (ФГБОУ ВО "МГТУ "СТАНКИН") Устройство для синтеза и осаждения металлических покрытий на токопроводящих изделиях
KR20180135853A (ko) * 2017-05-10 2018-12-21 어플라이드 머티어리얼스, 인코포레이티드 펄스형 dc 전력 공급부
EP3639356B1 (en) * 2017-06-12 2025-12-17 Starfire Industries, LLC Pulsed power module with pulse and ion flux control for magnetron sputtering
KR102141684B1 (ko) 2018-08-24 2020-09-14 한국원자력연구원 전류 펄스를 제어하는 모듈레이터 및 그 방법
SE542881C2 (en) * 2018-12-27 2020-08-04 Nils Brenning Ion thruster and method for providing thrust
CN113474482B (zh) * 2019-02-25 2025-07-15 星火工业有限公司 用于事故耐受核燃料、粒子加速器、和航空航天前沿的金属和陶瓷纳米涂层的方法和设备
CN114597109B (zh) * 2020-12-07 2025-05-27 中国科学院大连化学物理研究所 平面射频感性耦合放电等离子体加强型吸气剂装置
EP4531074A1 (en) * 2023-09-29 2025-04-02 Centre National de la Recherche Scientifique Fast high voltage for ionization improvement for sputtering process
WO2025225652A1 (ja) * 2024-04-23 2025-10-30 パナソニックＩｐマネジメント株式会社 評価システム、評価方法、プログラム

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Also Published As

Publication number Publication date
EP2157205B1 (en) 2011-11-30
US9551066B2 (en) 2017-01-24
US20100236919A1 (en) 2010-09-23
JP6042048B2 (ja) 2016-12-14
JP2010031359A (ja) 2010-02-12
JP2015148015A (ja) 2015-08-20
ATE535629T1 (de) 2011-12-15
EP2157205A1 (en) 2010-02-24

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