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KR900010995A - 반도체 장치 - Google Patents

반도체 장치 Download PDF

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Publication number
KR900010995A
KR900010995A KR1019890016283A KR890016283A KR900010995A KR 900010995 A KR900010995 A KR 900010995A KR 1019890016283 A KR1019890016283 A KR 1019890016283A KR 890016283 A KR890016283 A KR 890016283A KR 900010995 A KR900010995 A KR 900010995A
Authority
KR
South Korea
Prior art keywords
conductive regions
regions
conductive
insulator layer
charged
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
KR1019890016283A
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English (en)
Other versions
KR920010851B1 (ko
Inventor
히로시 다가끼
Original Assignee
시기 모리야
미쓰비시 뎅끼 가부시끼 가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 시기 모리야, 미쓰비시 뎅끼 가부시끼 가이샤 filed Critical 시기 모리야
Publication of KR900010995A publication Critical patent/KR900010995A/ko
Application granted granted Critical
Publication of KR920010851B1 publication Critical patent/KR920010851B1/ko
Expired legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
    • H10D89/601—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76897—Formation of self-aligned vias or contact plugs, i.e. involving a lithographically uncritical step
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/91—Controlling charging state at semiconductor-insulator interface

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Semiconductor Memories (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)

Abstract

내용 없음

Description

반도체 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1a도는, 본 발명의 한 실시예에 의한 반도체 장치를 표시하는 평면도, 제1b도 및 제1c도는, 각각 제1a도 중의 선 1B-1B 및 선 1C-1C를 따른 단면도, 제2a도 내지 제2h도는, 제1a도 내지 제1c도에 표시된 도전장치의 제조과정의 한 예를 설명하기 위한 단면도, 제3a도 및 제3b도는, 제1a도 내지 제1c도에 표시된 반도체장치내의 절연 파괴되기 쉬운 개소를 제거하는 과정을 설명하기위한 단면도, 제3c도는, 제3b도에 표시된 반도체장치의 평면도.

Claims (1)

  1. 제조과정에 있어서 하전입자의 조사를 받는 반도체 장치에 있어서, 상호 전기적으로 절연되어 서로 다른 위치에 형성된적어도 제1의 도전성 영역(3, 1) 및 제2의 도전성 영역(4a, 4b)과, 적어도 상기 제1도전성 영역(3, 1) 및 상기 제2도전성영역(4a, 4b)의 위치에 적층된 제3의 도전성 영역(8, 9)과, 상기 제1도전성 영역(3, 1) 및 상기 제3도전성 영역(8, 9)을상호 절연하도록 상기 제1도전성 영역(3, 1) 및 상기 제3도전성 영역(8, 9)에 끼인 제1의 절연체층 영역(5, 7)과, 상기제2도전성 영역(4a, 4b) 및 상기 제3도전성 영역(8, 9)을 상호 절연하도록 상기 제2도전성 영역(4a, 4b) 및 상기 제3도전성 영역(8, 9)에 끼인 제2의 절연체층 영역(6a, 6b)를 구비하고 상기 하전입자의 조사에 의하여 상기 제3도전성 영역(8,9)에 대전한 때에 상기 제2절연체층 영역(6a, 6b)이 상기 제1절연체층 영역(5, 7)에서 절연파괴가 생기기 쉽기 때문에 상기 제2도전성 영역(4a, 4b)은 예각부를 가지고 있는 것을 특징으로 하는 반도체장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019890016283A 1988-12-28 1989-11-10 반도체장치 Expired KR920010851B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP63332236A JPH0834297B2 (ja) 1988-12-28 1988-12-28 半導体装置
JP88-332236 1988-12-28
JP63-332236 1988-12-28

Publications (2)

Publication Number Publication Date
KR900010995A true KR900010995A (ko) 1990-07-11
KR920010851B1 KR920010851B1 (ko) 1992-12-19

Family

ID=18252701

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890016283A Expired KR920010851B1 (ko) 1988-12-28 1989-11-10 반도체장치

Country Status (5)

Country Link
US (1) US5079609A (ko)
JP (1) JPH0834297B2 (ko)
KR (1) KR920010851B1 (ko)
DE (1) DE3942657C2 (ko)
GB (1) GB2226699B (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5421213A (en) * 1990-10-12 1995-06-06 Okada; Kazuhiro Multi-dimensional force detector
US6314823B1 (en) 1991-09-20 2001-11-13 Kazuhiro Okada Force detector and acceleration detector and method of manufacturing the same
JPH05304154A (ja) * 1992-04-28 1993-11-16 Nec Corp 半導体装置
GB2268328B (en) * 1992-06-30 1995-09-06 Texas Instruments Ltd A capacitor with electrostatic discharge protection
US6282956B1 (en) 1994-12-29 2001-09-04 Kazuhiro Okada Multi-axial angular velocity sensor
US6285050B1 (en) * 1997-12-24 2001-09-04 International Business Machines Corporation Decoupling capacitor structure distributed above an integrated circuit and method for making same
US6370012B1 (en) 2000-08-30 2002-04-09 International Business Machines Corporation Capacitor laminate for use in printed circuit board and as an interconnector
FR2989827A1 (fr) * 2012-04-18 2013-10-25 Commissariat Energie Atomique Dispositif semi-conducteur comportant un transistor a effet de champ et un condensateur de protection dudit transistor
CN112466760B (zh) * 2020-12-03 2022-07-05 大连圣博达科技有限公司 一种具有去耦结构的半导体装置及其制造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1171874A (en) * 1968-04-26 1969-11-26 Hughes Aircraft Co Field Effect Transistor.
GB1244225A (en) * 1968-12-31 1971-08-25 Associated Semiconductor Mft Improvements in and relating to methods of manufacturing semiconductor devices
JPS5299786A (en) * 1976-02-18 1977-08-22 Agency Of Ind Science & Technol Mos integrated circuit
US4072976A (en) * 1976-12-28 1978-02-07 Hughes Aircraft Company Gate protection device for MOS circuits
US4190854A (en) * 1978-02-15 1980-02-26 National Semiconductor Corporation Trim structure for integrated capacitors
JPS5591173A (en) * 1978-12-28 1980-07-10 Mitsubishi Electric Corp Semiconductor integrated circuit device
US4486769A (en) * 1979-01-24 1984-12-04 Xicor, Inc. Dense nonvolatile electrically-alterable memory device with substrate coupling electrode
JPS56138955A (en) * 1980-04-01 1981-10-29 Nec Corp Field effect transistor
JPS56158479A (en) * 1980-05-10 1981-12-07 Toshiba Corp Semiconductor device
JPS5714216A (en) * 1980-06-30 1982-01-25 Mitsubishi Electric Corp Input protecting circuit
JPS5994454A (ja) * 1982-11-19 1984-05-31 Nec Kyushu Ltd 半導体装置とその製造方法
JPS6014462A (ja) * 1983-07-05 1985-01-25 Oki Electric Ind Co Ltd 半導体メモリ素子
JPS6072228A (ja) * 1983-09-28 1985-04-24 Toshiba Corp 半導体基板への不純物ド−ピング方法
FR2569054B1 (fr) * 1984-08-10 1986-11-28 Eurotechnique Sa Dispositif de neutralisation de l'acces a une zone a proteger d'un circuit integre
US4935801A (en) * 1987-01-27 1990-06-19 Inmos Corporation Metallic fuse with optically absorptive layer
US4941028A (en) * 1988-08-10 1990-07-10 Actel Corporation Structure for protecting thin dielectrics during processing

Also Published As

Publication number Publication date
GB8928751D0 (en) 1990-02-28
KR920010851B1 (ko) 1992-12-19
JPH0834297B2 (ja) 1996-03-29
US5079609A (en) 1992-01-07
JPH02177470A (ja) 1990-07-10
DE3942657A1 (de) 1990-07-05
GB2226699A (en) 1990-07-04
DE3942657C2 (de) 2000-02-03
GB2226699B (en) 1993-05-26

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