KR20170139664A - 금속 나노입자 분산액 - Google Patents
금속 나노입자 분산액 Download PDFInfo
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- KR20170139664A KR20170139664A KR1020177034149A KR20177034149A KR20170139664A KR 20170139664 A KR20170139664 A KR 20170139664A KR 1020177034149 A KR1020177034149 A KR 1020177034149A KR 20177034149 A KR20177034149 A KR 20177034149A KR 20170139664 A KR20170139664 A KR 20170139664A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F17/00—Printing apparatus or machines of special types or for particular purposes, not otherwise provided for
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
- C08K7/18—Solid spheres inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
- C09D11/033—Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
- C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
- C09D11/104—Polyesters
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/106—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
- C09D11/32—Inkjet printing inks characterised by colouring agents
- C09D11/322—Pigment inks
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
- C09D11/36—Inkjet printing inks based on non-aqueous solvents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2286—Oxides; Hydroxides of metals of silver
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Materials Engineering (AREA)
- Dispersion Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Nanotechnology (AREA)
- General Chemical & Material Sciences (AREA)
- Conductive Materials (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Manufacturing Of Electric Cables (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
Abstract
Description
Claims (15)
- 금속 나노입자, 결합제 및 액체 캐리어를 포함하는 금속 나노입자 분산액으로서, 상기 결합제가 상기 결합제의 총 중량을 기준으로 90 wt% 이하의 비닐리덴 클로라이드를 포함하는 비닐리덴 클로라이드 공중합체인 것을 특징으로 하는 금속 나노입자 분산액.
- 제1항에 있어서, 상기 비닐리덴 클로라이드 공중합체가 비닐 클로라이드, 알킬 아크릴레이트, 알킬 메타크릴레이트, 비닐에테르, 비닐아세테이트, 비닐 알콜, 아크릴로니트릴, 메타크릴로니트릴, 말레산, 말레산 무수물, 이타콘산, 이타콘산 무수물 및 크로톤산으로 이루어진 군으로부터 선택된 추가의 단량체를 포함하는 것인 금속 나노입자 분산액.
- 제1항 또는 제2항에 있어서, 상기 비닐리덴 클로라이드 공중합체가 비닐 클로라이드, 아크릴로니트릴, 말레산 무수물, 알킬 아크릴레이트 및 알킬 메타크릴레이트로 이루어진 군으로부터 선택된 추가의 단량체를 포함하는 것인 금속 나노입자 분산액.
- 제1항 내지 제3항 중 어느 한 항에 있어서, 상기 비닐리덴 클로라이드 공중합체가 40 내지 90 wt%의 비닐리덴 클로라이드, 0.5 내지 50 wt%의 비닐 클로라이드 및 0.5 내지 5 wt%의 아크릴로니트릴을 포함하는 것인 금속 나노입자 분산액.
- 제1항 내지 제4항 중 어느 한 항에 있어서, 상기 비닐리덴 공중합체의 양이 상기 분산액의 총 양에 대하여 0.25 내지 5.0 wt%인 금속 나노입자 분산액.
- 제1항 내지 제5항 중 어느 한 항에 있어서, 접착 촉진 화합물로서 산성 폴리에스테르를 추가로 포함하는 금속 나노입자 분산액.
- 제6항에 있어서, 상기 산성 폴리에스테르의 양이 상기 분산액의 총 양에 대하여 0.01 내지 10.0 wt%인 금속 나노입자 분산액.
- 제1항 내지 제7항 중 어느 한 항에 있어서, 상기 분산액의 총 중량에 대하여 0.01 내지 0.1 wt%의, 무기 산 또는 상기 금속 나노입자 분산액으로부터 형성된 금속 층 또는 패턴의 경화 동안 이러한 산을 생성할 수 있는 화합물을 추가로 포함하는 금속 나노입자 분산액.
- 제1항 내지 제8항 중 어느 한 항에 있어서, 상기 액체 캐리어가 고비점 용매 (HBS)인 금속 나노입자 분산액.
- 제9항에 있어서, 상기 HBS가 2-페녹시-에탄올, 프로필렌-카보네이트, n-부탄올, 감마-부티로-락톤, 디메틸술폭시드, 2-부톡시에탄올, 디프로필렌 글리콜 메틸 에테르 아세테이트, 메틸 이소부틸 케톤, 프로필렌 글리콜 모노 메틸 에테르 아세테이트로 이루어진 군으로부터 선택된 것인 금속 나노입자 분산액.
- 제1항 내지 제10항 중 어느 한 항에 정의된 바와 같은 금속 나노입자 분산액을 기판 상에 도포하는 단계 및 이어서 소결 단계를 포함하는, 금속 층 또는 패턴을 제조하는 방법.
- 제11항에 있어서, 상기 기판이 종이 기판, 유리 기판, 프라이머 층을 포함하거나 포함하지 않는 중합체 기판, 또는 중합체 또는 유리 지지체 상의 ITO 층인 방법.
- 제11항 또는 제12항에 있어서, 상기 금속 나노입자 분산액이 음각(intaglio) 인쇄, 스크린 인쇄, 플렉소그래픽(flexographic) 인쇄, 오프셋(offset) 인쇄, 잉크젯 인쇄 또는 그라비어(gravure) 오프셋 인쇄로부터 선택된 인쇄 방법에 의해 상기 기판 상에 도포되는 것인 방법.
- 제11항 내지 제13항 중 어느 한 항에 있어서, 상기 소결 단계가 30분 이하 동안 200℃ 이하의 온도에서 수행되는 것인 방법.
- 제11항 내지 제14항 중 어느 한 항에 있어서, 상기 소결 단계가 열 또는 광자 또는 NIR 경화에 의해 수행되는 것인 방법.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP15169396.7 | 2015-05-27 | ||
| EP15169396.7A EP3099145B1 (en) | 2015-05-27 | 2015-05-27 | Method of preparing a silver layer or pattern comprising a step of applying a silver nanoparticle dispersion |
| PCT/EP2016/061750 WO2016189015A1 (en) | 2015-05-27 | 2016-05-25 | A metallic nanoparticle dispersion |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20170139664A true KR20170139664A (ko) | 2017-12-19 |
| KR102111765B1 KR102111765B1 (ko) | 2020-06-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020177034149A Active KR102111765B1 (ko) | 2015-05-27 | 2016-05-25 | 금속 나노입자 분산액 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20180148593A1 (ko) |
| EP (1) | EP3099145B1 (ko) |
| JP (1) | JP6530512B2 (ko) |
| KR (1) | KR102111765B1 (ko) |
| CN (1) | CN107636083B (ko) |
| WO (1) | WO2016189015A1 (ko) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3790934A1 (en) | 2018-05-08 | 2021-03-17 | Agfa-Gevaert N.V. | Conductive inks |
| FI128435B (en) | 2018-05-09 | 2020-05-15 | Canatu Oy | Electrically conductive multilayer film |
| EP4163343A1 (en) | 2021-10-05 | 2023-04-12 | Agfa-Gevaert Nv | Conductive inks |
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- 2016-05-25 CN CN201680030153.8A patent/CN107636083B/zh active Active
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Also Published As
| Publication number | Publication date |
|---|---|
| EP3099145A1 (en) | 2016-11-30 |
| EP3099145B1 (en) | 2020-11-18 |
| CN107636083B (zh) | 2022-07-12 |
| WO2016189015A1 (en) | 2016-12-01 |
| JP6530512B2 (ja) | 2019-06-12 |
| US20180148593A1 (en) | 2018-05-31 |
| CN107636083A (zh) | 2018-01-26 |
| KR102111765B1 (ko) | 2020-06-09 |
| JP2018524763A (ja) | 2018-08-30 |
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