KR20160072042A - Delivery device, manufacturing system and process of manufacturing - Google Patents

Abstract

A manufacturing system and a manufacturing process of a delivery device are disclosed. The delivery device includes a chemical vapor deposition coating formed from the decomposition of a feed tube and the dimethylsilane applied on the inner surface of the feed tube. The manufacturing system includes a chamber for selective fluid communication with the delivery device and the delivery device. The manufacturing process uses the manufacturing system for producing an article.

Description

[0001] Delivery Device, Manufacturing System, and Manufacturing Process [0002]

The present invention is directed to a delivery device, a manufacturing system, and a manufacturing process. More particularly, the present invention relates to a delivery device for manufacturing an organic light emitting diode.

An organic light emitting diode (OLED) is a light emitting diode (LED) having an organic film that forms an emissive electroluminescent layer that emits light in response to an electric current. Currently, OLEDs have been developed for use in display and lighting technology and are generally considered to provide the highest resolution and most extreme contrast display possible. OLEDs are also introduced into high resolution, flexible display technology and high efficiency, unique conformational illumination systems.

One common method of manufacturing OLEDs for display technologies involves the deposition of organic films through spray coating. A typical manufacturing system includes a plurality of feeds, sprayed with an organic film providing pixel coloring. However, such manufacturing systems often include metal surfaces that do not include desirable performance characteristics. The inclusion of certain desirable performance characteristics may result in reduced yield, unsatisfactory performance requirements, increased manufacturing costs, or a combination thereof.

In particular, metal surfaces within a manufacturing system are susceptible to chemical adsorption, catalytic activity, corrosive attack, oxidation, reagent / carryover, stiction, And / or other undesirable surface activity. ≪ RTI ID = 0.0 > Due to the undesirable surface action, the organic film and / or coloring can be built up in the feed tube of the production system. The build-up of the organic film and / or coloring material clogs the feed tube, which requires cleaning of the tube, reducing the yield and increasing the cost. In addition, the accumulation of organic films and / or coloring materials can introduce cross-contamination in subsequent coating applications, which can change the coloring of the pixels and introduce errors into the manufacturing process have.

Delivery devices, manufacturing systems, and manufacturing processes that exhibit one or more improvements over the prior art will be desirable in the art.

In one embodiment, the delivery device comprises a feed tube and a chemical vapor deposition coating (CVD) applied on the inner surface of the feed tube, wherein the chemical vapor deposition coating is formed from the decomposition of the dimethylsilane.

In another embodiment, the manufacturing system comprises a feed tube, a delivery device having a chemical vapor deposition coating applied on the inner surface of the feed tube, wherein the chemical vapor deposition coating is formed from decomposition of the dimethylsilane. The system also includes a chamber for selective fluid communication with the delivery device.

In another embodiment, the article manufacturing process comprises a chemical vapor deposition coating applied on a surface thereof, wherein the chemical vapor deposition coating is formed from the decomposition of dimethylsilane, wherein the surface comprising the chemical vapor deposition coating Back to the top of the article. The component is selected from the group consisting of a feed tube, a ultra high vacuum (UHV) component, a shower head, a deflector plate, a fitting, and a combination thereof.

Other features and advantages of the present invention will become apparent from the following detailed description, taken in conjunction with the accompanying drawings, which illustrate, by way of example, the principles of the invention.

Figure 1 shows a perspective view of a portion of a manufacturing system.
Figure 2 shows a schematic view of a portion of a cross section of a feed tube, in accordance with an embodiment of the invention.
Figure 3 shows a schematic view of a portion of a cross-sectional view of a feed tube having a diffusion zone, in accordance with an embodiment of the invention.
Wherever possible, the same reference numbers will be used throughout the drawings to refer to the same parts.

A delivery device, a manufacturing system, and a manufacturing process are provided. Embodiments of the present invention may be used to reduce cross-contamination in coatings, increase coating efficiency, increase yields, and reduce coating errors, for example, in comparison to designs that do not include one or more of the features disclosed herein Reduce process costs, reduce stagnation / retention of reactants in the feed tube of the manufacturing system, reduce traction in the feed tube, or a combination thereof.

Referring to Figure 1, in one embodiment, an organic light emitting diode (OLED) manufacturing system 100 includes a delivery device 101, a processing material 105, and a substrate 110. The delivery device 101 may be used to apply a processing material 105 to the substrate 110, such as a spray mechanism (FIG. 1), a printing nozzle, a deposition mechanism, But is not limited to, any suitable device. The processing material 105 includes any material used during OLED manufacturing, such as a coloring material, an organic material, an OLED coating material, or a combination thereof. The substrate 110 includes any material for forming an OLED.

The at least one feed tube 103 is within and / or connected to the delivery device 101 and each of the at least one feed tube 103 is configured to house and / or move the workpiece 105 . During operation of the OLED manufacturing system 100, one or more feed tubes 103 supply the workpiece 105 to the delivery device 101, which in turn feeds the workpiece 105 to a chamber (not shown) 105) and / or to a substrate (110) disposed in another area configured to position the article to be manufactured. The feed tube 103 and the delivery device 101 form part of the manufacturing flow path 115 of the OLED manufacturing system 100. As used herein, the term "manufacturing flow path" refers to any surface of the OLED manufacturing system 100 that is in contact with the workpiece 105. The other surface forming part of the manufacturing flow path 205 may be any surface that connects the feed tube 103 to the delivery device 101 or any surface that connects the feed tube 103 to any component But is not limited to, an inner surface, and / or an inner surface of any additional components that are transported there through before the organic material 105 is applied to the substrate 110.

As shown in Figure 2, a coating 201 is applied over the surface 203 of any suitable substrate 204 of the manufacturing flow path 205 (Figure 1). Suitable substrates include pure or substantially pure metals (e.g., aluminum and platinum), metal alloys (e.g., stainless steel, aluminum-base alloys, and nickel-base alloys), impurities a metal-coated substrate (e.g., a tantalum-containing metal), an impure metal or an impurity metal alloy (e.g., a 95 wt% aluminum-containing metal, a 98 wt% aluminum- Coated), or any combination thereof, but is not limited thereto. For example, in one embodiment, the coating 201 is applied over the inner surface 207 of the feed tube 103. Although illustrated with respect to the inner surface 207 of the feed tube 103, the present invention is not limited to this, as understood by those skilled in the art, and may be applied to any other article or component, including a suitable substrate, Coating 201 < / RTI > Other articles or components having a suitable substrate may include other components of the manufacturing flow path 115, other components in the OLED manufacturing system 100, components that do not form part of the OLED manufacturing system 100, However, it is not limited thereto. Components that do not form part of the OLED manufacturing system 100 include, but are not limited to, ultra high vacuum (UHV) components, showerheads, deflector plates, fittings, or combinations thereof.

The coating 201 is formed from the decomposition of a silane material, such as but not limited to dimethylsilane, trimethylsilane, or combinations thereof. As disclosed in U.S. Patent Application No. 13 / 876,328 and U.S. Patent Application No. 13 / 504,533, both of which are incorporated herein by reference in their entirety, the process for forming the coating 201 may be performed by chemical vapor deposition of dimethylsilane CVD). Chemical vapor deposition is accomplished by thermal application and is not a plasma-assisted method.

In one embodiment, forming the coating 201 on the surface 203 of the substrate 204 via CVD thermally decomposes the thermally decomposing dimethylsilane and / or any other suitable thermal decomposition gases and deposits amorphous Carbosilane. ≪ / RTI > In general, the type of suitable cracking gas includes, but is not limited to, organosilane, dimethylsilane, any silane gas, or any other suitable chemical vapor deposition gas. Other suitable materials for introduction and / or subsequent treatment include silane, trimethylsilane, dialkylsilyl dihydride, alkylsilyl trihydride, dialkylsilyl dihydride, alkylsilyl trihydride, Alkoxysilane, and / or organofluorosilyl hydride.

Any portion of the chemical vapor deposition process may precede or follow the selective application of the purge gas to the chemical vapor deposition chamber through the introduction of a purge gas into the chemical vapor deposition chamber. The purge gas is nitrogen, helium, argon, or any other suitable inert gas. The purging may be accomplished by one purge cycle, two purge cycles, three purge cycles, three purge cycles, or any suitable number that allows the chemical vapor deposition chamber to be in a chemically inert environment It is within the purification cycle. For example, in one embodiment, after clarification, the cracked gas is introduced at a sub-decomposition temperature below the thermal cracking temperature of the cracking gas. As used herein, the expression "sub-decomposition temperature" refers to conditions under which the decomposition gas is not thermally decomposed.

In one embodiment, before forming the coating 201, the substrate 204 is deformed to receive the CVD coating. The deformation of the substrate 204 includes any suitable processing method. For example, deformation of the substrate 204 may be achieved by isolating the substrate 204 into a chemical vapor deposition chamber, preheating the substrate 204, flushing the chamber with an inert gas and emptying the chamber .

The isolation of the substrate 204 is carried out in an inert atmosphere in the chamber. The flow of gas within the chamber and / or the maintenance of the vacuum can provide a controlled atmosphere. The heat source may deserb water from the surface 203 of the substrate 204 and adjust the temperature in the chamber to remove residual contaminants. For example, the surface to be treated 203 may be contained within a chemical vapor deposition chamber with a tubing connection to permit entry and exit of the gas flow of the chemical vapor deposition chamber. The chamber may include a plurality of controlled intake vents and exhaust vents configured to inject and remove a plurality of airflows. The vacuum state can be connected to one or more exhaust pipes.

Depending on the cleanliness of the substrate 204, the metal may be manufactured by heating at a temperature in excess of 100 DEG C and a pressure of less than 1 atmosphere for a period ranging from several minutes to 15 hours. In general, the heating temperature is consistent with the characteristics of the substrate 204. In one embodiment, the period is from 0.5 to 15 hours. In another embodiment, the substrate 204 is heated at 450 DEG C for 2 hours. After fabrication under vacuum, the chamber may be selectively cleaned and emptied with an inert gas.

The thermal decomposition of the dimethylsilane is carried out by introducing dimethylsilane into the reaction chamber at a predetermined pressure and temperature sufficient to decompose the dimethylsilane and depositing the components from the decomposition onto the surface 203 of the substrate 204, For a predetermined period of time to achieve a predetermined thickness and / or to purify the chamber of the dimethylsilane. Without wishing to be bound by theory, it is believed that the dimethylsilane is thermally decomposed to form carbosilyl fragments, which recombine and bind to the substrate 204. The resulting coating 201 is believed to comprise an amorphous carbosilane with carbon, silicon and hydrogen on the substrate surface as well as the exposed surface of the chamber.

In one embodiment, at least during the introduction of the cracking gas, the operation of the chemical vapor deposition chamber may be substantially devoid of the catalyst (e.g., below a level that affects the process) (E. G., ≪ / RTI > detectable to a member and / or completely absent).

In one embodiment, the coating 201 is formed by cold fill deposition. The cold buried deposition includes placing the substrate 204 in a chemical vapor deposition chamber, followed by operating a chemical vapor deposition chamber. The operation of the chemical vapor deposition chamber cleans the chemical vapor deposition chamber, introducing the deposition gas into the chemical vapor deposition chamber, heating the chemical vapor deposition chamber, or a combination thereof. In addition to the advantages disclosed with respect to the coating 201 formed through CVD, the coating 201 formed through cold embedding deposition can be formed by increasing the number of materials on which the coating 201 can be formed, . For example, by using a cooled buried deposition, the coating 201 can be formed on a material prone to oxidation and / or thermal effects. Additionally, the cold buried deposition of the coating 201 allows for an increase in the cross-link density of the coating 201.

During and / or after the introduction of the decomposition gas, in one embodiment, the operation of the chemical vapor deposition chamber is controlled by a super-decomposition temperature that is equal to or greater than the thermal decomposition temperature of the decomposition gas, Lt; / RTI > As used herein, the expression "super-decomposition temperature" refers to the conditions under which the decomposition gas decomposes thermally. Heating the chemical vapor deposition chamber to the super-decomposition temperature in the presence of decomposition gas at least forms a coating 201 on the surface 203 of the substrate 204.

The chemical vapor deposition chamber is heated to any suitable heating rate from sub-decomposition temperature to super-decomposition temperature. Depending on the type of decomposition gas, suitable super-decomposition temperatures may be between 440 ° C and 460 ° C, greater than 460 ° C, greater than 450 ° C, greater than 460 ° C, greater than 480 ° C, greater than 500 ° C, , A range, or a sub-range within it. Suitable heating rates are between 6 ° C and 10 ° C per minute, between 7 ° C and 9 ° C per minute, greater than 6 ° C per minute, greater than 7 ° C per minute, less than 10 ° C per minute, less than 9 ° C per minute, 8 ° C per minute, But are not limited to, any suitable combination, sub-combination, range, or sub-range therein. At such a rate, in one embodiment, the chemical vapor deposition chamber has a period of between 3 minutes and 10 minutes, a period of between 5 minutes and 10 minutes, a period of between 7 minutes and 10 minutes, a period of between 3 minutes and 7 minutes , A period between 3 minutes and 5 minutes, or any suitable combination, sub-combination, range, or sub-range therein.

In one embodiment, the deposited material forms diffusion regions 305 between the substrate 204 and the coating 201 and diffuses to the surface 203 of the metal substrate, as shown in FIG. do. After forming the coating 201, the chamber can be cleaned of dimethylsilane and volatile, non-deposited carbosilyl fragments. If a thicker deposition layer is desired, the deposition conditions are changed. This can be accomplished by changing temperature, pressure, time, or a combination thereof. Multiple layers can also be applied by repeating the introduction and thermal decomposition of dimethylsilane.

Depending on the decomposition gas and other parameters, the pressure suitable for decomposition is between 1.0 psia and 250 psia, between 1.0 and 200 psia, between 1.0 psia and 150 psia, between 1.0 psia and 100 psia, between 1.0 psia and 75 psia, between 1.0 psia Between about 1 psia and about 50 psia, between about 1.0 psia and about 40 psia, between about 1.0 psia and about 30 psia, between about 1.0 psia and about 20 psia, between about 1.0 psia and about 10 psia, between about 1.0 psia and about 5.0 psia, between about 5 psia and about 40 psia, 5 psia, 40 psia, 100 psia, 200 psia, or any suitable combination, sub-combination, range, or sub-range therein.

Deg.] C, less than 200 [deg.] C, less than 250 [deg.] C, less than 300 [deg.] C, less than 350 [deg.] C, less than 400 [deg.] C, Sub-combination, range, or any combination thereof, that is less than 440 ° C, less than 450 ° C, 100 ° C to 300 ° C, 125 ° C to 275 ° C, 200 ° C to 300 ° C, Sub-range within.

Depending on the decomposition gas and other parameters, the period of time suitable for the decomposition is between 10 minutes and 24 hours, between 1 hour and 10 hours, between 2 hours and 10 hours, between 4 hours and 6 hours, between 4 hours and 8 hours, 10 minutes, at least 1 hour, at least 4 hours, at least 10 hours, less than 10 hours, less than 8 hours, less than 6 hours, less than 4 hours, or any suitable combination, sub-combination, .

The thickness of the coating 201 depends on the geometry of the substrate 204 to be coated and the type of finish required, but in the embodiment made according to the method disclosed herein, Subunit, range, or subdivision thereof, between 100 nm and 10,000 nm, between 100 nm and 5,000 nm, between 200 nm and 5,000 nm, between 100 nm and 3,000 nm, between 300 nm and 1,500 nm, - the thickness of the range. In another embodiment, the diffusion region 305 is between 5 nm and 500 nm. For example, in a further embodiment, the coating 201 extends to 130 nm and includes a portion of the diffusion region 305, which extends 20 nm and has an increased concentration of O and a reduced concentration of C and Si (E. G., At least 4-fold). ≪ / RTI >

In one embodiment, the coating 201 lacks or substantially lacks surface activity, which is indicative of the stagnation of the workpiece 105 in the manufacturing flow path 205 as compared to the substrate 204 without the coating 201, (Or, for example, refers to discoloration to produce a blue or purple appearance, but is not limited to this). By reducing or eliminating stagnation and / or accumulation of the workpiece 105, the coating 201 reduces or eliminates cross-contamination problems associated with current OLED manufacturing systems. In addition, by reducing or eliminating stagnation and / or accumulation of the workpiece 105, the coating 201 can reduce cleaning time, increase manufacturing efficiency, provide for the production of pure OLED displays, And / or reduce manufacturing costs.

Any other suitable processing step is carried out on the coating 201 after the cracking gas is introduced. The treatment of the coating 201 includes, for example, heating and / or deformation of the coating 201 applied over the substrate 204. In one embodiment, the treatment includes exposing substrate 204 and / or coating 201 to a suitable organosilane reagent. One suitable organosilane reagent is a trifunctional organosilane composed of the formula RR'R "Si-H wherein R, R ', R" Examples of an organoleptic group are alkyl, aryl, halogenated alkyl and aryl, ketone, aldehyde, acyl, alcohol, epoxy, and nitro-organic groups, and organometallic functional groups. In one embodiment, the organosilane is trimethylsilane.

The surface properties of the treated coating (e. G., The air-oxidized carboxysilane layer) are adjusted by modifying and varying the R 'group, or by using other molecules that are reactive with hydroxyl groups. For example, in one embodiment, the adjustment increases or decreases hardness and abrasion resistance, inertness, static friction, coking, contact angle, and combinations thereof. In another embodiment, adjustment of the coating 201 to reduce static friction and / or provide anti-stiction properties may be accomplished using an uncoated surface 203 of the substrate 204 To reduce or eliminate the adhesion, stagnation, retention, contamination, and / or accumulation of the workpiece 105 in the manufacturing flow path 205, The coating 201 reduces or eliminates cross contamination of the workpiece 105 by reducing or eliminating sticking, stagnation, retention, contamination, and / or accumulation of the workpiece 105 in the manufacturing flow path 205. [ , Reducing manufacturing errors, shortening cleaning time, increasing OLED manufacturing efficiency, and / or reducing manufacturing costs.

In one embodiment, the CVD of the dimethylsilane is accompanied by the functionalization to form an oxidized and / or functionalized carboxysilane to form a carboxysilane. The oxidation of the coating 201 comprises exposing the coating 201 to any suitable chemical species capable of donating reactive oxygen species under predetermined oxidizing conditions. Generally, oxidation is a large-scale reaction that affects most of the coating 201. The oxidation improves the hardness and / or abrasion resistance of the carbosilane and functionalized carbosilane-based chemical vapor deposition material on the surface 203 of the substrate 204. Oxidation can be controlled by increasing or decreasing the temperature in the chamber, the exposure time in the chamber, the type and / or amount of diluent gas, the pressure, and / or other suitable process conditions. Control of oxidation may increase or decrease the amount and / or depth of oxidation and, thus, the abrasion resistance and / or hardness of the surface.

Chemical species for oxidation of the coating 201 are selected based on the desired properties of the coating 201. [ Suitable species for oxidation of the coating 201 include, for example, water, oxygen, air, nitrous oxide, ozone, peroxide, and combinations thereof. In one embodiment, the coating 201 is oxidized to water, which is an oxidizing agent (e.g., in a temperature range of 100 占 폚 to 600 占 폚, in a temperature range of 300 占 폚 to 600 占 폚, or at a temperature of 450 占 폚). In this embodiment, the oxidation reduces friction (as compared to the use of oxidizing reagents of air and water), reduces abrasion resistance (e.g., compared to the use of oxidants of air and water), reduces Si -O-Si group. The Si-O-Si group formed in this embodiment can further reduce or eliminate the surface action of the coating 201 with respect to the workpiece 105. In another embodiment, the coating 201 is an oxidizing agent comprising air and water (for example, at a temperature ranging from 100 DEG C to 600 DEG C, at a temperature range from 300 DEG C to 600 DEG C, or at a temperature of 450 DEG C) Oxidized. In such an embodiment, the oxidation can be over-oxidized to reduce the amount of CH groups (e.g., compared to the case where water alone is used as the oxidizing agent) Reduces the amount of Si-C groups and increases the amount of Si-OH / C-OH groups (for example, compared to the case where only water is used as the oxidizing agent). Depending on the workpiece 105, a reduced amount of CH and Si-C groups and / or an increased amount of Si-OH / C-OH groups can further reduce or eliminate the surface action of coating 201 . In alternate embodiments, the coating 201 is oxidized (singly) to air (e.g., at a temperature range of 100 占 폚 to 600 占 폚, at a temperature range of 300 占 폚 to 600 占 폚, or at a temperature of 450 占 폚) . In this embodiment, oxidation reduces friction and increases abrasion resistance (e.g., as compared to the use of an oxidizing agent of water) and forms Si-O-Si and Si-OH groups. Reduced friction and increased abrasion resistance can increase the efficiency of the OLED manufacturing system 100 including the coating 201 and / or the Si-O-Si and Si-OH groups can further reduce the surface action of the coating 201 Or removed.

In one embodiment, after forming the coating 201 on the surface 203 of the substrate 204, the coating 201 is treated with trimethylsilane. In another embodiment, the coating 201 is oxidized to form a carboxysilane before being treated with trimethylsilane. In a further embodiment, after treating the carboxysilane with trimethylsilane, the coating 201 is functionalized. Treatment with trimethylsilane has been shown to improve inertness, corrosion resistance, hydrophobicity, pH resistance, abrasion resistance and hardness, and combinations thereof, as compared to untreated oxidized and / or functionalized coatings. Can be provided. Additionally or alternatively, the coating 201 may be adjusted for anti-traction and anti-calking properties.

Although the present invention has been described with reference to one or more embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements without departing from the scope of the invention . In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from the essential scope thereof. Therefore, it is intended that the invention not be limited to the particular embodiment disclosed as the best mode contemplated for carrying out this invention, but that the invention will include all embodiments falling within the scope of the appended claims. It is also to be understood that all numerical values identified in the detailed description are clearly identified as being both exact and approximate.

Claims (20)

A feed tube; And
A chemical vapor deposition coating applied on an inner surface of the feed tube,
Wherein the chemical vapor deposition coating is formed from decomposition of dimethylsilane,
Delivery device.
The method according to claim 1,
Wherein the chemical vapor deposition coating is applied under conditions of at least 1.0 psia and 200 psia,
Delivery device.
The method according to claim 1,
Wherein the chemical vapor deposition coating is applied under conditions of at least 1.0 psia and 10 psia,
Delivery device.
The method according to claim 1,
Wherein the chemical vapor deposition coating is applied under the condition of 200 캜 to 600 캜,
Delivery device.
The method according to claim 1,
Wherein the chemical vapor deposition coating is applied at a temperature of 400 ° C to 500 ° C,
Delivery device.
The method according to claim 1,
Wherein the chemical vapor deposition coating is applied for 10 minutes to 6 hours,
Delivery device.
The method according to claim 1,
Wherein the chemical vapor deposition coating is applied for 4 to 6 hours,
Delivery device.
The method according to claim 1,
Wherein the delivery device is disposed within the organic light emitting diode manufacturing system,
Delivery device.
The method according to claim 1,
Further comprising a processing material contained within the feed tube,
Delivery device.
10. The method of claim 9,
Wherein the delivery device is arranged and arranged to direct the workpiece material to a substrate to be coated,
Delivery device.
10. The method of claim 9,
Wherein the working material is an organic material,
Delivery device.
The method according to claim 1,
The chemical vapor deposition coating may be oxidized,
Delivery device.
The method according to claim 1,
The chemical vapor deposition coating is a functionalized,
Delivery device.
The method according to claim 1,
Wherein the chemical vapor deposition coating is treated with trimethylsilane,
Delivery device.
The method according to claim 1,
Wherein the inner surface is a pure metal surface or a substantially pure metal surface,
Delivery device.
The method according to claim 1,
Wherein the inner surface is a metal alloy surface,
Delivery device.
The method according to claim 1,
Wherein the inner surface is an impure metal surface,
Delivery device.
The method according to claim 1,
Further comprising additional feed tubes,
Delivery device.
A delivery device having a feed tube and a chemical vapor deposition coating applied on an inner surface of the feed tube, the chemical vapor deposition coating being formed from the decomposition of dimethylsilane; And
And a chamber for selective fluid communication with the delivery device.
Manufacturing system.
Providing a component comprising a chemical vapor deposition coating applied on a surface, wherein the chemical vapor deposition coating is formed from decomposition of dimethylsilane; And
And moving the material over the surface comprising the chemical vapor deposition coating,
Wherein the component is selected from the group consisting of a feed tube, an ultra-high vacuum (UHV) component, a shower head, a deflector plate, a fitting,
Goods manufacturing process.

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