KR20080007209A - Photosensitive composition and color filter formed from this photosensitive composition - Google Patents
Photosensitive composition and color filter formed from this photosensitive composition Download PDFInfo
- Publication number
- KR20080007209A KR20080007209A KR1020070140708A KR20070140708A KR20080007209A KR 20080007209 A KR20080007209 A KR 20080007209A KR 1020070140708 A KR1020070140708 A KR 1020070140708A KR 20070140708 A KR20070140708 A KR 20070140708A KR 20080007209 A KR20080007209 A KR 20080007209A
- Authority
- KR
- South Korea
- Prior art keywords
- group
- acrylate
- photosensitive composition
- methacrylate
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 51
- 150000001875 compounds Chemical class 0.000 claims abstract description 40
- 239000003086 colorant Substances 0.000 claims abstract description 23
- -1 silane compound Chemical class 0.000 claims abstract description 22
- 239000003623 enhancer Substances 0.000 claims abstract description 8
- 239000003999 initiator Substances 0.000 claims abstract description 6
- 239000003822 epoxy resin Substances 0.000 claims description 20
- 229920000647 polyepoxide Polymers 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 16
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 11
- 125000000962 organic group Chemical group 0.000 claims description 9
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 claims description 8
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 8
- 239000002253 acid Substances 0.000 claims description 7
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 6
- INQDDHNZXOAFFD-UHFFFAOYSA-N 2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOC(=O)C=C INQDDHNZXOAFFD-UHFFFAOYSA-N 0.000 claims description 6
- HCLJOFJIQIJXHS-UHFFFAOYSA-N 2-[2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOCCOC(=O)C=C HCLJOFJIQIJXHS-UHFFFAOYSA-N 0.000 claims description 6
- 229920003986 novolac Polymers 0.000 claims description 6
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 claims description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 5
- 239000004593 Epoxy Substances 0.000 claims description 5
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 claims description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 5
- LEJBBGNFPAFPKQ-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOC(=O)C=C LEJBBGNFPAFPKQ-UHFFFAOYSA-N 0.000 claims description 4
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 claims description 4
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 claims description 4
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000004925 Acrylic resin Substances 0.000 claims description 4
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 claims description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 4
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 claims description 4
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 claims description 4
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 4
- 125000003545 alkoxy group Chemical group 0.000 claims description 4
- AOJOEFVRHOZDFN-UHFFFAOYSA-N benzyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1=CC=CC=C1 AOJOEFVRHOZDFN-UHFFFAOYSA-N 0.000 claims description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 4
- 150000001244 carboxylic acid anhydrides Chemical group 0.000 claims description 4
- 229930003836 cresol Natural products 0.000 claims description 4
- 150000002148 esters Chemical class 0.000 claims description 4
- 239000001257 hydrogen Substances 0.000 claims description 4
- 229910052739 hydrogen Inorganic materials 0.000 claims description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 4
- 229920000728 polyester Polymers 0.000 claims description 4
- 150000003077 polyols Chemical group 0.000 claims description 4
- 150000007519 polyprotic acids Polymers 0.000 claims description 4
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims description 4
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 claims description 3
- IAKGBURUJDUUNN-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)-3-methylbutane-1,4-diol prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(C)C(CO)(CO)CO IAKGBURUJDUUNN-UHFFFAOYSA-N 0.000 claims description 3
- HWSSEYVMGDIFMH-UHFFFAOYSA-N 2-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOCCOC(=O)C(C)=C HWSSEYVMGDIFMH-UHFFFAOYSA-N 0.000 claims description 3
- LTHJXDSHSVNJKG-UHFFFAOYSA-N 2-[2-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOCCOCCOC(=O)C(C)=C LTHJXDSHSVNJKG-UHFFFAOYSA-N 0.000 claims description 3
- FDSUVTROAWLVJA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)COCC(CO)(CO)CO FDSUVTROAWLVJA-UHFFFAOYSA-N 0.000 claims description 3
- RUMACXVDVNRZJZ-UHFFFAOYSA-N 2-methylpropyl 2-methylprop-2-enoate Chemical compound CC(C)COC(=O)C(C)=C RUMACXVDVNRZJZ-UHFFFAOYSA-N 0.000 claims description 3
- CFVWNXQPGQOHRJ-UHFFFAOYSA-N 2-methylpropyl prop-2-enoate Chemical compound CC(C)COC(=O)C=C CFVWNXQPGQOHRJ-UHFFFAOYSA-N 0.000 claims description 3
- VFZKVQVQOMDJEG-UHFFFAOYSA-N 2-prop-2-enoyloxypropyl prop-2-enoate Chemical compound C=CC(=O)OC(C)COC(=O)C=C VFZKVQVQOMDJEG-UHFFFAOYSA-N 0.000 claims description 3
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 claims description 3
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 claims description 3
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims description 3
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 claims description 3
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 claims description 3
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 claims description 3
- JUDXBRVLWDGRBC-UHFFFAOYSA-N [2-(hydroxymethyl)-3-(2-methylprop-2-enoyloxy)-2-(2-methylprop-2-enoyloxymethyl)propyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(CO)(COC(=O)C(C)=C)COC(=O)C(C)=C JUDXBRVLWDGRBC-UHFFFAOYSA-N 0.000 claims description 3
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 claims description 3
- 150000008065 acid anhydrides Chemical class 0.000 claims description 3
- 150000001412 amines Chemical class 0.000 claims description 3
- 150000008064 anhydrides Chemical class 0.000 claims description 3
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 claims description 3
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 claims description 3
- XLYMOEINVGRTEX-ONEGZZNKSA-N (e)-4-ethoxy-4-oxobut-2-enoic acid Chemical compound CCOC(=O)\C=C\C(O)=O XLYMOEINVGRTEX-ONEGZZNKSA-N 0.000 claims description 2
- QRIMLDXJAPZHJE-UHFFFAOYSA-N 2,3-dihydroxypropyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(O)CO QRIMLDXJAPZHJE-UHFFFAOYSA-N 0.000 claims description 2
- OWPUOLBODXJOKH-UHFFFAOYSA-N 2,3-dihydroxypropyl prop-2-enoate Chemical compound OCC(O)COC(=O)C=C OWPUOLBODXJOKH-UHFFFAOYSA-N 0.000 claims description 2
- JJBFVQSGPLGDNX-UHFFFAOYSA-N 2-(2-methylprop-2-enoyloxy)propyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(C)COC(=O)C(C)=C JJBFVQSGPLGDNX-UHFFFAOYSA-N 0.000 claims description 2
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 claims description 2
- CQOZJDNCADWEKH-UHFFFAOYSA-N 2-[3,3-bis(2-hydroxyphenyl)propyl]phenol Chemical compound OC1=CC=CC=C1CCC(C=1C(=CC=CC=1)O)C1=CC=CC=C1O CQOZJDNCADWEKH-UHFFFAOYSA-N 0.000 claims description 2
- WYMDDFRYORANCC-UHFFFAOYSA-N 2-[[3-[bis(carboxymethyl)amino]-2-hydroxypropyl]-(carboxymethyl)amino]acetic acid Chemical compound OC(=O)CN(CC(O)=O)CC(O)CN(CC(O)=O)CC(O)=O WYMDDFRYORANCC-UHFFFAOYSA-N 0.000 claims description 2
- SFPNZPQIIAJXGL-UHFFFAOYSA-N 2-ethoxyethyl 2-methylprop-2-enoate Chemical compound CCOCCOC(=O)C(C)=C SFPNZPQIIAJXGL-UHFFFAOYSA-N 0.000 claims description 2
- FWWXYLGCHHIKNY-UHFFFAOYSA-N 2-ethoxyethyl prop-2-enoate Chemical compound CCOCCOC(=O)C=C FWWXYLGCHHIKNY-UHFFFAOYSA-N 0.000 claims description 2
- WDQMWEYDKDCEHT-UHFFFAOYSA-N 2-ethylhexyl 2-methylprop-2-enoate Chemical compound CCCCC(CC)COC(=O)C(C)=C WDQMWEYDKDCEHT-UHFFFAOYSA-N 0.000 claims description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 claims description 2
- XOJWAAUYNWGQAU-UHFFFAOYSA-N 4-(2-methylprop-2-enoyloxy)butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCOC(=O)C(C)=C XOJWAAUYNWGQAU-UHFFFAOYSA-N 0.000 claims description 2
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 claims description 2
- SAPGBCWOQLHKKZ-UHFFFAOYSA-N 6-(2-methylprop-2-enoyloxy)hexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCCOC(=O)C(C)=C SAPGBCWOQLHKKZ-UHFFFAOYSA-N 0.000 claims description 2
- JOZALWBFWGMCAU-UHFFFAOYSA-N CC(=C)C(O)=O.CC(=C)C(O)=O.CC(=C)C(O)=O.CC(=C)C(O)=O.OCC(C)C(CO)(CO)CO Chemical compound CC(=C)C(O)=O.CC(=C)C(O)=O.CC(=C)C(O)=O.CC(=C)C(O)=O.OCC(C)C(CO)(CO)CO JOZALWBFWGMCAU-UHFFFAOYSA-N 0.000 claims description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 2
- 125000002723 alicyclic group Chemical group 0.000 claims description 2
- 125000001931 aliphatic group Chemical group 0.000 claims description 2
- 125000004432 carbon atom Chemical group C* 0.000 claims description 2
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 claims description 2
- 239000001530 fumaric acid Substances 0.000 claims description 2
- XLYMOEINVGRTEX-UHFFFAOYSA-N fumaric acid monoethyl ester Natural products CCOC(=O)C=CC(O)=O XLYMOEINVGRTEX-UHFFFAOYSA-N 0.000 claims description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims description 2
- 239000004816 latex Substances 0.000 claims description 2
- 229920000126 latex Polymers 0.000 claims description 2
- CDOSHBSSFJOMGT-UHFFFAOYSA-N linalool Chemical compound CC(C)=CCCC(C)(O)C=C CDOSHBSSFJOMGT-UHFFFAOYSA-N 0.000 claims description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 claims description 2
- 239000011976 maleic acid Substances 0.000 claims description 2
- 229940074369 monoethyl fumarate Drugs 0.000 claims description 2
- 229920000151 polyglycol Polymers 0.000 claims description 2
- 239000010695 polyglycol Substances 0.000 claims description 2
- 229920005862 polyol Polymers 0.000 claims description 2
- 229920002635 polyurethane Polymers 0.000 claims description 2
- 239000004814 polyurethane Substances 0.000 claims description 2
- 229920003987 resole Polymers 0.000 claims description 2
- 150000005846 sugar alcohols Polymers 0.000 claims description 2
- NIFGBWQSQKASSJ-UHFFFAOYSA-N C(C(=C)C)(=O)OCC(C(=O)C=C)OC.COCCO Chemical compound C(C(=C)C)(=O)OCC(C(=O)C=C)OC.COCCO NIFGBWQSQKASSJ-UHFFFAOYSA-N 0.000 claims 1
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- 150000001252 acrylic acid derivatives Chemical class 0.000 claims 1
- HNEGQIOMVPPMNR-NSCUHMNNSA-N mesaconic acid Chemical compound OC(=O)C(/C)=C/C(O)=O HNEGQIOMVPPMNR-NSCUHMNNSA-N 0.000 claims 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 claims 1
- 239000011159 matrix material Substances 0.000 abstract description 22
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract description 10
- 229910000077 silane Inorganic materials 0.000 abstract description 8
- 229910052757 nitrogen Inorganic materials 0.000 abstract description 6
- 125000004435 hydrogen atom Chemical group [H]* 0.000 abstract description 2
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 abstract description 2
- 239000000049 pigment Substances 0.000 description 22
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- 239000000758 substrate Substances 0.000 description 14
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- 238000000576 coating method Methods 0.000 description 11
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- 230000002349 favourable effect Effects 0.000 description 6
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 6
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 5
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- YDIYEOMDOWUDTJ-UHFFFAOYSA-N 4-(dimethylamino)benzoic acid Chemical compound CN(C)C1=CC=C(C(O)=O)C=C1 YDIYEOMDOWUDTJ-UHFFFAOYSA-N 0.000 description 4
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- 125000004018 acid anhydride group Chemical group 0.000 description 3
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- GCTPMLUUWLLESL-UHFFFAOYSA-N benzyl prop-2-enoate Chemical compound C=CC(=O)OCC1=CC=CC=C1 GCTPMLUUWLLESL-UHFFFAOYSA-N 0.000 description 3
- 238000013329 compounding Methods 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 239000002270 dispersing agent Substances 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
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Classifications
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- G03F7/0755—Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0751—Silicon-containing compounds used as adhesion-promoting additives or as means to improve adhesion
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/085—Photosensitive compositions characterised by adhesion-promoting non-macromolecular additives
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Abstract
본 발명은 밀착성이 높고 품질이 양호한 블랙 매트릭스 및/또는 착색층을 형성할 수 있는 감광성 조성물, 및 상기 감광성 조성물로 형성되는 컬러필터를 제공한다. (a) 착색제, (b) 광중합성 화합물, (c) 광중합 개시제, 및 (d) 밀착증강제를 함유하는 착색제 함유 감광성 조성물로서, (d) 밀착증강제는 질소를 포함하는 기를 가지는 실란 화합물이며, 상기 질소에 결합되어 있는 수소가 1개 이하인 화합물을 사용한다.The present invention provides a photosensitive composition capable of forming a black matrix and / or a colored layer having high adhesion and good quality, and a color filter formed of the photosensitive composition. A colorant-containing photosensitive composition containing (a) a colorant, (b) a photopolymerizable compound, (c) a photopolymerization initiator, and (d) an adhesion enhancer, wherein (d) the adhesion enhancer is a silane compound having a group containing nitrogen. Compounds having one or less hydrogens bonded to nitrogen are used.
Description
본 발명은 감광성 조성물, 상기 감광성 조성물로 형성된 컬러필터에 관한 것으로, 더욱 구체적으로는 액정패널의 블랙 매트릭스 및/또는 컬러필터를 형성하는데 바람직한 감광성 조성물, 상기 감광성 조성물로 형성된 컬러필터에 관한 것이다.The present invention relates to a photosensitive composition, a color filter formed of the photosensitive composition, and more particularly, to a photosensitive composition suitable for forming a black matrix and / or a color filter of a liquid crystal panel, and a color filter formed of the photosensitive composition.
액정패널, 특히 TN 방식, STN 방식 등의 액정패널은, 화상의 컨트라스트를 강조하기 위한 블랙 매트릭스나 일반적으로 적색(R), 녹색(G), 청색(B)의 각 색으로 이루어지는 RGB의 착색층이 형성된 컬러필터를 구비하고 있다. 이 블랙 매트릭스나 착색층은 흑색 또는 각 색의 착색제가 분산된 감광성 조성물을 기판에 도포하고 건조한 후, 얻어진 도막을 노광, 현상하여, 원하는 패턴을 형성하는 것을 반복함으로써 형성된다. 이 블랙 매트릭스 및 착색층은, 특히 액정패널에 있어서의 신뢰성을 확보하기 위하여 기판과의 높은 밀착성이 요구된다. 이에 대하여, 일본특허공개2000-35670 공보에는 착색 감광성 수지조성물에 아민계 실란 커플링제를 첨가하는 것이 기재되어 있다. 하지만, 상기 문헌에서는 셀로판 테이프를 붙이고 이 셀 로판 테이프를 박리한 경우에 벗겨짐이 있는지 여부를 비교하고 있다. 이는 착색감광성 수지조성물의 경화성(硬化性)을 고려한 것으로, 경화성이 낮은 경우에 벗겨짐이 발생하는 것이다.Liquid crystal panels, in particular, liquid crystal panels such as TN and STN systems, have a black matrix for enhancing the contrast of an image, or an RGB colored layer generally composed of red (R), green (G), and blue (B) colors. The formed color filter is provided. This black matrix and a colored layer are formed by apply | coating the photosensitive composition which black or the coloring agent of each color disperse | distributed to a board | substrate, drying, exposing and developing the obtained coating film, and repeating forming a desired pattern. In particular, the black matrix and the colored layer are required to have high adhesion with the substrate in order to secure reliability in the liquid crystal panel. In contrast, Japanese Patent Application Laid-Open No. 2000-35670 discloses adding an amine silane coupling agent to a colored photosensitive resin composition. However, the document compares whether there is peeling when the cellophane tape is attached and the cellophane tape is peeled off. This takes into account the curability of the colored photosensitive resin composition, and peeling occurs when the curability is low.
예를 들어, 액정패널은 컬러필터가 형성된 기판과 대향 기판을 붙이고, 두 기판의 사이에 액정이 충전된 구조로 되어 있다. 그 때문에, 컬러필터가 벗겨진 경우, 액정패널로부터 액정이 새어나오는 문제가 발생한다. 그래서, 밀착성에 관한 내구성 시험으로서 PCT(Pressure Cooker Test)가 이루어진다. 이 PCT는 온도 120℃, 습도 100%, 기압 2atm이라는 가혹한 조건아래 액정패널을 2시간 동안 방치하고, 액정패널의 컬러필터 기판과 TFT 기판 사이에 봉입된 액정의 누설이 있는지 여부를 확인하는 것이다. 이와 같이, 근래에는 밀착성에 대한 요구가 더욱 고도화되고 있다. 결국, 종래와 다른 엄격한 조건하에서도 밀착성이 높은 블랙 매트릭스 및/또는 착색층이 요구되고 있다. 이에 대하여, 상기 문헌과 같은 셀로판 테이프에 의한 박리시험은, 현 상태에서는 밀착성 시험으로서 불충분하다고 할 수 있다. 특히, 블랙 매트릭스를 형성하는 경우, 감광성 조성물에 차광제가 포함되기 때문에, 경화성이 낮아지고 밀착성이 떨어져, 벗겨짐 등이 발생하기 쉬워진다는 문제가 있다.For example, the liquid crystal panel has a structure in which a substrate on which a color filter is formed and an opposing substrate are attached, and a liquid crystal is filled between the two substrates. Therefore, when a color filter is peeled off, the problem that a liquid crystal leaks out from a liquid crystal panel arises. Therefore, PCT (Pressure Cooker Test) is performed as a durability test regarding adhesion. In this PCT, the liquid crystal panel is left for 2 hours under severe conditions such as a temperature of 120 ° C., a humidity of 100% and an air pressure of 2 atm, to check whether there is a leakage of the liquid crystal enclosed between the color filter substrate and the TFT substrate of the liquid crystal panel. As such, in recent years, the demand for adhesion is further advanced. As a result, there is a demand for a black matrix and / or a colored layer having high adhesion even under stringent conditions different from those of the prior art. On the other hand, the peeling test by the cellophane tape like the said document can be said to be inadequate as an adhesive test in the present state. In particular, when forming a black matrix, since the light-shielding agent is contained in the photosensitive composition, there exists a problem that curability becomes low, adhesiveness falls, peeling etc. tend to occur.
본 발명은 상기 문제점에 감안하여 이루어진 것으로, 그 목적은 PCT에서도 밀착성이 높고 품질이 양호한 블랙 매트릭스 및/또는 착색층을 형성할 수 있는 감광성 조성물, 및 상기 감광성 조성물로 형성되는 컬러필터를 제공하는데 있다.The present invention has been made in view of the above problems, and an object thereof is to provide a photosensitive composition capable of forming a black matrix and / or a colored layer having high adhesion and good quality even in PCT, and a color filter formed of the photosensitive composition. .
본 발명의 감광성 조성물은 (a) 착색제, (b) 광중합성 화합물, (c) 광중합 개시제, 및 (d) 밀착증강제를 함유하는 착색제 함유 감광성 조성물로서, (d) 밀착증강제는 질소를 포함하는 기를 가지는 실란 화합물이며, 상기 질소에 결합되어 있는 수소가 1개 이하인 것을 특징으로 하고 있다.The photosensitive composition of the present invention is a colorant-containing photosensitive composition containing (a) a colorant, (b) a photopolymerizable compound, (c) a photopolymerization initiator, and (d) an adhesion enhancer, wherein (d) the adhesion enhancer is a group containing nitrogen. It is a silane compound, It is characterized by having one or less hydrogen couple | bonded with the said nitrogen.
본 발명의 착색제 함유 감광성 조성물은 (a) 착색제, (b) 광중합성 화합물, (c) 광중합 개시제, 및 (d) 밀착증강제를 함유하고 있다.The coloring agent containing photosensitive composition of this invention contains (a) a coloring agent, (b) photopolymerizable compound, (c) photoinitiator, and (d) adhesion promoter.
상기 (a) 착색제로서는 예를 들어, 컬러 인덱스(C.I.; The Society of Dyers and Colourists사 발행)에 있어서 피그멘트(pigment)로 분류되어 있는 화합물, 구체적으로는 아래와 같은 컬러 인덱스(C.I.) 번호가 붙어있는 것을 들 수 있다.As the (a) coloring agent, for example, a compound classified as a pigment in a color index (CI; issued by The Society of Dyers and Colourists, Inc.), specifically the following color index (CI) number is given. I can hear that.
C.I. 피그멘트 옐로우 1(이하, 'C.I.피그멘트 옐로우'는 같고 번호만 기재한다), 3, 11, 12, 13, 14, 15, 16, 17, 20, 24, 31, 53, 55, 60, 61, 65, 71, 73, 74, 81, 83, 86, 93, 95, 97, 98, 99, 100, 101, 104, 106, 108, 109, 110, 113, 114, 116, 117, 119, 120, 125, 126, 127, 128, 129, 137, 138, 139, 147, 148, 150, 151, 152, 153, 154, 155, 156, 166, 167, 168, 175, 180, 185;C.I. Pigment Yellow 1 (hereinafter 'CI Pigment Yellow' is the same and only numbers are listed), 3, 11, 12, 13, 14, 15, 16, 17, 20, 24, 31, 53, 55, 60, 61 , 65, 71, 73, 74, 81, 83, 86, 93, 95, 97, 98, 99, 100, 101, 104, 106, 108, 109, 110, 113, 114, 116, 117, 119, 120 , 125, 126, 127, 128, 129, 137, 138, 139, 147, 148, 150, 151, 152, 153, 154, 155, 156, 166, 167, 168, 175, 180, 185;
C.I. 피그멘트 오렌지 1(이하, 'C.I.피그멘트 오렌지'는 같고 번호만 기재한다), 5, 13, 14, 16, 17, 24, 34, 36, 38, 40, 43, 46, 49, 51, 55, 59, 61, 63, 64, 71, 73; C.I. Pigment Orange 1 (hereinafter 'CI Pigment Orange' is the same and only numbers are listed), 5, 13, 14, 16, 17, 24, 34, 36, 38, 40, 43, 46, 49, 51, 55 59, 61, 63, 64, 71, 73;
C.I. 피그멘트 바이올렛 1(이하, 'C.I.피그멘트 바이올렛'은 같고 번호만 기재한다), 19, 23, 29, 30, 32, 36, 37, 38, 39, 40, 50;C.I. Pigment Violet 1 (hereinafter 'C.I. Pigment Violet' is the same and lists only the numbers), 19, 23, 29, 30, 32, 36, 37, 38, 39, 40, 50;
C.I. 피그멘트 레드 1(이하, 'C.I.피그멘트 레드'는 같고 번호만 기재한다), 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 14, 15, 16, 17, 18, 19, 21, 22, 23, 30, 31, 32, 37, 38, 40, 41, 42, 48:1, 48:2, 48:3, 48:4, 49:1, 49:2, 50:1, 52:1, 53:1, 57, 57:1, 57:2, 58:2, 58:4, 60:1, 63:1, 63:2, 64:1, 81:1, 83, 88, 90:1, 97, 101, 102, 104, 105, 106, 108, 112, 113, 114, 122, 123, 144, 146, 149, 150, 151, 155, 166, 168, 170, 171, 172, 174, 175, 176, 177, 178, 179, 180, 185, 187, 188, 190, 192, 193, 194, 202, 206, 207, 208, 209, 215, 216, 217, 220, 223, 224, 226, 227, 228, 240, 242, 243, 245, 254, 255, 264, 265;C.I. Pigment Red 1 (hereinafter 'CI Pigment Red' is the same and only numbers are listed), 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 14, 15, 16, 17 , 18, 19, 21, 22, 23, 30, 31, 32, 37, 38, 40, 41, 42, 48: 1, 48: 2, 48: 3, 48: 4, 49: 1, 49: 2 , 50: 1, 52: 1, 53: 1, 57, 57: 1, 57: 2, 58: 2, 58: 4, 60: 1, 63: 1, 63: 2, 64: 1, 81: 1 , 83, 88, 90: 1, 97, 101, 102, 104, 105, 106, 108, 112, 113, 114, 122, 123, 144, 146, 149, 150, 151, 155, 166, 168, 170 , 171, 172, 174, 175, 176, 177, 178, 179, 180, 185, 187, 188, 190, 192, 193, 194, 202, 206, 207, 208, 209, 215, 216, 217, 220 , 223, 224, 226, 227, 228, 240, 242, 243, 245, 254, 255, 264, 265;
C.I. 피그멘트 블루 1(이하, 'C.I.피그멘트 블루'는 같고 번호만 기재한다), 2, 15, 15:3, 15:4, 15:6, 16, 22, 60, 64, 66; C.I. Pigment Blue 1 (hereinafter 'C.I. Pigment Blue' is the same and lists only the numbers), 2, 15, 15: 3, 15: 4, 15: 6, 16, 22, 60, 64, 66;
C.I. 피그멘트 그린 7, C.I. 피그멘트 그린 36, C.I. 피그멘트 그린 37; C.I. Pigment Green 7, C.I. Pigment Green 36, C.I. Pigment green 37;
C.I. 피그멘트 브라운 23, C.I. 피그멘트 브라운 25, C.I. 피그멘트 브라운 26, C.I. 피그멘트 브라운 28; C.I. Pigment Brown 23, C.I. Pigment Brown 25, C.I. Pigment Brown 26, C.I. Pigment brown 28;
C.I. 피그멘트 블랙 1, C.I. 피그멘트 블랙 7.C.I. Pigment Black 1, C.I. Pigment Black 7.
(a) 착색제의 첨가량은 목적으로 하는 색조에 따라 적절히 변경할 수 있지 만, 일반적으로 (b) 광중합성 화합물(혹은 고분자 바인더 및 광중합성 모노머), 및 (c) 광중합 개시제의 합계 100 중량부에 대하여, 5~250 질량부의 범위에서 첨가하는 것이 바람직하고, 보다 바람직한 범위는 10~200 질량부 정도이다.Although the addition amount of (a) coloring agent can be suitably changed according to the target color tone, Generally, (b) 100 weight part of photopolymerizable compounds (or a polymeric binder and a photopolymerizable monomer), and (c) a photoinitiator total. It is preferable to add in 5-250 mass parts, and a more preferable range is about 10-200 mass parts.
또한, 블랙 마스크를 형성하는 경우에는 착색제로서 차광제를 사용한다. 이 차광제로서는 차광층으로 했을 때 충분한 차광율을 가지는 것이면 특별히 한정되지 않으며, 예를 들어, 흑색안료를 들 수 있다. 이 흑색안료로서는 카본 블랙, 티탄 블랙, 페릴렌 블랙 등을 들 수 있다. 더욱이, 색조를 정돈하거나 더 높은 저항값을 얻기 위하여, 차광성능을 떨어뜨리지 않는 범위에서 상기 착색제를 첨가하여도 좋다.In addition, when forming a black mask, a light-shielding agent is used as a coloring agent. The light shielding agent is not particularly limited as long as it has a sufficient light shielding ratio when used as the light shielding layer, and examples thereof include black pigments. Carbon black, titanium black, perylene black, etc. are mentioned as this black pigment. Furthermore, in order to reduce color tone or obtain a higher resistance value, the coloring agent may be added within a range not to impair the light shielding performance.
또한, 일반적으로 착색제로서 차광제를 사용한 감광성 조성물을 도포하여 형성한 블랙 매트릭스가 높은 컨트라스트의 화상을 유지하기 위해서는, 차광율이 OD값으로 1.5 이상, 바람직하게는 3.0 이상, 더욱 바람직하게는 4.0 이상인 것이 좋다.In addition, in order to maintain an image with high contrast, the black matrix formed by coating the photosensitive composition using the light-shielding agent as a colorant generally has an OD value of 1.5 or more, preferably 3.0 or more, and more preferably 4.0 or more. It is good.
본 발명의 감광성 조성물에 첨가되는 차광제의 양은, (b) 광중합성 화합물 (혹은 고분자 바인더 및 광중합성 모노머) 및 (c) 광중합 개시제의 합계 100 중량부에 대하여, 20~150 중량부, 바람직하게는 25~100 중량부, 더욱 바람직하게는 30~80 중량부의 범위가 좋다. 상기 범위를 20 중량부 이상으로 함으로써, 충분한 차광성을 가지는 블랙 매트릭스를 제공할 수 있다. 또한, 상기 범위를 150 중량부 이하로 함으로써, 경화 불량을 방지하고 양호한 블랙 매트릭스를 형성할 수 있다.The amount of the light-shielding agent added to the photosensitive composition of the present invention is 20 to 150 parts by weight, preferably 100 parts by weight of the total of (b) the photopolymerizable compound (or the polymer binder and the photopolymerizable monomer) and (c) the photopolymerization initiator. Is in the range of 25 to 100 parts by weight, more preferably 30 to 80 parts by weight. By making the said range 20 weight part or more, the black matrix which has sufficient light-shielding property can be provided. Moreover, by making the said range into 150 weight part or less, a hardening failure can be prevented and a favorable black matrix can be formed.
더욱이, 상기 (a) 착색제는, 분산제를 사용하여 적당한 농도(예를 들어, 10~20%)로 분산시킨 용액으로 하여, 다른 성분과 혼합할 수 있다. 상기 분산제는 특별히 한정되는 것은 아니지만, 예를 들어, 폴리에틸렌이민계, 우레탄 수지계, 아크릴 수지계의 고분자 분산제가 바람직하게 사용된다.Moreover, the said (a) coloring agent can be mixed with another component as a solution disperse | distributed to a suitable density | concentration (for example, 10 to 20%) using a dispersing agent. Although the said dispersing agent is not specifically limited, For example, the polymer dispersing agent of a polyethyleneimine system, a urethane resin system, and an acrylic resin system is used preferably.
상기 (b) 광중합성 화합물은 자외선 등 광의 조사를 받아 중합하고 경화하는 물질이다. 광중합성 화합물로서는 에틸렌성 이중결합을 가지는 화합물이 바람직하며, 구체적으로는 아크릴산, 메타크릴산, 푸마르산, 말레산, 푸마르산 모노메틸, 푸마르산 모노에틸, 2-히드록시에틸아크릴레이트, 2-히드록시에틸메타크릴레이트, 에틸렌글리콜모노메틸에테르아크릴레이트, 에틸렌글리콜모노메틸에테르메타크릴레이트, 에틸렌글리콜모노에틸에테르아크릴레이트, 에틸렌글리콜모노에틸에테르메타크릴레이트, 글리세롤아크릴레이트, 글리세롤메타크릴레이트, 아크릴산아미드, 메타크릴산아미드, 아크릴로니트릴, 메타크릴로니트릴, 메틸아크릴레이트, 메틸메타크릴레이트, 에틸아크릴레이트, 에틸메타크릴레이트, 이소부틸아크릴레이트, 이소부틸메타크릴레이트, 2-에틸헥실아크릴레이트, 2-에틸헥실메타크릴레이트, 벤질아크릴레이트, 벤질메타크릴레이트, 에틸렌글리콜디아크릴레이트, 에틸렌글리콜디메타크릴레이트, 디에틸렌글리콜디아크릴레이트, 트리에틸렌글리콜디아크릴레이트, 트리에틸렌글리콜디메타크릴레이트, 테트라에틸렌글리콜디아크릴레이트, 테트라에틸렌글리콜디메타크릴레이트, 부틸렌글리콜디메타크릴레이트, 프로필렌글리콜디아크릴레이트, 프로필렌글리콜디메타크릴레이트, 트리메틸롤프로판트리아크릴레이트, 트리메틸롤프로판트리메타크릴레이트, 테트라메틸롤프로판테트라아크릴레이트, 테트라메틸롤프로판테트라메타크릴레이트, 펜타에리스리톨트리아크릴레이트, 펜타에 리스리톨트리메타크릴레이트, 펜타에리스리톨테트라아크릴레이트(DPTA), 펜타에리스리톨테트라메타크릴레이트, 디펜타에리스리톨펜타아크릴레이트, 디펜타에리스리톨펜타메타크릴레이트, 디펜타에리스리톨헥사아크릴레이트(DPHA), 디펜타에리스리톨헥사메타크릴레이트, 1,6-헥산디올디아크릴레이트, 1,6-헥산디올디메타크릴레이트, 카르드에폭시디아크릴레이트 등의 모노머, 올리고머류; 다가 알코올류와 1염기산 또는 다염기산을 축합하여 얻어지는 폴리에스테르 프리폴리머에 (메타)아크릴산을 반응하여 얻어지는 폴리에스테르(메타)아크릴레이트, 폴리올기와 2개의 이소시아네이트기를 가지는 화합물을 반응시킨 후, (메타)아크릴산을 반응하여 얻어지는 폴리우레탄(메타)아크릴레이트; 비스페놀 A형 에폭시 수지, 비스페놀 F형 에폭시 수지, 비스페놀 S형 에폭시 수지, 페놀 또는 크레졸노볼락형 에폭시 수지, 레졸형 에폭시수지, 트리페놀메탄형 에폭시 수지, 폴리카르복시산 폴리글리시딜에스테르, 폴리올폴리글리시딜에스테르, 지방족 또는 지환식 에폭시 수지, 아민에폭시 수지, 디히드록시벤젠형 에폭시 수지 등의 에폭시 수지와 (메타)아크릴산을 반응하여 얻어지는 에폭시(메타)아크릴레이트 수지 등을 들 수 있다. 더욱이 상기 에폭시(메타)아크릴레이트 수지에 다염기산 무수물을 반응시킨 수지도 바람직하게 사용할 수 있다.Said (b) photopolymerizable compound is a substance which superposes | polymerizes and hardens | cures by irradiation of light, such as an ultraviolet-ray. As the photopolymerizable compound, a compound having an ethylenic double bond is preferable, and specifically, acrylic acid, methacrylic acid, fumaric acid, maleic acid, monomethyl fumarate, monoethyl fumarate, 2-hydroxyethyl acrylate, 2-hydroxyethyl Methacrylate, ethylene glycol monomethyl ether acrylate, ethylene glycol monomethyl ether methacrylate, ethylene glycol monoethyl ether acrylate, ethylene glycol monoethyl ether methacrylate, glycerol acrylate, glycerol methacrylate, acrylic acid amide, Methacrylate amide, acrylonitrile, methacrylonitrile, methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, isobutyl acrylate, isobutyl methacrylate, 2-ethylhexyl acrylate, 2-ethylhexyl methacrylate, benzyl acrylate, benzyl Methacrylate, ethylene glycol diacrylate, ethylene glycol dimethacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, triethylene glycol dimethacrylate, tetraethylene glycol diacrylate, tetraethylene glycol di Methacrylate, butylene glycol dimethacrylate, propylene glycol diacrylate, propylene glycol dimethacrylate, trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, tetramethylolpropane tetraacrylate, tetramethyl Roll propane tetramethacrylate, pentaerythritol triacrylate, pentaerythritol trimethacrylate, pentaerythritol tetraacrylate (DPTA), pentaerythritol tetramethacrylate, dipentaerythritol pentaacrylate, dipentaerythritol pentamethacrylate Relate, dipentaerythritol hexaacrylate (DPHA), dipentaerythritol hexamethacrylate, 1,6-hexanediol diacrylate, 1,6-hexanediol dimethacrylate, cardepoxy diacrylate, and the like Monomers and oligomers; After (meth) acrylic acid is reacted with a polyester (meth) acrylate obtained by reacting (meth) acrylic acid to a polyester prepolymer obtained by condensing polyhydric alcohols with monobasic acid or polybasic acid, a compound having a polyol group and two isocyanate groups Polyurethane (meth) acrylate obtained by reacting; Bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, phenol or cresol novolak type epoxy resin, resol type epoxy resin, triphenol methane type epoxy resin, polycarboxylic acid polyglycidyl ester, polyol polyglycol Epoxy (meth) acrylate resin etc. which are obtained by reacting (meth) acrylic acid with epoxy resins, such as a cydyl ester, an aliphatic or alicyclic epoxy resin, an amine epoxy resin, and a dihydroxy benzene type epoxy resin, are mentioned. Moreover, the resin which made polybasic acid anhydride react with the said epoxy (meth) acrylate resin can also be used preferably.
또한, 광중합성 화합물로서는 하기 화학식 1로 나타내어지는 화합물도 적용할 수 있다. 이 화학식 1로 나타내어지는 화합물은 그 자체가 광경화성이 높다는 점에서 바람직한 화합물이다.Moreover, as a photopolymerizable compound, the compound represented by following formula (1) is also applicable. The compound represented by this general formula (1) is a preferable compound by the point that itself is highly photocurable.
여기서, n은 1~20의 정수이다. 또한, 화학식 1로 나타내어지는 화합물의 X는 하기 화학식 2로 나타내어지는 기(基)인 것이 바람직하다.Here, n is an integer of 1-20. In addition, it is preferable that X of the compound represented by General formula (1) is group represented by following General formula (2).
또한, 화학식 1로 나타내어지는 화합물의 Y는 예를 들어, 무수 말레산, 무수 호박산, 무수 이타콘산, 무수 프탈산, 무수 테트라히드로프탈산, 무수 헥사히드로프탈산, 무수 메틸엔도메틸렌테트라히드로프탈산, 무수 클로렌드산(chlorendic acid), 메틸테트라히드로 무수프탈산, 무수 글루타르산이라는 디카르복시산 무수물로부터 카르복시산 무수물기(-CO-O-CO-)를 제거한 잔기이다.In addition, Y of the compound represented by Formula 1 is, for example, maleic anhydride, succinic anhydride, itaconic anhydride, phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methylendomethylenetetrahydrophthalic anhydride, chloride anhydride, for example. It is the residue which removed carboxylic anhydride group (-CO-O-CO-) from dicarboxylic anhydrides, such as an acid (chlorendic acid), methyltetrahydro phthalic anhydride, and glutaric anhydride.
또한, 화학식 1로 나타내어지는 화합물의 Z는 예를 들어, 무수 피로멜리트산, 벤조페논테트라카르복시산 이무수물, 비페닐테트라카르복시산 이무수물, 비페닐에테르테트라카르복시산 이무수물 등의 테트라카르복시산 이무수물로부터 2개의 카르복시산 무수물기를 제거한 잔기이다.In addition, Z of the compound represented by General formula (1) is two from tetracarboxylic dianhydrides, such as pyromellitic anhydride, a benzophenone tetracarboxylic dianhydride, a biphenyl tetracarboxylic dianhydride, and a biphenyl ether tetracarboxylic dianhydride, for example. It is the residue remove | excluding the carboxylic anhydride group.
이 광중합성 화합물들은 1종 또는 2종 이상을 조합하여 사용하여도 좋다.These photopolymerizable compounds may be used alone or in combination of two or more thereof.
상기에서는 광중합성 화합물로서 그 분자 자체가 중합가능한 것을 들었지만, 본 발명에서는 (b-1) 고분자 바인더와 (b-2) 광중합성 모노머와의 혼합물도 (b) 광중합성 화합물에 포함되는 것으로 한다.In the above, although the molecule | numerator itself was mentioned as a photopolymerizable compound, in this invention, the mixture of (b-1) polymeric binder and (b-2) photopolymerizable monomer shall also be included in (b) photopolymerizable compound.
상기 (b-1) 고분자 바인더로서는 현상이 용이하여 알칼리 현상이 가능한 바인더가 바람직하다.As said (b-1) polymeric binder, the binder which is easy to develop and which can develop alkali is preferable.
구체적으로는 아크릴산, 메타크릴산 등의 카르복시기를 가지는 모노머와, 아크릴산 메틸, 메타크릴산 메틸, 아크릴산 에틸, 메타크릴산 에틸, 2-히드록시에틸아크릴레이트, 2-히드록시에틸메타크릴레이트, 2-히드록시프로필메타크릴레이트, N-부틸아크릴레이트, N-부틸메타크릴레이트, 이소부틸아크릴레이트, 이소부틸메타크릴레이트, 벤질아크릴레이트, 벤질메타크릴레이트, 페녹시아크릴레이트, 페녹시메타크릴레이트, 이소보르닐아크릴레이트, 이소보르닐메타크릴레이트, 글리시딜메타크릴레이트, 스틸렌, 아크릴아미드, 아크릴로니트릴 등과의 공중합체, 및 페놀노볼락형 에폭시아크릴레이트 중합체, 페놀노볼락형 에폭시메타크릴레이트 중합체, 크레졸 노볼락형 에폭시 아크릴레이트 중합체, 크레졸 노볼락형 에폭시 메타크릴레이트 중합체, 비스페놀 A형 에폭시 아크릴레이트 중합체, 비스페놀 S형 에폭시 아크릴레이트 중합체 등의 수지를 들 수 있다. 상기 수지에는 아크릴로일기 또는 메타크릴로일기가 도입되고 있어, 가교효율이 높아져 도막의 내광성, 내약품성이 뛰어나다. 상기 수지를 구성하는 아크릴산, 메타크릴산 등의 카르복시기를 가지는 모노머 성분의 함유량은 5~40 질량%의 범위가 좋다. 이 고분자 바인더의 중량평균 분 자량의 바람직한 범위는 1,000~100,000이다. 중량평균 분자량을 1,000 이상으로 함으로써 도막을 균일하게 할 수 있다. 또한, 100,000 이하로 함으로써 현상성을 양호하게 할 수 있다.Specifically, monomers having a carboxyl group such as acrylic acid and methacrylic acid, methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, 2 Hydroxypropyl methacrylate, N-butyl acrylate, N-butyl methacrylate, isobutyl acrylate, isobutyl methacrylate, benzyl acrylate, benzyl methacrylate, phenoxy acrylate, phenoxy methacrylate Copolymers of latex, isobornyl acrylate, isobornyl methacrylate, glycidyl methacrylate, styrene, acrylamide, acrylonitrile and the like, and phenol novolak type epoxy acrylate polymer, phenol novolak type epoxy Methacrylate polymers, cresol novolac type epoxy acrylate polymers, cresol novolac type epoxy methacrylate polymers, 'S phenol A epoxy acrylate polymers, it may be mentioned resins such as bisphenol S-type epoxy acrylate polymer. Acryloyl group or methacryloyl group is introduce | transduced into the said resin, crosslinking efficiency becomes high, and it is excellent in the light resistance and chemical-resistance of a coating film. Content of the monomer component which has carboxyl groups, such as acrylic acid and methacrylic acid which comprise the said resin, has a range of 5-40 mass%. The preferable range of the weight average molecular weight of this polymeric binder is 1,000-100,000. By making a weight average molecular weight 1,000 or more, a coating film can be made uniform. Moreover, developability can be made favorable by setting it as 100,000 or less.
또한, (b-2) 광중합성 모노머로서는 메틸아크릴레이트, 메틸메타크릴레이트, 2-히드록시에틸아크릴레이트, 2-히드록시에틸메타크릴레이트, 2-히드록시프로필메타크릴레이트, 에틸렌글리콜디아크릴레이트, 에틸렌글리콜디메타크릴레이트, 트리에틸렌글리콜디아크릴레이트, 트리에틸렌글리콜디메타크릴레이트, 테트라에틸렌글리콜디아크릴레이트, 테트라에틸렌글리콜디메타크릴레이트, 프로필렌글리콜디아크릴레이트, 프로필렌글리콜디메타크릴레이트, 트리메틸롤프로판트리아크릴레이트, 트리메틸롤프로판트리메타크릴레이트, 테트라메틸롤프로판테트라아크릴레이트, 테트라메틸롤프로판테트라메타크릴레이트, 펜타에리스리톨트리아크릴레이트, 펜타에리스리톨트리메타크릴레이트, 펜타에리스리톨테트라아크릴레이트, 펜타에리스리톨테트라메타크릴레이트, 디펜타에리스리톨펜타아크릴레이트, 디펜타에리스리톨펜타메타크릴레이트, 디펜타에리스리톨헥사아크릴레이트, 디펜타에리스리톨헥사메타크릴레이트, 1,6-헥산디올디아크릴레이트, 벤질아크릴레이트, 벤질메타크릴레이트, 카르드에폭시디아크릴레이트, 아크릴산, 메타크릴산 등을 들 수 있는데, 이것들로 한정되는 것은 아니다.As the photopolymerizable monomer (b-2), methyl acrylate, methyl methacrylate, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, and ethylene glycol diacryl Ethylene glycol dimethacrylate, triethylene glycol diacrylate, triethylene glycol dimethacrylate, tetraethylene glycol diacrylate, tetraethylene glycol dimethacrylate, propylene glycol diacrylate, propylene glycol dimethacryl Rate, trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, tetramethylolpropane tetraacrylate, tetramethylolpropane tetramethacrylate, pentaerythritol triacrylate, pentaerythritol trimethacrylate, pentaerythritol tetra Acrylate, Pentaerythritol Tet Methacrylate, dipentaerythritol pentaacrylate, dipentaerythritol pentamethacrylate, dipentaerythritol hexaacrylate, dipentaerythritol hexamethacrylate, 1,6-hexanediol diacrylate, benzyl acrylate, benzyl methacrylate Although acrylate, cardepoxy diacrylate, acrylic acid, methacrylic acid, etc. are mentioned, It is not limited to these.
(b) 성분이 (b-1) 성분과 (b-2) 성분으로 이루어지는 경우, (b-1) 성분은 (b-1) 성분과 (b-2) 성분 및 (c) 광중합 개시제의 합계 100 중량부 중, 10~60 중량부의 범위에서 배합되는 것이 좋다. 상기 배합량을 10 중량부 이상으로 함으로써, 도포, 건조시에 막을 쉽게 형성할 수 있어, 경화 후의 피막강도를 충분히 높일 수 있다. 또한, 배합량을 60 중량부 이하로 함으로써, 현상성을 양호하게 할 수 있다. 더욱이 (b-2) 성분은 (b-1) 성분과 (b-2) 성분 및 (c) 광중합 개시제의 합계 100 중량부당 15~50 중량부의 범위로 배합되는 것이 바람직하다. 상기 배합량을 15 중량부 이상으로 함으로써, 광경화 불량을 방지하고, 충분한 내열성, 내약품성을 얻을 수 있다. 또한, 50 중량부 이하로 함으로써, 도막 형성 능력을 양호하게 할 수 있다.When the component (b) consists of the component (b-1) and the component (b-2), the component (b-1) is the sum of the component (b-1), the component (b-2) and the photopolymerization initiator (c). It is good to mix | blend in the range of 10-60 weight part among 100 weight part. By making the said compounding quantity 10 weight part or more, a film | membrane can be easily formed at the time of application | coating and drying, and the film strength after hardening can fully be raised. Moreover, developability can be made favorable by making a compounding quantity 60 weight part or less. Furthermore, it is preferable that (b-2) component is mix | blended in the range of 15-50 weight part per 100 weight part of components of (b-1) component, (b-2) component, and (c) photoinitiator in total. By making the said compounding quantity 15 weight part or more, the photocuring defect can be prevented and sufficient heat resistance and chemical-resistance can be obtained. Moreover, coating film formation ability can be made favorable by using 50 weight part or less.
상기 (c) 광중합 개시제는 상기 (b) 광중합성 화합물의 종류에 따라 적절한 것을 선택하면 좋다. 이 광중합 개시제는 1종 또는 2종 이상을 조합하여 사용하여도 좋다. 이 광중합 개시제로서는 예를 들어, 1-히드록시시클로헥실페닐케톤, 2-히드록시-2-메틸-1-페닐프로판-1-온, 1-[4-(2-히드록시에톡시)페닐]-2-히드록시-2-메틸-1-프로판-1-온, 1-(4-이소프로필페닐)-2-히드록시-2-메틸프로판-1-온, 1-(4-드데실페닐)-2-히드록시-2-메틸프로판-1-온, 2,2-디메톡시-1,2-디페닐에탄-1-온, 비스(4-디메틸아미노페닐)케톤, 2-메틸-1-[4-(메틸티오)페닐]-2-모노폴리노프로판-1-온, 2-벤질-2-디메틸아미노-1-(4-모노폴리노페닐)-부탄-1-온, 2,4,6-트리메틸벤조일디페닐포스핀옥시드, 4-벤조일-4'-메틸디메틸설파이드, 4-디메틸아미노 안식향산, 4-디메틸아미노 안식향산 메틸, 4-디메틸아미노 안식향산 에틸, 4-디메틸아미노 안식향산 부틸, 4-디메틸아미노-2-에틸헥실 안식향산, 4-디메틸아미노-2-이소아밀 안식향산, 벤질-β-메톡시에틸아세탈, 벤질디메틸케탈, 1-페닐-1,2-프로판디온-2-(o-에톡시카르보닐)옥심, o-벤조일 안식향산 메틸, 2,4-디에틸티오크산톤, 2-클 로로티오크산톤, 2,4-디메틸티오크산톤, 1-클로로-4-프로폭시티오크산톤, 티오크산텐, 2-클로로티오크산텐, 2,4-디에틸티오크산텐, 2-메틸티오크산텐, 2-이소프로필티오크산텐, 2-에틸안트라퀴논, 옥타메틸안트라퀴논, 1,2-벤즈안트라퀴논, 2,3-디페닐안트라퀴논, 아조비스이소부티로니트릴, 벤조일퍼옥사이드, 쿠멘퍼옥사이드, 2-메르캅토벤조이미다졸, 2-메르캅토벤조옥사졸, 2-메르캅토벤조티아졸, 2-(o-클로로페닐)-4,5-디(m-메톡시페닐)-이미다졸릴 이량체, 벤조페논, 2-클로로벤조페논, p,p'-비스디메틸아미노벤조페논, 4,4'-비스디에틸아미노벤조페논, 4,4'-디클로로벤조페논, 3,3'-디메틸-4-메톡시벤조페논, 벤질, 벤조인, 벤조인메틸에테르, 벤조인에틸에테르, 벤조인이소프로필에테르, 벤조인-n-부틸에테르, 벤조인이소부틸에테르, 벤조인부틸에테르, 아세토페논, 2,2-디에톡시아세토페논, p-디메틸아세토페논, p-디메틸아미노프로피오페논, 디클로로아세토페논, 트리클로로아세토페논, p-tert-부틸아세토페논, p-디메틸아미노아세토페논, p-tert-부틸트리클로로아세토페논, p-tert-부틸디클로로아세토페논, α,α-디클로로-4-페녹시아세토페논, 티옥산톤, 2-메틸티옥산톤, 2-이소프로필티옥산톤, 디벤조스베론(benzosuberone), 펜틸-4-디메틸아미노벤조에이트, 9-페닐아크리딘, 1,7-비스-(9-아크리디닐)헵탄, 1,5-비스-(9-아크리디닐)헵탄, 1,3-비스-(9-아크리디닐)프로판, p-메톡시트리아진, 2,4,6-트리스(트리클로로메틸)-s-트리아진, 2-메틸-4,6-비스(트리클로로메틸)-s-트리아진, 2-[2-(5-메틸푸란-2-일)에테닐]-4,6-비스(트리클로로메틸)-s-트리아진, 2-[2-(푸란-2-일)에테닐]-4,6-비스(트리클로로메틸)-s-트리아진, 2-[2-(4-디에틸아미노-2-메틸페닐)에테닐]-4,6-비스(트리클로로메틸)-s-트라아진, 2-[2-(3,4-디메톡시페놀)에테 닐]-4,6-비스(트리클로로메틸)-s-트리아진, 2-(4-메톡시페닐)-4,6-비스(트리클로로메틸)-s-트리아진, 2-(4-에톡시스티릴)-4,6-비스(트리클로로메틸)-s-트리아진, 2-(4-n-부톡시페닐)-4,6-비스(트리클로로메틸)-s-트리아진, 2,4-비스-트리클로로메틸-6-(3-브로모-4-메톡시)페닐-s-트리아진, 2,4-비스-트리클로로메틸-6-(2-브로모-4-메톡시)페닐-s-트리아진, 2,4-비스-트리클로로메틸-6-(3-브로모-4-메톡시)스티릴페닐-s-트리아진, 2,4-비스-트리클로로메틸-6-(2-브로모-4-메톡시)스티릴페닐-s-트리아진 등을 들 수 있다.What is necessary is just to select the said (c) photoinitiator according to the kind of said (b) photopolymerizable compound. You may use this photoinitiator 1 type or in combination of 2 or more types. As this photoinitiator, for example, 1-hydroxycyclohexylphenyl ketone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1- [4- (2-hydroxyethoxy) phenyl] 2-hydroxy-2-methyl-1-propan-1-one, 1- (4-isopropylphenyl) -2-hydroxy-2-methylpropan-1-one, 1- (4-ddecylphenyl ) -2-hydroxy-2-methylpropan-1-one, 2,2-dimethoxy-1,2-diphenylethan-1-one, bis (4-dimethylaminophenyl) ketone, 2-methyl-1 -[4- (methylthio) phenyl] -2-monopolynopropan-1-one, 2-benzyl-2-dimethylamino-1- (4-monopolynophenyl) -butan-1-one, 2,4, 6-trimethylbenzoyldiphenylphosphineoxide, 4-benzoyl-4'-methyldimethylsulfide, 4-dimethylamino benzoic acid, 4-dimethylamino benzoic acid methyl, 4-dimethylamino benzoic acid ethyl, 4-dimethylamino benzoic acid butyl, 4- Dimethylamino-2-ethylhexyl benzoic acid, 4-dimethylamino-2-isoamyl benzoic acid, benzyl-β-methoxyethylacetal, benzyldimethyl ketal, 1 -Phenyl-1,2-propanedione-2- (o-ethoxycarbonyl) oxime, o-benzoyl methyl benzoate, 2,4-diethyl thioxanthone, 2-chlorothioxanthone, 2,4- Dimethyl thioxanthone, 1-chloro-4-propoxy thioxanthone, thioxanthene, 2-chlorothioxanthene, 2,4-diethyl thioxanthene, 2-methylthioxanthene, 2-isopropylthione Oxanthene, 2-ethylanthraquinone, octamethylanthraquinone, 1,2-benzanthraquinone, 2,3-diphenylanthraquinone, azobisisobutyronitrile, benzoyl peroxide, cumene peroxide, 2-mercapto Benzoimidazole, 2-mercaptobenzoxazole, 2-mercaptobenzothiazole, 2- (o-chlorophenyl) -4,5-di (m-methoxyphenyl) -imidazolyl dimer, benzophenone , 2-chlorobenzophenone, p, p'-bisdimethylaminobenzophenone, 4,4'-bisdiethylaminobenzophenone, 4,4'-dichlorobenzophenone, 3,3'-dimethyl-4-methoxy Benzophenone, benzyl, benzoin, benzoin methyl ether, benzoin ethyl ether, Join isopropyl ether, benzoin-n-butyl ether, benzoin isobutyl ether, benzoin butyl ether, acetophenone, 2,2-diethoxyacetophenone, p-dimethylacetophenone, p-dimethylaminopropiophenone, Dichloroacetophenone, trichloroacetophenone, p-tert-butylacetophenone, p-dimethylaminoacetophenone, p-tert-butyltrichloroacetophenone, p-tert-butyldichloroacetophenone, α, α-dichloro-4 Phenoxyacetophenone, thioxanthone, 2-methylthioxanthone, 2-isopropylthioxanthone, dibenzosuberone, pentyl-4-dimethylaminobenzoate, 9-phenylacridine, 1 , 7-bis- (9-acridinyl) heptane, 1,5-bis- (9-acridinyl) heptane, 1,3-bis- (9-acridinyl) propane, p-methoxytriazine , 2,4,6-tris (trichloromethyl) -s-triazine, 2-methyl-4,6-bis (trichloromethyl) -s-triazine, 2- [2- (5-methylfuran- 2-yl) ethenyl] -4,6-bis (trichloromethyl) -s- Lyazine, 2- [2- (furan-2-yl) ethenyl] -4,6-bis (trichloromethyl) -s-triazine, 2- [2- (4-diethylamino-2-methylphenyl ) Ethenyl] -4,6-bis (trichloromethyl) -s-triazine, 2- [2- (3,4-dimethoxyphenol) ethenyl] -4,6-bis (trichloromethyl)- s-triazine, 2- (4-methoxyphenyl) -4,6-bis (trichloromethyl) -s-triazine, 2- (4-ethoxystyryl) -4,6-bis (trichloro Methyl) -s-triazine, 2- (4-n-butoxyphenyl) -4,6-bis (trichloromethyl) -s-triazine, 2,4-bis-trichloromethyl-6- (3 -Bromo-4-methoxy) phenyl-s-triazine, 2,4-bis-trichloromethyl-6- (2-bromo-4-methoxy) phenyl-s-triazine, 2,4- Bis-trichloromethyl-6- (3-bromo-4-methoxy) styrylphenyl-s-triazine, 2,4-bis-trichloromethyl-6- (2-bromo-4-methoxy ) Styrylphenyl-s-triazine etc. are mentioned.
또한, 상기 광중합 개시제에 광개시 조제(助劑)를 조합하여도 좋다.Moreover, you may combine photoinitiator with the said photoinitiator.
이 광개시 조제로서는 예를 들어, 트리에탄올아민, 메틸디에탄올아민, 트리이소프로판올아민, 4-디메틸아미노 안식향산메틸, 4-디메틸아미노 안식향산에틸, 4-디메틸아미노 안식향산 이소아밀, 4-디메틸아미노 안식향산 2-에틸헥실, 안식향산2-디메틸아미노에틸, N,N-디메틸파라톨루이딘, 4,4'-비스(디메틸아미노)벤조페논(통칭, 미힐러케톤(Michler's Ketone)), 4,4'-비스(디에틸아미노)벤조페논, 9,10-디메톡시안트라센, 2-에틸-9,10-디메톡시안트라센, 9,10-디에톡시안트라센, 2-에틸-9,10-디에톡시안트라센 등을 들 수 있다. 이 광개시 조제는 1종 또는 2종 이상 조합하여 사용하여도 좋다.As this photoinitiation adjuvant, for example, triethanolamine, methyl diethanolamine, triisopropanolamine, 4-dimethylamino benzoate, 4-dimethylamino benzoate, 4-dimethylamino benzoate isoamyl, 4-dimethylamino benzoic acid 2- Ethylhexyl, 2-dimethylaminoethyl benzoate, N, N-dimethylparatoluidine, 4,4'-bis (dimethylamino) benzophenone (collectively, Michler's Ketone), 4,4'-bis (di Ethylamino) benzophenone, 9,10-dimethoxyanthracene, 2-ethyl-9,10-dimethoxyanthracene, 9,10-diethoxyanthracene, 2-ethyl-9,10-diethoxyanthracene, and the like. . You may use this photoinitiator, 1 type, or in combination of 2 or more types.
본 발명의 감광성 조성물에서의 (d) 밀착증강제는 질소를 포함하는 기를 가지는 실란 화합물이며, 상기 질소에 결합되어 있는 수소가 1개 이하인 화합물이다.The (d) adhesion promoter in the photosensitive composition of the present invention is a silane compound having a group containing nitrogen, and a compound having one or less hydrogens bonded to the nitrogen.
이 화합물로서는 예를 들어, 2급 또는 3급 아민인 아민계 실란화합물, 이소시아네이트계 실란화합물, 케티민계 실란화합물을 들 수 있다. 이 화합물들을 사용 함으로써 밀착성을 향상시킬 수 있다.As this compound, the amine silane compound which is a secondary or tertiary amine, an isocyanate silane compound, a ketimine silane compound is mentioned, for example. By using these compounds, adhesiveness can be improved.
상기 아민계 실란화합물로서는 예를 들어, 하기 화학식 3으로 나타내어지는 화합물을 들 수 있다.As said amine silane compound, the compound represented by following formula (3) is mentioned, for example.
(식 중, R1 및 R2는 수소 또는 유기기를 나타내며(단, R1 및 R2의 적어도 하나는 유기기이다), R3, R4, 및 R5는 서로 독립하여 탄소수 1~6의 알콕시기 또는 유기기를 나타낸다(단, R3, R4, 및 R5의 적어도 하나는 알콕시기이다), 또한 n은 1~6의 정수를 나타낸다)(Wherein, R 1 and R 2 represents hydrogen or an organic (provided that at least one of R 1 and R 2 is an organic group), R 3, R 4, and R 5 are each other independently of 1 to 6 carbon atoms An alkoxy group or an organic group (wherein at least one of R 3 , R 4 , and R 5 is an alkoxy group), and n represents an integer of 1 to 6)
상기 R1 및 R2에 따른 유기기로서는 예를 들어, 탄소수 1~10의 1급 또는 2급 알킬기, 탄소수 3~7의 시클로알킬기, 탄소수 6~10의 아릴기, 탄소수 7~10의 아랄킬기 등을 들 수 있다. 구체적으로는 메틸기, 에틸기, 프로필기, 부틸기, 펜틸기, 헥실기, 헵틸기, 옥틸기, 노닐기, 데실기, 이소부틸기, 2-메틸부틸기, 이소펜틸기, 이소헥실기, 이소프로필기, sec-부틸기, 2-펜틸기, 3-펜틸기, 시클로프로필기, 시클로부틸기, 시클로펜틸기, 시클로헥실기, 시클로헵틸기, 페닐기, 트릴기, 크실릴기, 메시틸기, 1-나프틸기, 2-나프틸기, 벤질기, α-페네틸기, β-페네틸기 등을 들 수 있다. 이들 중에서 전자공여성기인 것이 바람직하며, 특히 페닐기인 것이 바람직하다.As an organic group which concerns on said R <1> and R <2> , For example, a C1-C10 primary or secondary alkyl group, a C3-C7 cycloalkyl group, a C6-C10 aryl group, a C7-C10 aralkyl group Etc. can be mentioned. Specifically, methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group, heptyl group, octyl group, nonyl group, decyl group, isobutyl group, 2-methylbutyl group, isopentyl group, isohexyl group, iso Propyl group, sec-butyl group, 2-pentyl group, 3-pentyl group, cyclopropyl group, cyclobutyl group, cyclopentyl group, cyclohexyl group, cycloheptyl group, phenyl group, trilyl group, xylyl group, mesityl group, 1-naphthyl group, 2-naphthyl group, benzyl group, (alpha)-phenethyl group, (beta) -phenethyl group, etc. are mentioned. It is preferable that it is an electron-donating group among these, and it is especially preferable that it is a phenyl group.
상기 이소시아네이트계 실란 화합물로서는 예를 들어, 하기 화학식 4로 나타내어지는 화합물을 들 수 있다.As said isocyanate type silane compound, the compound represented by following formula (4) is mentioned, for example.
*(식 중, R3, R4, 및 R5는 상기와 마찬가지이다. 또한, n은 1~6의 정수를 나타낸다)* (In formula, R <3> , R <4> and R <5> are the same as the above. Moreover, n represents the integer of 1-6.)
상기 케티민계 실란화합물로서는 예를 들어, 하기 화학식 5로 나타내어지는 화합물을 들 수 있다.As said ketimine silane compound, the compound represented by following formula (5) is mentioned, for example.
(식 중, R6 및 R7은 수소 또는 유기기를 나타내고, R3, R4, 및 R5는 상기와 마찬가지이다. 또한, n은 1~6의 정수를 나타낸다)(In formula, R <6> and R <7> represents hydrogen or an organic group, and R <3> , R <4> and R <5> are the same as the above. Moreover, n represents the integer of 1-6.
상기 R6 및 R7에 따른 유기기로서는 예를 들어, 탄소수 1~10의 1급 또는 2급 알킬기, 탄소수 3~7의 시클로알킬기, 탄소수 6~10의 아릴기, 탄소수 7~10의 아랄킬기 등을 들 수 있다. 구체적으로는 메틸기, 에틸기, 프로필기, 부틸기, 펜틸기, 헥실기, 헵틸기, 옥틸기, 노닐기, 데실기, 이소부틸기, 2-메틸부틸기, 이소펜틸기, 이소헥실기, 이소프로필기, sec-부틸기, 2-펜틸기, 3-펜틸기, 시클로프로필기, 시클로부틸기, 시클로펜틸기, 시클로헥실기, 시클로헵틸기, 페닐기, 트릴기, 크실릴기, 메시틸기, 1-나프틸기, 2-나프틸기, 벤질기, α-페네틸기, β-페네틸기 등을 들 수 있다. As an organic group which concerns on said R <6> and R <7> , For example, a C1-C10 primary or secondary alkyl group, a C3-C7 cycloalkyl group, a C6-C10 aryl group, a C7-C10 aralkyl group Etc. can be mentioned. Specifically, methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group, heptyl group, octyl group, nonyl group, decyl group, isobutyl group, 2-methylbutyl group, isopentyl group, isohexyl group, iso Propyl group, sec-butyl group, 2-pentyl group, 3-pentyl group, cyclopropyl group, cyclobutyl group, cyclopentyl group, cyclohexyl group, cycloheptyl group, phenyl group, trilyl group, xylyl group, mesityl group, 1-naphthyl group, 2-naphthyl group, benzyl group, (alpha)-phenethyl group, (beta) -phenethyl group, etc. are mentioned.
상기 밀착증강제는 감광성 조성물 전체 중량을 기준으로 하여, 10~10000ppm의 범위에서 배합되는 것이 바람직하고, 5000~9000ppm의 범위에서 배합되는 것이 더욱 바람직하다. 이 범위로 함으로써 밀착성을 한층 향상시킬 수 있다.The adhesion enhancer is preferably blended in the range of 10 to 10000 ppm, more preferably in the range of 5000 to 9000 ppm, based on the total weight of the photosensitive composition. By setting it as this range, adhesiveness can be improved further.
본 발명의 감광성 조성물에는 도포성의 개선 및 점도조정을 위하여, 유기용제를 배합할 수 있다. 유기용제로서는 벤젠, 톨루엔, 크실렌, 메틸에틸케톤, 아세톤, 메틸이소부틸케톤, 시클로헥사논, 메탄올, 에탄올, 프로판올, 부탄올, 헥사놀, 시클로헥사놀, 에틸렌글리콜, 디에틸렌글리콜, 글리세린, 에틸렌글리콜모노메틸에테르, 에틸렌글리콜모노에틸에테르, 프로필렌글리콜모노메틸에테르, 프로필렌글리콜모노에틸에테르, 디에틸렌글리콜모노메틸에테르, 디에틸렌글리콜모노에틸에테르, 디에틸렌글리콜디메틸에테르, 디에틸렌글리콜디에틸에테르, 3-메톡시부틸아세테이트(MBA), 3-메틸-3-메톡시부틸아세테이트, 프로필렌글리콜모노메틸에테르아세테이트(PGMEA), 프로필렌글리콜모노메틸에테르프로피오네이트, 프로필렌글리콜모노에틸에테르프로피오네이트, 탄산메틸, 탄산에틸, 탄산프로필, 탄산부틸 등을 들 수 있다. 그 중에서도 3-메톡시부틸아세테이트는 감광성 조성물 중의 가용성분에 대하여 뛰어난 용해성을 나타낼 뿐만 아니라, 안료 등의 불용성 성분의 분산성을 양호하게 한다는 점에서 바람직하다.An organic solvent can be mix | blended with the photosensitive composition of this invention for the improvement of applicability | paintability, and viscosity adjustment. Organic solvents include benzene, toluene, xylene, methyl ethyl ketone, acetone, methyl isobutyl ketone, cyclohexanone, methanol, ethanol, propanol, butanol, hexanol, cyclohexanol, ethylene glycol, diethylene glycol, glycerin, ethylene glycol Monomethyl ether, ethylene glycol monoethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, 3 Methoxybutyl acetate (MBA), 3-methyl-3-methoxybutyl acetate, propylene glycol monomethyl ether acetate (PGMEA), propylene glycol monomethyl ether propionate, propylene glycol monoethyl ether propionate, methyl carbonate And ethyl carbonate, propyl carbonate, butyl carbonate and the like. Especially, 3-methoxybutyl acetate is preferable at the point which shows not only the outstanding solubility with respect to the soluble component in a photosensitive composition, but also makes the dispersibility of insoluble components, such as a pigment, favorable.
유기용제의 사용량은 특별히 한정되지 않지만, 기판 등에 도포가능한 농도로 도포막 두께에 따라 적절히 설정된다. 본 발명에서의 감광성 조성물의 점도는 5~100cp, 바람직하게는 10~50cp, 보다 바람직하게는 20~30cp이다. 또한, 고형분 농도는 5~100질량%, 바람직하게는 20~50질량%의 범위이다.Although the usage-amount of an organic solvent is not specifically limited, It is suitably set according to the coating film thickness in the density | concentration which can be apply | coated to a board | substrate. The viscosity of the photosensitive composition in this invention is 5-100cp, Preferably it is 10-50cp, More preferably, it is 20-30cp. Moreover, solid content concentration is 5-100 mass%, Preferably it is the range of 20-50 mass%.
또한, 본 발명의 감광성 조성물에는 열중합 금지제, 소포제, 계면활성제 등을 첨가하여도 좋다. 이것들은 단독 또는 여러가지를 병용하여 사용할 수도 있다.Moreover, you may add a thermal polymerization inhibitor, an antifoamer, surfactant, etc. to the photosensitive composition of this invention. These can also be used individually or in combination.
상기 열중합 금지제로서는 종래 공지의 것이어도 좋고, 히드로퀴논, 히드로퀴논모노에틸에테르 등을 들 수 있다.As said thermal polymerization inhibitor, a conventionally well-known thing may be sufficient, hydroquinone, hydroquinone monoethyl ether, etc. are mentioned.
상기 소포제로서는 종래 공지의 것이어도 좋고, 실리콘계, 불소계 화합물을 들 수 있다.As said antifoamer, a conventionally well-known thing may be sufficient, and a silicone type and a fluorine-type compound are mentioned.
상기 계면활성제로서는 종래 공지의 것이어도 좋고, 아니온계, 카티온계, 노니온계 등의 화합물을 들 수 있다.As said surfactant, a conventionally well-known thing may be sufficient, and compounds, such as an anionic type, a cation type, and a nonionic type, are mentioned.
<감광성 조성물의 조제방법><Method of Preparing Photosensitive Composition>
본 발명의 감광성 조성물은 아래의 방법에 의해 조제할 수 있다.The photosensitive composition of this invention can be prepared by the following method.
(a) 착색제, (b) 광중합성 화합물, (c) 광중합 개시제, 및 (d) 밀착증강제, 그리고 필요에 따라 유기첨가제 등을 더하여 3개 롤밀, 볼밀, 샌드밀 등의 교반기로 혼합(분산·혼련)하고, 예를 들어, 5㎛ 멤브레인 필터로 여과하여 감광성 조성물을 조제한다.(a) a colorant, (b) a photopolymerizable compound, (c) a photopolymerization initiator, (d) an adhesion enhancer, and an organic additive, if necessary, mixed with three roll mills, ball mills, sand mills, etc. Kneading), for example, by filtration with a 5 μm membrane filter to prepare a photosensitive composition.
<차광층(블랙 매트릭스)의 형성방법><Forming method of light shielding layer (black matrix)>
이하, 본 발명의 감광성 조성물을 사용하여 차광층을 형성하는 방법의 일 실시예로서, 블랙 매트릭스를 형성하는 방법의 예를 설명한다.Hereinafter, as an embodiment of the method of forming the light shielding layer using the photosensitive composition of the present invention, an example of a method of forming a black matrix will be described.
먼저, 착색제로서 차광제를 사용한 감광성 조성물을, 기판 위에 롤코터(roll coater), 리버스코터(reverse coater), 바코터 등의 접촉전사형 도포장치나 스피너(회전식 도포장치), 카텐 플로우 코터 등의 비접촉형 도포장치를 사용하여 도포한다. 기판은 광투과성을 가지는 기판이 사용되며, 예를 들어, 글라스 기판이다.First, a photosensitive composition using a light shielding agent as a colorant is coated on a substrate, such as a contact transfer type coating device such as a roll coater, a reverse coater, a bar coater, a spinner (rotary coating device), a kate flow coater, or the like. Apply using a mold coating device. As the substrate, a substrate having light transparency is used, for example, a glass substrate.
상기 감광성 조성물의 도포 후, 건조시켜 용제를 제거한다.After application of the photosensitive composition, the solvent is dried to remove the solvent.
이어서, 네가티브형 마스크를 통하여, 자외선, 엑시머 레이저광 등의 활성성 에너지선을 조사하여 부분적으로 노광한다. 노광에는 고압 수은등, 초고압 수은등, 크세논램프, 카본아크등 등의 자외선을 발하는 광원을 사용할 수 있다. 조사하는 에너지선량은 감광성 조성물의 조성에 따라 다르지만, 예를 들어, 30~2000mJ/cm2 정도가 바람직하다.Next, active energy rays, such as an ultraviolet-ray and an excimer laser beam, are irradiated and partially exposed through a negative mask. A light source that emits ultraviolet rays such as a high pressure mercury lamp, an ultra high pressure mercury lamp, a xenon lamp, and a carbon arc can be used for the exposure. Although the energy dose to irradiate changes with the composition of the photosensitive composition, about 30-2000mJ / cm <2> is preferable, for example.
노광 후의 막을 현상액을 사용하여 현상함으로써 블랙 매트릭스를 형성한다. 현상방법은 특별히 한정되지 않고, 예를 들어, 침지법, 스프레이법 등을 사용할 수 있다. 또한, 프리웨트(pre-wet)을 채용하여도 좋다. 화상형성 후 현상액의 건조, 레지스트막의 경화를 높일 목적으로 포스트베이크(post-bake), 후(後)광경화 등을 채용하여도 좋다. 현상액의 구체예로서는 모노에탄올아민, 디에탄올아민, 트리에탄올아민 등의 유기계의 것이나, 수산화 나트륨, 수산화 칼륨, 탄산 나트륨, 암모니아, 4급 암모늄염 등의 수용액을 들 수 있다.The black matrix is formed by developing the film | membrane after exposure using a developing solution. The image development method is not specifically limited, For example, an immersion method, a spray method, etc. can be used. In addition, pre-wet may be employed. After image formation, post-bake, post-curing, or the like may be employed for the purpose of increasing the drying of the developer and curing of the resist film. Specific examples of the developing solution include organic compounds such as monoethanolamine, diethanolamine, and triethanolamine, and aqueous solutions such as sodium hydroxide, potassium hydroxide, sodium carbonate, ammonia, and quaternary ammonium salts.
<칼라 필터의 형성방법><Formation method of color filter>
상기 블랙 매트릭스를 형성한 기판에 대하여, 감광성 수지조성물을 상기와 마찬가지로 도포, 건조, 노광, 현상하여 소정 색의 착색층을 블랙 매트릭스의 소정의 위치(개구부)에 패턴(스트라이프 또는 도트 등)이 형성되도록 한다. 예를 들어, 적색(R), 녹색(G), 청색(B)의 RGB의 컬러필터를 제조하는 경우에는, R, G, B의 각 색의 착색제를 함유하는 감광성 수지조성물을 사용하여, 상기 공정을 반복하여 3색의 착색층을 형성한다.A photosensitive resin composition is applied, dried, exposed to light, and developed on the substrate on which the black matrix is formed, and a pattern (such as a stripe or a dot) is formed at a predetermined position (opening) of a predetermined color on a black layer. Be sure to For example, when manufacturing the RGB color filter of red (R), green (G), and blue (B), using the photosensitive resin composition containing the coloring agent of each color of R, G, and B, the said The process is repeated to form three colored layers.
이상으로부터, 컬러필터를 형성할 수 있다.From the above, the color filter can be formed.
상기 구성에 따르면, PCT와 같은 엄격한 조건에서도 벗겨짐이 거의 발생하지 않는 블랙 매트릭스 및/또는 착색층을 제공할 수 있으며, 고품질의 컬러필터, 나아가서는 고품질의 액정패널을 제공할 수 있다.According to the above configuration, it is possible to provide a black matrix and / or a colored layer which hardly peels even under strict conditions such as PCT, and to provide a high quality color filter, and thus a high quality liquid crystal panel.
[실시예]EXAMPLE
이하, 본 발명은 실시예에 의해 더욱 상세히 설명하는데, 본 발명은 이들 실시예에 의해 한정되지 않는다.Hereinafter, the present invention will be described in more detail with reference to Examples, but the present invention is not limited to these Examples.
(수지합성예1)(Resin Synthesis Example 1)
먼저, 일본특허공개 2001-354735호 공보에 기재된 방법에 따라 화학식 1로 나타내어지는 화합물 1을 합성하였다.First, the compound 1 represented by General formula (1) was synthesize | combined according to the method of Unexamined-Japanese-Patent No. 2001-354735.
즉, 500ml 입구가 4개인 플라스크 안에 비스페놀플루오렌형 에폭시수지 235g(에폭시 당량 235)과 테트라메틸암모늄클로라이드 110mg, 2,6-디-tert부틸-4-메틸페놀 100mg 및 아크릴산 72.0g을 넣고, 이것에 25ml/min의 속도로 공기를 불어넣으면서 90~100℃에서 가열용해하였다. 이어서, 용액이 백탁한 상태 그대로 서서히 승온시켜, 120℃로 가열하여 완전용해시켰다. 여기서, 용액은 차례로 투명 점조(粘稠)가 되었지만, 그대로 교반을 계속하였다. 그 동안, 산가를 측정하여 1.0mgKOH/g 미만이 될 때까지 가열교반을 계속하였다. 산가가 목표에 도달할 때까지 12시간이 필요하였다. 그리고 실온까지 냉각하여, 무색투명으로 고체형상의 하기 화학식 6으로 나타내어지는 비스페놀플루오렌형 에폭시 아크릴레이트를 얻었다.That is, 235 g (epoxy equivalent 235) of bisphenol fluorene-type epoxy resin, 110 mg of tetramethylammonium chloride, 100 mg of 2,6-di-tertbutyl-4-methylphenol, and 72.0 g of acrylic acid were placed in a 500 ml inlet flask. It melted by heating at 90-100 degreeC, blowing in air at a rate of 25 ml / min. Subsequently, the solution was gradually warmed as it was in a cloudy state, heated to 120 ° C, and completely dissolved. Here, although the solution became transparent viscous one by one, stirring was continued as it was. In the meantime, heating stirring was continued until the acid value was measured and it became less than 1.0 mgKOH / g. Twelve hours were required until the acid value reached the goal. Then, it cooled to room temperature and obtained the bisphenol fluorene type epoxy acrylate represented by following formula (6) of colorless and transparent solid.
이어서, 이와 같이 하여 얻어진 상기 비스페놀플루오렌형 에폭시 아크릴레이 트 307.0g에 프로필렌글리콜모노메틸에테르아세테이트(PGMEA) 600g을 더하여 용해한 후, 벤조페논테트라카르복시산 이무수물 80.5g 및 브롬화테트라에틸암모늄 1g을 혼합하고, 서서히 승온하여 110~115℃에서 4시간 반응시켰다. 산무수물기의 소실을 확인한 후, 1,2,3,6-테트라히드로무수프탈산 38.0g을 혼합하고, 90℃에서 6시간 반응시켜, 상기 화학식 1로 나타내는 화합물 1을 얻었다. 산무수물기의 소실은 IR 스펙트럼에 의해 확인하였다.Subsequently, 600 g of propylene glycol monomethyl ether acetate (PGMEA) was added to 307.0 g of the bisphenol fluorene type epoxy acrylate obtained as described above, and dissolved therein, and then 80.5 g of benzophenonetetracarboxylic dianhydride and 1 g of tetraethylammonium bromide were mixed. It heated up gradually and made it react at 110-115 degreeC for 4 hours. After confirming the disappearance of the acid anhydride group, 38.0 g of 1,2,3,6-tetrahydrophthalic anhydride was mixed and reacted at 90 ° C for 6 hours to obtain Compound 1 represented by the above formula (1). Disappearance of the acid anhydride group was confirmed by IR spectrum.
여기서, 화합물 1은 화학식 1로 나타내는 화합물에 있어서, X는 화학식 2로 나타내어지는 기이며, Y는 1,2,3,6-테트라히드로무수프탈산 이무수물로부터 산무수물기 (-CO-O-CO-)를 제거한 잔기, Z는 3,3',4,4'-벤조페논테트라카르복시산 사(四)무수물로부터 산무수물을 제거한 잔기인 동시에, Y/Z 몰비는 50.0/50.0이다.Here, Compound 1 is a compound represented by the formula (1), X is a group represented by the formula (2), Y is an acid anhydride group from 1,2,3,6-tetrahydrophthalic anhydride dianhydride (-CO-O-CO The residue from which-) is removed, Z is a residue from which an acid anhydride is removed from 3,3 ', 4,4'-benzophenone tetracarboxylic acid anhydride, and the Y / Z molar ratio is 50.0 / 50.0.
이 화합물 1을 주된 광중합성 화합물로 하여, 본 발명의 감광성 조성물을 조제하였다.The photosensitive composition of this invention was prepared using this compound 1 as a main photopolymerizable compound.
실시예Example 1 One
하기 표 1에 나타내는 조성으로 감광성 조성물을 조제하였다.A photosensitive composition was prepared by the composition shown in Table 1 below.
*1 카본 농도 20%, 일본 미쿠니컬러사 제조* 1 20% carbon concentration, manufactured by Mikuni Color, Japan
*2 55% 고형분으로 조정되어 있음* 2 adjusted to 55% solids
*3 에타논(ethanone), 1-[9-에틸-6-(2-메틸벤조일)-9H-카르바졸-3-일]-, 1-(O-아세틸옥심), 치바스페셜티케미컬사 제품* 3 Ethanone, 1- [9-ethyl-6- (2-methylbenzoyl) -9H-carbazol-3-yl]-, 1- (O-acetyloxime), from Chiba Specialty Chemicals Co., Ltd.
*4 2-벤질-2-디메틸아미노-1-(4-모르폴리노페닐)-부탄-1온, 치바가이기사 제품* 4 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1one manufactured by Chiba-Geigi Co., Ltd.
실시예 1~4 및 비교예 1~5에 대하여, 상기 성분으로 이루어지는 혼합물을 교반기로 2시간 혼합하고, 5㎛ 멤브레인 필터로 여과하여 감광성 조성물을 얻었다.About Examples 1-4 and Comparative Examples 1-5, the mixture which consists of the said component was mixed with the stirrer for 2 hours, and it filtered with the 5 micrometer membrane filter, and obtained the photosensitive composition.
얻어진 감광성 조성물을 두께 1mm의 청정한 표면을 가지는 글라스 기판 위에 스핀코터(TR 25000: 도교오카 가부시키가이샤 제품)를 사용하여 건조 막두께가 1.2㎛가 되도록 도포하고, 90℃에서 2분간 건조하여 감광성 조성물의 막(감광층)을 형성하였다. 이어서 이 막에 네가티브 마스크를 통하여 자외선을 선택적으로 조사하였다. 노광량은 50mJ로 하였다. 그 후, 0.5 중량% 탄산나트륨 수용액으로 25℃, 60초간 스프레이 현상함으로써, 선폭 10㎛의 라인을 포함하는 블랙 매트릭스를 형성하였다. 그 후, 220℃ -30min 순환식 오븐에서 포스트 베이크하였다. 작성된 각 블랙 매트릭스의 막두께는 1.0㎛였다.The obtained photosensitive composition was applied onto a glass substrate having a clean surface having a thickness of 1 mm using a spin coater (TR 25000 (manufactured by Tokyooka Co., Ltd.)) so as to have a dry film thickness of 1.2 μm, and dried at 90 ° C. for 2 minutes to dry the photosensitive composition. Film (photosensitive layer) was formed. This film was then selectively irradiated with ultraviolet light through a negative mask. The exposure amount was 50 mJ. Thereafter, spray development at 25 ° C. for 60 seconds with a 0.5 wt% sodium carbonate aqueous solution was performed to form a black matrix including a line having a line width of 10 μm. Thereafter, it was post-baked in a 220 ° C -30 min circulation oven. The film thickness of each created black matrix was 1.0 micrometer.
또한, 작성된 각 블랙 매트릭스에 대하여, OD 측정장치 D-200II(그레타그막베스(GretagMacbeth)사 제품)로 측정하였더니 OD값은 3.5였다.In addition, when the produced black matrix was measured with OD measuring apparatus D-200II (made by Gretag Macbeth), OD value was 3.5.
상술한 바와 같이 하여 얻어진 실시예 1~4 및 비교예 1~5의 블랙 매트릭스를, 온도 120℃, 습도 100%, 기압 2atm의 조건하에서 2시간 방치하여, 블랙 매트릭스의 벗겨짐 유무에 대하여 평가하였다. 이 결과를 표 1에 나타낸다.The black matrices of Examples 1 to 4 and Comparative Examples 1 to 5 obtained as described above were left to stand for 2 hours under conditions of a temperature of 120 ° C., a humidity of 100%, and an atmospheric pressure of 2 atm, and the presence or absence of peeling of the black matrix was evaluated. The results are shown in Table 1.
상기와 같이 실시예에서는 온도 120℃, 습도 100%, 기압 2atm라는 가혹한 조건에서도 벗겨짐이 발생하지 않고 밀착성이 양호하였다. 한편, 비교예에서는 벗겨짐이 발생하였다. 또한, 각 실시예, 비교예에서도 현상찌꺼기는 확인되지 않았다.As mentioned above, even in the severe conditions of temperature 120 degreeC, humidity 100%, and atmospheric pressure 2atm, peeling did not generate | occur | produce and adhesiveness was favorable. On the other hand, peeling occurred in the comparative example. In addition, the development residue was not confirmed also in each Example and the comparative example.
이 블랙 매트릭스를 형성한 컬러필터를 사용하여 액정패널을 작성한 경우, 엄격한 조건아래에서도 블랙 매트릭스의 벗겨짐이 거의 없어, 액정이 새는 것을 방지할 수 있다. 따라서, 신뢰성이 높은 액정패널을 제공할 수 있다.When a liquid crystal panel is produced using the color filter in which this black matrix was formed, there is little peeling of a black matrix even under severe conditions, and liquid crystal leakage can be prevented. Therefore, a highly reliable liquid crystal panel can be provided.
또한, 흑색의 안료 대신에, 적색, 녹색 또는 청색의 착색제를 사용함 감광성 조성물을 사용하면, 컬러필터를 형성할 수 있다. 이와 같이, 적색, 녹색 또는 청색의 착색제를 사용하면, 차광율이 높은 흑색의 착색제에 비하여 감광성이 높아진다. 따라서, 밀착성은 흑색의 착색제를 사용한 것보다 높아진다. 이에, 이 감광성 조성물을 사용하면 밀착성이 높은 컬러필터를 형성할 수 있어, 신뢰성이 높은 액정패널을 제공할 수 있다.In addition, instead of the black pigment, a red, green, or blue colorant is used. A photosensitive composition can be used to form a color filter. Thus, when a red, green, or blue coloring agent is used, photosensitivity is improved compared with the black coloring agent with high light-shielding rate. Therefore, adhesiveness becomes higher than using the black coloring agent. Therefore, by using this photosensitive composition, a color filter with high adhesiveness can be formed and a highly reliable liquid crystal panel can be provided.
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| JP5030638B2 (en) * | 2007-03-29 | 2012-09-19 | 富士フイルム株式会社 | Color filter and manufacturing method thereof |
| KR100904068B1 (en) * | 2007-09-04 | 2009-06-23 | 제일모직주식회사 | Photosensitive resin composition for color filters and color filter using same |
| KR101282516B1 (en) * | 2009-11-18 | 2013-07-04 | 코오롱인더스트리 주식회사 | Photopolymerizable resin composition |
| US9269487B2 (en) * | 2011-09-15 | 2016-02-23 | Panasonic Intellectual Property Management Co., Ltd. | Common mode noise filter and production method therefor |
| KR102025099B1 (en) * | 2011-12-13 | 2019-09-25 | 주식회사 동진쎄미켐 | Photoresist composition |
| WO2013089403A1 (en) * | 2011-12-13 | 2013-06-20 | 주식회사 동진쎄미켐 | Photoresist composition |
| CN102827526B (en) * | 2012-08-23 | 2015-04-15 | 京东方科技集团股份有限公司 | High-impedance material, and display substrate black matrix and liquid crystal display apparatus containing same |
| KR102084218B1 (en) * | 2013-07-11 | 2020-03-04 | 동우 화인켐 주식회사 | composition for forming patterns of non-display part |
| TWI489213B (en) * | 2013-10-22 | 2015-06-21 | Chi Mei Corp | Photosensitive resin composition, color filter and liquid crystal display device having the same |
| TWI484296B (en) * | 2013-12-03 | 2015-05-11 | Chi Mei Corp | Photosensitive resin composition, color filter and method for manufacturing the same, liquid crystal display apparatus |
| JP6401529B2 (en) * | 2014-07-15 | 2018-10-10 | 東京応化工業株式会社 | Photosensitive composition |
| JP6423215B2 (en) * | 2014-09-18 | 2018-11-14 | 株式会社Adeka | Photocurable composition |
| JP6424052B2 (en) * | 2014-09-25 | 2018-11-14 | 東京応化工業株式会社 | Photosensitive resin composition |
| JP7440224B2 (en) * | 2019-08-21 | 2024-02-28 | 太陽ホールディングス株式会社 | Positive photosensitive resin composition |
| KR20220136155A (en) | 2021-03-31 | 2022-10-07 | 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 | Photosensitive resin composition for black resist, light-shielding layer cured thereof, and manufacturing method of color filter with them |
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| JPH10142794A (en) * | 1996-11-14 | 1998-05-29 | Hitachi Chem Co Ltd | Photosensitive solution for forming colored image and manufacture of color filter by using the same and color filter |
| JPH11160526A (en) * | 1997-11-26 | 1999-06-18 | Jsr Corp | Radiation-sensitive composition for color filter |
| JP2000035670A (en) * | 1998-07-21 | 2000-02-02 | Sumitomo Chem Co Ltd | Colored photosensitive resin composition |
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| JP2003064293A (en) * | 2001-08-29 | 2003-03-05 | Dainippon Ink & Chem Inc | Pigment dispersion composition for color filter, pigment dispersion resist, and color filter |
| JP2004069754A (en) * | 2002-08-01 | 2004-03-04 | Tokyo Ohka Kogyo Co Ltd | Photopolymerizable black composition and black pattern forming method |
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