KR19980013718A - 질화알루미늄 및 반도체 제조용 장치, 질화 알루미늄 소결체, 그의 제조 방법 및 반도체 제조용 장치 - Google Patents
질화알루미늄 및 반도체 제조용 장치, 질화 알루미늄 소결체, 그의 제조 방법 및 반도체 제조용 장치 Download PDFInfo
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- KR19980013718A KR19980013718A KR1019960032318A KR19960032318A KR19980013718A KR 19980013718 A KR19980013718 A KR 19980013718A KR 1019960032318 A KR1019960032318 A KR 1019960032318A KR 19960032318 A KR19960032318 A KR 19960032318A KR 19980013718 A KR19980013718 A KR 19980013718A
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- aluminum nitride
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
- C04B35/581—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on aluminium nitride
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/15—Ceramic or glass substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10S156/914—Differential etching apparatus including particular materials of construction
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- Ceramic Products (AREA)
Abstract
Description
Claims (27)
- 질화알루미늄 소결체의 전자 스핀 공명법에 의한 스펙트럼에서 부대 전자의 g값이 2.0010이상인 것을 특징으로 하는 질화 알루미늄 소결체.
- 제1항에 있어서, 상기 g값이 2.0040이상인 것을 특징으로 하는 질화 알루미늄 소결체.
- 제1항 또는 제2항에 있어서, AlN으로 이루어진는 주결정상과 AlON으로 이루어지는 부결정상을 구비하고 있는 것을 특징으로 하는 질화 알루미늄 소결체.
- 제1항 또는 2항에 있어서,(AlN)X(Al2OC)1-X상을 실질적으로 함유하지 않고, JISZ 8721에 규정하는 명도가 N4이하인 것을 특징으로 하는 질화 알루미늄 소결체.
- 제3항에 있어서,(AlN)X(Al2OC)1-X상을 실질적으로 함유하지 않고, JIS Z 8721에규정하는 명도가 N4이하인 것을 특징으로 하는 질화 알루미늄 소결체.
- 제1항 또는 제2항에 따른 질화알루미늄 소결체를 기재로서 사용하는 것을 특징으로 하는 반도체 제조용 장치.
- 제3항에 따른 질화알루미늄 소결체를 기재로서 사용하는 것을 특징으로 하는 반도체 제조용 장치.
- 제4항에 따른 질화알루미늄 소결체를 기재로서 사옹하는 것을 특징으로 하는 반도체 제조용 장치.
- 제5항에 따른 질화알루미늄 소결체를 기재로서 사용하는 것을 특징으로 하는 반도체 제조용 장치.
- 질화 알루미늄 소결체의 전자 스핀 공명법에 의한 스펙트럼에 있어서, 알루미늄의 단위㎎당 스핀량이 5×1012spin/mg이하인 것을 특징으로 하는 질화 알루미늄 소결체.
- 질화 알루미늄 소결체의 레이저 라만 분광 측정 스펙트럼에 있어서,133cm-l의 피크 높이I(133)과, 680cm-1의 피크 높이I(680)의 비율 I(133)/Ⅰ(680)이 0.3 이상인 것을 특징으로 하는 질화 알루미늄 소결체.
- 제11항에 있어서, I(133)/Ⅰ(680)의 비율이 0.4이상이고, JIS Z 8721에 규정하는 명도가 4이하인 것을 특징으로 하는 질화알루미늄 소결체.
- 제11항 또는 제12항에 있어서, AlN으로 이루어지는 주결정상과, AlON으로 이루어지는 부결정상을 구비하고 있는 것을 특징으로 하는 질화 알루미늄 소결체.
- 제10항 내지 제12항 중 어느 한 항에 따른 질화 알루미늄 소걸체를 기재로써 사용하는 것을 특징으로 하는 반도체 제조용 장치.
- 제13항에 따른 질화 알루미늄 소결체를 기재로써 사용하는 것을 특징으로 하는반도체 제조용 장치.
- 질화 알루미늄 소결체의 X선 회절 차트에 있어서, 주결정상인 질화 알루미늄 (AlN)을 나타내는 피크 이외에 X선 회절 각도2θ=44° ∼45°에서 카본 피크가검출되는 것을 특징으로 하는 질화 알루미늄 소결체.
- 제16항에 있어서, AlN으로 이루어지는 주결정상과 AlON으로 이루어지는 부결정상과 카본상를 구비하는 것을 특징으로 하는 질화 알루미늄 소결체.
- 제16항 또는 제17항에 있어서, (AlN)X(Al2OC)1-X상을 실질적으로 함유하지 않고, JIS Z 8721에 규정하는 명도가 N4이하인 것을 특징으로 하는 질화 알루미늄 소결체
- 제16항 또는 제17항에 있어서, 500ppm∼5000ppm의 탄소 원자를 함유하는 것을 특징으로 하는 질화 알루미늄 소결체.
- 제18항에 있어서,500ppm∼5000ppm의 탄소 원자를 함유하는 것을 특징으로 하는 질화 알루미늄 소결체.
- 제16항 또는 제17항에 따른 질화 알루미늄 소결체를 기재로서 사용하는 것을 특징으로 하는 반도체 제조용 장치.
- 제18항에 따른 질화 알루미늄 소결체를 기재로서 사용하는 것을 특징으로 하는반도체 제조용 장치.
- 제19항에 따른 질화 알루미늄 소결체를 기재로서 사용하는 것을 특징으로 하는반도체 제조용 장치.
- 제20항에 따른 질화 알루미늄 소결체를 기재로서 사용하는 것을 특징으로 하는반도체 제조용 장치.
- 탄소 함유량이 500ppm∼5000ppm인 질화 알루미늄 분말로 이루어지는 원료를1730℃이상, 1920℃이하의 온도 및 80kg/㎠이상의 압력으로 소결시킴으로써 질화알루미늄 소결체를 얻는 것을 특징으로 하는 질화 알루미늄 소결체의 제조방법.
- 제25항에 있어서, 탄소 함유량이 500ppm∼5000ppm인 질화 알루미늄 분말로 이루어지는 상기 원료가 상이한 탄소 함유량을 갖는 제1 중 및 제2 종 이상의 질화 알루미늄 분말을 혼합함으로써 제조되는 것을 특징으로 하는 질화 알루미늄 소결체의 제조방법.
- 제26항에 있어서, 상기 제2종의 질화 알루미늄 분말을 환원질화법에 의해 제조하는 것을 특징으로 하는 질화 알루미늄 소결체의 제조방법.
Applications Claiming Priority (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7218158A JP3037883B2 (ja) | 1995-08-03 | 1995-08-03 | 窒化アルミニウム焼結体、その製造方法および半導体製造用装置 |
| JP95-218,158 | 1995-08-03 | ||
| JP21825695 | 1995-08-04 | ||
| JP95-218,256 | 1995-08-04 | ||
| JP7218257A JP3040939B2 (ja) | 1995-08-04 | 1995-08-04 | 窒化アルミニウムおよび半導体製造用装置 |
| JP95-218,257 | 1995-08-04 | ||
| JP96-207,556 | 1996-07-19 | ||
| JP20755696A JP3559123B2 (ja) | 1995-08-04 | 1996-07-19 | 窒化アルミニウムおよび半導体製造用装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR19980013718A true KR19980013718A (ko) | 1998-05-15 |
| KR0185528B1 KR0185528B1 (ko) | 1999-04-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019960032318A Expired - Lifetime KR0185528B1 (ko) | 1995-08-03 | 1996-08-02 | 질화알루미늄 및 반도체 제조용 장치, 질화 알루미늄 소결체, 그의 제조 방법 및 반도체 제조용 장치 |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US5728635A (ko) |
| EP (2) | EP0992470B1 (ko) |
| KR (1) | KR0185528B1 (ko) |
| DE (2) | DE69635908T2 (ko) |
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| US6723274B1 (en) | 1999-12-09 | 2004-04-20 | Saint-Gobain Ceramics & Plastics, Inc. | High-purity low-resistivity electrostatic chucks |
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| JP2543638B2 (ja) * | 1991-10-09 | 1996-10-16 | 日本碍子株式会社 | セラミックスヒ―タ― |
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| JPH06172040A (ja) * | 1992-12-09 | 1994-06-21 | Asahi Glass Co Ltd | 窒化アルミニウム焼結体の製造方法 |
| JPH06227868A (ja) * | 1993-02-01 | 1994-08-16 | Sumitomo Kinzoku Ceramics:Kk | グリーンシート成形用窒化アルミニウム粉末及びその製造方法 |
| JP3633636B2 (ja) * | 1993-02-05 | 2005-03-30 | 住友電気工業株式会社 | 窒化アルミニウム焼結体 |
| US5591269A (en) * | 1993-06-24 | 1997-01-07 | Tokyo Electron Limited | Vacuum processing apparatus |
| JP2642858B2 (ja) * | 1993-12-20 | 1997-08-20 | 日本碍子株式会社 | セラミックスヒーター及び加熱装置 |
| WO1995021139A1 (fr) * | 1994-02-03 | 1995-08-10 | Ngk Insulators, Ltd. | Agglomere de nitrure d'aluminium et methode de production |
| US5680013A (en) * | 1994-03-15 | 1997-10-21 | Applied Materials, Inc. | Ceramic protection for heated metal surfaces of plasma processing chamber exposed to chemically aggressive gaseous environment therein and method of protecting such heated metal surfaces |
| TW295677B (ko) * | 1994-08-19 | 1997-01-11 | Tokyo Electron Co Ltd | |
| JPH0881267A (ja) * | 1994-09-16 | 1996-03-26 | Toshiba Corp | 窒化アルミニウム焼結体、その製造方法と窒化アルミニウム回路基板、その製造方法 |
| DE69503472T2 (de) * | 1994-12-12 | 1999-03-04 | Philips Electronics N.V., Eindhoven | Substrat aus einem keramischen material |
| JP2901907B2 (ja) * | 1996-01-10 | 1999-06-07 | アプライド マテリアルズ インコーポレイテッド | プロセスチャンバウィンドウ |
-
1996
- 1996-07-30 EP EP99124534A patent/EP0992470B1/en not_active Expired - Lifetime
- 1996-07-30 DE DE69635908T patent/DE69635908T2/de not_active Expired - Lifetime
- 1996-07-30 EP EP96305580A patent/EP0757023B1/en not_active Expired - Lifetime
- 1996-07-30 DE DE69610673T patent/DE69610673T2/de not_active Expired - Lifetime
- 1996-08-01 US US08/691,915 patent/US5728635A/en not_active Expired - Lifetime
- 1996-08-02 KR KR1019960032318A patent/KR0185528B1/ko not_active Expired - Lifetime
-
1997
- 1997-09-02 US US08/922,023 patent/US5908799A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| EP0757023A2 (en) | 1997-02-05 |
| DE69635908D1 (de) | 2006-05-04 |
| KR0185528B1 (ko) | 1999-04-15 |
| US5728635A (en) | 1998-03-17 |
| EP0992470A2 (en) | 2000-04-12 |
| DE69635908T2 (de) | 2006-11-23 |
| EP0757023B1 (en) | 2000-10-18 |
| US5908799A (en) | 1999-06-01 |
| DE69610673D1 (de) | 2000-11-23 |
| EP0757023A3 (en) | 1997-08-13 |
| EP0992470A3 (en) | 2002-07-17 |
| EP0992470B1 (en) | 2006-03-08 |
| DE69610673T2 (de) | 2001-05-10 |
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