KR101123159B1 - 카메라 모듈 - Google Patents
카메라 모듈 Download PDFInfo
- Publication number
- KR101123159B1 KR101123159B1 KR1020100064744A KR20100064744A KR101123159B1 KR 101123159 B1 KR101123159 B1 KR 101123159B1 KR 1020100064744 A KR1020100064744 A KR 1020100064744A KR 20100064744 A KR20100064744 A KR 20100064744A KR 101123159 B1 KR101123159 B1 KR 101123159B1
- Authority
- KR
- South Korea
- Prior art keywords
- camera module
- lens unit
- lens
- holder
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/02—Bodies
- G03B17/12—Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/804—Containers or encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/806—Optical elements or arrangements associated with the image sensors
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Studio Devices (AREA)
- Lens Barrels (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
본 발명의 카메라 모듈은 적어도 하나 이상의 렌즈가 구비된 렌즈부, 상기 렌즈를 통해 집광된 광을 전기적인 신호로 변환하기 위해 촬상소자가 구비된 이미지 센서, 상기 이미지 센서가 설치되는 인쇄회로기판, 상기 렌즈부를 내부에 수용하여 지지하기 위한 홀더를 포함하고, 상기 렌즈부는 측면이 상기 홀더의 내면에 접착되어 고정된다.
또한, 본 발명의 카메라 모듈에서, 상기 홀더는 제1 몸체와, 제2 몸체를 포함하며, 상기 렌즈부는 제1 몸체의 내면에 접착 고정되고, 상기 제2 몸체는 상기 제1 몸체의 상부에 접착 고정된다.
Description
도 2는 상기 도 1에 도시된 카메라 모듈의 분해 사시도
도 3은 상기 도 1 및 도 2에 도시된 홀더에서 제1 몸체를 설명하기 위한 도면
도 4는 종래에 따른 카메라 모듈을 설명하기 위한 도면
12 : 제1 몸체 13 : 배기홈
20 : 이미지 센서 30 : 인쇄회로기판
40 : 렌즈부 50 : 접착제
Claims (4)
- 적어도 하나 이상의 렌즈가 구비된 렌즈부;
상기 렌즈를 통해 집광된 광을 전기적인 신호로 변환하기 위해 촬상소자가 구비된 이미지 센서;
상기 이미지 센서가 설치되는 인쇄회로기판; 및
제1 몸체와, 상기 제1 몸체의 상부에 접착 고정되는 제2 몸체를 포함하고, 상기 렌즈부를 내부에 수용하여 지지하기 위한 홀더
를 포함하고,
상기 렌즈부는 측면이 상기 제1 몸체의 내면에 접착되어 고정되며,
상기 제1 몸체와 상기 제2 몸체가 접하는 면에는, 상기 제1 몸체와 상기 제2 몸체를 고정하기 위한 접착제 경화 시 발생하는 가스 및 열을 배출하기 위한 적어도 하나 이상의 배기홈이 형성되는 카메라 모듈. - 삭제
- 삭제
- 제1항에 있어서,
상기 제1 몸체 및 제2 몸체는 사변형으로 이루어져 있고,
상기 배기홈은 각 변에 적어도 1개 이상 형성된 카메라 모듈.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020100064744A KR101123159B1 (ko) | 2010-07-06 | 2010-07-06 | 카메라 모듈 |
| US13/808,215 US9041850B2 (en) | 2010-07-06 | 2011-06-22 | Camera module for tilt balance of lens |
| CN201180033489.7A CN102972018B (zh) | 2010-07-06 | 2011-06-22 | 相机模块 |
| PCT/KR2011/004543 WO2012005456A2 (en) | 2010-07-06 | 2011-06-22 | Camera module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020100064744A KR101123159B1 (ko) | 2010-07-06 | 2010-07-06 | 카메라 모듈 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20120004082A KR20120004082A (ko) | 2012-01-12 |
| KR101123159B1 true KR101123159B1 (ko) | 2012-03-20 |
Family
ID=45441617
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020100064744A Active KR101123159B1 (ko) | 2010-07-06 | 2010-07-06 | 카메라 모듈 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US9041850B2 (ko) |
| KR (1) | KR101123159B1 (ko) |
| WO (1) | WO2012005456A2 (ko) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5341266B2 (ja) * | 2012-02-17 | 2013-11-13 | シャープ株式会社 | カメラモジュール |
| KR102076339B1 (ko) | 2013-03-13 | 2020-02-11 | 삼성전자주식회사 | 반도체 패키지 및 그 제조방법 |
| JP6416269B2 (ja) * | 2014-08-26 | 2018-10-31 | シャープ株式会社 | カメラモジュール |
| KR102293357B1 (ko) | 2015-01-12 | 2021-08-25 | 엘지이노텍 주식회사 | 카메라 모듈 |
| JP2017139258A (ja) * | 2016-02-01 | 2017-08-10 | ソニー株式会社 | 撮像素子パッケージ及び撮像装置 |
| DE102016208547A1 (de) | 2016-05-18 | 2017-11-23 | Robert Bosch Gmbh | Kameramodul für ein Fahrzeug |
| DE102016208544A1 (de) * | 2016-05-18 | 2017-11-23 | Robert Bosch Gmbh | Kameramodul für ein Fahrzeug |
| CN111212199B (zh) * | 2018-11-21 | 2025-08-08 | 北京小米移动软件有限公司 | 驱动机构、摄像头模组及电子设备 |
| US11778293B2 (en) * | 2019-09-02 | 2023-10-03 | Canon Kabushiki Kaisha | Mounting substrate to which image sensor is mounted, sensor package and manufacturing method thereof |
| US11515220B2 (en) | 2019-12-04 | 2022-11-29 | Advanced Semiconductor Engineering, Inc. | Semiconductor package structures and methods of manufacturing the same |
| KR102879016B1 (ko) * | 2020-08-28 | 2025-10-29 | 엘지이노텍 주식회사 | 이미지 센서 패키지 및 이를 포함하는 카메라 장치 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100845547B1 (ko) | 2006-10-10 | 2008-07-10 | 삼성전기주식회사 | 카메라 모듈과 이의 조립 장치 |
| KR20090110978A (ko) * | 2008-04-21 | 2009-10-26 | 삼성전기주식회사 | 카메라 모듈 |
| KR20100048101A (ko) * | 2008-10-30 | 2010-05-11 | 삼성전기주식회사 | 자동차용 카메라 모듈 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6483101B1 (en) * | 1999-12-08 | 2002-11-19 | Amkor Technology, Inc. | Molded image sensor package having lens holder |
| TW200632506A (en) | 2005-03-02 | 2006-09-16 | Premier Image Technology Corp | Camera module and its manufacturing process |
| KR20070045922A (ko) * | 2005-10-28 | 2007-05-02 | 마츠시타 덴끼 산교 가부시키가이샤 | 고체 촬상장치의 제조방법 및 고체 촬상장치 |
| JP4490406B2 (ja) * | 2006-10-11 | 2010-06-23 | 浜松ホトニクス株式会社 | 固体撮像装置 |
| US7980773B2 (en) * | 2006-11-30 | 2011-07-19 | Hitachi Maxell, Ltd. | Camera module and imaging apparatus |
| JP2010141123A (ja) * | 2008-12-11 | 2010-06-24 | Shinko Electric Ind Co Ltd | 電子部品装置 |
| JP5541088B2 (ja) * | 2010-10-28 | 2014-07-09 | ソニー株式会社 | 撮像素子パッケージ、撮像素子パッケージの製造方法、及び、電子機器 |
-
2010
- 2010-07-06 KR KR1020100064744A patent/KR101123159B1/ko active Active
-
2011
- 2011-06-22 US US13/808,215 patent/US9041850B2/en active Active
- 2011-06-22 WO PCT/KR2011/004543 patent/WO2012005456A2/en not_active Ceased
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100845547B1 (ko) | 2006-10-10 | 2008-07-10 | 삼성전기주식회사 | 카메라 모듈과 이의 조립 장치 |
| KR20090110978A (ko) * | 2008-04-21 | 2009-10-26 | 삼성전기주식회사 | 카메라 모듈 |
| KR20100048101A (ko) * | 2008-10-30 | 2010-05-11 | 삼성전기주식회사 | 자동차용 카메라 모듈 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2012005456A2 (en) | 2012-01-12 |
| US20130100343A1 (en) | 2013-04-25 |
| US9041850B2 (en) | 2015-05-26 |
| KR20120004082A (ko) | 2012-01-12 |
| CN102972018A (zh) | 2013-03-13 |
| WO2012005456A3 (en) | 2012-04-12 |
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