JPH11314313A - Plastic laminate - Google Patents
Plastic laminateInfo
- Publication number
- JPH11314313A JPH11314313A JP450798A JP450798A JPH11314313A JP H11314313 A JPH11314313 A JP H11314313A JP 450798 A JP450798 A JP 450798A JP 450798 A JP450798 A JP 450798A JP H11314313 A JPH11314313 A JP H11314313A
- Authority
- JP
- Japan
- Prior art keywords
- film
- plastic laminate
- laminate according
- conductive film
- photocurable resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002650 laminated plastic Substances 0.000 title claims abstract description 49
- 229920005989 resin Polymers 0.000 claims abstract description 49
- 239000011347 resin Substances 0.000 claims abstract description 49
- 230000004888 barrier function Effects 0.000 claims abstract description 38
- 239000000758 substrate Substances 0.000 claims abstract description 37
- 239000004973 liquid crystal related substance Substances 0.000 claims abstract description 18
- 239000007789 gas Substances 0.000 claims description 34
- 239000000203 mixture Substances 0.000 claims description 31
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 28
- -1 mercapto compound Chemical class 0.000 claims description 24
- 125000004432 carbon atom Chemical group C* 0.000 claims description 13
- 229910052809 inorganic oxide Inorganic materials 0.000 claims description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- 229910052717 sulfur Inorganic materials 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 125000000217 alkyl group Chemical group 0.000 claims description 5
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 5
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 5
- 239000002985 plastic film Substances 0.000 claims description 5
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 5
- 125000004434 sulfur atom Chemical group 0.000 claims description 5
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 4
- 125000003545 alkoxy group Chemical group 0.000 claims description 2
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 claims description 2
- 125000005843 halogen group Chemical group 0.000 claims description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 2
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 claims description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 3
- 125000001424 substituent group Chemical group 0.000 claims 1
- 239000011521 glass Substances 0.000 abstract description 18
- 230000003287 optical effect Effects 0.000 abstract description 5
- 238000006243 chemical reaction Methods 0.000 abstract description 4
- 239000010408 film Substances 0.000 description 129
- 239000010410 layer Substances 0.000 description 35
- 150000001875 compounds Chemical class 0.000 description 20
- 238000000034 method Methods 0.000 description 18
- 239000006087 Silane Coupling Agent Substances 0.000 description 15
- 239000011248 coating agent Substances 0.000 description 14
- 239000003795 chemical substances by application Substances 0.000 description 13
- 238000000576 coating method Methods 0.000 description 13
- 239000000126 substance Substances 0.000 description 13
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 12
- 229910044991 metal oxide Inorganic materials 0.000 description 11
- 150000004706 metal oxides Chemical class 0.000 description 11
- 239000010409 thin film Substances 0.000 description 11
- 239000002904 solvent Substances 0.000 description 10
- 239000007983 Tris buffer Substances 0.000 description 9
- 229910052782 aluminium Inorganic materials 0.000 description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 9
- 239000000178 monomer Substances 0.000 description 9
- 238000002834 transmittance Methods 0.000 description 9
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 8
- 239000008199 coating composition Substances 0.000 description 8
- 239000003999 initiator Substances 0.000 description 8
- 238000005259 measurement Methods 0.000 description 8
- 239000002585 base Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- 239000010419 fine particle Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 6
- 238000006116 polymerization reaction Methods 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 238000005452 bending Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 230000006866 deterioration Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000005755 formation reaction Methods 0.000 description 5
- 238000007373 indentation Methods 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 230000000704 physical effect Effects 0.000 description 5
- 239000004033 plastic Substances 0.000 description 5
- 229920003023 plastic Polymers 0.000 description 5
- 239000013522 chelant Substances 0.000 description 4
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 4
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 150000002430 hydrocarbons Chemical group 0.000 description 4
- 229910003437 indium oxide Inorganic materials 0.000 description 4
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000005693 optoelectronics Effects 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 239000004094 surface-active agent Substances 0.000 description 4
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 4
- 229910001887 tin oxide Inorganic materials 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 125000002947 alkylene group Chemical group 0.000 description 3
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 3
- 239000012965 benzophenone Substances 0.000 description 3
- 125000004386 diacrylate group Chemical group 0.000 description 3
- 229910001507 metal halide Inorganic materials 0.000 description 3
- 150000005309 metal halides Chemical class 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 238000002203 pretreatment Methods 0.000 description 3
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000012719 thermal polymerization Methods 0.000 description 3
- 229940071127 thioglycolate Drugs 0.000 description 3
- CWERGRDVMFNCDR-UHFFFAOYSA-M thioglycolate(1-) Chemical compound [O-]C(=O)CS CWERGRDVMFNCDR-UHFFFAOYSA-M 0.000 description 3
- 125000003396 thiol group Chemical group [H]S* 0.000 description 3
- 238000011282 treatment Methods 0.000 description 3
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 3
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- VIYWVRIBDZTTMH-UHFFFAOYSA-N 2-[4-[2-[4-[2-(2-methylprop-2-enoyloxy)ethoxy]phenyl]propan-2-yl]phenoxy]ethyl 2-methylprop-2-enoate Chemical compound C1=CC(OCCOC(=O)C(=C)C)=CC=C1C(C)(C)C1=CC=C(OCCOC(=O)C(C)=C)C=C1 VIYWVRIBDZTTMH-UHFFFAOYSA-N 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- WRMNZCZEMHIOCP-UHFFFAOYSA-N 2-phenylethanol Chemical compound OCCC1=CC=CC=C1 WRMNZCZEMHIOCP-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 2
- NKIDFMYWMSBSRA-UHFFFAOYSA-N [4-(2-methylprop-2-enoyloxymethyl)cyclohexyl]methyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1CCC(COC(=O)C(C)=C)CC1 NKIDFMYWMSBSRA-UHFFFAOYSA-N 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 150000004703 alkoxides Chemical class 0.000 description 2
- 229910000410 antimony oxide Inorganic materials 0.000 description 2
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 2
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 150000002170 ethers Chemical class 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- HOXINJBQVZWYGZ-UHFFFAOYSA-N fenbutatin oxide Chemical compound C=1C=CC=CC=1C(C)(C)C[Sn](O[Sn](CC(C)(C)C=1C=CC=CC=1)(CC(C)(C)C=1C=CC=CC=1)CC(C)(C)C=1C=CC=CC=1)(CC(C)(C)C=1C=CC=CC=1)CC(C)(C)C1=CC=CC=C1 HOXINJBQVZWYGZ-UHFFFAOYSA-N 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 150000008282 halocarbons Chemical class 0.000 description 2
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 238000007733 ion plating Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000003446 ligand Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910052755 nonmetal Inorganic materials 0.000 description 2
- 150000002843 nonmetals Chemical class 0.000 description 2
- 150000007524 organic acids Chemical class 0.000 description 2
- 235000005985 organic acids Nutrition 0.000 description 2
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 239000002798 polar solvent Substances 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 239000007870 radical polymerization initiator Substances 0.000 description 2
- 238000010526 radical polymerization reaction Methods 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 239000013077 target material Substances 0.000 description 2
- CWERGRDVMFNCDR-UHFFFAOYSA-N thioglycolic acid Chemical compound OC(=O)CS CWERGRDVMFNCDR-UHFFFAOYSA-N 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- 239000013585 weight reducing agent Substances 0.000 description 2
- SQWIEBKHVLRDRG-UHFFFAOYSA-N (2,6-dimethylphenyl)-diphenylphosphorylmethanone Chemical compound CC1=CC=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 SQWIEBKHVLRDRG-UHFFFAOYSA-N 0.000 description 1
- PFNQVRZLDWYSCW-UHFFFAOYSA-N (fluoren-9-ylideneamino) n-naphthalen-1-ylcarbamate Chemical compound C12=CC=CC=C2C2=CC=CC=C2C1=NOC(=O)NC1=CC=CC2=CC=CC=C12 PFNQVRZLDWYSCW-UHFFFAOYSA-N 0.000 description 1
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- OBNIRVVPHSLTEP-UHFFFAOYSA-N 1-ethoxy-2-(2-hydroxyethoxy)ethanol;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(O)COCCO OBNIRVVPHSLTEP-UHFFFAOYSA-N 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- KAJBSGLXSREIHP-UHFFFAOYSA-N 2,2-bis[(2-sulfanylacetyl)oxymethyl]butyl 2-sulfanylacetate Chemical compound SCC(=O)OCC(CC)(COC(=O)CS)COC(=O)CS KAJBSGLXSREIHP-UHFFFAOYSA-N 0.000 description 1
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 1
- CMCLUJRFBZBVSW-UHFFFAOYSA-N 2-(2-hydroxyethoxy)-1-methoxyethanol;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(O)COCCO CMCLUJRFBZBVSW-UHFFFAOYSA-N 0.000 description 1
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- OBETXYAYXDNJHR-UHFFFAOYSA-N 2-Ethylhexanoic acid Chemical compound CCCCC(CC)C(O)=O OBETXYAYXDNJHR-UHFFFAOYSA-N 0.000 description 1
- FBHYXKSGCYPHCM-UHFFFAOYSA-N 2-[4-[2-[4-[2-(2-methylprop-2-enoyloxy)ethoxy]cyclohexyl]propan-2-yl]cyclohexyl]oxyethyl 2-methylprop-2-enoate Chemical compound C1CC(OCCOC(=O)C(=C)C)CCC1C(C)(C)C1CCC(OCCOC(=O)C(C)=C)CC1 FBHYXKSGCYPHCM-UHFFFAOYSA-N 0.000 description 1
- DCJRSMRCVNVQLB-UHFFFAOYSA-N 2-[[3-[2-(2-methylprop-2-enoyloxy)ethylsulfanylmethyl]phenyl]methylsulfanyl]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCSCC1=CC=CC(CSCCOC(=O)C(C)=C)=C1 DCJRSMRCVNVQLB-UHFFFAOYSA-N 0.000 description 1
- OJRFWSBEXBWPTJ-UHFFFAOYSA-N 2-[[4-[2-(2-methylprop-2-enoyloxy)ethylsulfanylmethyl]phenyl]methylsulfanyl]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCSCC1=CC=C(CSCCOC(=O)C(C)=C)C=C1 OJRFWSBEXBWPTJ-UHFFFAOYSA-N 0.000 description 1
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical compound ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- WWIRABUTUYUIAT-UHFFFAOYSA-N 2-methylprop-2-enoic acid;pentadecane Chemical compound CC(=C)C(O)=O.CC(=C)C(O)=O.CCCCCCCCCCCCCCC WWIRABUTUYUIAT-UHFFFAOYSA-N 0.000 description 1
- HGEAJQRQJIHKKQ-UHFFFAOYSA-N 2-methylprop-2-enoic acid;pentadecane;prop-2-enoic acid Chemical compound OC(=O)C=C.CC(=C)C(O)=O.CCCCCCCCCCCCCCC HGEAJQRQJIHKKQ-UHFFFAOYSA-N 0.000 description 1
- QCDWFXQBSFUVSP-UHFFFAOYSA-N 2-phenoxyethanol Chemical compound OCCOC1=CC=CC=C1 QCDWFXQBSFUVSP-UHFFFAOYSA-N 0.000 description 1
- WUPHOULIZUERAE-UHFFFAOYSA-N 3-(oxolan-2-yl)propanoic acid Chemical compound OC(=O)CCC1CCCO1 WUPHOULIZUERAE-UHFFFAOYSA-N 0.000 description 1
- DOYKFSOCSXVQAN-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CCO[Si](C)(OCC)CCCOC(=O)C(C)=C DOYKFSOCSXVQAN-UHFFFAOYSA-N 0.000 description 1
- UDWIZRDPCQAYRF-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propyl prop-2-enoate Chemical compound CCO[Si](C)(OCC)CCCOC(=O)C=C UDWIZRDPCQAYRF-UHFFFAOYSA-N 0.000 description 1
- LZMNXXQIQIHFGC-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C(C)=C LZMNXXQIQIHFGC-UHFFFAOYSA-N 0.000 description 1
- MCDBEBOBROAQSH-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl prop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C=C MCDBEBOBROAQSH-UHFFFAOYSA-N 0.000 description 1
- DMZPTAFGSRVFIA-UHFFFAOYSA-N 3-[tris(2-methoxyethoxy)silyl]propyl 2-methylprop-2-enoate Chemical compound COCCO[Si](OCCOC)(OCCOC)CCCOC(=O)C(C)=C DMZPTAFGSRVFIA-UHFFFAOYSA-N 0.000 description 1
- ZVYGIPWYVVJFRW-UHFFFAOYSA-N 3-methylbutyl prop-2-enoate Chemical compound CC(C)CCOC(=O)C=C ZVYGIPWYVVJFRW-UHFFFAOYSA-N 0.000 description 1
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- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 238000002233 thin-film X-ray diffraction Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Chemical group 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 229910001930 tungsten oxide Inorganic materials 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 229910001935 vanadium oxide Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical group [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Liquid Crystal (AREA)
- Laminated Bodies (AREA)
- Photovoltaic Devices (AREA)
Abstract
(57)【要約】
【課題】 ガラス基板を使用したものより軽量であり、
且つ、光学物性、機械的強度等に優れた、液晶表示装
置、タッチパネル及び太陽電池変換素子等の基板に好適
に使用できるプラスチック積層体を提供する。
【解決手段】 下記A,B,Cがこの順序で積層されて
なることを特徴とするプラスチック積層体。該積層体の
光硬化性樹脂層の上には、通常、更に導電膜を積層す
る。
A:光硬化性樹脂
B:ガスバリア膜
C:硬化被膜(57) [Summary] [Problem] Lighter than one using a glass substrate,
A plastic laminate excellent in optical properties, mechanical strength, and the like, which can be suitably used for substrates such as a liquid crystal display device, a touch panel, and a solar cell conversion element is provided. SOLUTION: A plastic laminate characterized in that the following A, B, C are laminated in this order. Usually, a conductive film is further laminated on the photocurable resin layer of the laminate. A: Photocurable resin B: Gas barrier film C: Cured film
Description
【0001】[0001]
【発明の属する技術分野】本発明は、液晶表示装置、タ
ッチパネル及び太陽電池変換素子等の基板に好適に使用
されるプラスチック積層体に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plastic laminate suitably used for substrates such as a liquid crystal display, a touch panel and a solar cell conversion element.
【0002】[0002]
【従来の技術】エレクトロニクス技術の急速な進歩に伴
い、特に液晶表示装置、タッチパネル、太陽電池変換素
子等、光エレクトロニクス分野は拡大している。一般的
に、光エレクトロニク素子は、素子を、透明導電層を有
するガラス基板上に形成することにより各種用途に供さ
れている。しかしながら、ガラスは重量が大きく、可搬
型装置に組み込んだ場合は、ガラスの大きな比重のため
機器の重量が大きくなるという問題があった。そのた
め、軽量化が強く望まれており、ガラス基板に代わるプ
ラスチックシートとして、強度、透明性、耐熱性等に比
較的優れたポリアリレート、ポリエーテルスルホン、ポ
リカーボネート等のシート基板が採用されつつある。2. Description of the Related Art With the rapid progress of electronics technology, the field of optoelectronics, especially liquid crystal display devices, touch panels, solar cell conversion elements, etc., is expanding. 2. Description of the Related Art In general, an optoelectronic element is provided for various uses by forming the element on a glass substrate having a transparent conductive layer. However, glass has a large weight, and when incorporated into a portable device, there is a problem that the weight of the equipment increases due to the large specific gravity of the glass. Therefore, weight reduction is strongly desired, and a sheet substrate made of polyarylate, polyethersulfone, polycarbonate, or the like, which is relatively excellent in strength, transparency, heat resistance, and the like, is being used as a plastic sheet instead of a glass substrate.
【0003】しかしながら、現状のこれらシート基板
は、厚さが0.1mmm程度であるので、従来のガラス
基板に比べて剛性に欠ける。剛性を付与するため、フィ
ルムの膜厚化が考えられるが、溶媒キャスト法では、発
泡、平面性の低下、残留溶媒の問題のため現実的には厚
さ0.2mm程度の製造が限界である。また、液晶素子
への応用のためにはシート基板の複屈折率が通常20n
m以下、好ましくは10nm以下であることが必要であ
るが、プラスチック成形の際、分子配向を受けやすく低
複屈折の成形体を製造するのは困難である。そこで、特
開平7ー36023号公報などには、複屈折率の小さい
シートを2層積層した光学プラスチックシートが提案さ
れているが、かかるシートでは熱可塑性樹脂であるため
に、剛性が小さく、また、耐薬品性についても大きく劣
るといった欠点がある。また、特開平6ー116406
号公報には、光学用シートとして基材シートの表面層に
硬化性樹脂をコートしたものが提案されているが、かか
るシートも基板洗浄時にシート側面から溶剤により膨
潤、溶解されるため結果として、耐薬品性に劣り、ま
た、基板の剛性も十分なものではないという問題があ
る。However, these sheet substrates at present have a thickness of about 0.1 mm and thus lack rigidity as compared with conventional glass substrates. In order to impart rigidity, it is conceivable to increase the film thickness. However, in the solvent casting method, production of about 0.2 mm in thickness is practically limited due to problems of foaming, reduction in flatness, and residual solvent. . For application to liquid crystal devices, the sheet substrate usually has a birefringence of 20 n.
m or less, preferably 10 nm or less, but it is difficult to produce a molded article having low birefringence which is easily affected by molecular orientation during plastic molding. Therefore, Japanese Patent Application Laid-Open No. 7-36023 and the like have proposed an optical plastic sheet in which two sheets of sheets having a small birefringence are laminated. However, since such a sheet is a thermoplastic resin, the sheet has low rigidity. Also, there is a drawback that the chemical resistance is significantly poor. Also, JP-A-6-116406
In the publication, a sheet in which the surface layer of a base sheet is coated with a curable resin as an optical sheet has been proposed, but such a sheet is also swollen by a solvent from the side of the sheet when washing the substrate, and as a result, There is a problem that the chemical resistance is poor and the rigidity of the substrate is not sufficient.
【0004】更に、光エレクトロニクス素子分野では、
特に高度の光学特性、ガスバリア性、電気伝導性、機械
強度等が要求されるため、実際には、各機能を有する複
数層ないしは膜からなる積層構造の基板が用いられ、例
えば、特開平2−5308号公報には、プラスチック成
形体上の両面に硬化被膜を設け、片面に導電膜を設け、
他方片面には金属酸化物被膜を設けた積層体が提案され
ている。しかしながら、この積層体では、基材シートだ
けの問題以外にも、各層の性質の相違や密着性の問題等
により、加熱時のクラックが発生し易い等の問題があ
る。Further, in the field of optoelectronic devices,
In particular, since a high degree of optical characteristics, gas barrier properties, electrical conductivity, mechanical strength, and the like are required, a substrate having a multilayer structure composed of a plurality of layers or films having various functions is actually used. No. 5308 discloses that a cured film is provided on both surfaces of a plastic molded body, and a conductive film is provided on one surface.
On the other hand, a laminate in which a metal oxide film is provided on one side has been proposed. However, this laminated body has a problem that cracks are likely to occur during heating due to a difference in properties of each layer and a problem of adhesion, in addition to the problem of the base sheet alone.
【0005】一方、ガラス代替基板として有用なプラス
チックシート基板であるが、利用価値を高めるには、軽
量であることのみならず、可撓性を合わせ持つことが必
要である。即ち、ある曲率で基板を撓ませた(屈曲させ
た)際に、導電膜にクラックが入ったりせず、電気伝導
性を保つことが必要である。しかしながら、従来のプラ
スチックシート基板では、その耐屈曲性が不十分である
という問題がある。On the other hand, although a plastic sheet substrate is useful as a glass substitute substrate, it is necessary not only to be light in weight but also to have flexibility in order to increase the utility value. That is, when the substrate is bent (bent) at a certain curvature, it is necessary that the conductive film does not crack and the electrical conductivity is maintained. However, the conventional plastic sheet substrate has a problem that its bending resistance is insufficient.
【0006】[0006]
【発明が解決しようとする課題】本発明は、上記事情に
鑑み、液晶素子装置、タッチパネル、太陽電池等の基板
として十分な耐屈曲性を持つプラスチック積層体を提供
することにある。SUMMARY OF THE INVENTION In view of the above circumstances, an object of the present invention is to provide a plastic laminate having sufficient bending resistance as a substrate for a liquid crystal device, a touch panel, a solar cell, and the like.
【0007】[0007]
【課題を解決するための手段】ー 本発明者等は、上記
課題を解決するために鋭意検討を行った結果、光硬化樹
脂を基板しートを含む特定構造のプラスチック積層体の
諸物性が顕著に優れていること注目し、本発明に到達し
た。即ち、本発明は、下記A,B,Cがこの順序で積層
されてなることを特徴とするプラスチック積層体に存す
る。 A:光硬化性樹脂 B:ガスバリア膜 C:硬化被膜Means for Solving the Problems The inventors of the present invention have conducted intensive studies to solve the above-mentioned problems, and as a result, have found that various physical properties of a plastic laminate having a specific structure including a photocurable resin as a substrate are included. Noting that it is remarkably superior, the present invention has been reached. That is, the present invention resides in a plastic laminate characterized in that the following A, B, and C are laminated in this order. A: Photocurable resin B: Gas barrier film C: Cured film
【0008】[0008]
【発明の実施の形態】以下本発明のプラスチック積層体
について更に詳細に説明する。 (光硬化性樹脂層)光硬化性樹脂層は、本発明のプラス
チック積層体の基材層を構成する。該基材層となる光硬
化性樹脂シートを形成する光硬化性樹脂とは、紫外線等
の照射によって硬化する樹脂である。具体的には、ラジ
カル反応性不飽和化合物を有するアクリレート化合物よ
りなる樹脂組成物、このアクリレート化合物とチオール
基を有するメルカプト化合物よりなる樹脂組成物、エポ
キシアクリレート、ウレタンアクリレート、ポリエステ
ルアクリレート、ポリエーテルアクリレート等のオリゴ
マーを多官能アクリレートモノマーに溶融せしめた樹脂
組成物等が挙げられるがこれらに限定されるものではな
い。BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the plastic laminate of the present invention will be described in more detail. (Photo-curable resin layer) The photo-curable resin layer constitutes the base layer of the plastic laminate of the present invention. The photocurable resin that forms the photocurable resin sheet serving as the base material layer is a resin that is cured by irradiation with ultraviolet light or the like. Specifically, a resin composition comprising an acrylate compound having a radically reactive unsaturated compound, a resin composition comprising this acrylate compound and a mercapto compound having a thiol group, epoxy acrylate, urethane acrylate, polyester acrylate, polyether acrylate, etc. And the like, but are not limited thereto.
【0009】このうち、式(1)で示される含イオウビ
ス(メタ)アクリレート及び式(2)で示される脂環骨
格ビス(メタ)アクリレートより選ばれる少なくとも1
種のビス(メタ)アクリレートよりなる組成物が耐薬品
性、剛性等の面で好ましい。なお「(メタ)アクリレー
ト」は、アクリレートないしメタクリレートを総称する
ものである。Among them, at least one selected from sulfur-containing bis (meth) acrylate represented by the formula (1) and alicyclic skeleton bis (meth) acrylate represented by the formula (2)
A composition comprising a kind of bis (meth) acrylate is preferable in terms of chemical resistance, rigidity and the like. “(Meth) acrylate” is a generic term for acrylate or methacrylate.
【0010】[0010]
【化6】 Embedded image
【0011】[式(1)中、R1 及びR2 は、互に異っ
ていてもよく、水素原子又はメチル基を示す。R3 は炭
素鎖中に酸素原子及び/又は硫黄原子を有していてもよ
い炭素数1〜6の炭化水素基、好ましくは炭素数2〜4
のアルキレン基を示す。R4 は炭素鎖中に酸素原子及び
/又は硫黄原子を有していてもよい炭素数1〜6の炭化
水素基、好ましくは炭素数1〜3のアルキレン基を示
す。Xはハロゲン原子、炭素数1〜6のアルキル基又は
炭素数1〜6のアルコキシ基を示し、aは0〜4の整数
を示す。但しaが2以上の整数の場合には、複数のXは
互に異っていてもよい。] 式(1)で示される化合物のいくつかを例示すれば、次
の通りである。p−ビス(β−メタクリロイルオキシエ
チルチオメチル)ベンゼン、p−ビス(β−アクリロイ
ルオキシエチルチオメチル)ベンゼン、m−ビス(β−
メタクリロイルオキシエチルチオメチル)ベンゼン、m
−ビス(β−アクリロイルオキシエチルチオメチル)ベ
ンゼン、p−ビス(β−メタクリロイルオキシエチルオ
キシエチルチオメチル)ベンゼン、p−ビス(β−メタ
クリロイルオキシエチルチオエチルチオメチル)ベンゼ
ン、p−ビス(β−メタクリロイルオキシエチルチオメ
チル)テトラブロムベンゼン、m−ビス(β−メタクリ
ロイルオキシエチルチオメチル)テトラクロロベンゼ
ン。これらの化合物は、例えば、特開昭62−1953
57号公報に開示されている方法で合成することができ
る。[In the formula (1), R 1 and R 2 may be different from each other and represent a hydrogen atom or a methyl group. R 3 is a hydrocarbon group having 1 to 6 carbon atoms which may have an oxygen atom and / or a sulfur atom in the carbon chain, preferably 2 to 4 carbon atoms.
Represents an alkylene group. R 4 represents a hydrocarbon group having 1 to 6 carbon atoms which may have an oxygen atom and / or a sulfur atom in the carbon chain, preferably an alkylene group having 1 to 3 carbon atoms. X represents a halogen atom, an alkyl group having 1 to 6 carbon atoms or an alkoxy group having 1 to 6 carbon atoms, and a represents an integer of 0 to 4. However, when a is an integer of 2 or more, a plurality of Xs may be different from each other. Some examples of the compound represented by the formula (1) are as follows. p-bis (β-methacryloyloxyethylthiomethyl) benzene, p-bis (β-acryloyloxyethylthiomethyl) benzene, m-bis (β-
Methacryloyloxyethylthiomethyl) benzene, m
-Bis (β-acryloyloxyethylthiomethyl) benzene, p-bis (β-methacryloyloxyethyloxyethylthiomethyl) benzene, p-bis (β-methacryloyloxyethylthioethylthiomethyl) benzene, p-bis (β -Methacryloyloxyethylthiomethyl) tetrabromobenzene, m-bis (β-methacryloyloxyethylthiomethyl) tetrachlorobenzene. These compounds are described in, for example, JP-A-62-1953.
No. 57 can be synthesized.
【0012】[0012]
【化7】 Embedded image
【0013】[式(2)中、R5 及びR6 は、互に異っ
ていてもよく、水素原子又はメチル基を示す。bは1又
は2を示し、cは0又は1を示す。] 式(2)で示される化合物のいくつかを例示すれば、次
の通りである。ビス(オキシメチル)トリシクロ〔5.
2.1.02,6 〕デカン=ジアクリレート、ビス(オ
キシメチル)トリシクロ〔5.2.1.02,6 〕デカ
ン=ジメタクリレート、ビス(オキシメチル)トリシク
ロ〔5.2.1.02,6 〕デカン=アクリレートメタ
クリレート、ビス(オキシメチル)ペンタシクロ〔6.
5.1.13,6 .02,7 .09,13〕ペンタデカン=
ジアクリレート、ビス(オキシメチル)ペンタシクロ
〔6.5.1.1.3,6 .02,7 .09,13〕ペンタ
デカン=ジメタクリレート、ビス(オキシメチル)ペン
タシクロ〔6.5.1.1. 3,6.02,7 .09,13〕
ペンタデカン=アクリレートメタクリレート。これらの
化合物は、例えば、特開昭62−225508号公報に
開示されている方法で合成することができる。In the formula (2), RFiveAnd R6Are different from each other
And may represent a hydrogen atom or a methyl group. b is 1 or
Represents 2 and c represents 0 or 1. When some of the compounds represented by the formula (2) are exemplified,
It is as follows. Bis (oxymethyl) tricyclo [5.
2.1.02,6] Decane = diacrylate, bis (e
Xymethyl) tricyclo [5.2.1.02,6] Deca
Dimethacrylate, bis (oxymethyl) tris
B [5.2.1.02,6] Decane = acrylate meta
Acrylate, bis (oxymethyl) pentacyclo [6.
5.1.13,6. 02,7. 09, 13Pentadecane =
Diacrylate, bis (oxymethyl) pentacyclo
[6.5.1.1.3,6. 02,7. 09, 13Penta
Decane dimethacrylate, bis (oxymethyl) pen
Tacyclo [6.5.1.1. 3,6. 02,7. 09, 13]
Pentadecane acrylate methacrylate. these
The compound is described in, for example, JP-A-62-225508.
It can be synthesized by the disclosed methods.
【0014】以上の式(1)及び式(2)で示される
(メタ)アクリレートは、単独もしくは2種以上を併用
して用いることができる。式(1)の化合物を単独で用
いる場合、本発明により得られる低複屈折板の屈折率
は、ナトリウムのD線(589.3mm)において室温
で1.54〜1.65となり、高屈折率を有する。また
式(2)の化合物を単独で用いる場合は比較的低い屈折
率1.47〜1.51となる。したがって式(1)及び
式(2)で示される化合物を2種以上併用することによ
り、1.47〜1.65の間で所望の屈折率を有する低
複屈折板を得ることができる。The (meth) acrylates represented by the above formulas (1) and (2) can be used alone or in combination of two or more. When the compound of the formula (1) is used alone, the low birefringence plate obtained according to the present invention has a refractive index of 1.54 to 1.65 at room temperature at a D line (589.3 mm) of sodium, and has a high refractive index. Having. When the compound of the formula (2) is used alone, the refractive index is relatively low, from 1.47 to 1.51. Therefore, a low birefringent plate having a desired refractive index between 1.47 and 1.65 can be obtained by using two or more compounds represented by the formulas (1) and (2) in combination.
【0015】光硬化性樹脂は、上記ビス(メタ)アクリ
レートを、単独で重合させて使用することができるが、
下記の式(3)、(4)及び(5)で示される分子内に
2個以上のチオール基を有するメルカプト化合物より選
ばれる少なくとも1種のメルカプト化合物をビス(メ
タ)アクリレート80〜99.1重量部に対して、0.
1〜20重量部、より好ましくは1〜15重量部、更に
好ましくは5〜10重量部配合することにより複屈折の
低減、適度の靱性を付与することができる。メルカプト
化合物が20重量部を超えると耐熱性が低くなるのであ
まり好ましくない。The photocurable resin can be used by polymerizing the above bis (meth) acrylate alone.
At least one mercapto compound selected from mercapto compounds having two or more thiol groups in the molecule represented by the following formulas (3), (4) and (5) is bis (meth) acrylate 80 to 99.1. With respect to parts by weight, 0.
By mixing 1 to 20 parts by weight, more preferably 1 to 15 parts by weight, and still more preferably 5 to 10 parts by weight, it is possible to reduce birefringence and impart appropriate toughness. If the amount of the mercapto compound is more than 20 parts by weight, heat resistance is lowered, which is not preferred.
【0016】[0016]
【化8】 Embedded image
【0017】[式(3)中、複数のR7 は互に異ってい
てもよく、それぞれメチレン基又はエチレン基を示す。
R8 は炭素鎖中に酸素原子及び/又は硫黄原子を含んで
いてもよい炭素数2〜15、好ましくは2〜6の炭化水
素残基を示す。dは2〜6の整数を示す。] 即ち、式(3)で示される化合物は、チオグリコール酸
又はチオプロピオン酸とポリオールとのジエステル〜ヘ
キサエステルである。そのいくつかを例示すると、ペン
タエリスリトールテトラキス(β−チオプロピオネー
ト)、ペンタエリスリトールテトラキス(チオグリコレ
ート)、トリメチロールプロパントリス(β−チオプロ
ピオネート)、トリメチロールプロパントリス(チオグ
リコレート)、ジエチレングリコールビス(β−チオプ
ロピオネート)、ジエチレングリコールビス(チオグリ
コレート)、トリエチレングリコールビス(β−チオプ
ロピオネート)、トリエチレングリコールビス(チオグ
リコレート)、ジペンタエリスリトールヘキサキス(β
−チオプロピオネート)、ジペンタエリスリトールヘキ
サキス(チオグリコレート)などが挙げられる。[In the formula (3), a plurality of R 7 may be different from each other and each represents a methylene group or an ethylene group.
R 8 is 2 to 15 carbon atoms which may contain an oxygen atom and / or sulfur atom in the carbon chain, preferably a hydrocarbon residue of 2-6. d shows the integer of 2-6. That is, the compound represented by the formula (3) is a diester to hexaester of thioglycolic acid or thiopropionic acid and a polyol. Some examples are pentaerythritol tetrakis (β-thiopropionate), pentaerythritol tetrakis (thioglycolate), trimethylolpropane tris (β-thiopropionate), and trimethylolpropane tris (thioglycolate). , Diethylene glycol bis (β-thiopropionate), diethylene glycol bis (thioglycolate), triethylene glycol bis (β-thiopropionate), triethylene glycol bis (thioglycolate), dipentaerythritol hexakis (β
-Thiopropionate), dipentaerythritol hexakis (thioglycolate) and the like.
【0018】[0018]
【化9】 Embedded image
【0019】[式(4)中、Yは互に異っていてもよ
く、HS−(CH2 )e −(CO)(OCH2 −C
H2 )f −(CH2 )g −を示す。但しeは1〜4の整
数、fは1〜4の整数、gは0〜2の整数をそれぞれ示
す。] 即ち、式(4)の化合物はω−SH基含有トリイソシア
ヌレートである。そのいくつかを例示すると、トリス
〔2−(β−チオプロピオニルオキシ)エチル〕イソシ
アヌレート、トリス(2−チオグリコニルオキシエチ
ル)イソシアヌレート、トリス〔2−(β−チオプロピ
オニルオキシエトキシ)エチル〕イソシアヌレート、ト
リス(2−チオグリコニルオキシエトキシエチル)イソ
シアヌレート、トリス〔3−(β−チオプロピオニルオ
キシ)プロピル〕イソシアヌレート、トリス(3−チオ
グリコニルオキシプロピル)イソシアヌレートなどが挙
げられる。[In the formula (4), Y may be different from each other, and HS- (CH 2 ) e- (CO) (OCH 2 -C
H 2) f - (CH 2 ) g - shows a. Here, e represents an integer of 1 to 4, f represents an integer of 1 to 4, and g represents an integer of 0 to 2, respectively. That is, the compound of the formula (4) is an ω-SH group-containing triisocyanurate. Some examples are tris [2- (β-thiopropionyloxy) ethyl] isocyanurate, tris (2-thioglyconyloxyethyl) isocyanurate, and tris [2- (β-thiopropionyloxyethoxy) ethyl]. Examples include isocyanurate, tris (2-thioglyconyloxyethoxyethyl) isocyanurate, tris [3- (β-thiopropionyloxy) propyl] isocyanurate, and tris (3-thioglyconyloxypropyl) isocyanurate.
【0020】[0020]
【化10】 Embedded image
【0021】[式(5)中、R9 及びR10は、互に異っ
ていてもよく、炭素数1〜3の炭化水素基を示す。m及
びnはそれぞれ0又は1を示す。pは1又は2を示
す。] すなわち、式(5)の化合物はα,ω−SH基含有化合
物である。そのいくつかを例示すると、ベンゼンジメル
カプタン、キシリレンジメルカプタン、4,4′−ジメ
ルカプトジフェニルスルフィドなどが挙げられる。[In the formula (5), R 9 and R 10 may be different from each other and represent a hydrocarbon group having 1 to 3 carbon atoms. m and n each represent 0 or 1. p represents 1 or 2. That is, the compound of the formula (5) is an α, ω-SH group-containing compound. Some examples thereof include benzenedimercaptan, xylylenedimercaptan, and 4,4'-dimercaptodiphenylsulfide.
【0022】また、以上の光硬化性樹脂の重合の際に用
いる他の単量体としては、例えば、メチル(メタ)アク
リレート、フェニル(メタ)アクリレート、2−ヒドロ
キシエチル(メタ)アクリレート、メタクリロイルオキ
シメチルテトラシクロドデカン、メタクリロイルオキシ
メチルテトラシクロドデセン、エチレングリコールジ
(メタ)アクリレート、ジエチレングリコールジ(メ
タ)アクリレート、1,6−ヘキサンジオールジ(メ
タ)アクリレート、2,2−ビス[4−(β−メタクリ
ロイルオキシエトキシ)フェニル]プロパン、2,2′
−ビス[4−(β−メタクリロイルオキシエトキシ)シ
クロヘキシル]プロパン、1,4−ビス(メタクリロイ
ルオキシメチル)シクロヘキサン、トリメチロールプロ
パントリ(メタ)アクリレート等の(メタ)アクリレー
ト化合物、スチレン、クロルスチレン、ジビニルベンゼ
ン、α−メチルスチレン等の核及び(又は)側鎖置換及
び非置換スチレンなどが挙げられる。これらの他の単量
体の中でもメタクリロイルオキシメチルシクロドデカ
ン、2,2−ビス[4−(β−メタクリロイルオキシエ
トキシ)フェニル]プロパン、2,2−ビス[4−(β
−メタクリロイルオキシエトキシ)シクロヘキシル]プ
ロパン、1,4−ビス(メタクリロイルオキシメチル)
シクロヘキサン、及びこれらの混合物が特に好ましい。
更に、これらには少量の酸化防止剤、紫外線吸収剤、染
顔料、充填剤等を含んでいてもよい。Other monomers used in the polymerization of the photocurable resin include, for example, methyl (meth) acrylate, phenyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, methacryloyloxy Methyltetracyclododecane, methacryloyloxymethyltetracyclododecene, ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, 2,2-bis [4- (β -Methacryloyloxyethoxy) phenyl] propane, 2,2 '
-(Meth) acrylate compounds such as -bis [4-([beta] -methacryloyloxyethoxy) cyclohexyl] propane, 1,4-bis (methacryloyloxymethyl) cyclohexane, trimethylolpropane tri (meth) acrylate, styrene, chlorostyrene and divinyl Core and / or side chain substituted and unsubstituted styrenes such as benzene and α-methylstyrene. Among these other monomers, methacryloyloxymethylcyclododecane, 2,2-bis [4- (β-methacryloyloxyethoxy) phenyl] propane, 2,2-bis [4- (β
-Methacryloyloxyethoxy) cyclohexyl] propane, 1,4-bis (methacryloyloxymethyl)
Cyclohexane, and mixtures thereof, are particularly preferred.
Further, these may contain small amounts of antioxidants, ultraviolet absorbers, dyes and pigments, fillers and the like.
【0023】以上のようなビス(メタ)アクリレート又
はビス(メタ)アクリレートとメルカプト化合物との混
合物は、紫外線等の活性エネルギー線によりラジカルを
発生する光重合開始剤を添加する公知のラジカル重合に
より硬化させる。その際に用いる光重合開始剤として
は、例えばベンゾフェノン、ベンゾインメチルエーテ
ル、ベンゾインイソプロピルエーテル、ジエトキシアセ
トフェノン、1−ヒドロキシシクロヘキシルフェニルケ
トン、2,6−ジメチルベンゾイルジフェニルホスフィ
ンオキシド、2,4,6−トリメチルベンゾイルジフェ
ニルホスフィンオキシド等が挙げられる。好ましい光開
始剤としては、2,4,6−トリメチルベンゾイルジフ
ェニルホスフィンオキシド、ベンゾフェノンである。こ
れら光重合開始剤は2種以上を併用してもよい。The bis (meth) acrylate or a mixture of the bis (meth) acrylate and the mercapto compound as described above is cured by a known radical polymerization in which a photopolymerization initiator which generates a radical by active energy rays such as ultraviolet rays is added. Let it. As the photopolymerization initiator used at that time, for example, benzophenone, benzoin methyl ether, benzoin isopropyl ether, diethoxyacetophenone, 1-hydroxycyclohexylphenyl ketone, 2,6-dimethylbenzoyldiphenylphosphine oxide, 2,4,6-trimethyl Benzoyldiphenylphosphine oxide and the like. Preferred photoinitiators are 2,4,6-trimethylbenzoyldiphenylphosphine oxide and benzophenone. Two or more of these photopolymerization initiators may be used in combination.
【0024】光重合開始剤の添加量は、モノマー100
重量部に対し0.01〜1重量部、好ましくは0.02
〜0.3重量部である。光重合開始剤の添加量が多すぎ
ると、重合が急激に進行し複屈折の増大をもたらすだけ
でなく色相も悪化する。また少なすぎると組成物を充分
に硬化させることができなくなる。照射する活性エネル
ギー線の量は、光重合開始剤がラジカルを発生する範囲
であれば任意であるが、極端に少ない場合は重合が不完
全なため硬化物の耐熱性、機械特性が十分に発現され
ず、逆に極端に過剰な場合には硬化物の黄変等の光によ
る劣化を生じるので、モノマーの組成及び光重合開始剤
の種類、量に合わせて200〜400nmの紫外線を好
ましくは0.1〜200Jの範囲で照射する。使用する
ランプの具体例としては、メタルハライドランプ、高圧
水銀灯ランプ等を挙げることができる。The amount of the photopolymerization initiator added is 100
0.01 to 1 part by weight, preferably 0.02 part by weight based on part by weight
0.30.3 parts by weight. If the amount of the photopolymerization initiator is too large, the polymerization proceeds rapidly, causing not only an increase in birefringence but also a deterioration in hue. If the amount is too small, the composition cannot be cured sufficiently. The amount of the active energy rays to be irradiated is arbitrary as long as the photopolymerization initiator generates radicals.However, if the amount is extremely small, the heat resistance and mechanical properties of the cured product are sufficiently exhibited due to incomplete polymerization. On the contrary, if the amount is extremely excessive, deterioration of the cured product due to light such as yellowing occurs. Therefore, ultraviolet rays having a wavelength of 200 to 400 nm are preferably 0 to 400 nm depending on the composition of the monomer and the type and amount of the photopolymerization initiator. Irradiate in the range of 1 to 200 J. Specific examples of the lamp to be used include a metal halide lamp and a high-pressure mercury lamp.
【0025】硬化を速やかに完了させる目的で、熱重合
を併用してもよい。即ち、光照射と同時に組成物並びに
型全体を通常30〜300℃の範囲で加熱する。この場
合は重合をよりよく完結するためにラジカル重合開始剤
を添加してもよいが、過剰な使用は複屈折の増大と色相
の悪化をもたらす。熱重合開始剤の具体例としてはベン
ゾイルパーオキシド、ジイソプロピルパーオキシカーボ
ネート、t−ブチルパーオキシ(2−エチルヘキサノエ
ート)等が挙げられ、使用量はモノマー100重量部に
対して1重量部以下が好ましい。For the purpose of promptly completing the curing, thermal polymerization may be used in combination. That is, the composition and the whole mold are usually heated in the range of 30 to 300 ° C. simultaneously with the light irradiation. In this case, a radical polymerization initiator may be added in order to complete the polymerization better, but excessive use causes an increase in birefringence and a deterioration in hue. Specific examples of the thermal polymerization initiator include benzoyl peroxide, diisopropyl peroxy carbonate, t-butyl peroxy (2-ethylhexanoate), and the amount used is 1 part by weight or less based on 100 parts by weight of the monomer. Is preferred.
【0026】更に、光照射によるラジカル重合を行った
後、硬化物を加熱することにより重合反応の完結及び重
合時に発生する内部歪を低減することも可能である。加
熱温度は、硬化物の組成やガラス転移温度に合わせて適
宜選択されるが、過剰な加熱は硬化物の色相悪化をもた
らすため、ガラス転移温度付近かそれ以下の温度が好ま
しい。Furthermore, after the radical polymerization by light irradiation is performed, the cured product is heated to reduce the completion of the polymerization reaction and the internal strain generated during the polymerization. The heating temperature is appropriately selected according to the composition of the cured product and the glass transition temperature. However, since excessive heating results in deterioration of the hue of the cured product, a temperature around the glass transition temperature or lower is preferable.
【0027】光硬化性樹脂シートの成形方法は、少なく
とも一面が活性エネルギー線を透過可能な2枚の相対す
る平板(以下「成形型」という。)を用いスペーサー等
によりキャビティを形成させ周辺部をシールしてなる注
入型に光硬化性樹脂を注入し、活性エネルギー線を照射
して光硬化性樹脂を硬化させる。成形型の材質は、硬化
後のシートの表面から、好ましくは研磨ガラスを用い、
光硬化性樹脂を硬化させるに充分な活性エネルギー線の
透過性を持ち、熱等により容易にその形状を変形させな
いものであればよい。また、研磨ガラスと同等な表面性
を得られるアクリル板等のプラスチック等が挙げられ
る。The molding method of the photocurable resin sheet is such that a cavity is formed by a spacer or the like using two opposing flat plates (hereinafter, referred to as a "molding die") at least one surface of which is capable of transmitting active energy rays, and a peripheral portion is formed. The photocurable resin is injected into a sealed injection mold, and irradiated with active energy rays to cure the photocurable resin. The material of the mold, from the surface of the sheet after curing, preferably using polished glass,
Any material may be used as long as it has sufficient transmittance of active energy rays to cure the photocurable resin and does not easily deform its shape due to heat or the like. Moreover, plastics, such as an acrylic plate, which can obtain surface properties equivalent to a polished glass are mentioned.
【0028】また、必要により成形型上に剥離剤等の塗
布、又は剥離層を設け硬化後の光硬化性樹脂シートを成
形型より除去し易くする処理を行うこともできる。用い
る剥離剤、剥離層、その塗布方法などについては特に限
定すされるものではないが、光硬化樹脂を硬化させるに
充分な活性エネルギー線の透過性を持つ物質であり、更
に、光硬化性樹脂を硬化させるための活性エネルギー線
や、硬化時に発生する熱等により容易にその形成状態を
変形しない物質であり、ガラス表面並の平面性が得られ
る物質であればよい。If necessary, a release agent or the like may be applied on the mold, or a release layer may be provided so that the cured photocurable resin sheet can be easily removed from the mold. The release agent to be used, the release layer, its application method and the like are not particularly limited, but a substance having sufficient transmittance of active energy rays to cure the photocurable resin, and furthermore, a photocurable resin. Any substance may be used as long as it is a substance that does not easily change its state of formation due to active energy rays for curing, heat generated during curing, or the like, and has a flatness comparable to that of a glass surface.
【0029】活性エネルギー線は光硬化性樹脂を硬化さ
せるものであり、例えば、紫外線等が挙げられる。活性
エネルギー線の照射量は用いる光硬化性樹脂を硬化させ
る量であればよい。キャビティを形成させるスペーサー
等については、特に限定しないが、所望のシート厚さが
得られるものであればよい。例えば、シリコンゴム等の
ゴム製、金属製の板もしくは棒状、テフロン等の樹脂製
の板もしくは棒状が挙げられる。 (ガスバリア膜)本発明における膜としては、無機酸化
物膜、あるいは、エチレンービニルアルコール共重合体
(例えば、エバール商品名エバール、ソアノール)、塩
化ビニリデン等のガスバリアー性樹脂層が挙げられる
が、好ましくは無機酸化物膜である。無機酸化物とは、
金属、非金属、亜金属の酸化物であり、具体例として
は、酸化アルミニウム、酸化亜鉛、酸化アンチモン、酸
化インジウム、酸化カルシウム、酸化カドミウム、酸化
銀、酸化金、酸化クロム、酸化珪素、酸化コバルト、酸
化ジルコニウム、酸化スズ、酸化チタン、酸化鉄、酸化
銅、酸化ニッケル、酸化白金、酸化パラジウム、酸化ビ
スマス、酸化マグネシウム、酸化マンガン、酸化モリブ
デン、酸化バナジウム、酸化バリウム等が挙げられる
が、酸化珪素が特に好ましい。なお、無機酸化物には、
微量の金属、非金属、亜金属単体やそれらの水酸化物、
また、可撓性を向上させるために適宜炭素又はフッ素が
含まれていてもよい。ガスバリア層を形成する方法とし
ては、樹脂等をコートする方法、無機酸化物よりなる蒸
着膜を形成する方法が挙げられる。蒸着膜を形成する方
法としては、真空蒸着法、真空スパッタ法、イオンプレ
ーティング法、CVD法等、従来公知の方法が使用でき
る。The active energy ray cures the photocurable resin, and includes, for example, ultraviolet rays. The irradiation amount of the active energy ray may be an amount that cures the photocurable resin to be used. The spacers and the like for forming the cavities are not particularly limited, as long as the desired sheet thickness can be obtained. For example, a plate or bar made of rubber or metal such as silicon rubber, or a plate or bar made of resin such as Teflon may be used. (Gas barrier film) Examples of the film in the present invention include an inorganic oxide film, and a gas barrier resin layer such as an ethylene-vinyl alcohol copolymer (for example, EVAL, trade name EVAL, Soarnol) or vinylidene chloride. Preferably, it is an inorganic oxide film. What is an inorganic oxide?
These are oxides of metals, nonmetals, and submetals. Specific examples include aluminum oxide, zinc oxide, antimony oxide, indium oxide, calcium oxide, cadmium oxide, silver oxide, gold oxide, chromium oxide, silicon oxide, and cobalt oxide. , Zirconium oxide, tin oxide, titanium oxide, iron oxide, copper oxide, nickel oxide, platinum oxide, palladium oxide, bismuth oxide, magnesium oxide, manganese oxide, molybdenum oxide, vanadium oxide, barium oxide, and the like. Is particularly preferred. In addition, in the inorganic oxide,
Trace amounts of metals, non-metals, sub-metals and their hydroxides,
Further, carbon or fluorine may be appropriately contained in order to improve flexibility. Examples of a method of forming the gas barrier layer include a method of coating a resin or the like and a method of forming a vapor deposition film made of an inorganic oxide. As a method for forming the deposited film, a conventionally known method such as a vacuum deposition method, a vacuum sputtering method, an ion plating method, and a CVD method can be used.
【0030】以上のガスバリア膜の厚さは特に制限はな
く、ガスバリア膜の構成成分の種類によっても異なる
が、酸素ガスバリア性及び水蒸気バリア性、更には経済
性を考慮すると、膜の厚さは5〜50nmが好ましい。
更に高度な酸素ガスバリア性や水蒸気バリア性を得るた
めには膜の厚さを厚くすればよいが、膜の厚さが5nm
未満では膜が島状になって膜が形成されない箇所が生ず
る可能性があり均一な膜が得られない傾向があるので余
り好ましくない。 (硬化被膜)本発明における硬化被膜としては、有機化
合物系硬化被膜であれば、特に限定されることなく用い
られるが、ハードコート剤、アンカーコート剤(プライ
マーコート剤)等より形成されるものである。その具体
例としては、ハードコート剤としては、ポリウレタンア
クリレート、エポキシアクリレートなどのアクリレート
あるいは多官能アクリレート、光重合開始剤、及び有機
溶剤を主成分とするものを使用することができる。ま
た、アンカーコート剤としては、イソシアネート系、ポ
リウレタン系、ポリエステル系、ポリエチレンイミン
系、ポリブタジエン系、アルキルチタネート系等の公知
のアンカーコート剤がが挙げられる。これらの樹脂は、
単独での使用あるいは2種以上の併用が可能であり、更
に、各種硬化剤、架橋剤などを用いて三次元架橋するこ
とも可能である。The thickness of the above-mentioned gas barrier film is not particularly limited, and varies depending on the type of the constituent components of the gas barrier film. ~ 50 nm is preferred.
In order to obtain a more advanced oxygen gas barrier property and a higher water vapor barrier property, the thickness of the film may be increased.
If it is less than 10 nm, the film may be in an island shape and a portion where the film is not formed may be generated, and a uniform film may not be obtained. (Curing film) The cured film in the present invention is not particularly limited as long as it is an organic compound-based cured film, and is formed from a hard coating agent, an anchor coating agent (primer coating agent) or the like. is there. As a specific example, as the hard coat agent, an acrylate such as polyurethane acrylate or epoxy acrylate or a polyfunctional acrylate, a photopolymerization initiator, and an organic solvent as main components can be used. Examples of the anchor coating agent include known anchor coating agents such as isocyanate-based, polyurethane-based, polyester-based, polyethyleneimine-based, polybutadiene-based and alkyl titanate-based agents. These resins are
It can be used alone or in combination of two or more kinds. Further, three-dimensional crosslinking can be performed using various curing agents, crosslinking agents and the like.
【0031】硬化被膜として特に好ましいものを更に具
体的に例示するに、表面硬度、耐熱性、耐薬品性、透明
性などの諸特性を考慮した場合では、有機高分子として
シリコーン系樹脂を用いることが好ましく、特にアクリ
ロイル基やメタクリロイル基を有するシランカップリン
グ剤を含有する活性エネルギー線硬化性組成物が好適で
ある。アクリロイル基やメタクリロイル基を有するシラ
ンカップリング剤を含む活性エネルギー線硬化性組成物
を用いると、特に、金属酸化物等からなるガスバリア膜
と硬化被膜との密着性がよくなり、かつ、ガスバリア性
が特に向上する。その理由は詳らかでないが、密着性の
向上は、シランカップリング剤が金属酸化物薄膜と化学
結合し、かつシランカップリング剤のアクリロイル基や
メタクリロイル基が共存する他の被膜形成々分と反応し
て硬化被膜を金属酸化物薄膜に強固に結合させることに
よるものと考えられる。また、ガスバリア性の向上も、
金属酸化物薄膜を構成している金属酸化物粒子間の間隙
を、シランカップリング剤ないしはそのアクリロイル基
やメタクリロイル基と反応した被膜形成成分が充填する
ことによるものと考えられる。Particularly preferable examples of the cured film include a silicone resin as an organic polymer when various properties such as surface hardness, heat resistance, chemical resistance, and transparency are taken into consideration. The active energy ray-curable composition containing a silane coupling agent having an acryloyl group or a methacryloyl group is particularly preferable. When an active energy ray-curable composition containing a silane coupling agent having an acryloyl group or a methacryloyl group is used, in particular, the adhesion between a gas barrier film made of a metal oxide or the like and a cured film is improved, and the gas barrier property is improved. Especially improve. Although the reason is not clear, the improvement in adhesion is due to the fact that the silane coupling agent chemically reacts with the metal oxide thin film and reacts with other film formations where acryloyl groups and methacryloyl groups of the silane coupling agent coexist. It is considered that the cured film is firmly bonded to the metal oxide thin film. In addition, improvement of gas barrier property,
It is considered that the gap between the metal oxide particles constituting the metal oxide thin film is filled with a silane coupling agent or a film forming component reacted with the acryloyl group or methacryloyl group.
【0032】シランカップリング剤は、アクリロイル基
及びメタクリロイル基の少くとも一方を有するものであ
ればよいが、反応速度の大きいアクリロイル基を有する
ものの方が好ましい。例えば、反応性基としてイソシア
ネート基やメルカプト基のみを有し、アクリロイル基や
メタクリロイル基を有しないシランカップリング剤を使
用したのでは、密着性は改良されない。これはシランカ
ップリング剤と金属酸化物薄膜との結合は形成されて
も、このシランカップリング剤が共存する他の被膜形成
々分と反応して被膜中に取込まれ難いことによるものと
思われる。The silane coupling agent may have at least one of an acryloyl group and a methacryloyl group, but preferably has an acryloyl group having a high reaction rate. For example, if a silane coupling agent having only an isocyanate group or a mercapto group as a reactive group and not having an acryloyl group or a methacryloyl group is used, the adhesion is not improved. This seems to be due to the fact that even though the bond between the silane coupling agent and the metal oxide thin film is formed, the silane coupling agent reacts with other co-existing film formations and is hardly taken into the film. It is.
【0033】アクリロイル基やメタクリロイル基を有す
るシランカップリング剤としては、例えばγ−アクリロ
キシプロピルトリメトキシシラン、γ−メタクリロキシ
プロピルトリメトキシシラン、γ−アクリロキシプロピ
ルトリエトキシシラン、γ−メタクリロキシプロピルト
リエトキシシラン、γ−アクリロキシプロピルメチルジ
メトキシシラン、γ−アクリロキシプロピルメチルジエ
トキシシラン、γ−メタクリロキシプロピルメチルジメ
トキシシラン、γ−メタクリロキシプロピルメチルジエ
トキシシラン、γ−アクリロキシプロピル−トリス(β
−メトキシエトキシ)シラン、γ−メタクリロキシプロ
ピル−トリス(β−メトキシエトキシ)シランなどが挙
げられる。Examples of the silane coupling agent having an acryloyl group or a methacryloyl group include γ-acryloxypropyltrimethoxysilane, γ-methacryloxypropyltrimethoxysilane, γ-acryloxypropyltriethoxysilane, γ-methacryloxypropyl Triethoxysilane, γ-acryloxypropylmethyldimethoxysilane, γ-acryloxypropylmethyldiethoxysilane, γ-methacryloxypropylmethyldimethoxysilane, γ-methacryloxypropylmethyldiethoxysilane, γ-acryloxypropyl-tris ( β
-Methoxyethoxy) silane, γ-methacryloxypropyl-tris (β-methoxyethoxy) silane, and the like.
【0034】これらのシランカップリング剤は、活性エ
ネルギー線硬化性組成物中で、通常0.1〜60重量
%、好ましくは0.2〜45重量%を占める。シランカ
ップリング剤が少な過ぎると硬化被膜と金属酸化物薄膜
との密着性が十分に発現され難い。これは組成物中の金
属酸化物薄膜と反応する官能基の量が十分でないためと
考えられる。逆にシランカップリング剤が過剰に存在す
ると、硬化被膜の耐アルカリ性が低下するようになるこ
とがある。これは金属酸化物薄膜と反応しないシランカ
ップリング剤が、硬化被膜中に多量に残存し、これがア
ルカリと反応するためと考えられる。These silane coupling agents generally account for 0.1 to 60% by weight, preferably 0.2 to 45% by weight, of the active energy ray-curable composition. If the amount of the silane coupling agent is too small, it is difficult for the adhesion between the cured film and the metal oxide thin film to be sufficiently exhibited. This is presumably because the amount of the functional group that reacts with the metal oxide thin film in the composition is not sufficient. Conversely, if the silane coupling agent is present in excess, the alkali resistance of the cured film may decrease. This is probably because a large amount of the silane coupling agent that does not react with the metal oxide thin film remains in the cured film and reacts with the alkali.
【0035】活性エネルギー線硬化性組成物は、シラン
カップリング剤を含む以外は、活性エネルギー線の照射
により重合して硬化被膜を形成する常用のモノマーやオ
リゴマー、ポリマー等から成っている。例えばエポキシ
(メタ)アクリレート、ウレタン(メタ)アクリレー
ト、ポリエステル(メタ)アクリレート等のモノマーや
オリゴマーが用いられる。これらのいくつかを例示する
と、トリメチロールプロパントリアクリレート、トリメ
チロールプロパントリメタクリレート、ペンタエリスリ
トールトリアクリレート、ペンタエリスリトールトリメ
タクリレート、ペンタエリスリトールテトラアクリレー
ト、ペンタエリスリトールテトラメタクリレート、ジペ
ンタエリスリトールヘキサアクリレート、ジペンタエリ
スリトールヘキサメタクリレート、イソアミルアクリレ
ート、エトキシジエチレングリコールアクリレート、メ
トキシジエチレングリコールアクリレート、N−ビニル
ピロリドンなど、1個以上の炭素−炭素二重結合を有す
る単官能および多官能のアクリルモノマー、メタクリル
モノマー、ビニルモノマー類が挙げられる。 また、活
性エネルギー線硬化性組成物には、公知の添加剤、例え
ば、紫外線吸収剤、熱重合禁止剤などが配合されていて
もよい。The active energy ray-curable composition comprises a conventional monomer, oligomer, polymer, or the like which is polymerized by irradiation with an active energy ray to form a cured film, except for containing a silane coupling agent. For example, monomers or oligomers such as epoxy (meth) acrylate, urethane (meth) acrylate, and polyester (meth) acrylate are used. Examples of some of these include trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, pentaerythritol triacrylate, pentaerythritol trimethacrylate, pentaerythritol tetraacrylate, pentaerythritol tetramethacrylate, dipentaerythritol hexaacrylate, dipentaerythritol hexaacrylate. Monofunctional and polyfunctional acrylic monomers, methacrylic monomers, and vinyl monomers having one or more carbon-carbon double bonds, such as methacrylate, isoamyl acrylate, ethoxydiethylene glycol acrylate, methoxydiethylene glycol acrylate, and N-vinylpyrrolidone. Further, the active energy ray-curable composition may contain known additives such as an ultraviolet absorber and a thermal polymerization inhibitor.
【0036】活性エネルギー線硬化性組成物で硬化被膜
を形成するには、活性エネルギー線硬化性組成物をグラ
ビアコート法、リバースコート法、ダイコート法などの
各種塗布方法で塗布し、活性エネルギー線を照射して硬
化させればよい。このとき、塗布してから硬化させる前
に予備加熱を行っても良い。活性エネルギー線硬化性組
成物が溶剤で希釈されている場合は、この予備加熱の工
程において溶剤を除去しなければならない。In order to form a cured film with the active energy ray-curable composition, the active energy ray-curable composition is applied by various coating methods such as a gravure coating method, a reverse coating method, a die coating method and the like, and the active energy ray is applied. Irradiation and curing may be used. At this time, preheating may be performed after application and before curing. When the active energy ray-curable composition is diluted with a solvent, the solvent must be removed in this preheating step.
【0037】上記組成物は、通常揮発性溶媒により希釈
して液状組成物として塗布されることが好ましい。溶媒
として塗布されるものは、特に限定されないが、使用に
あたって被塗布物の表面性状を損なわぬことが要求され
る。さらには、組成物の安定性、基材に対するぬれ性、
揮発性などをも考慮して、溶媒は決められるべきであ
る。また、溶媒は1種のみならず2種以上の混合物とし
て用いることも可能である。溶媒としては、アルコー
ル、エステル、エーテル、ケトン、ハロゲン化炭化水
素、トルエンやキシレンなどの芳香族炭化水素、および
非プロトン性極性溶媒などが挙げられる。The above composition is usually preferably diluted with a volatile solvent and applied as a liquid composition. Although what is applied as a solvent is not particularly limited, it is required that the surface properties of the object to be applied are not impaired in use. Furthermore, stability of the composition, wettability to the substrate,
The solvent should be determined in consideration of volatility and the like. Further, the solvent may be used as a mixture of not only one kind but also two or more kinds. Examples of the solvent include alcohols, esters, ethers, ketones, halogenated hydrocarbons, aromatic hydrocarbons such as toluene and xylene, and aprotic polar solvents.
【0038】なお、硬化被膜には、表面硬度の向上、屈
折率の調節、機械的強度の向上、熱的特性の向上、硬化
被膜上に設けられる金属酸化物膜、透明導電膜の耐久性
向上などを目的に、無機微粒子が添加される。かかる無
機微粒子としては、被膜状態で透明性を損なわないもの
であればとくに限定されない。作業性向上、透明性付与
の点から特に好ましい例としては、コロイド状に分散し
たゾルが挙げられる。さらに具体的な例としては、シリ
カゾル、酸化アンチモンゾル、チタニアゾル、アルミナ
ゾル、ジルコニアゾル、酸化タングステンゾルなどが挙
げられる。無機微粒子の添加量は、とくに限定されない
が、効果をより顕著にするためには、透明被膜中に1重
量%以上、80重量%以下含有されていることが好まし
い。1重量%未満では明らかな添加の効果が認められに
くく、また、80重量%を越えると透明樹脂との接着性
不良や被膜自体のクラックが発生し、耐衝撃性が低下す
るなどの問題を生じる場合がある。無機微粒子の粒子径
は、特に限定されないが、好ましくは1〜300mμ、
更にら好ましくは5〜100mμのものが使用される。
平均粒子径が300mμを越えるものを使用した場合
は、生成する被膜の透明性が悪く、濁りが大きくなる傾
向がある。また、微粒子状無機物の分散性を改良するた
めに、各種の微粒子表面処理を行ってもよいし、各種の
界面活性剤やアミンなどを添加しても何ら問題はない。The cured film has an improved surface hardness, a controlled refractive index, an improved mechanical strength, an improved thermal characteristic, and an improved durability of the metal oxide film and the transparent conductive film provided on the cured film. For the purpose, etc., inorganic fine particles are added. Such inorganic fine particles are not particularly limited as long as they do not impair transparency in a film state. A particularly preferred example from the viewpoint of improving workability and imparting transparency is a sol dispersed in a colloidal state. More specific examples include silica sol, antimony oxide sol, titania sol, alumina sol, zirconia sol, tungsten oxide sol, and the like. The addition amount of the inorganic fine particles is not particularly limited, but in order to make the effect more remarkable, it is preferable that the content is 1% by weight or more and 80% by weight or less in the transparent coating. If the amount is less than 1% by weight, a clear effect of the addition is hardly recognized, and if it exceeds 80% by weight, problems such as poor adhesion to the transparent resin and cracks in the coating itself occur, resulting in a decrease in impact resistance. There are cases. The particle diameter of the inorganic fine particles is not particularly limited, but is preferably 1 to 300 mμ,
More preferably, those having 5 to 100 mμ are used.
When the particles having an average particle diameter of more than 300 μm are used, the resulting film tends to be poor in transparency and turbid. Further, in order to improve the dispersibility of the particulate inorganic material, various kinds of fine particle surface treatments may be performed, and there is no problem even if various surfactants, amines and the like are added.
【0039】硬化被膜形成時に使用されるコーティング
組成物には、硬化促進や低温硬化などを可能とする目的
で各種の硬化剤を併用してもよい。硬化剤としては、各
種エポキシ樹脂硬化剤あるいは各種有機ケイ素樹脂硬化
剤などが使用される。これらの硬化剤の具体例として
は、各種の有機酸およびそれらの酸無水物、窒素含有有
機化合物、各種金属錯化合物、金属アルコキシド、アル
カリ金属の有機カルボン酸塩や炭酸塩などの各種塩や過
酸化物、アゾビスイソブチロニトリルなどのラジカル重
合開始剤などが挙げられる。これらの硬化剤は2種以上
混合して使用することも可能である。これらの硬化剤の
中でも、コーティング組成物の安定性、コーティング後
の被膜の着色の有無などの点から、とくにアルミニウム
キレート化合物が有用である。Various curing agents may be used in combination with the coating composition used at the time of forming the cured film for the purpose of accelerating curing and curing at a low temperature. As the curing agent, various epoxy resin curing agents or various organic silicon resin curing agents are used. Specific examples of these curing agents include various organic acids and their acid anhydrides, nitrogen-containing organic compounds, various metal complex compounds, metal alkoxides, various salts such as organic carboxylate and carbonate of alkali metals, and salts of organic acids. Examples thereof include oxides and radical polymerization initiators such as azobisisobutyronitrile. These curing agents can be used as a mixture of two or more kinds. Among these curing agents, an aluminum chelate compound is particularly useful from the viewpoint of the stability of the coating composition, the presence or absence of coloring of the film after coating, and the like.
【0040】ここでいうアルミニウムキレート化合物と
しては、例えば、一般式AIXn Y 3-n で示されるアル
ミニウムキレート化合物である。ただし、式中のXはO
L(Lは低級アルキル基を示す)、Yは一般式M1 CO
CH2 COM2 (M1,M2はいずれも低級アルキル基)
で示される化合物に由来する配位子および一般式M 3 C
OCH2 COOM4 (M3 ,M4 はいずれも低級アルキ
ル基)で示される化合物に由来する配位子から選ばれる
少なくとも一つであり、nは0,1または2である。一
般式AlXnY3-n で示されるアルミニウムキレート化
合物としては、各種化合物を挙げることができるが、組
成物への溶解性、安定性、硬化触媒としての効果などの
観点からとくに好ましいのは、アルミニウムアセチルア
セトネート、アルミニウムビスエチルアセトアセテート
モノアセチルアセトネート、アルミニウム−ジ−n−ブ
トキシド−モノエチルアセトアセテート、アルミニウム
−ジ−iso−プロポキシド−モノメチルアセトアセテ
ートなどである。これらは2種以上を混合して使用する
ことも可能である。The aluminum chelate compound referred to here
For example, the general formula AIXn Y 3-n Al indicated by
It is a minium chelate compound. Where X in the formula is O
L (L represents a lower alkyl group), Y is a general formula M1 CO
CHTwo COMTwo (M1, MTwoAre lower alkyl groups)
And a ligand derived from the compound represented by the general formula M Three C
OCHTwo COOMFour (MThree , MFour Are low-grade alk
Selected from the ligands derived from the compounds represented by
At least one, and n is 0, 1 or 2. one
General formula AlXnY3-n Aluminum chelation indicated by
Examples of the compound include various compounds.
Such as solubility in products, stability, and effect as a curing catalyst
Particularly preferred from a viewpoint is aluminum acetyl alcohol.
Cetonate, aluminum bisethyl acetoacetate
Monoacetylacetonate, aluminum di-n-butyl
Toxide-monoethyl acetoacetate, aluminum
-Di-iso-propoxide-monomethylacetoacete
And so on. These are used by mixing two or more kinds.
It is also possible.
【0041】硬化被膜形成時に使用されるコーティング
組成物には、塗布時におけるフローを向上させかつ透明
被膜の平滑性を向上させて被膜表面の摩擦係数を低下さ
せる目的で各種の界面活性剤を添加することも可能であ
る。界面活性剤としては、とくにジメチルポリシロキサ
ンとアルキレンオキシドとのブロックまたはグラフト共
重合体、およびフッ素系界面活性剤などが有効である。Various types of surfactants are added to the coating composition used for forming the cured film in order to improve the flow during application and improve the smoothness of the transparent film to lower the coefficient of friction of the film surface. It is also possible. As the surfactant, a block or graft copolymer of dimethylpolysiloxane and alkylene oxide, a fluorine-based surfactant, and the like are particularly effective.
【0042】硬化被膜形成時に使用されるコーティング
組成物中には、被膜性能や透明性などを大幅に低下させ
ない範囲で、無機微粒子以外の無機酸化物なども添加す
ることができる。これらの添加物の併用によって、基材
との密着性、耐薬品性、表面硬度、耐久性などの諸特性
を向上させることができる。添加可能な無機材料として
は、例えば以下の一般式(C)で表される金属アルコキ
シド、キレート化合物および/またはその加水分解物が
挙げられる。An inorganic oxide other than the inorganic fine particles can be added to the coating composition used for forming the cured film as long as the film performance and the transparency are not significantly reduced. The combined use of these additives can improve various properties such as adhesion to a substrate, chemical resistance, surface hardness, and durability. Examples of the inorganic material that can be added include a metal alkoxide, a chelate compound and / or a hydrolyzate thereof represented by the following general formula (C).
【0043】M(OR)m (C) ここで、Mは、ケイ素、チタン、ジルコン、アンチモ
ン、タンタル、ゲルマニウム、アルミニウムなどであ
る。Rはアルキル基、アシル基、アルコキシアルキル基
である。mは金属Mの電荷数と同じ値である。硬化被膜
は、前記コーティング組成物を硬化させることによって
得られるが、硬化は加熱処理によって行なわれる。加熱
温度は、コーティング組成物の組成や透明架橋樹脂の耐
熱性を考慮して適宜選択されるが、好ましくは50〜2
50℃である。透明樹脂上への被膜の塗布方法として
は、刷毛塗り、浸漬塗り、ロール塗り、スプレー塗装、
スピン塗装、流し塗りなどの通常行なわれる塗布方法が
容易に使用可能である。コーティング組成物の塗布にあ
たっては、清浄化、密着性および耐水性等の向上を目的
として各種の前処理を施すことも有効な手段である。と
くに好ましく用いられる前処理としては、活性化ガス処
理、薬品処理、紫外線処理などが挙げられる。これらの
前処理は、連続的または段階的に併用して実施すること
も十分可能である。M (OR) m (C) Here, M is silicon, titanium, zircon, antimony, tantalum, germanium, aluminum or the like. R is an alkyl group, an acyl group, or an alkoxyalkyl group. m is the same value as the number of charges of the metal M. The cured film is obtained by curing the coating composition, and the curing is performed by a heat treatment. The heating temperature is appropriately selected in consideration of the composition of the coating composition and the heat resistance of the transparent crosslinked resin, but is preferably 50 to 2
50 ° C. As a method of applying the coating on the transparent resin, brush coating, dip coating, roll coating, spray coating,
Conventional coating methods such as spin coating and flow coating can be easily used. In applying the coating composition, it is also an effective means to perform various pretreatments for the purpose of improving cleaning, adhesion, and water resistance. Particularly preferred pretreatments include an activation gas treatment, a chemical treatment, and an ultraviolet treatment. It is sufficiently possible to carry out these pretreatments continuously or stepwise in combination.
【0044】以上の硬化被膜の膜厚は、とくに限定され
るものではないが、接着強度の保持や硬度などの点か
ら、通常0.1〜50μm、好ましくは0.3〜10μ
mである。また、被膜の塗布にあたって、作業性、被膜
厚さ調節などの目的で、コーティング組成物は各種溶剤
により希釈して用いられる。希釈溶剤としては、例え
ば、水、アルコール、エステル、エーテル、ハロゲン化
炭化水素、ジメチルホルムアミド、ジメチルスルホキシ
ドなどが目的に応じて種々使用可能であり、必要に応じ
て混合溶媒を使用することも可能である。微粒子状無機
酸化物の分散性などの点から、水、アルコール、ジメチ
ルホルムアミド、エチレングリコール、ジエチレングリ
コール、トリエチレングリコール、ベンジルアルコー
ル、フェネチルアルコール、フェニルセロソルブなどの
極性溶媒が好ましく用いられる。 (導電膜)本発明のプラスチック積層体では、光硬化性
樹脂層の上に導電膜を積層したものは、液晶表示装置基
板として好ましく使用される。この導電膜を形成する導
電物質としては、酸化インジウム、酸化スズ、金、銀、
銅、ニッケル等が挙げられ、これらは単独又は2種以上
を混合して使用することができる。このうち、通常、酸
化インジウム99〜90%と酸化スズ1〜10%との混
合物よりなるインジウムスズオキサイド(以下「IT
O」という)が透明性と導電性のバランスの面から特に
好ましい。透明導電膜を形成する方法は、従来から公知
の真空蒸着法、スパッタリング法、イオンプレーティン
グ法、化学蒸着法等を用いて行うことができる。このう
ち、スパッタリング法が密着性の点から好ましい。以上
の透明導電膜の厚さは、通常500〜2000Åの範囲
が透明性及び導電性のバランスの面から好ましい。The thickness of the cured film is not particularly limited, but is usually 0.1 to 50 μm, preferably 0.3 to 10 μm from the viewpoint of maintaining the adhesive strength and hardness.
m. In applying the coating, the coating composition is used after being diluted with various solvents for the purpose of controlling the workability and the thickness of the coating. As the diluting solvent, for example, water, alcohols, esters, ethers, halogenated hydrocarbons, dimethylformamide, dimethylsulfoxide and the like can be variously used depending on the purpose, and a mixed solvent can be used if necessary. is there. A polar solvent such as water, alcohol, dimethylformamide, ethylene glycol, diethylene glycol, triethylene glycol, benzyl alcohol, phenethyl alcohol, and phenyl cellosolve is preferably used from the viewpoint of the dispersibility of the particulate inorganic oxide. (Conductive Film) In the plastic laminate of the present invention, a laminate in which a conductive film is laminated on a photocurable resin layer is preferably used as a liquid crystal display device substrate. As a conductive material forming this conductive film, indium oxide, tin oxide, gold, silver,
Copper, nickel and the like can be mentioned, and these can be used alone or in combination of two or more. Among them, usually, indium tin oxide (hereinafter referred to as “IT”) composed of a mixture of 99 to 90% of indium oxide and 1 to 10% of tin oxide
O ") is particularly preferred from the viewpoint of the balance between transparency and conductivity. The method for forming the transparent conductive film can be performed by using a conventionally known vacuum evaporation method, sputtering method, ion plating method, chemical vapor deposition method, or the like. Of these, the sputtering method is preferred from the viewpoint of adhesion. The thickness of the above-mentioned transparent conductive film is usually preferably in the range of 500 to 2000 ° from the viewpoint of the balance between transparency and conductivity.
【0045】また、 また、耐屈曲性能の高いプラスチ
ック積層体として、液晶表示装置、タッチパネル等の光
エレクトロニクス分野の基板に好適に使用されるには、
導電膜の硬度が2GP以上、又は/或いは、スティフネ
スが1.5μN/nm以上、又は/或いは、モジュラス
(ヤング率)が15GP以上であるプラスチック積層体
であれば、一般に、積層体を撓ませても、導電膜にクラ
ックが入らず、電気抵抗値も劣化しない。そして、好ま
しくは、硬度が3GP以上、又は/或いはスティフネス
が1.5μN/nm以上、又は/或いは、モジュラス
(ヤング率)が20GP以上である。Further, in order to be suitably used as a plastic laminate having high bending resistance for substrates in the field of optoelectronics such as a liquid crystal display device and a touch panel,
Generally, if the plastic laminate has a hardness of 2 GP or more in the conductive film and / or a stiffness of 1.5 μN / nm or more and / or a modulus (Young's modulus) of 15 GP or more, the laminate is generally bent. Also, the conductive film does not crack and the electric resistance value does not deteriorate. And, preferably, the hardness is 3 GP or more, and / or the stiffness is 1.5 μN / nm or more, and / or the modulus (Young's modulus) is 20 GP or more.
【0046】一般に、成膜された膜は、基材(下地)と
膜との熱膨張係数の差により内部応力が生じ、それが大
きいと膜にクラックが入りやすいと云われている。膜の
内部応力測定は、各種方法が知られているが、次の種々
の理由で該プラスチック積層体においては適用できな
い。 (イ)成膜後の基板のたわみ量計測は、プラスチック基
板の場合、熱等の影響分があるため不確かである。 (ロ)薄膜X線回折の結晶ピークの格子定数及び面間隔
から求める方法は、膜が非晶質の場合は測定できない。 (ハ)ラマン散乱による測定では、基材がプラスチック
であるため測定が難しい。Generally, it is said that a film formed has an internal stress due to a difference in thermal expansion coefficient between the substrate (base) and the film, and that a large amount of the film tends to cause cracks in the film. Various methods are known for measuring the internal stress of the film, but cannot be applied to the plastic laminate for the following various reasons. (A) Measurement of the amount of deflection of a substrate after film formation is uncertain in the case of a plastic substrate because of the influence of heat and the like. (B) The method of obtaining from the lattice constant and the plane spacing of the crystal peak of thin film X-ray diffraction cannot be measured when the film is amorphous. (C) Measurement by Raman scattering is difficult because the base material is plastic.
【0047】また、膜の内部応力は、成膜後等の静止時
におけるクラック発生と関係づけられてはいるものの、
プラスチック積層体を撓ませた場合でのクラック発生に
は他の因子が含まれる。その一つが、プラスチック積層
体を撓ませた時の基材シートに対する膜の追従性の良し
悪しである。基材シートに対する膜の追従性が悪いとク
ラックが入りやすい。それを物性として評価として、硬
度及び弾性が考えられ、撓みによる膜のクラック発生の
有無の影響因子として直接的に特徴づけることができ
る。Further, although the internal stress of the film is related to the occurrence of cracks when the film is at rest, such as after film formation,
Cracking when the plastic laminate is bent includes other factors. One of them is the quality of the film following the base sheet when the plastic laminate is bent. Cracks are likely to occur if the film does not follow the substrate sheet poorly. Hardness and elasticity can be considered as the evaluation as physical properties, and can be directly characterized as an influencing factor of the presence or absence of cracks in the film due to bending.
【0048】導電膜の硬度等の物性を特定値以上にする
ためには、導電膜の性質を制御してもよいが、積層体に
おける層構成及び導電膜以外の層の性質も大きな影響を
与える。なお、基板がプラスチックであるため成膜温度
の上限は低く、また、他の成膜条件を如何に変化させて
も導電膜の物理的性質を変化させるには限りがある。一
方、硬化被膜は、処方や硬化条件を変えるなど幅広い範
囲で物理的性質を変化させることが比較的容易である。 (積層体の層構成)本発明のプラスチック積層体は、以
上の光硬化性樹脂(A)、ガスバリア膜(B)、硬化被
膜(C)がこの順序で積層されてなり、特に、光硬化性
樹脂層の上に導電膜を積層してなる。かかる構成の積層
体として最も基本的な構成は図1で示される。また、本
発明のプラスチック積層体は図1のものに限定されるの
ではなく、更に、光硬化性樹脂層と導電膜との間にガス
バリア膜を介在させてなる図2の構成、光硬化性樹脂層
と導電膜との間に硬化被膜を介在させてなる図3の構
成、硬化被膜と導電膜との間にガスバリア膜を介在させ
てなる図4の構成が例示される。In order to make physical properties such as hardness of the conductive film to a specific value or more, the properties of the conductive film may be controlled. However, the layer structure and the properties of layers other than the conductive film in the laminate also have a great influence. . Note that since the substrate is made of plastic, the upper limit of the film forming temperature is low, and there is a limit to changing the physical properties of the conductive film even if other film forming conditions are changed. On the other hand, a cured film is relatively easy to change its physical properties in a wide range, such as by changing the formulation and curing conditions. (Layer Structure of Laminate) The plastic laminate of the present invention comprises the above photocurable resin (A), gas barrier film (B), and cured film (C) laminated in this order. It is formed by stacking a conductive film on a resin layer. FIG. 1 shows the most basic configuration as a laminate having such a configuration. Further, the plastic laminate of the present invention is not limited to the one shown in FIG. 1, and further has a structure shown in FIG. 2 in which a gas barrier film is interposed between a photocurable resin layer and a conductive film. The configuration in FIG. 3 in which a cured film is interposed between the resin layer and the conductive film, and the configuration in FIG. 4 in which a gas barrier film is interposed between the cured film and the conductive film are exemplified.
【0049】光硬化樹脂(A)上にガスバリア層(B)
を直接積層するとガスバリア性は向上するが、A、Bが
接触することにより、積層体をハンドリングする際、ガ
スバリア層がこすれたり、キズついたりした場合、バリ
アー性が大きく低下する恐れがある。ガスバリア層の上
に硬化皮膜(C)を積層すると、ガスバリア性が更に向
上するだけでなく、ハンドリング時のこすれ、キズがあ
ったとしても、ガスバリアー性の低下は小さく、結果と
して安定なガスバリア性を付与することが可能である。Gas barrier layer (B) on photocurable resin (A)
When the gas barrier layer is rubbed or scratched during handling of the laminated body due to contact of A and B, the barrier property may be greatly reduced. When the cured film (C) is laminated on the gas barrier layer, not only the gas barrier property is further improved, but even if there is rubbing or scratches during handling, the gas barrier property does not decrease much, resulting in a stable gas barrier property. Can be provided.
【0050】本発明の積層体に導電膜を積層したものを
液晶表示素子とした場合、セル内にガスが入らず、液晶
の劣化、及びセル内に気泡が発生せず良好な液晶表示素
子となる。更に、導電膜と硬化樹脂層のアイ台にガスバ
リアー膜を入れることにより、更にバリアー性を向上さ
せ、ひいては、導電膜の耐熱性が向上させることができ
る。また、導電膜と光硬化樹脂の間に硬化皮膜を入れた
場合は、導電膜の密着性が向上し、ITOの剥がれ等が
なく良好な膜となるため望ましい。更に、硬化皮膜と導
電膜の間にガスバリアー膜を入れた場合は、硬化樹脂層
に直接ガスバリアー膜を積層するよりも更にガスバリア
ー性が向上するだけでなく膜の耐熱性も向上するので特
に好ましい場合がある。 (積層体の性質)本発明のプラスチック積層体は、55
0nmの光の波長での光線透過率が80%以上であるこ
とが好ましい。光線透過率が80%未満だと、カラー表
示等の場合、画面が暗くなるため使用でき難く、モノク
ロ表示素子等の用途にしか使用できない傾向にある。ま
た、プラスチック積層体の複屈折率としては、20nm
以下、特に10nm以下であることが好ましい。20n
mよりも大きいと表示パネルとした場合、表示画面の色
ムラが生じる傾向がある。When a liquid crystal display device is obtained by laminating a conductive film on the laminate of the present invention, it is possible to obtain a good liquid crystal display device in which gas does not enter the cell, deterioration of the liquid crystal, and no bubbles are generated in the cell. Become. Furthermore, by inserting a gas barrier film in the eye of the conductive film and the cured resin layer, the barrier properties can be further improved, and the heat resistance of the conductive film can be further improved. When a cured film is inserted between the conductive film and the photocurable resin, the adhesion of the conductive film is improved, and a favorable film is obtained without peeling of ITO or the like. Furthermore, when a gas barrier film is inserted between the cured film and the conductive film, not only the gas barrier property is further improved than that of directly laminating the gas barrier film on the cured resin layer, and the heat resistance of the film is also improved. It may be particularly preferred. (Properties of Laminate) The plastic laminate of the present invention has 55 properties.
It is preferable that the light transmittance at a wavelength of light of 0 nm is 80% or more. When the light transmittance is less than 80%, in the case of color display or the like, the screen becomes dark, so that it is difficult to use it, and it tends to be used only for applications such as a monochrome display element. The birefringence of the plastic laminate is 20 nm.
The thickness is particularly preferably 10 nm or less. 20n
When it is larger than m, when a display panel is used, color unevenness of a display screen tends to occur.
【0051】一方、プラスチック積層体の厚さは、0.
10〜2.00mmが好ましい。透明導電性シートは曲
げ弾性率は大きいが、0.10mm未満ではシートが自
重によりたわみ易く、従来のガラス製基板を使用した液
晶表示装置の製造プロセスが使用できない傾向があり、
2.00mmを超えると従来の1.5〜0.7mmのガ
ラス基板と同じ重量となり、軽量化の目的からはずれて
しまう。On the other hand, the thickness of the plastic laminate is not more than 0.1.
10 to 2.00 mm is preferred. The transparent conductive sheet has a large flexural modulus, but if it is less than 0.10 mm, the sheet tends to bend under its own weight, and there is a tendency that the manufacturing process of a liquid crystal display device using a conventional glass substrate cannot be used,
If it exceeds 2.00 mm, the weight becomes the same as that of a conventional glass substrate of 1.5 to 0.7 mm, which deviates from the purpose of weight reduction.
【0052】本発明のプラスチック積層体の応用例とし
ては、例えば、液晶表示装置用基板として使用する場
合、通常、プラスチック積層体によって液晶を挟んだ構
成をとる。更に、プラスチック積層体の導電膜上に、必
要に応じて絶縁膜、更に、その上に配向膜が設けられた
基板により液晶層を挾持した製造をとる。液晶層を挾持
した基板の外側には偏向板が設けられる。また、エレク
トロルミネッセンス表示素子においては、通常、本発明
のプラスチック積層体上に、発光体層、絶縁層及び背面
電極を順次形成し、更に全体をガスバリア層で被覆した
構造のものが例示される。この場合、発光体層には硫化
亜鉛、硫化カドミウム、セレン化亜鉛等が、絶縁層には
酸化イットリウム、酸化タリウム、窒化シリコン等が、
背面電極にはアルミニウム等が用いられる。As an application example of the plastic laminate of the present invention, for example, when it is used as a substrate for a liquid crystal display device, it usually has a configuration in which liquid crystal is sandwiched between plastic laminates. Further, a liquid crystal layer is sandwiched between substrates provided with an insulating film, if necessary, and an alignment film on the conductive film of the plastic laminate, if necessary. A deflection plate is provided outside the substrate holding the liquid crystal layer. In addition, the electroluminescent display element usually has a structure in which a light emitting layer, an insulating layer, and a back electrode are sequentially formed on the plastic laminate of the present invention, and the whole is further covered with a gas barrier layer. In this case, the light emitting layer contains zinc sulfide, cadmium sulfide, zinc selenide, etc., and the insulating layer contains yttrium oxide, thallium oxide, silicon nitride, etc.
Aluminum or the like is used for the back electrode.
【0053】[0053]
【実施例】以下、本発明の内容および効果を実施例によ
り更に詳細に説明するが、本発明は、その要旨を越えな
い限り以下の例に限定されるものではない。また、実施
例及び比較例で得られたプラスチック積層体は、以下の
方法により評価した。 <膜の厚さ>実施例及び比較例により得られた積層体の
ガスバリア膜と導電膜については、積層体の断面を透過
型電子顕微鏡(日立製作所製、H−600型)で観察
し、薄膜の厚さを測定した。 <導電膜の表面抵抗値>三菱化学(株)製の4端子法抵
抗測定器(ロレスターMP)を用いて、表面抵抗値を測
定した。 <導電膜の耐屈曲性試験>5x10cm大きさのプラス
チック積層体を、導電膜を内側にして長辺に沿ってφ2
5mmのステンレス管にプラスチック積層体を巻き付け
た後、導電膜を外側にして巻き付け、その後、光学顕微
鏡で導電膜のクラック発生の有無を調べ、表面抵抗値を
上記方法で測定した。 <導電膜のインデント試験>Hysitron社製Pi
coIndenterを用い、圧子押し込み深さが膜厚
の約10分の1程度になる荷重(μN)で、一回のイン
デント(圧子押し込み)を10秒間で行い、1サンプル
につき5回測定し平均値を求めた。各回の測定は、圧痕
の影響が生じないように測定箇所の距離を十分とった。
また、サンプルは試料台に十分固定した。 <耐熱性>ビガット軟化試験において、測定条件が、圧
子断面積1.0mm、荷重5Kg、昇温速度50℃/h
r、120℃以下で圧子が0.4mm以上進入したもの
を×、0.2〜0.4mm進入したものを△、0.1m
m以下で進入がほとんどなかったものを○とした。 <複屈折率>複屈折測定装置(オーク製作所製、ADR
100)を使用し、632.8nmの波長で面内の複屈
折率を測定した。 <光線透過率>(株)日立製作所の分光光度計を使用
し、波長550nmでの透過率を測定した。 <ITO膜表面の粗さ(Ra)>表面粗さ測定器
((株)東京精密製、サーフコーム575A)を用い、
ダイヤモンド針(1μmR、90゜円錐)、測定長さ
0.5mm、カットオフ値0.16mm、測定速度0.
06mm/sec及び直線補正の条件で測定した。 実施例1 ビスオキシメチルトリシクロ[5.2.1.02,6]デ
カンジメタクリレート100重量部、光開始剤として
2,4,6−トリメチルベンゾイルジフェニルフォスフ
ィンオキシド(BASF社製「ルシリンTPO」)0.
05重量部、ベンゾフェノン0.05重量部を均一に混
合撹拌した後、脱泡して組成物を得た。この組成物をス
ペーサーとして厚さ0.4mmのシリコン板を用いた光
学研磨ガラスの型に注入し、ガラス面上にある出力80
W/cmのメタルハライドランプにてガラス型面に40
J/cm2のエネルギーになるように照射後、ガラス型
を離型し、厚さ約0.4mmの光硬化性樹脂シートを得
た。EXAMPLES Hereinafter, the contents and effects of the present invention will be described in more detail with reference to examples, but the present invention is not limited to the following examples unless it exceeds the gist of the present invention. The plastic laminates obtained in Examples and Comparative Examples were evaluated by the following methods. <Film Thickness> Regarding the gas barrier film and the conductive film of the laminate obtained in Examples and Comparative Examples, the cross section of the laminate was observed with a transmission electron microscope (H-600, manufactured by Hitachi, Ltd.) Was measured for thickness. <Surface Resistance Value of Conductive Film> The surface resistance value was measured using a 4-terminal resistance meter (Lorester MP) manufactured by Mitsubishi Chemical Corporation. <Bending resistance test of conductive film> A plastic laminate having a size of 5 × 10 cm was placed along the long side with the conductive film on the inner side of φ2.
After winding the plastic laminate around a 5 mm stainless steel tube, the conductive film was wound outside, and then the presence or absence of cracks in the conductive film was examined with an optical microscope, and the surface resistance was measured by the above method. <Indentation test of conductive film> Pi manufactured by Hysitron
Using a coIndenter, one indentation (indenter indentation) was performed for 10 seconds at a load (μN) at which the indenter indentation depth was about one-tenth of the film thickness, and the average value was measured five times per sample. I asked. In each measurement, the distance between the measurement points was sufficiently large so that the influence of the indentation did not occur.
Further, the sample was sufficiently fixed on the sample stage. <Heat resistance> In the bigat softening test, the measurement conditions were as follows: indenter cross-sectional area 1.0 mm, load 5 kg, heating rate 50 ° C./h.
r, those in which the indenter penetrated 0.4 mm or more at 120 ° C. or less were ×, those that penetrated 0.2 to 0.4 mm were Δ, 0.1 m
When there was almost no approach below m, the result was marked as “○”. <Birefringence index> Birefringence measuring device (ODR, ADR
100), and the in-plane birefringence was measured at a wavelength of 632.8 nm. <Light transmittance> The transmittance at a wavelength of 550 nm was measured using a spectrophotometer manufactured by Hitachi, Ltd. <Roughness (Ra) of ITO film surface> Using a surface roughness measuring device (Surf Comb 575A, manufactured by Tokyo Seimitsu Co., Ltd.)
Diamond needle (1 μmR, 90 ° cone), measurement length 0.5 mm, cutoff value 0.16 mm, measurement speed 0.
The measurement was performed under the conditions of 06 mm / sec and linear correction. Example 1 100 parts by weight of bisoxymethyltricyclo [5.2.1.0 2,6 ] decane dimethacrylate and 2,4,6-trimethylbenzoyldiphenylphosphine oxide ("Lucillin TPO" manufactured by BASF) as a photoinitiator ") 0.
After uniformly mixing and stirring 05 parts by weight and 0.05 parts by weight of benzophenone, the composition was defoamed to obtain a composition. This composition was poured into an optically polished glass mold using a 0.4 mm thick silicon plate as a spacer, and an output of 80% on the glass surface was obtained.
40 / cm on the glass mold surface with a metal halide lamp of W / cm
After irradiation so as to have an energy of J / cm 2 , the glass mold was released, and a photocurable resin sheet having a thickness of about 0.4 mm was obtained.
【0054】得られた硬化樹脂シート(A)に、アルバ
ック社製RFスパッタリング機によりアルゴンガス全圧
6.7E-1Pa、ターゲット材SIOで厚さ10nmの
珪素酸化物薄膜(B)を成形させた。更に、(B)層の
上に下記成分a,b,c,dをそれぞれ62、38、
5、0.3%の割合で混合し、プロピレングリコールモ
ノメチルエエーテルで希釈し、スピンコートで塗布し、
出力80W/cmのメタルハライドランプにて5J/c
m2のエネルギーになるように照射して、硬化被膜
(C)を積層した。 成分a;ビスオキシメチルトリシクロ[5.2.1.0
2,6 ]デカンジアクリレート、三菱化学(株)製ユピマ
ーUV SA−1002 ジシクロペンタニルジアクリレート、日本化薬(株)製
カヤラッドR684 成分b;トリメチロールプロパントリアクリレート及び
エポキシアクリレート等混合物、日本化薬(株)製カヤ
ラッドR130 成分c;1−ヒドロキシシクロエキシルフェニルケトン
とビス(2,6−ジメトキシベンゾイル)−2,4,4
−トリメチルペンチルホスフィンオキシドの混合物、日
本チバガイギー(株)製イルガキュア1800 成分d;ポリエーテル変性シリコン、共栄社化学(株)
製グラノール450 このA/B/Cの層構成の積層体の酸素透過率をオキシ
トラン社製酸素モコン測定器にて23℃、湿度80%の
条件で測定すると、酸素バリアーは0.1cc/m2・
day以下であった。なお、比較として、硬化樹脂シー
ト(A)の酸素透過率を測定したところ16cc/m2
・dayであり、同様にA/Bの層構成の積層体の酸素
透過率は1.5cc/m2・dayであった。On the obtained cured resin sheet (A), a 10 nm thick silicon oxide thin film (B) was formed with a target material SIO using an argon gas total pressure of 6.7 E −1 Pa using an RF sputtering machine manufactured by ULVAC. Was. Further, components (a), (b), (c) and (d) shown below were added to the layer (B) at 62, 38, respectively.
5, 0.3% mixed, diluted with propylene glycol monomethyl ether, applied by spin coating,
5J / c with 80W / cm output metal halide lamp
The cured film (C) was laminated by irradiating so as to have an energy of m 2 . Component a; bisoxymethyltricyclo [5.2.1.0
2,6 ] decane diacrylate, upimer UV SA-1002 dicyclopentanyl diacrylate manufactured by Mitsubishi Chemical Corporation, Kayarad R684 manufactured by Nippon Kayaku Co., Ltd. Component b; a mixture of trimethylolpropane triacrylate, epoxy acrylate, etc., Japan Kayrad R130 manufactured by Kayaku Co., Ltd. Component c; 1-hydroxycyclohexylphenyl ketone and bis (2,6-dimethoxybenzoyl) -2,4,4
A mixture of trimethylpentylphosphine oxide, Irgacure 1800, manufactured by Ciba-Geigy Japan, Inc. Component d; polyether-modified silicon, Kyoeisha Chemical Co., Ltd.
Granol 450 The oxygen barrier of the laminate having the A / B / C layer structure is measured using an Oxy-Tran Oxy-Mocon meter at 23 ° C. and 80% humidity, and the oxygen barrier is 0.1 cc / m 2.・
day or less. In addition, as a comparison, when the oxygen permeability of the cured resin sheet (A) was measured, it was 16 cc / m 2.
And the oxygen permeability of the laminate having the A / B layer configuration was 1.5 cc / m 2 · day.
【0055】次に、上記のA/B/Cの層構成の積層体
のA層側表面に、前記と同じ成分a,b,c,dからな
る硬化被膜(C)を積層し、次いで、続いて同機で酸素
分圧1E-2Pa、全圧6.7E-1Pa、ターゲット材I
TO(酸化インジウムに対する酸化錫比95:5)で厚
さ120nmのITO膜を形成させ、プラスチック積層
体を得た。該積層体の評価結果を表−1に示す。また、
該積層体の耐熱性、複屈折率、光線透過率、ITO膜表
面の粗さも測定したがいずれも良好であった。 実施例2 積層の順を、ITO膜、光硬化性樹脂シート、珪素酸化
物薄膜、硬化被膜、の順に変えた他は、実施例1と同様
にしてプラスチック積層体を得た。該積層体の評価結果
を表−1に示す。また、該積層体の耐熱性、複屈折率、
光線透過率、ITO膜表面の粗さも測定したがいずれも
良好であった。 実施例3 珪素酸化物薄膜及びITO膜をアルバック社製DCスパ
ッタリング機で成膜した他は、実施例1と同様にしてプ
ラスチック積層体を得た。該積層体の評価結果を表−1
に示す。また、該積層体の耐熱性、複屈折率、光線透過
率、ITO膜表面の粗さも測定したがいずれも良好であ
った。Next, a cured film (C) composed of the same components a, b, c and d as described above is laminated on the layer A side surface of the laminate having the above-mentioned A / B / C layer constitution. Subsequently, using the same machine, oxygen partial pressure 1E -2 Pa, total pressure 6.7E -1 Pa, target material I
A 120 nm thick ITO film was formed with TO (tin oxide to indium oxide ratio: 95: 5) to obtain a plastic laminate. Table 1 shows the evaluation results of the laminate. Also,
The heat resistance, birefringence, light transmittance and roughness of the ITO film surface of the laminate were also measured, and all were good. Example 2 A plastic laminate was obtained in the same manner as in Example 1, except that the order of lamination was changed to an ITO film, a photocurable resin sheet, a silicon oxide thin film, and a cured film. Table 1 shows the evaluation results of the laminate. Further, the heat resistance of the laminate, birefringence,
The light transmittance and the roughness of the ITO film surface were also measured, and all were good. Example 3 A plastic laminate was obtained in the same manner as in Example 1, except that a silicon oxide thin film and an ITO film were formed by a DC sputtering machine manufactured by ULVAC. Table 1 shows the evaluation results of the laminate.
Shown in Further, the heat resistance, birefringence, light transmittance and roughness of the ITO film surface of the laminate were also measured, and all were good.
【0056】[0056]
【表1】 [Table 1]
【0057】[0057]
【発明の効果】本発明のプラスチック積層体は、耐薬品
性及び剛性が優れており、従来のガラス基板プロセスを
利用することが可能であり、基板の耐薬品性が優れてい
るので透明導電膜の剥離、ひび割れを生じることがな
く、またガラス基板を使用したものより軽量で、耐衝撃
性にも優れているという特別に有利な効果を奏し、産業
上の利用価値は極めて大である。The plastic laminate of the present invention is excellent in chemical resistance and rigidity, can use the conventional glass substrate process, and has excellent chemical resistance of the substrate, so that the transparent conductive film It has a particularly advantageous effect that it does not cause peeling or cracking, is lighter than a glass substrate, and has excellent impact resistance, and is extremely valuable in industrial use.
【0058】本発明のプラスチック積層体は液晶表示装
置用基板として好ましく使用され、TN(Twisted Nema
tic 型)、STN(Super Twisted Nematic 型、強誘電
液晶)FLC(Ferroelectric Liquid Cristal)型など
の単純マトリックス型、MIM(Metal-Insulator-Meta
l )型、TFT(Thin-Film Transistor)型などのアク
ティブマトリックス型などの液晶表示装置に適用可能で
ある。The plastic laminate of the present invention is preferably used as a substrate for a liquid crystal display device, and is provided with a TN (Twisted Nema).
Simple matrix type such as tic type, STN (Super Twisted Nematic type, ferroelectric liquid crystal) FLC (Ferroelectric Liquid Cristal) type, MIM (Metal-Insulator-Meta)
l) It can be applied to liquid crystal display devices such as an active matrix type such as a TFT type and a TFT (Thin-Film Transistor) type.
【図1】図1は、本発明のプラスチック積層体の一態様
を示す。FIG. 1 shows one embodiment of the plastic laminate of the present invention.
【図2】図2は、本発明のプラスチック積層体の一態様
を示す。FIG. 2 shows one embodiment of the plastic laminate of the present invention.
【図3】図3は、本発明のプラスチック積層体の一態様
を示す。FIG. 3 shows one embodiment of the plastic laminate of the present invention.
【図4】図3は、本発明のプラスチック積層体の一態様
を示す。FIG. 3 shows one embodiment of the plastic laminate of the present invention.
A:光硬化性樹脂 B:ガスバリア膜 C:硬化被膜 I:導電膜 A: Photocurable resin B: Gas barrier film C: Cured film I: Conductive film
Claims (14)
なることを特徴とするプラスチック積層体。 A:光硬化性樹脂 B:ガスバリア膜 C:硬化被膜1. A plastic laminate comprising the following layers A, B and C laminated in this order. A: Photocurable resin B: Gas barrier film C: Cured film
なることを特徴とする請求項1のプラスチック積層体。2. The plastic laminate according to claim 1, wherein a conductive film is laminated on the photocurable resin layer.
リア膜を介在させてなることを特徴とする請求項2のプ
ラスチック積層体。3. The plastic laminate according to claim 2, wherein a gas barrier film is interposed between the photocurable resin layer and the conductive film.
膜を介在させてなることを特徴とする請求項2のプラス
チック積層体。4. The plastic laminate according to claim 2, wherein a cured film is interposed between the photocurable resin layer and the conductive film.
を介在させてなることを特徴とする請求項2のプラスチ
ック積層体。5. The plastic laminate according to claim 2, wherein a gas barrier film is interposed between the cured film and the conductive film.
特徴とする請求項2〜5のいずれかのプラスチック積層
体。6. The plastic laminate according to claim 2, wherein the hardness of the conductive film is 2 GP or more.
m以上であることを特徴とする請求項2〜6のいずれか
のプラスチック積層体。7. The stiffness of the conductive film is 1.5 μN / n.
The plastic laminate according to any one of claims 2 to 6, wherein m is not less than m.
ることを特徴とする請求項2〜6のいずれかのプラスチ
ック積層体。8. The plastic laminate according to claim 2, wherein the modulus of the conductive film is 15 GP or more.
り選ばれた少なくとも1種のビス(メタ)アクリレート
を含んでなる組成物を活性エネルギー線により硬化させ
て成形したシートからなることを特徴とする請求項1〜
8のいずれかのプラスチック積層体。 【化1】 [式(1)中、R1 及びR2 は、互に異っていてもよ
く、水素原子又はメチル基を示す。R3 及びR4 は、互
に異っていてもよく、炭素鎖中に酸素原子及び/又は硫
黄原子を有していてもよい炭素数1〜6の炭化水素基を
示す。Xはハロゲン原子、炭素数1〜6のアルキル基及
び炭素数1〜6のアルコキシ基から選ばれた置換基を示
し、aは0〜4の整数を示す。但しaが2以上の整数の
場合には、複数のXは互に異っていてもよい。] 【化2】 [式(2)中、R5 及びR6 は、互に異っていてもよ
く、水素原子又はメチル基を示す。bは1又は2を示
し、cは0又は1を示す。]9. A sheet in which a photocurable resin layer is formed by curing a composition comprising at least one bis (meth) acrylate selected from the following formulas (1) and (2) with active energy rays: Claim 1 characterized by the following.
8. The plastic laminate according to any one of 8. Embedded image [In the formula (1), R 1 and R 2 may be different from each other and represent a hydrogen atom or a methyl group. R 3 and R 4 may be different from each other and represent a hydrocarbon group having 1 to 6 carbon atoms which may have an oxygen atom and / or a sulfur atom in a carbon chain. X represents a substituent selected from a halogen atom, an alkyl group having 1 to 6 carbon atoms and an alkoxy group having 1 to 6 carbon atoms, and a represents an integer of 0 to 4. However, when a is an integer of 2 or more, a plurality of Xs may be different from each other. ] [In the formula (2), R 5 and R 6 may be different from each other and represent a hydrogen atom or a methyl group. b represents 1 or 2, and c represents 0 or 1. ]
(2)より選ばれた少なくとも1種のビス(メタ)アク
リレート80〜99.9重量部と下式(3)、(4)及
び(5)より選ばれた少なくとも1種のメルカプト化合
物0.1〜20重量部とを含んでなる組成物を活性エネ
ルギー線により硬化させて成形したシートであることを
特徴とする請求項9のプラスチック積層体。 【化3】 [式(3)中、複数のR7 は互に異っていてもよく、そ
れぞれメチレン基又はエチレン基を示す。R8 は炭素鎖
中に酸素原子及び/又は硫黄原子を含んでいてもよい炭
素数2〜15の炭化水素残基を示す。dは2〜6の整数
を示す。] 【化4】 [式(4)中、Yは互に異っていてもよく、HS−(C
H2 )e −(CO)(OCH2 −CH2 )f −(C
H2 )g −を示す。但しeは1〜4の整数、fは1〜4
の整数、gは0〜2の整数をそれぞれ示す。] 【化5】 [式(5)中、R9 及びR10は、互に異っていてもよ
く、炭素数1〜3の炭化水素基を示す。m及びnはそれ
ぞれ0又は1を示す。pは1又は2を示す。]10. A photocurable resin sheet comprising 80 to 99.9 parts by weight of at least one bis (meth) acrylate selected from the formulas (1) and (2) and the following formulas (3), (4) and (5) A plastic sheet according to claim 9, which is a sheet formed by curing a composition containing 0.1 to 20 parts by weight of at least one mercapto compound selected from the group consisting of an active energy ray. Laminate. Embedded image [In the formula (3), a plurality of R 7 may be different from each other, and each represents a methylene group or an ethylene group. R 8 represents a hydrocarbon residue having 2 to 15 carbon atoms which may contain an oxygen atom and / or a sulfur atom in the carbon chain. d shows the integer of 2-6. ] [In the formula (4), Y may be different from each other, and HS- (C
H 2) e - (CO) (OCH 2 -CH 2) f - (C
H 2 ) g −. Where e is an integer of 1 to 4, f is 1 to 4
And g represents an integer of 0 to 2, respectively. ] [In the formula (5), R 9 and R 10 may be different from each other and represent a hydrocarbon group having 1 to 3 carbon atoms. m and n each represent 0 or 1. p represents 1 or 2. ]
とを特徴とする請求項1〜10のいずれかのプラスチッ
ク積層体。11. The plastic laminate according to claim 1, wherein the gas barrier film is made of an inorganic oxide.
を特徴とする請求項1〜11のいずれかのプラスチック
積層体。12. The plastic laminate according to claim 1, wherein the gas barrier film is made of silicon oxide.
らなることを特徴とする請求項2〜12のいずれかのプ
ラスチック積層体。13. The plastic laminate according to claim 2, wherein the conductive film is made of indium tin oxide.
ック積層体からなる液晶表示装置用基板。14. A substrate for a liquid crystal display device comprising the plastic laminate according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP00450798A JP3658962B2 (en) | 1998-01-13 | 1998-01-13 | Plastic laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP00450798A JP3658962B2 (en) | 1998-01-13 | 1998-01-13 | Plastic laminate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11314313A true JPH11314313A (en) | 1999-11-16 |
| JP3658962B2 JP3658962B2 (en) | 2005-06-15 |
Family
ID=11585978
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP00450798A Expired - Fee Related JP3658962B2 (en) | 1998-01-13 | 1998-01-13 | Plastic laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3658962B2 (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002270880A (en) * | 2001-03-14 | 2002-09-20 | Shin Etsu Handotai Co Ltd | Solar cell module and method of manufacturing the same |
| JP2002368243A (en) * | 2001-06-11 | 2002-12-20 | Bridgestone Corp | Solar battery |
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| JP2006130680A (en) * | 2004-11-02 | 2006-05-25 | Mitsubishi Rayon Co Ltd | Acrylic resin laminate, transparent electrode plate, and touch panel manufacturing method |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002270880A (en) * | 2001-03-14 | 2002-09-20 | Shin Etsu Handotai Co Ltd | Solar cell module and method of manufacturing the same |
| JP2002368243A (en) * | 2001-06-11 | 2002-12-20 | Bridgestone Corp | Solar battery |
| JP2005060496A (en) * | 2003-08-11 | 2005-03-10 | Mitsubishi Rayon Co Ltd | Acrylic resin plate manufacturing method, transparent electrode plate for touch panel, and touch panel |
| JP2005302425A (en) * | 2004-04-08 | 2005-10-27 | Oike Ind Co Ltd | Transparent conductive film |
| JP2006130680A (en) * | 2004-11-02 | 2006-05-25 | Mitsubishi Rayon Co Ltd | Acrylic resin laminate, transparent electrode plate, and touch panel manufacturing method |
| WO2008026322A1 (en) * | 2006-08-31 | 2008-03-06 | National Institute Of Advanced Industrial Science And Technology | Transparent electrode substrate for solar cell |
| JP2008085323A (en) * | 2006-08-31 | 2008-04-10 | National Institute Of Advanced Industrial & Technology | Transparent electrode substrate for solar cell |
| WO2014014114A1 (en) * | 2012-07-19 | 2014-01-23 | 日立化成株式会社 | Composition for forming passivation layer, semiconductor substrate with passivation layer, method for manufacturing semiconductor substrate with passivation layer, solar cell element, method for manufacturing solar cell element, and solar cell |
| KR20150036363A (en) * | 2012-07-19 | 2015-04-07 | 히타치가세이가부시끼가이샤 | Passivation-layer-forming composition, semiconductor substrate having passivation layer, method for manufacturing semiconductor substrate having passivation layer, solar-cell element, method for manufacturing solar-cell element, and solar cell |
| JPWO2014014114A1 (en) * | 2012-07-19 | 2016-07-07 | 日立化成株式会社 | Passivation layer forming composition, semiconductor substrate with passivation layer, method for manufacturing semiconductor substrate with passivation layer, solar cell element, method for manufacturing solar cell element, and solar cell |
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