JP3658962B2 - Plastic laminate - Google Patents
Plastic laminate Download PDFInfo
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- JP3658962B2 JP3658962B2 JP00450798A JP450798A JP3658962B2 JP 3658962 B2 JP3658962 B2 JP 3658962B2 JP 00450798 A JP00450798 A JP 00450798A JP 450798 A JP450798 A JP 450798A JP 3658962 B2 JP3658962 B2 JP 3658962B2
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- 239000002650 laminated plastic Substances 0.000 title claims description 44
- 229920005989 resin Polymers 0.000 claims description 46
- 239000011347 resin Substances 0.000 claims description 46
- 239000000203 mixture Substances 0.000 claims description 41
- 230000004888 barrier function Effects 0.000 claims description 40
- 239000007789 gas Substances 0.000 claims description 36
- 239000000758 substrate Substances 0.000 claims description 34
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 32
- -1 mercapto compound Chemical class 0.000 claims description 24
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 22
- 125000004432 carbon atom Chemical group C* 0.000 claims description 22
- 239000004973 liquid crystal related substance Substances 0.000 claims description 16
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 15
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 14
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 11
- 229910052717 sulfur Inorganic materials 0.000 claims description 11
- 125000000217 alkyl group Chemical group 0.000 claims description 10
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 10
- 125000004434 sulfur atom Chemical group 0.000 claims description 10
- 229910052809 inorganic oxide Inorganic materials 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 8
- 125000003545 alkoxy group Chemical group 0.000 claims description 7
- 125000005843 halogen group Chemical group 0.000 claims description 7
- 229920002050 silicone resin Polymers 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 6
- 125000001424 substituent group Chemical group 0.000 claims description 6
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 claims description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 7
- 239000010408 film Substances 0.000 description 130
- 239000010410 layer Substances 0.000 description 37
- 238000000034 method Methods 0.000 description 22
- 238000001723 curing Methods 0.000 description 21
- 150000001875 compounds Chemical class 0.000 description 20
- 239000011521 glass Substances 0.000 description 17
- 239000000126 substance Substances 0.000 description 16
- 239000003795 chemical substances by application Substances 0.000 description 15
- 239000011248 coating agent Substances 0.000 description 13
- 238000000576 coating method Methods 0.000 description 12
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 12
- 229910044991 metal oxide Inorganic materials 0.000 description 11
- 239000000178 monomer Substances 0.000 description 11
- 239000010409 thin film Substances 0.000 description 11
- 150000004706 metal oxides Chemical class 0.000 description 10
- 239000002904 solvent Substances 0.000 description 10
- 239000008199 coating composition Substances 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 239000007983 Tris buffer Substances 0.000 description 8
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 239000002585 base Substances 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 7
- 239000010419 fine particle Substances 0.000 description 7
- 238000005755 formation reaction Methods 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- 239000003999 initiator Substances 0.000 description 7
- 239000004033 plastic Substances 0.000 description 7
- 229920003023 plastic Polymers 0.000 description 7
- 238000002834 transmittance Methods 0.000 description 7
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- YCOZIPAWZNQLMR-UHFFFAOYSA-N pentadecane Chemical compound CCCCCCCCCCCCCCC YCOZIPAWZNQLMR-UHFFFAOYSA-N 0.000 description 6
- 238000006116 polymerization reaction Methods 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 5
- 239000013522 chelant Substances 0.000 description 5
- 150000002430 hydrocarbons Chemical group 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 230000000704 physical effect Effects 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 238000005452 bending Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 238000007373 indentation Methods 0.000 description 4
- 229910003437 indium oxide Inorganic materials 0.000 description 4
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000002985 plastic film Substances 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 239000004094 surface-active agent Substances 0.000 description 4
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 4
- 229910001887 tin oxide Inorganic materials 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 125000002947 alkylene group Chemical group 0.000 description 3
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 3
- 239000012965 benzophenone Substances 0.000 description 3
- 125000004386 diacrylate group Chemical group 0.000 description 3
- 229910001507 metal halide Inorganic materials 0.000 description 3
- 150000005309 metal halides Chemical class 0.000 description 3
- 230000005693 optoelectronics Effects 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 238000002203 pretreatment Methods 0.000 description 3
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 3
- 150000003254 radicals Chemical class 0.000 description 3
- 239000011342 resin composition Substances 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000012719 thermal polymerization Methods 0.000 description 3
- 229940071127 thioglycolate Drugs 0.000 description 3
- CWERGRDVMFNCDR-UHFFFAOYSA-M thioglycolate(1-) Chemical compound [O-]C(=O)CS CWERGRDVMFNCDR-UHFFFAOYSA-M 0.000 description 3
- 125000003396 thiol group Chemical group [H]S* 0.000 description 3
- 238000011282 treatment Methods 0.000 description 3
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- MUZDXNQOSGWMJJ-UHFFFAOYSA-N 2-methylprop-2-enoic acid;prop-2-enoic acid Chemical group OC(=O)C=C.CC(=C)C(O)=O MUZDXNQOSGWMJJ-UHFFFAOYSA-N 0.000 description 2
- WRMNZCZEMHIOCP-UHFFFAOYSA-N 2-phenylethanol Chemical compound OCCC1=CC=CC=C1 WRMNZCZEMHIOCP-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 2
- NKIDFMYWMSBSRA-UHFFFAOYSA-N [4-(2-methylprop-2-enoyloxymethyl)cyclohexyl]methyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1CCC(COC(=O)C(C)=C)CC1 NKIDFMYWMSBSRA-UHFFFAOYSA-N 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 150000004703 alkoxides Chemical class 0.000 description 2
- 229910000410 antimony oxide Inorganic materials 0.000 description 2
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 2
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 2
- 125000006355 carbonyl methylene group Chemical group [H]C([H])([*:2])C([*:1])=O 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- 238000007865 diluting Methods 0.000 description 2
- 229910001882 dioxygen Inorganic materials 0.000 description 2
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 2
- SNRUBQQJIBEYMU-UHFFFAOYSA-N dodecane Chemical compound CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- HOXINJBQVZWYGZ-UHFFFAOYSA-N fenbutatin oxide Chemical compound C=1C=CC=CC=1C(C)(C)C[Sn](O[Sn](CC(C)(C)C=1C=CC=CC=1)(CC(C)(C)C=1C=CC=CC=1)CC(C)(C)C=1C=CC=CC=1)(CC(C)(C)C=1C=CC=CC=1)CC(C)(C)C1=CC=CC=C1 HOXINJBQVZWYGZ-UHFFFAOYSA-N 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 150000008282 halocarbons Chemical class 0.000 description 2
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000007733 ion plating Methods 0.000 description 2
- 239000003446 ligand Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910052755 nonmetal Inorganic materials 0.000 description 2
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 238000000016 photochemical curing Methods 0.000 description 2
- 239000002798 polar solvent Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 239000007870 radical polymerization initiator Substances 0.000 description 2
- 238000010526 radical polymerization reaction Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 239000013077 target material Substances 0.000 description 2
- CWERGRDVMFNCDR-UHFFFAOYSA-N thioglycolic acid Chemical compound OC(=O)CS CWERGRDVMFNCDR-UHFFFAOYSA-N 0.000 description 2
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- 239000013585 weight reducing agent Substances 0.000 description 2
- SQWIEBKHVLRDRG-UHFFFAOYSA-N (2,6-dimethylphenyl)-diphenylphosphorylmethanone Chemical compound CC1=CC=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 SQWIEBKHVLRDRG-UHFFFAOYSA-N 0.000 description 1
- PFNQVRZLDWYSCW-UHFFFAOYSA-N (fluoren-9-ylideneamino) n-naphthalen-1-ylcarbamate Chemical compound C12=CC=CC=C2C2=CC=CC=C2C1=NOC(=O)NC1=CC=CC2=CC=CC=C12 PFNQVRZLDWYSCW-UHFFFAOYSA-N 0.000 description 1
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- OBNIRVVPHSLTEP-UHFFFAOYSA-N 1-ethoxy-2-(2-hydroxyethoxy)ethanol;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(O)COCCO OBNIRVVPHSLTEP-UHFFFAOYSA-N 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- KAJBSGLXSREIHP-UHFFFAOYSA-N 2,2-bis[(2-sulfanylacetyl)oxymethyl]butyl 2-sulfanylacetate Chemical compound SCC(=O)OCC(CC)(COC(=O)CS)COC(=O)CS KAJBSGLXSREIHP-UHFFFAOYSA-N 0.000 description 1
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 1
- CMCLUJRFBZBVSW-UHFFFAOYSA-N 2-(2-hydroxyethoxy)-1-methoxyethanol;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(O)COCCO CMCLUJRFBZBVSW-UHFFFAOYSA-N 0.000 description 1
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- RMIIFALOCSCUAJ-UHFFFAOYSA-N 2-(4-propylcyclohexyl)oxyethyl 2-methylprop-2-enoate Chemical compound C(C(=C)C)(=O)OCCOC1CCC(CC1)CCC RMIIFALOCSCUAJ-UHFFFAOYSA-N 0.000 description 1
- OBETXYAYXDNJHR-UHFFFAOYSA-N 2-Ethylhexanoic acid Chemical compound CCCCC(CC)C(O)=O OBETXYAYXDNJHR-UHFFFAOYSA-N 0.000 description 1
- VIYWVRIBDZTTMH-UHFFFAOYSA-N 2-[4-[2-[4-[2-(2-methylprop-2-enoyloxy)ethoxy]phenyl]propan-2-yl]phenoxy]ethyl 2-methylprop-2-enoate Chemical compound C1=CC(OCCOC(=O)C(=C)C)=CC=C1C(C)(C)C1=CC=C(OCCOC(=O)C(C)=C)C=C1 VIYWVRIBDZTTMH-UHFFFAOYSA-N 0.000 description 1
- DCJRSMRCVNVQLB-UHFFFAOYSA-N 2-[[3-[2-(2-methylprop-2-enoyloxy)ethylsulfanylmethyl]phenyl]methylsulfanyl]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCSCC1=CC=CC(CSCCOC(=O)C(C)=C)=C1 DCJRSMRCVNVQLB-UHFFFAOYSA-N 0.000 description 1
- OJRFWSBEXBWPTJ-UHFFFAOYSA-N 2-[[4-[2-(2-methylprop-2-enoyloxy)ethylsulfanylmethyl]phenyl]methylsulfanyl]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCSCC1=CC=C(CSCCOC(=O)C(C)=C)C=C1 OJRFWSBEXBWPTJ-UHFFFAOYSA-N 0.000 description 1
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical compound ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- QCDWFXQBSFUVSP-UHFFFAOYSA-N 2-phenoxyethanol Chemical compound OCCOC1=CC=CC=C1 QCDWFXQBSFUVSP-UHFFFAOYSA-N 0.000 description 1
- WUPHOULIZUERAE-UHFFFAOYSA-N 3-(oxolan-2-yl)propanoic acid Chemical compound OC(=O)CCC1CCCO1 WUPHOULIZUERAE-UHFFFAOYSA-N 0.000 description 1
- XBIUWALDKXACEA-UHFFFAOYSA-N 3-[bis(2,4-dioxopentan-3-yl)alumanyl]pentane-2,4-dione Chemical compound CC(=O)C(C(C)=O)[Al](C(C(C)=O)C(C)=O)C(C(C)=O)C(C)=O XBIUWALDKXACEA-UHFFFAOYSA-N 0.000 description 1
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- 238000004381 surface treatment Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical group [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229910003438 thallium oxide Inorganic materials 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 238000002233 thin-film X-ray diffraction Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Chemical group 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 229910001930 tungsten oxide Inorganic materials 0.000 description 1
- 229910001935 vanadium oxide Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
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- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
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- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical group [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Photovoltaic Devices (AREA)
Description
【0001】
【発明の属する技術分野】
本発明は、液晶表示装置、タッチパネル及び太陽電池変換素子等の基板に好適に使用されるプラスチック積層体に関する。
【0002】
【従来の技術】
エレクトロニクス技術の急速な進歩に伴い、特に液晶表示装置、タッチパネル、太陽電池変換素子等、光エレクトロニクス分野は拡大している。一般的に、光エレクトロニク素子は、素子を、透明導電層を有するガラス基板上に形成することにより各種用途に供されている。しかしながら、ガラスは重量が大きく、可搬型装置に組み込んだ場合は、ガラスの大きな比重のため機器の重量が大きくなるという問題があった。そのため、軽量化が強く望まれており、ガラス基板に代わるプラスチックシートとして、強度、透明性、耐熱性等に比較的優れたポリアリレート、ポリエーテルスルホン、ポリカーボネート等のシート基板が採用されつつある。
【0003】
しかしながら、現状のこれらシート基板は、厚さが0.1mmm程度であるので、従来のガラス基板に比べて剛性に欠ける。剛性を付与するため、フィルムの膜厚化が考えられるが、溶媒キャスト法では、発泡、平面性の低下、残留溶媒の問題のため現実的には厚さ0.2mm程度の製造が限界である。また、液晶素子への応用のためにはシート基板の複屈折率が通常20nm以下、好ましくは10nm以下であることが必要であるが、プラスチック成形の際、分子配向を受けやすく低複屈折の成形体を製造するのは困難である。そこで、特開平7ー36023号公報などには、複屈折率の小さいシートを2層積層した光学プラスチックシートが提案されているが、かかるシートでは熱可塑性樹脂であるために、剛性が小さく、また、耐薬品性についても大きく劣るといった欠点がある。また、特開平6ー116406号公報には、光学用シートとして基材シートの表面層に硬化性樹脂をコートしたものが提案されているが、かかるシートも基板洗浄時にシート側面から溶剤により膨潤、溶解されるため結果として、耐薬品性に劣り、また、基板の剛性も十分なものではないという問題がある。
【0004】
更に、光エレクトロニクス素子分野では、特に高度の光学特性、ガスバリア性、電気伝導性、機械強度等が要求されるため、実際には、各機能を有する複数層ないしは膜からなる積層構造の基板が用いられ、例えば、特開平2−5308号公報には、プラスチック成形体上の両面に硬化被膜を設け、片面に導電膜を設け、他方片面には金属酸化物被膜を設けた積層体が提案されている。しかしながら、この積層体では、基材シートだけの問題以外にも、各層の性質の相違や密着性の問題等により、加熱時のクラックが発生し易い等の問題がある。
【0005】
一方、ガラス代替基板として有用なプラスチックシート基板であるが、利用価値を高めるには、軽量であることのみならず、可撓性を合わせ持つことが必要である。即ち、ある曲率で基板を撓ませた(屈曲させた)際に、導電膜にクラックが入ったりせず、電気伝導性を保つことが必要である。しかしながら、従来のプラスチックシート基板では、その耐屈曲性が不十分であるという問題がある。
【0006】
【発明が解決しようとする課題】
本発明は、上記事情に鑑み、液晶素子装置、タッチパネル、太陽電池等の基板として十分な耐屈曲性を持つプラスチック積層体を提供することにある。
【0007】
【課題を解決するための手段】
本発明者等は、上記課題を解決するために鋭意検討を行った結果、光硬化樹脂を基板シートを含む特定構造のプラスチック積層体の諸物性が顕著に優れていること注目し、本発明に到達した。即ち、本発明は、下記A、B、Cの3層よりなり、かつ3層がこの順序で積層されてなることを特徴とするプラスチック積層体に存する。
A:下式(1)及び(2)より選ばれる少なくとも1種のビス(メタ)アクリレートを含む組成物を活性エネルギー線により硬化させてなる光硬化性樹脂
【化14】
[式(1)中、R1及びR2は、互に異っていてもよく、水素原子又はメチル基を示す。R3及びR4は、互に異っていてもよく、炭素鎖中に酸素原子及び/又は硫黄原子を有していてもよい炭素数1〜6の炭化水素基を示す。Xはハロゲン原子、炭素数1〜6のアルキル基及び炭素数1〜6のアルコキシ基から選ばれた置換基を示し、aは0〜4の整数を示す。但しaが2以上の整数の場合には、複数のXは互に異っていてもよい。]
【化15】
[式(2)中、R5及びR6は、互に異っていてもよく、水素原子又はメチル基を示す。bは1又は2を示し、cは0又は1を示す。]
B:ガスバリア膜
C:シリコーン系樹脂またはシランカップリング剤を含む液状硬化性組成物を硬化させてなる硬化被膜
【0008】
【発明の実施の形態】
以下本発明のプラスチック積層体について更に詳細に説明する。
(光硬化性樹脂層)
光硬化性樹脂層は、本発明のプラスチック積層体の基材層を構成する。該基材層となる光硬化性樹脂シートを形成する光硬化性樹脂とは、紫外線等の照射によって硬化する樹脂である。具体的には、ラジカル反応性不飽和化合物を有するアクリレート化合物よりなる樹脂組成物、このアクリレート化合物とチオール基を有するメルカプト化合物よりなる樹脂組成物、エポキシアクリレート、ウレタンアクリレート、ポリエステルアクリレート、ポリエーテルアクリレート等のオリゴマーを多官能アクリレートモノマーに溶融せしめた樹脂組成物等が挙げられるがこれらに限定されるものではない。
【0009】
このうち、式(1)で示される含イオウビス(メタ)アクリレート及び式(2)で示される脂環骨格ビス(メタ)アクリレートより選ばれる少なくとも1種のビス(メタ)アクリレートよりなる組成物が耐薬品性、剛性等の面で好ましい。なお「(メタ)アクリレート」は、アクリレートないしメタクリレートを総称するものである。
【0010】
【化6】
【0011】
[式(1)中、R1 及びR2 は、互に異っていてもよく、水素原子又はメチル基を示す。R3 は炭素鎖中に酸素原子及び/又は硫黄原子を有していてもよい炭素数1〜6の炭化水素基、好ましくは炭素数2〜4のアルキレン基を示す。R4 は炭素鎖中に酸素原子及び/又は硫黄原子を有していてもよい炭素数1〜6の炭化水素基、好ましくは炭素数1〜3のアルキレン基を示す。Xはハロゲン原子、炭素数1〜6のアルキル基又は炭素数1〜6のアルコキシ基を示し、aは0〜4の整数を示す。但しaが2以上の整数の場合には、複数のXは互に異っていてもよい。]
式(1)で示される化合物のいくつかを例示すれば、次の通りである。p−ビス(β−メタクリロイルオキシエチルチオメチル)ベンゼン、p−ビス(β−アクリロイルオキシエチルチオメチル)ベンゼン、m−ビス(β−メタクリロイルオキシエチルチオメチル)ベンゼン、m−ビス(β−アクリロイルオキシエチルチオメチル)ベンゼン、p−ビス(β−メタクリロイルオキシエチルオキシエチルチオメチル)ベンゼン、p−ビス(β−メタクリロイルオキシエチルチオエチルチオメチル)ベンゼン、p−ビス(β−メタクリロイルオキシエチルチオメチル)テトラブロムベンゼン、m−ビス(β−メタクリロイルオキシエチルチオメチル)テトラクロロベンゼン。これらの化合物は、例えば、特開昭62−195357号公報に開示されている方法で合成することができる。
【0012】
【化16】
【0013】
[式(2)中、R5 及びR6 は、互に異っていてもよく、水素原子又はメチル基を示す。bは1又は2を示し、cは0又は1を示す。]
式(2)で示される化合物のいくつかを例示すれば、次の通りである。ビス(オキシメチル)トリシクロ〔5.2.1.02 , 6 〕デカン=ジアクリレート、ビス(オキシメチル)トリシクロ〔5.2.1.02 , 6 〕デカン=ジメタクリレート、ビス(オキシメチル)トリシクロ〔5.2.1.02 , 6 〕デカン=アクリレートメタクリレート、ビス(オキシメチル)ペンタシクロ〔6.5.1.13 , 6 .02 , 7 .09 , 13〕ペンタデカン=ジアクリレート、ビス(オキシメチル)ペンタシクロ〔6.5.1.1.3 , 6 .02 , 7 .09 , 13〕ペンタデカン=ジメタクリレート、ビス(オキシメチル)ペンタシクロ〔6.5.1.1.3 , 6.02 , 7 .09 , 13〕ペンタデカン=アクリレートメタクリレート。これらの化合物は、例えば、特開昭62−225508号公報に開示されている方法で合成することができる。
【0014】
以上の式(1)及び式(2)で示される(メタ)アクリレートは、単独もしくは2種以上を併用して用いることができる。式(1)の化合物を単独で用いる場合、本発明により得られる低複屈折板の屈折率は、ナトリウムのD線(589.3mm)において室温で1.54〜1.65となり、高屈折率を有する。また式(2)の化合物を単独で用いる場合は比較的低い屈折率1.47〜1.51となる。したがって式(1)及び式(2)で示される化合物を2種以上併用することにより、1.47〜1.65の間で所望の屈折率を有する低複屈折板を得ることができる。
【0015】
光硬化性樹脂は、上記ビス(メタ)アクリレートを、単独で重合させて使用することができるが、下記の式(3)、(4)及び(5)で示される分子内に2個以上のチオール基を有するメルカプト化合物より選ばれる少なくとも1種のメルカプト化合物をビス(メタ)アクリレート80〜99.1重量部に対して、0.1〜20重量部、より好ましくは1〜15重量部、更に好ましくは5〜10重量部配合することにより複屈折の低減、適度の靱性を付与することができる。メルカプト化合物が20重量部を超えると耐熱性が低くなるのであまり好ましくない。
【0016】
【化8】
【0017】
[式(3)中、複数のR7 は互に異っていてもよく、それぞれメチレン基又はエチレン基を示す。R8 は炭素鎖中に酸素原子及び/又は硫黄原子を含んでいてもよい炭素数2〜15、好ましくは2〜6の炭化水素残基を示す。dは2〜6の整数を示す。]
即ち、式(3)で示される化合物は、チオグリコール酸又はチオプロピオン酸とポリオールとのジエステル〜ヘキサエステルである。そのいくつかを例示すると、ペンタエリスリトールテトラキス(β−チオプロピオネート)、ペンタエリスリトールテトラキス(チオグリコレート)、トリメチロールプロパントリス(β−チオプロピオネート)、トリメチロールプロパントリス(チオグリコレート)、ジエチレングリコールビス(β−チオプロピオネート)、ジエチレングリコールビス(チオグリコレート)、トリエチレングリコールビス(β−チオプロピオネート)、トリエチレングリコールビス(チオグリコレート)、ジペンタエリスリトールヘキサキス(β−チオプロピオネート)、ジペンタエリスリトールヘキサキス(チオグリコレート)などが挙げられる。
【0018】
【化9】
【0019】
[式(4)中、Yは互に異っていてもよく、HS−(CH2 )e −(CO)(OCH2 −CH2 )f −(CH2 )g −を示す。但しeは1〜4の整数、fは1〜4の整数、gは0〜2の整数をそれぞれ示す。]
即ち、式(4)の化合物はω−SH基含有トリイソシアヌレートである。そのいくつかを例示すると、トリス〔2−(β−チオプロピオニルオキシ)エチル〕イソシアヌレート、トリス(2−チオグリコニルオキシエチル)イソシアヌレート、トリス〔2−(β−チオプロピオニルオキシエトキシ)エチル〕イソシアヌレート、トリス(2−チオグリコニルオキシエトキシエチル)イソシアヌレート、トリス〔3−(β−チオプロピオニルオキシ)プロピル〕イソシアヌレート、トリス(3−チオグリコニルオキシプロピル)イソシアヌレートなどが挙げられる。
【0020】
【化10】
【0021】
[式(5)中、R9 及びR10は、互に異っていてもよく、炭素数1〜3の炭化水素基を示す。m及びnはそれぞれ0又は1を示す。pは1又は2を示す。]
すなわち、式(5)の化合物はα,ω−SH基含有化合物である。そのいくつかを例示すると、ベンゼンジメルカプタン、キシリレンジメルカプタン、4,4′−ジメルカプトジフェニルスルフィドなどが挙げられる。
【0022】
また、以上の光硬化性樹脂の重合の際に用いる他の単量体としては、例えば、メチル(メタ)アクリレート、フェニル(メタ)アクリレート、2−ヒドロキシエチル(メタ)アクリレート、メタクリロイルオキシメチルテトラシクロドデカン、メタクリロイルオキシメチルテトラシクロドデセン、エチレングリコールジ(メタ)アクリレート、ジエチレングリコールジ(メタ)アクリレート、1,6−ヘキサンジオールジ(メタ)アクリレート、2,2−ビス[4−(β−メタクリロイルオキシエトキシ)フェニル]プロパン、2,2′−ビス[4−(β−メタクリロイルオキシエトキシ)シクロヘキシル]プロパン、1,4−ビス(メタクリロイルオキシメチル)シクロヘキサン、トリメチロールプロパントリ(メタ)アクリレート等の(メタ)アクリレート化合物、スチレン、クロルスチレン、ジビニルベンゼン、α−メチルスチレン等の核及び(又は)側鎖置換及び非置換スチレンなどが挙げられる。これらの他の単量体の中でもメタクリロイルオキシメチルシクロドデカン、2,2−ビス[4−(β−メタクリロイルオキシエトキシ)フェニル]プロパン、2,2−ビス[4−(β−メタクリロイルオキシエトキシ)シクロヘキシル]プロパン、1,4−ビス(メタクリロイルオキシメチル)シクロヘキサン、及びこれらの混合物が特に好ましい。更に、これらには少量の酸化防止剤、紫外線吸収剤、染顔料、充填剤等を含んでいてもよい。
【0023】
以上のようなビス(メタ)アクリレート又はビス(メタ)アクリレートとメルカプト化合物との混合物は、紫外線等の活性エネルギー線によりラジカルを発生する光重合開始剤を添加する公知のラジカル重合により硬化させる。その際に用いる光重合開始剤としては、例えばベンゾフェノン、ベンゾインメチルエーテル、ベンゾインイソプロピルエーテル、ジエトキシアセトフェノン、1−ヒドロキシシクロヘキシルフェニルケトン、2,6−ジメチルベンゾイルジフェニルホスフィンオキシド、2,4,6−トリメチルベンゾイルジフェニルホスフィンオキシド等が挙げられる。好ましい光開始剤としては、2,4,6−トリメチルベンゾイルジフェニルホスフィンオキシド、ベンゾフェノンである。これら光重合開始剤は2種以上を併用してもよい。
【0024】
光重合開始剤の添加量は、モノマー100重量部に対し0.01〜1重量部、好ましくは0.02〜0.3重量部である。光重合開始剤の添加量が多すぎると、重合が急激に進行し複屈折の増大をもたらすだけでなく色相も悪化する。また少なすぎると組成物を充分に硬化させることができなくなる。
照射する活性エネルギー線の量は、光重合開始剤がラジカルを発生する範囲であれば任意であるが、極端に少ない場合は重合が不完全なため硬化物の耐熱性、機械特性が十分に発現されず、逆に極端に過剰な場合には硬化物の黄変等の光による劣化を生じるので、モノマーの組成及び光重合開始剤の種類、量に合わせて200〜400nmの紫外線を好ましくは0.1〜200Jの範囲で照射する。使用するランプの具体例としては、メタルハライドランプ、高圧水銀灯ランプ等を挙げることができる。
【0025】
硬化を速やかに完了させる目的で、熱重合を併用してもよい。即ち、光照射と同時に組成物並びに型全体を通常30〜300℃の範囲で加熱する。この場合は重合をよりよく完結するためにラジカル重合開始剤を添加してもよいが、過剰な使用は複屈折の増大と色相の悪化をもたらす。熱重合開始剤の具体例としてはベンゾイルパーオキシド、ジイソプロピルパーオキシカーボネート、t−ブチルパーオキシ(2−エチルヘキサノエート)等が挙げられ、使用量はモノマー100重量部に対して1重量部以下が好ましい。
【0026】
更に、光照射によるラジカル重合を行った後、硬化物を加熱することにより重合反応の完結及び重合時に発生する内部歪を低減することも可能である。加熱温度は、硬化物の組成やガラス転移温度に合わせて適宜選択されるが、過剰な加熱は硬化物の色相悪化をもたらすため、ガラス転移温度付近かそれ以下の温度が好ましい。
【0027】
光硬化性樹脂シートの成形方法は、少なくとも一面が活性エネルギー線を透過可能な2枚の相対する平板(以下「成形型」という。)を用いスペーサー等によりキャビティを形成させ周辺部をシールしてなる注入型に光硬化性樹脂を注入し、活性エネルギー線を照射して光硬化性樹脂を硬化させる。成形型の材質は、硬化後のシートの表面から、好ましくは研磨ガラスを用い、光硬化性樹脂を硬化させるに充分な活性エネルギー線の透過性を持ち、熱等により容易にその形状を変形させないものであればよい。また、研磨ガラスと同等な表面性を得られるアクリル板等のプラスチック等が挙げられる。
【0028】
また、必要により成形型上に剥離剤等の塗布、又は剥離層を設け硬化後の光硬化性樹脂シートを成形型より除去し易くする処理を行うこともできる。用いる剥離剤、剥離層、その塗布方法などについては特に限定すされるものではないが、光硬化樹脂を硬化させるに充分な活性エネルギー線の透過性を持つ物質であり、更に、光硬化性樹脂を硬化させるための活性エネルギー線や、硬化時に発生する熱等により容易にその形成状態を変形しない物質であり、ガラス表面並の平面性が得られる物質であればよい。
【0029】
活性エネルギー線は光硬化性樹脂を硬化させるものであり、例えば、紫外線等が挙げられる。活性エネルギー線の照射量は用いる光硬化性樹脂を硬化させる量であればよい。キャビティを形成させるスペーサー等については、特に限定しないが、所望のシート厚さが得られるものであればよい。例えば、シリコンゴム等のゴム製、金属製の板もしくは棒状、テフロン等の樹脂製の板もしくは棒状が挙げられる。
(ガスバリア膜)
本発明における膜としては、無機酸化物膜、あるいは、エチレンービニルアルコール共重合体(例えば、エバール商品名エバール、ソアノール)、塩化ビニリデン等のガスバリアー性樹脂層が挙げられるが、好ましくは無機酸化物膜である。無機酸化物とは、金属、非金属、亜金属の酸化物であり、具体例としては、酸化アルミニウム、酸化亜鉛、酸化アンチモン、酸化インジウム、酸化カルシウム、酸化カドミウム、酸化銀、酸化金、酸化クロム、酸化珪素、酸化コバルト、酸化ジルコニウム、酸化スズ、酸化チタン、酸化鉄、酸化銅、酸化ニッケル、酸化白金、酸化パラジウム、酸化ビスマス、酸化マグネシウム、酸化マンガン、酸化モリブデン、酸化バナジウム、酸化バリウム等が挙げられるが、酸化珪素が特に好ましい。なお、無機酸化物には、微量の金属、非金属、亜金属単体やそれらの水酸化物、また、可撓性を向上させるために適宜炭素又はフッ素が含まれていてもよい。ガスバリア層を形成する方法としては、樹脂等をコートする方法、無機酸化物よりなる蒸着膜を形成する方法が挙げられる。蒸着膜を形成する方法としては、真空蒸着法、真空スパッタ法、イオンプレーティング法、CVD法等、従来公知の方法が使用できる。
【0030】
以上のガスバリア膜の厚さは特に制限はなく、ガスバリア膜の構成成分の種類によっても異なるが、酸素ガスバリア性及び水蒸気バリア性、更には経済性を考慮すると、膜の厚さは5〜50nmが好ましい。更に高度な酸素ガスバリア性や水蒸気バリア性を得るためには膜の厚さを厚くすればよいが、膜の厚さが5nm未満では膜が島状になって膜が形成されない箇所が生ずる可能性があり均一な膜が得られない傾向があるので余り好ましくない。
(硬化被膜)
本発明における硬化被膜としては、有機化合物系硬化被膜であれば、特に限定されることなく用いられるが、ハードコート剤、アンカーコート剤(プライマーコート剤)等より形成されるものである。その具体例としては、ハードコート剤としては、ポリウレタンアクリレート、エポキシアクリレートなどのアクリレートあるいは多官能アクリレート、光重合開始剤、及び有機溶剤を主成分とするものを使用することができる。また、アンカーコート剤としては、イソシアネート系、ポリウレタン系、ポリエステル系、ポリエチレンイミン系、ポリブタジエン系、アルキルチタネート系等の公知のアンカーコート剤がが挙げられる。これらの樹脂は、単独での使用あるいは2種以上の併用が可能であり、更に、各種硬化剤、架橋剤などを用いて三次元架橋することも可能である。
【0031】
硬化被膜として特に好ましいものを更に具体的に例示するに、表面硬度、耐熱性、耐薬品性、透明性などの諸特性を考慮した場合では、有機高分子としてシリコーン系樹脂を用いることが好ましく、特にアクリロイル基やメタクリロイル基を有するシランカップリング剤を含有する活性エネルギー線硬化性組成物が好適である。アクリロイル基やメタクリロイル基を有するシランカップリング剤を含む活性エネルギー線硬化性組成物を用いると、特に、金属酸化物等からなるガスバリア膜と硬化被膜との密着性がよくなり、かつ、ガスバリア性が特に向上する。その理由は詳らかでないが、密着性の向上は、シランカップリング剤が金属酸化物薄膜と化学結合し、かつシランカップリング剤のアクリロイル基やメタクリロイル基が共存する他の被膜形成々分と反応して硬化被膜を金属酸化物薄膜に強固に結合させることによるものと考えられる。また、ガスバリア性の向上も、金属酸化物薄膜を構成している金属酸化物粒子間の間隙を、シランカップリング剤ないしはそのアクリロイル基やメタクリロイル基と反応した被膜形成成分が充填することによるものと考えられる。
【0032】
シランカップリング剤は、アクリロイル基及びメタクリロイル基の少くとも一方を有するものであればよいが、反応速度の大きいアクリロイル基を有するものの方が好ましい。例えば、反応性基としてイソシアネート基やメルカプト基のみを有し、アクリロイル基やメタクリロイル基を有しないシランカップリング剤を使用したのでは、密着性は改良されない。これはシランカップリング剤と金属酸化物薄膜との結合は形成されても、このシランカップリング剤が共存する他の被膜形成々分と反応して被膜中に取込まれ難いことによるものと思われる。
【0033】
アクリロイル基やメタクリロイル基を有するシランカップリング剤としては、例えばγ−アクリロキシプロピルトリメトキシシラン、γ−メタクリロキシプロピルトリメトキシシラン、γ−アクリロキシプロピルトリエトキシシラン、γ−メタクリロキシプロピルトリエトキシシラン、γ−アクリロキシプロピルメチルジメトキシシラン、γ−アクリロキシプロピルメチルジエトキシシラン、γ−メタクリロキシプロピルメチルジメトキシシラン、γ−メタクリロキシプロピルメチルジエトキシシラン、γ−アクリロキシプロピル−トリス(β−メトキシエトキシ)シラン、γ−メタクリロキシプロピル−トリス(β−メトキシエトキシ)シランなどが挙げられる。
【0034】
これらのシランカップリング剤は、活性エネルギー線硬化性組成物中で、通常0.1〜60重量%、好ましくは0.2〜45重量%を占める。シランカップリング剤が少な過ぎると硬化被膜と金属酸化物薄膜との密着性が十分に発現され難い。これは組成物中の金属酸化物薄膜と反応する官能基の量が十分でないためと考えられる。逆にシランカップリング剤が過剰に存在すると、硬化被膜の耐アルカリ性が低下するようになることがある。これは金属酸化物薄膜と反応しないシランカップリング剤が、硬化被膜中に多量に残存し、これがアルカリと反応するためと考えられる。
【0035】
活性エネルギー線硬化性組成物は、シランカップリング剤を含む以外は、活性エネルギー線の照射により重合して硬化被膜を形成する常用のモノマーやオリゴマー、ポリマー等から成っている。例えばエポキシ(メタ)アクリレート、ウレタン(メタ)アクリレート、ポリエステル(メタ)アクリレート等のモノマーやオリゴマーが用いられる。これらのいくつかを例示すると、トリメチロールプロパントリアクリレート、トリメチロールプロパントリメタクリレート、ペンタエリスリトールトリアクリレート、ペンタエリスリトールトリメタクリレート、ペンタエリスリトールテトラアクリレート、ペンタエリスリトールテトラメタクリレート、ジペンタエリスリトールヘキサアクリレート、ジペンタエリスリトールヘキサメタクリレート、イソアミルアクリレート、エトキシジエチレングリコールアクリレート、メトキシジエチレングリコールアクリレート、N−ビニルピロリドンなど、1個以上の炭素−炭素二重結合を有する単官能および多官能のアクリルモノマー、メタクリルモノマー、ビニルモノマー類が挙げられる。 また、活性エネルギー線硬化性組成物には、公知の添加剤、例えば、紫外線吸収剤、熱重合禁止剤などが配合されていてもよい。
【0036】
活性エネルギー線硬化性組成物で硬化被膜を形成するには、活性エネルギー線硬化性組成物をグラビアコート法、リバースコート法、ダイコート法などの各種塗布方法で塗布し、活性エネルギー線を照射して硬化させればよい。このとき、塗布してから硬化させる前に予備加熱を行っても良い。活性エネルギー線硬化性組成物が溶剤で希釈されている場合は、この予備加熱の工程において溶剤を除去しなければならない。
【0037】
上記組成物は、通常揮発性溶媒により希釈して液状組成物として塗布されることが好ましい。溶媒として塗布されるものは、特に限定されないが、使用にあたって被塗布物の表面性状を損なわぬことが要求される。さらには、組成物の安定性、基材に対するぬれ性、揮発性などをも考慮して、溶媒は決められるべきである。また、溶媒は1種のみならず2種以上の混合物として用いることも可能である。溶媒としては、アルコール、エステル、エーテル、ケトン、ハロゲン化炭化水素、トルエンやキシレンなどの芳香族炭化水素、および非プロトン性極性溶媒などが挙げられる。
【0038】
なお、硬化被膜には、表面硬度の向上、屈折率の調節、機械的強度の向上、熱的特性の向上、硬化被膜上に設けられる金属酸化物膜、透明導電膜の耐久性向上などを目的に、無機微粒子が添加される。かかる無機微粒子としては、被膜状態で透明性を損なわないものであればとくに限定されない。作業性向上、透明性付与の点から特に好ましい例としては、コロイド状に分散したゾルが挙げられる。さらに具体的な例としては、シリカゾル、酸化アンチモンゾル、チタニアゾル、アルミナゾル、ジルコニアゾル、酸化タングステンゾルなどが挙げられる。無機微粒子の添加量は、とくに限定されないが、効果をより顕著にするためには、透明被膜中に1重量%以上、80重量%以下含有されていることが好ましい。1重量%未満では明らかな添加の効果が認められにくく、また、80重量%を越えると透明樹脂との接着性不良や被膜自体のクラックが発生し、耐衝撃性が低下するなどの問題を生じる場合がある。無機微粒子の粒子径は、特に限定されないが、好ましくは1〜300mμ、更にら好ましくは5〜100mμのものが使用される。平均粒子径が300mμを越えるものを使用した場合は、生成する被膜の透明性が悪く、濁りが大きくなる傾向がある。また、微粒子状無機物の分散性を改良するために、各種の微粒子表面処理を行ってもよいし、各種の界面活性剤やアミンなどを添加しても何ら問題はない。
【0039】
硬化被膜形成時に使用されるコーティング組成物には、硬化促進や低温硬化などを可能とする目的で各種の硬化剤を併用してもよい。硬化剤としては、各種エポキシ樹脂硬化剤あるいは各種有機ケイ素樹脂硬化剤などが使用される。これらの硬化剤の具体例としては、各種の有機酸およびそれらの酸無水物、窒素含有有機化合物、各種金属錯化合物、金属アルコキシド、アルカリ金属の有機カルボン酸塩や炭酸塩などの各種塩や過酸化物、アゾビスイソブチロニトリルなどのラジカル重合開始剤などが挙げられる。これらの硬化剤は2種以上混合して使用することも可能である。これらの硬化剤の中でも、コーティング組成物の安定性、コーティング後の被膜の着色の有無などの点から、とくにアルミニウムキレート化合物が有用である。
【0040】
ここでいうアルミニウムキレート化合物としては、例えば、一般式AIXn Y3-n で示されるアルミニウムキレート化合物である。ただし、式中のXはOL(Lは低級アルキル基を示す)、Yは一般式M1 COCH2 COM2 (M1,M2 はいずれも低級アルキル基)で示される化合物に由来する配位子および一般式M3 COCH2 COOM4 (M3 ,M4 はいずれも低級アルキル基)で示される化合物に由来する配位子から選ばれる少なくとも一つであり、nは0,1または2である。一般式AlXnY3-n で示されるアルミニウムキレート化合物としては、各種化合物を挙げることができるが、組成物への溶解性、安定性、硬化触媒としての効果などの観点からとくに好ましいのは、アルミニウムアセチルアセトネート、アルミニウムビスエチルアセトアセテートモノアセチルアセトネート、アルミニウム−ジ−n−ブトキシド−モノエチルアセトアセテート、アルミニウム−ジ−iso−プロポキシド−モノメチルアセトアセテートなどである。これらは2種以上を混合して使用することも可能である。
【0041】
硬化被膜形成時に使用されるコーティング組成物には、塗布時におけるフローを向上させかつ透明被膜の平滑性を向上させて被膜表面の摩擦係数を低下させる目的で各種の界面活性剤を添加することも可能である。界面活性剤としては、とくにジメチルポリシロキサンとアルキレンオキシドとのブロックまたはグラフト共重合体、およびフッ素系界面活性剤などが有効である。
【0042】
硬化被膜形成時に使用されるコーティング組成物中には、被膜性能や透明性などを大幅に低下させない範囲で、無機微粒子以外の無機酸化物なども添加することができる。これらの添加物の併用によって、基材との密着性、耐薬品性、表面硬度、耐久性などの諸特性を向上させることができる。添加可能な無機材料としては、例えば以下の一般式(C)で表される金属アルコキシド、キレート化合物および/またはその加水分解物が挙げられる。
【0043】
M(OR)m (C)
ここで、Mは、ケイ素、チタン、ジルコン、アンチモン、タンタル、ゲルマニウム、アルミニウムなどである。Rはアルキル基、アシル基、アルコキシアルキル基である。mは金属Mの電荷数と同じ値である。
硬化被膜は、前記コーティング組成物を硬化させることによって得られるが、硬化は加熱処理によって行なわれる。加熱温度は、コーティング組成物の組成や透明架橋樹脂の耐熱性を考慮して適宜選択されるが、好ましくは50〜250℃である。透明樹脂上への被膜の塗布方法としては、刷毛塗り、浸漬塗り、ロール塗り、スプレー塗装、スピン塗装、流し塗りなどの通常行なわれる塗布方法が容易に使用可能である。コーティング組成物の塗布にあたっては、清浄化、密着性および耐水性等の向上を目的として各種の前処理を施すことも有効な手段である。とくに好ましく用いられる前処理としては、活性化ガス処理、薬品処理、紫外線処理などが挙げられる。これらの前処理は、連続的または段階的に併用して実施することも十分可能である。
【0044】
以上の硬化被膜の膜厚は、とくに限定されるものではないが、接着強度の保持や硬度などの点から、通常0.1〜50μm、好ましくは0.3〜10μmである。また、被膜の塗布にあたって、作業性、被膜厚さ調節などの目的で、コーティング組成物は各種溶剤により希釈して用いられる。希釈溶剤としては、例えば、水、アルコール、エステル、エーテル、ハロゲン化炭化水素、ジメチルホルムアミド、ジメチルスルホキシドなどが目的に応じて種々使用可能であり、必要に応じて混合溶媒を使用することも可能である。微粒子状無機酸化物の分散性などの点から、水、アルコール、ジメチルホルムアミド、エチレングリコール、ジエチレングリコール、トリエチレングリコール、ベンジルアルコール、フェネチルアルコール、フェニルセロソルブなどの極性溶媒が好ましく用いられる。
(導電膜)
本発明のプラスチック積層体では、光硬化性樹脂層の上に導電膜を積層したものは、液晶表示装置基板として好ましく使用される。この導電膜を形成する導電物質としては、酸化インジウム、酸化スズ、金、銀、銅、ニッケル等が挙げられ、これらは単独又は2種以上を混合して使用することができる。このうち、通常、酸化インジウム99〜90%と酸化スズ1〜10%との混合物よりなるインジウムスズオキサイド(以下「ITO」という)が透明性と導電性のバランスの面から特に好ましい。透明導電膜を形成する方法は、従来から公知の真空蒸着法、スパッタリング法、イオンプレーティング法、化学蒸着法等を用いて行うことができる。このうち、スパッタリング法が密着性の点から好ましい。以上の透明導電膜の厚さは、通常500〜2000Åの範囲が透明性及び導電性のバランスの面から好ましい。
【0045】
また、 また、耐屈曲性能の高いプラスチック積層体として、液晶表示装置、タッチパネル等の光エレクトロニクス分野の基板に好適に使用されるには、導電膜の硬度が2GP以上、又は/或いは、スティフネスが1.5μN/nm以上、又は/或いは、モジュラス(ヤング率)が15GP以上であるプラスチック積層体であれば、一般に、積層体を撓ませても、導電膜にクラックが入らず、電気抵抗値も劣化しない。そして、好ましくは、硬度が3GP以上、又は/或いはスティフネスが1.5μN/nm以上、又は/或いは、モジュラス(ヤング率)が20GP以上である。
【0046】
一般に、成膜された膜は、基材(下地)と膜との熱膨張係数の差により内部応力が生じ、それが大きいと膜にクラックが入りやすいと云われている。膜の内部応力測定は、各種方法が知られているが、次の種々の理由で該プラスチック積層体においては適用できない。
(イ)成膜後の基板のたわみ量計測は、プラスチック基板の場合、熱等の影響分があるため不確かである。
(ロ)薄膜X線回折の結晶ピークの格子定数及び面間隔から求める方法は、膜が非晶質の場合は測定できない。
(ハ)ラマン散乱による測定では、基材がプラスチックであるため測定が難しい。
【0047】
また、膜の内部応力は、成膜後等の静止時におけるクラック発生と関係づけられてはいるものの、プラスチック積層体を撓ませた場合でのクラック発生には他の因子が含まれる。その一つが、プラスチック積層体を撓ませた時の基材シートに対する膜の追従性の良し悪しである。基材シートに対する膜の追従性が悪いとクラックが入りやすい。それを物性として評価として、硬度及び弾性が考えられ、撓みによる膜のクラック発生の有無の影響因子として直接的に特徴づけることができる。
【0048】
導電膜の硬度等の物性を特定値以上にするためには、導電膜の性質を制御してもよいが、積層体における層構成及び導電膜以外の層の性質も大きな影響を与える。なお、基板がプラスチックであるため成膜温度の上限は低く、また、他の成膜条件を如何に変化させても導電膜の物理的性質を変化させるには限りがある。一方、硬化被膜は、処方や硬化条件を変えるなど幅広い範囲で物理的性質を変化させることが比較的容易である。
(積層体の層構成)
本発明のプラスチック積層体は、以上の光硬化性樹脂(A)、ガスバリア膜(B)、硬化被膜(C)がこの順序で積層されてなり、特に、光硬化性樹脂層の上に導電膜を積層してなる。かかる構成の積層体として最も基本的な構成は図1で示される。また、本発明のプラスチック積層体は図1のものに限定されるのではなく、更に、光硬化性樹脂層と導電膜との間にガスバリア膜を介在させてなる図2の構成、光硬化性樹脂層と導電膜との間に硬化被膜を介在させてなる図3の構成、硬化被膜と導電膜との間にガスバリア膜を介在させてなる図4の構成が例示される。
【0049】
光硬化樹脂(A)上にガスバリア層(B)を直接積層するとガスバリア性は向上するが、A、Bが接触することにより、積層体をハンドリングする際、ガスバリア層がこすれたり、キズついたりした場合、バリアー性が大きく低下する恐れがある。ガスバリア層の上に硬化皮膜(C)を積層すると、ガスバリア性が更に向上するだけでなく、ハンドリング時のこすれ、キズがあったとしても、ガスバリアー性の低下は小さく、結果として安定なガスバリア性を付与することが可能である。
【0050】
本発明の積層体に導電膜を積層したものを液晶表示素子とした場合、セル内にガスが入らず、液晶の劣化、及びセル内に気泡が発生せず良好な液晶表示素子となる。更に、導電膜と硬化樹脂層のアイ台にガスバリアー膜を入れることにより、更にバリアー性を向上させ、ひいては、導電膜の耐熱性が向上させることができる。また、導電膜と光硬化樹脂の間に硬化皮膜を入れた場合は、導電膜の密着性が向上し、ITOの剥がれ等がなく良好な膜となるため望ましい。更に、硬化皮膜と導電膜の間にガスバリアー膜を入れた場合は、硬化樹脂層に直接ガスバリアー膜を積層するよりも更にガスバリアー性が向上するだけでなく膜の耐熱性も向上するので特に好ましい場合がある。
(積層体の性質)
本発明のプラスチック積層体は、550nmの光の波長での光線透過率が80%以上であることが好ましい。光線透過率が80%未満だと、カラー表示等の場合、画面が暗くなるため使用でき難く、モノクロ表示素子等の用途にしか使用できない傾向にある。また、プラスチック積層体の複屈折率としては、20nm以下、特に10nm以下であることが好ましい。20nmよりも大きいと表示パネルとした場合、表示画面の色ムラが生じる傾向がある。
【0051】
一方、プラスチック積層体の厚さは、0.10〜2.00mmが好ましい。透明導電性シートは曲げ弾性率は大きいが、0.10mm未満ではシートが自重によりたわみ易く、従来のガラス製基板を使用した液晶表示装置の製造プロセスが使用できない傾向があり、2.00mmを超えると従来の1.5〜0.7mmのガラス基板と同じ重量となり、軽量化の目的からはずれてしまう。
【0052】
本発明のプラスチック積層体の応用例としては、例えば、液晶表示装置用基板として使用する場合、通常、プラスチック積層体によって液晶を挟んだ構成をとる。更に、プラスチック積層体の導電膜上に、必要に応じて絶縁膜、更に、その上に配向膜が設けられた基板により液晶層を挾持した製造をとる。液晶層を挾持した基板の外側には偏向板が設けられる。また、エレクトロルミネッセンス表示素子においては、通常、本発明のプラスチック積層体上に、発光体層、絶縁層及び背面電極を順次形成し、更に全体をガスバリア層で被覆した構造のものが例示される。この場合、発光体層には硫化亜鉛、硫化カドミウム、セレン化亜鉛等が、絶縁層には酸化イットリウム、酸化タリウム、窒化シリコン等が、背面電極にはアルミニウム等が用いられる。
【0053】
【実施例】
以下、本発明の内容および効果を実施例により更に詳細に説明するが、本発明は、その要旨を越えない限り以下の例に限定されるものではない。また、実施例及び比較例で得られたプラスチック積層体は、以下の方法により評価した。
<膜の厚さ>
実施例及び比較例により得られた積層体のガスバリア膜と導電膜については、積層体の断面を透過型電子顕微鏡(日立製作所製、H−600型)で観察し、薄膜の厚さを測定した。
<導電膜の表面抵抗値>
三菱化学(株)製の4端子法抵抗測定器(ロレスターMP)を用いて、表面抵抗値を測定した。
<導電膜の耐屈曲性試験>
5x10cm大きさのプラスチック積層体を、導電膜を内側にして長辺に沿ってφ25mmのステンレス管にプラスチック積層体を巻き付けた後、導電膜を外側にして巻き付け、その後、光学顕微鏡で導電膜のクラック発生の有無を調べ、表面抵抗値を上記方法で測定した。
<導電膜のインデント試験>
Hysitron社製PicoIndenterを用い、圧子押し込み深さが膜厚の約10分の1程度になる荷重(μN)で、一回のインデント(圧子押し込み)を10秒間で行い、1サンプルにつき5回測定し平均値を求めた。各回の測定は、圧痕の影響が生じないように測定箇所の距離を十分とった。また、サンプルは試料台に十分固定した。
<耐熱性>
ビガット軟化試験において、測定条件が、圧子断面積1.0mm、荷重5Kg、昇温速度50℃/hr、120℃以下で圧子が0.4mm以上進入したものを×、0.2〜0.4mm進入したものを△、0.1mm以下で進入がほとんどなかったものを○とした。
<複屈折率>
複屈折測定装置(オーク製作所製、ADR100)を使用し、632.8nmの波長で面内の複屈折率を測定した。
<光線透過率>
(株)日立製作所の分光光度計を使用し、波長550nmでの透過率を測定した。
<ITO膜表面の粗さ(Ra)>
表面粗さ測定器((株)東京精密製、サーフコーム575A)を用い、ダイヤモンド針(1μmR、90゜円錐)、測定長さ0.5mm、カットオフ値0.16mm、測定速度0.06mm/sec及び直線補正の条件で測定した。
実施例1
ビスオキシメチルトリシクロ[5.2.1.02,6]デカンジメタクリレート100重量部、光開始剤として2,4,6−トリメチルベンゾイルジフェニルフォスフィンオキシド(BASF社製「ルシリンTPO」)0.05重量部、ベンゾフェノン0.05重量部を均一に混合撹拌した後、脱泡して組成物を得た。この組成物をスペーサーとして厚さ0.4mmのシリコン板を用いた光学研磨ガラスの型に注入し、ガラス面上にある出力80W/cmのメタルハライドランプにてガラス型面に40J/cm2のエネルギーになるように照射後、ガラス型を離型し、厚さ約0.4mmの光硬化性樹脂シートを得た。
【0054】
得られた硬化樹脂シート(A)に、アルバック社製RFスパッタリング機によりアルゴンガス全圧6.7E-1Pa、ターゲット材SIOで厚さ10nmの珪素酸化物薄膜(B)を成形させた。更に、(B)層の上に下記成分a,b,c,dをそれぞれ62、38、5、0.3%の割合で混合し、プロピレングリコールモノメチルエエーテルで希釈し、スピンコートで塗布し、出力80W/cmのメタルハライドランプにて5J/cm2のエネルギーになるように照射して、硬化被膜(C)を積層した。
成分a;ビスオキシメチルトリシクロ[5.2.1.02,6 ]デカンジアクリレート、三菱化学(株)製ユピマーUV SA−1002
ジシクロペンタニルジアクリレート、日本化薬(株)製カヤラッドR684
成分b;トリメチロールプロパントリアクリレート及びエポキシアクリレート等混合物、日本化薬(株)製カヤラッドR130
成分c;1−ヒドロキシシクロエキシルフェニルケトンとビス(2,6−ジメトキシベンゾイル)−2,4,4−トリメチルペンチルホスフィンオキシドの混合物、日本チバガイギー(株)製イルガキュア1800
成分d;ポリエーテル変性シリコン、共栄社化学(株)製グラノール450
このA/B/Cの層構成の積層体の酸素透過率をオキシトラン社製酸素モコン測定器にて23℃、湿度80%の条件で測定すると、酸素バリアーは0.1cc/m2・day以下であった。なお、比較として、硬化樹脂シート(A)の酸素透過率を測定したところ16cc/m2・dayであり、同様にA/Bの層構成の積層体の酸素透過率は1.5cc/m2・dayであった。
【0055】
次に、上記のA/B/Cの層構成の積層体のA層側表面に、前記と同じ成分a,b,c,dからなる硬化被膜(C)を積層し、次いで、続いて同機で酸素分圧1E-2Pa、全圧6.7E-1Pa、ターゲット材ITO(酸化インジウムに対する酸化錫比95:5)で厚さ120nmのITO膜を形成させ、プラスチック積層体を得た。該積層体の評価結果を表−1に示す。また、該積層体の耐熱性、複屈折率、光線透過率、ITO膜表面の粗さも測定したがいずれも良好であった。
実施例2
積層の順を、ITO膜、光硬化性樹脂シート、珪素酸化物薄膜、硬化被膜、の順に変えた他は、実施例1と同様にしてプラスチック積層体を得た。該積層体の評価結果を表−1に示す。また、該積層体の耐熱性、複屈折率、光線透過率、ITO膜表面の粗さも測定したがいずれも良好であった。
実施例3
珪素酸化物薄膜及びITO膜をアルバック社製DCスパッタリング機で成膜した他は、実施例1と同様にしてプラスチック積層体を得た。該積層体の評価結果を表−1に示す。また、該積層体の耐熱性、複屈折率、光線透過率、ITO膜表面の粗さも測定したがいずれも良好であった。
【0056】
【表1】
【0057】
【発明の効果】
本発明のプラスチック積層体は、耐薬品性及び剛性が優れており、従来のガラス基板プロセスを利用することが可能であり、基板の耐薬品性が優れているので透明導電膜の剥離、ひび割れを生じることがなく、またガラス基板を使用したものより軽量で、耐衝撃性にも優れているという特別に有利な効果を奏し、産業上の利用価値は極めて大である。
【0058】
本発明のプラスチック積層体は液晶表示装置用基板として好ましく使用され、TN(Twisted Nematic 型)、STN(Super Twisted Nematic 型、強誘電液晶)FLC(Ferroelectric Liquid Cristal)型などの単純マトリックス型、MIM(Metal-Insulator-Metal )型、TFT(Thin-Film Transistor)型などのアクティブマトリックス型などの液晶表示装置に適用可能である。
【図面の簡単な説明】
【図1】図1は、本発明のプラスチック積層体の一態様を示す。
【図2】図2は、本発明のプラスチック積層体の一態様を示す。
【図3】図3は、本発明のプラスチック積層体の一態様を示す。
【図4】図3は、本発明のプラスチック積層体の一態様を示す。
【符号の説明】
A:光硬化性樹脂
B:ガスバリア膜
C:硬化被膜
I:導電膜[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a plastic laminate that is suitably used for substrates such as liquid crystal display devices, touch panels, and solar cell conversion elements.
[0002]
[Prior art]
With the rapid advancement of electronics technology, the field of optoelectronics such as liquid crystal display devices, touch panels, solar cell conversion elements, etc. is expanding. In general, a photoelectronic element is used for various applications by forming the element on a glass substrate having a transparent conductive layer. However, glass has a large weight, and when incorporated in a portable device, there is a problem that the weight of the device increases due to the large specific gravity of the glass. Therefore, weight reduction is strongly desired, and sheet substrates such as polyarylate, polyethersulfone, and polycarbonate, which are relatively excellent in strength, transparency, heat resistance, and the like, are being adopted as plastic sheets instead of glass substrates.
[0003]
However, since these present sheet substrates have a thickness of about 0.1 mm, they lack rigidity compared to conventional glass substrates. In order to impart rigidity, it is conceivable to increase the film thickness. However, in the solvent casting method, the production of a thickness of about 0.2 mm is practically limited due to problems of foaming, deterioration of flatness, and residual solvent. . In addition, for application to liquid crystal elements, the birefringence of the sheet substrate is usually 20 nm or less, preferably 10 nm or less. It is difficult to manufacture the body. Therefore, in JP-A-7-36023, etc., an optical plastic sheet in which two sheets having a low birefringence are laminated is proposed. However, since such a sheet is a thermoplastic resin, its rigidity is small, and The chemical resistance is also greatly inferior. JP-A-6-116406 proposes an optical sheet in which a surface layer of a base sheet is coated with a curable resin, but such a sheet also swells with a solvent from the side of the sheet during substrate cleaning. As a result, there is a problem that the chemical resistance is poor and the rigidity of the substrate is not sufficient.
[0004]
Furthermore, in the field of optoelectronic devices, particularly high optical properties, gas barrier properties, electrical conductivity, mechanical strength, and the like are required. Therefore, a substrate having a multilayer structure composed of multiple layers or films having various functions is actually used. For example, JP-A-2-5308 proposes a laminate in which a cured film is provided on both sides of a plastic molded body, a conductive film is provided on one side, and a metal oxide film is provided on the other side. Yes. However, in this laminate, there is a problem that cracks during heating are likely to occur due to a difference in properties of each layer, a problem of adhesion, and the like in addition to the problem of the base sheet alone.
[0005]
On the other hand, it is a plastic sheet substrate useful as a glass substitute substrate. In order to increase the utility value, it is necessary not only to be lightweight but also to have flexibility. That is, when the substrate is bent (bent) with a certain curvature, it is necessary to maintain electrical conductivity without cracking the conductive film. However, the conventional plastic sheet substrate has a problem that its bending resistance is insufficient.
[0006]
[Problems to be solved by the invention]
In view of the above circumstances, an object of the present invention is to provide a plastic laminate having sufficient bending resistance as a substrate for liquid crystal element devices, touch panels, solar cells and the like.
[0007]
[Means for Solving the Problems]
As a result of intensive studies to solve the above-mentioned problems, the present inventors have noticed that various physical properties of a plastic laminate having a specific structure including a substrate sheet and a photocurable resin are remarkably excellent. Reached. That is, the present invention resides in a plastic laminate comprising the following three layers A, B and C, and the three layers are laminated in this order.
A: A photocurable resin obtained by curing a composition containing at least one bis (meth) acrylate selected from the following formulas (1) and (2) with active energy rays
Embedded image
[In formula (1), R1And R2May be different from each other and represent a hydrogen atom or a methyl group. R3And R4Are different from each other and represent a C 1-6 hydrocarbon group which may have an oxygen atom and / or a sulfur atom in the carbon chain. X represents a substituent selected from a halogen atom, an alkyl group having 1 to 6 carbon atoms, and an alkoxy group having 1 to 6 carbon atoms, and a represents an integer of 0 to 4. However, when a is an integer of 2 or more, a plurality of Xs may be different from each other. ]
Embedded image
[In formula (2), R5And R6May be different from each other and represent a hydrogen atom or a methyl group. b represents 1 or 2, and c represents 0 or 1. ]
B: Gas barrier film
C: A cured film obtained by curing a liquid curable composition containing a silicone resin or a silane coupling agent
[0008]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the plastic laminate of the present invention will be described in more detail.
(Photocurable resin layer)
A photocurable resin layer comprises the base material layer of the plastic laminated body of this invention. The photocurable resin that forms the photocurable resin sheet serving as the base material layer is a resin that is cured by irradiation with ultraviolet rays or the like. Specifically, a resin composition comprising an acrylate compound having a radical reactive unsaturated compound, a resin composition comprising this acrylate compound and a mercapto compound having a thiol group, epoxy acrylate, urethane acrylate, polyester acrylate, polyether acrylate, etc. Although the resin composition etc. which fuse | melted these oligomers to the polyfunctional acrylate monomer are mentioned, it is not limited to these.
[0009]
Among these, a composition comprising at least one bis (meth) acrylate selected from sulfur-containing bis (meth) acrylate represented by formula (1) and alicyclic skeleton bis (meth) acrylate represented by formula (2) is resistant. It is preferable in terms of chemical properties and rigidity. “(Meth) acrylate” is a generic term for acrylate or methacrylate.
[0010]
[Chemical 6]
[0011]
[In formula (1), R1And R2May be different from each other and represent a hydrogen atom or a methyl group. RThreeRepresents a hydrocarbon group having 1 to 6 carbon atoms which may have an oxygen atom and / or a sulfur atom in the carbon chain, preferably an alkylene group having 2 to 4 carbon atoms. RFourRepresents a hydrocarbon group having 1 to 6 carbon atoms, preferably an alkylene group having 1 to 3 carbon atoms, which may have an oxygen atom and / or a sulfur atom in the carbon chain. X represents a halogen atom, an alkyl group having 1 to 6 carbon atoms or an alkoxy group having 1 to 6 carbon atoms, and a represents an integer of 0 to 4. However, when a is an integer of 2 or more, a plurality of Xs may be different from each other. ]
Some examples of the compound represented by the formula (1) are as follows. p-bis (β-methacryloyloxyethylthiomethyl) benzene, p-bis (β-acryloyloxyethylthiomethyl) benzene, m-bis (β-methacryloyloxyethylthiomethyl) benzene, m-bis (β-acryloyloxy) Ethylthiomethyl) benzene, p-bis (β-methacryloyloxyethyloxyethylthiomethyl) benzene, p-bis (β-methacryloyloxyethylthioethylthiomethyl) benzene, p-bis (β-methacryloyloxyethylthiomethyl) Tetrabromobenzene, m-bis (β-methacryloyloxyethylthiomethyl) tetrachlorobenzene. These compounds can be synthesized, for example, by the method disclosed in JP-A No. 62-195357.
[0012]
Embedded image
[0013]
[In formula (2), RFiveAnd R6May be different from each other and represent a hydrogen atom or a methyl group. b represents 1 or 2, and c represents 0 or 1. ]
Some examples of the compound represented by formula (2) are as follows. Bis (oxymethyl) tricyclo [5.2.1.02 , 6Decane = diacrylate, bis (oxymethyl) tricyclo [5.2.1.0]2 , 6Decane = dimethacrylate, bis (oxymethyl) tricyclo [5.2.1.0]2 , 6] Decane = acrylate methacrylate, bis (oxymethyl) pentacyclo [6.5.1.1Three , 6. 02 , 7. 09 , 13] Pentadecane = diacrylate, bis (oxymethyl) pentacyclo [6.5.1.1.Three , 6. 02 , 7. 09 , 13] Pentadecane = dimethacrylate, bis (oxymethyl) pentacyclo [6.5.1.1.Three , 6. 02 , 7. 09 , 13] Pentadecane = acrylate methacrylate. These compounds can be synthesized, for example, by the method disclosed in JP-A-62-225508.
[0014]
The (meth) acrylates represented by the above formulas (1) and (2) can be used alone or in combination of two or more. When the compound of the formula (1) is used alone, the refractive index of the low birefringent plate obtained by the present invention is 1.54 to 1.65 at room temperature on the sodium D-line (589.3 mm), which is a high refractive index. Have Moreover, when using the compound of Formula (2) independently, it becomes comparatively low refractive index 1.47-1.51. Therefore, a low birefringence plate having a desired refractive index between 1.47 and 1.65 can be obtained by using two or more compounds represented by formula (1) and formula (2) in combination.
[0015]
The photo-curable resin can be used by polymerizing the above bis (meth) acrylate alone, but two or more in the molecule represented by the following formulas (3), (4) and (5) 0.1 to 20 parts by weight, more preferably 1 to 15 parts by weight, based on 80 to 99.1 parts by weight of bis (meth) acrylate, of at least one mercapto compound selected from mercapto compounds having a thiol group, Preferably, by blending 5 to 10 parts by weight, birefringence can be reduced and moderate toughness can be imparted. When the mercapto compound exceeds 20 parts by weight, the heat resistance is lowered, which is not preferable.
[0016]
[Chemical 8]
[0017]
[In formula (3), a plurality of R7May be different from each other and each represents a methylene group or an ethylene group. R8Represents a hydrocarbon residue having 2 to 15 carbon atoms, preferably 2 to 6 carbon atoms, which may contain an oxygen atom and / or a sulfur atom in the carbon chain. d shows the integer of 2-6. ]
That is, the compound represented by the formula (3) is a diester to hexaester of thioglycolic acid or thiopropionic acid and a polyol. Some examples are pentaerythritol tetrakis (β-thiopropionate), pentaerythritol tetrakis (thioglycolate), trimethylolpropane tris (β-thiopropionate), trimethylolpropane tris (thioglycolate). , Diethylene glycol bis (β-thiopropionate), diethylene glycol bis (thioglycolate), triethylene glycol bis (β-thiopropionate), triethylene glycol bis (thioglycolate), dipentaerythritol hexakis (β -Thiopropionate), dipentaerythritol hexakis (thioglycolate) and the like.
[0018]
[Chemical 9]
[0019]
[In Formula (4), Y may be different from each other, and HS— (CH2)e-(CO) (OCH2-CH2)f-(CH2)g-Is shown. However, e shows the integer of 1-4, f shows the integer of 1-4, g shows the integer of 0-2, respectively. ]
That is, the compound of formula (4) is a ω-SH group-containing triisocyanurate. Some examples are tris [2- (β-thiopropionyloxy) ethyl] isocyanurate, tris (2-thioglyconyloxyethyl) isocyanurate, tris [2- (β-thiopropionyloxyethoxy) ethyl]. Examples include isocyanurate, tris (2-thioglyconyloxyethoxyethyl) isocyanurate, tris [3- (β-thiopropionyloxy) propyl] isocyanurate, and tris (3-thioglyconyloxypropyl) isocyanurate.
[0020]
[Chemical Formula 10]
[0021]
[In formula (5), R9And RTenMay be different from each other and represents a hydrocarbon group having 1 to 3 carbon atoms. m and n each represents 0 or 1; p represents 1 or 2. ]
That is, the compound of Formula (5) is an α, ω-SH group-containing compound. Some examples include benzene dimercaptan, xylylene dimercaptan, 4,4'-dimercaptodiphenyl sulfide, and the like.
[0022]
Examples of other monomers used in the polymerization of the above photocurable resin include methyl (meth) acrylate, phenyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, and methacryloyloxymethyltetracyclohexane. Dodecane, methacryloyloxymethyltetracyclododecene, ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, 2,2-bis [4- (β-methacryloyloxy) (Methoxy) phenyl] propane, 2,2′-bis [4- (β-methacryloyloxyethoxy) cyclohexyl] propane, 1,4-bis (methacryloyloxymethyl) cyclohexane, trimethylolpropane tri (meth) acrylate, And nuclei such as acrylate compounds, styrene, chlorostyrene, divinylbenzene, α-methylstyrene, and / or side chain substituted and unsubstituted styrene. Among these other monomers, methacryloyloxymethylcyclododecane, 2,2-bis [4- (β-methacryloyloxyethoxy) phenyl] propane, 2,2-bis [4- (β-methacryloyloxyethoxy) cyclohexyl Propane, 1,4-bis (methacryloyloxymethyl) cyclohexane, and mixtures thereof are particularly preferred. Further, these may contain a small amount of an antioxidant, an ultraviolet absorber, a dye / pigment, a filler and the like.
[0023]
The above bis (meth) acrylate or a mixture of bis (meth) acrylate and a mercapto compound is cured by a known radical polymerization in which a photopolymerization initiator that generates radicals by active energy rays such as ultraviolet rays is added. Examples of the photopolymerization initiator used here include benzophenone, benzoin methyl ether, benzoin isopropyl ether, diethoxyacetophenone, 1-hydroxycyclohexyl phenyl ketone, 2,6-dimethylbenzoyldiphenylphosphine oxide, 2,4,6-trimethyl. Examples include benzoyldiphenylphosphine oxide. Preferred photoinitiators are 2,4,6-trimethylbenzoyldiphenylphosphine oxide and benzophenone. Two or more of these photopolymerization initiators may be used in combination.
[0024]
The addition amount of a photoinitiator is 0.01-1 weight part with respect to 100 weight part of monomers, Preferably it is 0.02-0.3 weight part. When the addition amount of the photopolymerization initiator is too large, the polymerization proceeds rapidly and not only causes an increase in birefringence but also deteriorates the hue. If the amount is too small, the composition cannot be cured sufficiently.
The amount of active energy rays to irradiate is arbitrary as long as the photopolymerization initiator generates radicals, but if it is extremely small, the polymerization is incomplete, so the heat resistance and mechanical properties of the cured product are fully expressed. On the contrary, when it is extremely excessive, deterioration of the cured product due to light such as yellowing occurs. Therefore, ultraviolet rays of 200 to 400 nm are preferably 0 according to the monomer composition and the type and amount of the photopolymerization initiator. Irradiate in the range of 1 to 200J. Specific examples of the lamp used include a metal halide lamp, a high-pressure mercury lamp, and the like.
[0025]
Thermal polymerization may be used in combination for the purpose of promptly completing the curing. That is, simultaneously with light irradiation, the composition and the entire mold are usually heated in the range of 30 to 300 ° C. In this case, a radical polymerization initiator may be added to complete the polymerization better, but excessive use leads to an increase in birefringence and a deterioration in hue. Specific examples of the thermal polymerization initiator include benzoyl peroxide, diisopropyl peroxycarbonate, t-butyl peroxy (2-ethylhexanoate), and the amount used is 1 part by weight or less based on 100 parts by weight of the monomer. Is preferred.
[0026]
Furthermore, after performing radical polymerization by light irradiation, the cured product can be heated to complete the polymerization reaction and reduce internal strain generated during the polymerization. The heating temperature is appropriately selected according to the composition of the cured product and the glass transition temperature. However, excessive heating causes deterioration of the hue of the cured product, and therefore, a temperature near or below the glass transition temperature is preferable.
[0027]
The photocurable resin sheet is formed by forming a cavity with a spacer or the like using two opposing flat plates (hereinafter referred to as “molding die”) that allow at least one surface to transmit active energy rays, and seal the periphery. A photocurable resin is injected into the injection mold, and the photocurable resin is cured by irradiation with active energy rays. The material of the molding die is preferably polished glass from the surface of the cured sheet, has sufficient transmission of active energy rays to cure the photocurable resin, and does not easily deform its shape due to heat or the like. Anything is acceptable. Moreover, plastics, such as an acrylic board which can obtain the surface property equivalent to polishing glass, etc. are mentioned.
[0028]
In addition, if necessary, it is possible to apply a release agent or the like on the mold, or to provide a release layer so that the cured photocurable resin sheet can be easily removed from the mold. The release agent to be used, the release layer, and the application method thereof are not particularly limited. However, the release agent, the release layer, and the application method thereof are substances having sufficient transmission of active energy rays to cure the photocurable resin. Any substance that does not easily deform its formation state due to active energy rays for curing, heat generated at the time of curing, or the like and that can obtain flatness equivalent to the glass surface may be used.
[0029]
The active energy ray is for curing the photocurable resin, and examples thereof include ultraviolet rays. The irradiation amount of an active energy ray should just be an amount which hardens the photocurable resin to be used. The spacer for forming the cavity is not particularly limited as long as a desired sheet thickness can be obtained. Examples thereof include a rubber plate such as silicon rubber, a metal plate or rod shape, and a resin plate or rod shape such as Teflon.
(Gas barrier film)
Examples of the film in the present invention include an inorganic oxide film, or a gas barrier resin layer such as an ethylene-vinyl alcohol copolymer (for example, Eval brand name Eval, Soarnol), vinylidene chloride, and preferably an inorganic oxide film. It is a material film. Inorganic oxides are metal, non-metal, and sub-metal oxides. Specific examples include aluminum oxide, zinc oxide, antimony oxide, indium oxide, calcium oxide, cadmium oxide, silver oxide, gold oxide, and chromium oxide. , Silicon oxide, cobalt oxide, zirconium oxide, tin oxide, titanium oxide, iron oxide, copper oxide, nickel oxide, platinum oxide, palladium oxide, bismuth oxide, magnesium oxide, manganese oxide, molybdenum oxide, vanadium oxide, barium oxide, etc. Among them, silicon oxide is particularly preferable. The inorganic oxide may contain trace amounts of metals, non-metals, sub-metals alone or their hydroxides, and carbon or fluorine as appropriate in order to improve flexibility. Examples of the method for forming the gas barrier layer include a method of coating a resin and the like, and a method of forming a vapor deposition film made of an inorganic oxide. As a method for forming the deposited film, a conventionally known method such as a vacuum deposition method, a vacuum sputtering method, an ion plating method, a CVD method, or the like can be used.
[0030]
The thickness of the above gas barrier film is not particularly limited and varies depending on the type of constituents of the gas barrier film, but considering the oxygen gas barrier property, water vapor barrier property, and economic efficiency, the thickness of the film is 5 to 50 nm. preferable. In order to obtain higher oxygen gas barrier properties and water vapor barrier properties, the thickness of the film may be increased. However, if the thickness of the film is less than 5 nm, there is a possibility that the film may be island-like and the film may not be formed. And there is a tendency that a uniform film cannot be obtained.
(Curing coating)
The cured film in the present invention is not particularly limited as long as it is an organic compound-based cured film, but is formed from a hard coat agent, an anchor coat agent (primer coat agent) or the like. As a specific example, as a hard coat agent, an acrylate or polyfunctional acrylate such as polyurethane acrylate or epoxy acrylate, a photopolymerization initiator, and an organic solvent as main components can be used. Examples of the anchor coating agent include known anchor coating agents such as isocyanate, polyurethane, polyester, polyethyleneimine, polybutadiene, and alkyl titanate. These resins can be used alone or in combination of two or more, and can also be three-dimensionally crosslinked using various curing agents, crosslinking agents and the like.
[0031]
In order to more specifically exemplify a particularly preferable cured film, in consideration of various properties such as surface hardness, heat resistance, chemical resistance, transparency, it is preferable to use a silicone resin as the organic polymer, In particular, an active energy ray-curable composition containing a silane coupling agent having an acryloyl group or a methacryloyl group is suitable. When an active energy ray-curable composition containing a silane coupling agent having an acryloyl group or a methacryloyl group is used, the adhesion between the gas barrier film made of a metal oxide or the like and the cured film is improved, and the gas barrier property is improved. Especially improved. The reason for this is not clear, but the improvement in adhesion is caused by a reaction between the silane coupling agent and other metal film formation in which the silane coupling agent coexists with the acryloyl group and methacryloyl group. This is considered to be caused by firmly bonding the cured film to the metal oxide thin film. Further, the improvement of gas barrier property is due to the fact that the gap between the metal oxide particles constituting the metal oxide thin film is filled with a silane coupling agent or a film forming component that has reacted with the acryloyl group or methacryloyl group. Conceivable.
[0032]
The silane coupling agent only needs to have at least one of an acryloyl group and a methacryloyl group, but those having an acryloyl group having a high reaction rate are preferred. For example, if a silane coupling agent having only an isocyanate group or a mercapto group as a reactive group and no acryloyl group or methacryloyl group is used, the adhesion is not improved. This is thought to be due to the fact that the bond between the silane coupling agent and the metal oxide thin film is formed, but this silane coupling agent is difficult to be incorporated into the film by reacting with other film formations in which the silane coupling agent coexists. It is.
[0033]
Examples of the silane coupling agent having an acryloyl group or a methacryloyl group include γ-acryloxypropyltrimethoxysilane, γ-methacryloxypropyltrimethoxysilane, γ-acryloxypropyltriethoxysilane, and γ-methacryloxypropyltriethoxysilane. Γ-acryloxypropylmethyldimethoxysilane, γ-acryloxypropylmethyldiethoxysilane, γ-methacryloxypropylmethyldimethoxysilane, γ-methacryloxypropylmethyldiethoxysilane, γ-acryloxypropyl-tris (β-methoxy) Ethoxy) silane, γ-methacryloxypropyl-tris (β-methoxyethoxy) silane and the like.
[0034]
These silane coupling agents usually occupy 0.1 to 60% by weight, preferably 0.2 to 45% by weight in the active energy ray-curable composition. If the amount of the silane coupling agent is too small, the adhesion between the cured film and the metal oxide thin film is not sufficiently exhibited. This is presumably because the amount of functional groups that react with the metal oxide thin film in the composition is not sufficient. On the other hand, if the silane coupling agent is present in excess, the alkali resistance of the cured film may be lowered. This is presumably because a large amount of the silane coupling agent that does not react with the metal oxide thin film remains in the cured film and reacts with the alkali.
[0035]
The active energy ray-curable composition is composed of ordinary monomers, oligomers, polymers, and the like that are polymerized by irradiation with active energy rays to form a cured film, except that a silane coupling agent is included. For example, monomers and oligomers such as epoxy (meth) acrylate, urethane (meth) acrylate, and polyester (meth) acrylate are used. Some of these include trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, pentaerythritol triacrylate, pentaerythritol trimethacrylate, pentaerythritol tetraacrylate, pentaerythritol tetramethacrylate, dipentaerythritol hexaacrylate, dipentaerythritol hexaacrylate. Examples thereof include monofunctional and polyfunctional acrylic monomers, methacrylic monomers, and vinyl monomers having one or more carbon-carbon double bonds, such as methacrylate, isoamyl acrylate, ethoxydiethylene glycol acrylate, methoxydiethylene glycol acrylate, and N-vinylpyrrolidone. The active energy ray-curable composition may contain a known additive such as an ultraviolet absorber or a thermal polymerization inhibitor.
[0036]
In order to form a cured film with an active energy ray-curable composition, the active energy ray-curable composition is applied by various application methods such as a gravure coating method, a reverse coating method, and a die coating method, and irradiated with active energy rays. What is necessary is just to harden. At this time, preliminary heating may be performed after application and before curing. When the active energy ray-curable composition is diluted with a solvent, the solvent must be removed in this preheating step.
[0037]
The composition is preferably applied as a liquid composition after diluting with a volatile solvent. Although what is apply | coated as a solvent is not specifically limited, It is requested | required not to impair the surface property of a to-be-coated article in use. Furthermore, the solvent should be determined in consideration of the stability of the composition, the wettability with respect to the substrate, the volatility, and the like. Further, the solvent can be used not only as one type but also as a mixture of two or more types. Examples of the solvent include alcohols, esters, ethers, ketones, halogenated hydrocarbons, aromatic hydrocarbons such as toluene and xylene, and aprotic polar solvents.
[0038]
The purpose of the cured film is to improve surface hardness, adjust the refractive index, improve mechanical strength, improve thermal properties, improve the durability of the metal oxide film and transparent conductive film provided on the cured film, etc. Inorganic fine particles are added. Such inorganic fine particles are not particularly limited as long as they do not impair transparency in a coating state. Particularly preferred examples from the viewpoint of improving workability and imparting transparency include colloidally dispersed sols. More specific examples include silica sol, antimony oxide sol, titania sol, alumina sol, zirconia sol, tungsten oxide sol, and the like. The addition amount of the inorganic fine particles is not particularly limited, but in order to make the effect more remarkable, it is preferably contained in the transparent film in an amount of 1% by weight to 80% by weight. If it is less than 1% by weight, it is difficult to clearly see the effect of addition, and if it exceeds 80% by weight, problems such as poor adhesion to the transparent resin and cracks in the coating itself occur, resulting in reduced impact resistance. There is a case. The particle size of the inorganic fine particles is not particularly limited, but preferably 1 to 300 mμ, more preferably 5 to 100 mμ. When a particle having an average particle diameter exceeding 300 mμ is used, the resulting coating film has poor transparency and tends to become turbid. Moreover, in order to improve the dispersibility of the fine inorganic particles, various fine particle surface treatments may be performed, and various surfactants and amines may be added without any problem.
[0039]
Various curing agents may be used in combination with the coating composition used at the time of forming the cured film for the purpose of enabling curing acceleration or low-temperature curing. As the curing agent, various epoxy resin curing agents or various organosilicon resin curing agents are used. Specific examples of these curing agents include various salts such as various organic acids and acid anhydrides, nitrogen-containing organic compounds, various metal complex compounds, metal alkoxides, alkali metal organic carboxylates and carbonates, and peroxides. Examples include oxides and radical polymerization initiators such as azobisisobutyronitrile. These curing agents can be used in combination of two or more. Among these curing agents, aluminum chelate compounds are particularly useful from the viewpoints of the stability of the coating composition and the presence or absence of coloring of the coated film.
[0040]
Examples of the aluminum chelate compound herein include, for example, the general formula AIXn Y3-n It is an aluminum chelate compound shown by these. However, X in a formula is OL (L shows a lower alkyl group), Y is general formula M1 COCH2 COM2 (M1, M2 And a ligand derived from a compound represented by the general formula MThree COCH2 COOMFour (MThree , MFour Are at least one selected from a ligand derived from a compound represented by (lower alkyl group), and n is 0, 1 or 2. General formula AlXnY3-n Examples of the aluminum chelate compound represented by the formula (1) include various compounds, and aluminum acetylacetonate and aluminum bisethyl are particularly preferable from the viewpoints of solubility in the composition, stability, and effect as a curing catalyst. Examples include acetoacetate monoacetylacetonate, aluminum-di-n-butoxide-monoethylacetoacetate, aluminum-di-iso-propoxide-monomethylacetoacetate, and the like. These may be used in combination of two or more.
[0041]
Various surfactants may be added to the coating composition used for forming the cured film for the purpose of improving the flow during application and improving the smoothness of the transparent film and reducing the coefficient of friction of the film surface. Is possible. As the surfactant, a block or graft copolymer of dimethylpolysiloxane and alkylene oxide, a fluorine-based surfactant, and the like are particularly effective.
[0042]
In the coating composition used at the time of forming the cured film, inorganic oxides other than the inorganic fine particles can be added to the extent that the film performance and transparency are not significantly reduced. By using these additives in combination, various properties such as adhesion to the substrate, chemical resistance, surface hardness, and durability can be improved. Examples of the inorganic material that can be added include metal alkoxides, chelate compounds and / or hydrolysates thereof represented by the following general formula (C).
[0043]
M (OR) m (C)
Here, M is silicon, titanium, zircon, antimony, tantalum, germanium, aluminum or the like. R is an alkyl group, an acyl group, or an alkoxyalkyl group. m is the same value as the number of charges of the metal M.
The cured film is obtained by curing the coating composition, and curing is performed by heat treatment. The heating temperature is appropriately selected in consideration of the composition of the coating composition and the heat resistance of the transparent crosslinked resin, but is preferably 50 to 250 ° C. As a method for applying the coating onto the transparent resin, a commonly applied application method such as brush coating, dip coating, roll coating, spray coating, spin coating, or flow coating can be easily used. In applying the coating composition, it is also an effective means to perform various pretreatments for the purpose of improving cleaning, adhesion, water resistance and the like. Particularly preferable pretreatments include activated gas treatment, chemical treatment, and ultraviolet treatment. These pretreatments can be sufficiently carried out in combination continuously or stepwise.
[0044]
The film thickness of the cured film is not particularly limited, but is usually 0.1 to 50 μm, preferably 0.3 to 10 μm, from the viewpoints of maintaining adhesive strength and hardness. In coating the coating composition, the coating composition is diluted with various solvents for the purpose of workability and film thickness adjustment. As the diluting solvent, for example, water, alcohol, ester, ether, halogenated hydrocarbon, dimethylformamide, dimethyl sulfoxide and the like can be used in various ways depending on the purpose, and a mixed solvent can be used as necessary. is there. From the viewpoint of dispersibility of the fine particle inorganic oxide, polar solvents such as water, alcohol, dimethylformamide, ethylene glycol, diethylene glycol, triethylene glycol, benzyl alcohol, phenethyl alcohol, and phenyl cellosolve are preferably used.
(Conductive film)
In the plastic laminate of the present invention, a laminate in which a conductive film is laminated on a photocurable resin layer is preferably used as a liquid crystal display device substrate. Examples of the conductive material forming the conductive film include indium oxide, tin oxide, gold, silver, copper, nickel, and the like, and these can be used alone or in combination of two or more. Of these, indium tin oxide (hereinafter referred to as “ITO”) composed of a mixture of 99 to 90% indium oxide and 1 to 10% tin oxide is particularly preferable from the viewpoint of the balance between transparency and conductivity. The method for forming the transparent conductive film can be performed using a conventionally known vacuum deposition method, sputtering method, ion plating method, chemical vapor deposition method, or the like. Of these, the sputtering method is preferable from the viewpoint of adhesion. The thickness of the above transparent conductive film is usually preferably in the range of 500 to 2000 mm from the viewpoint of the balance between transparency and conductivity.
[0045]
Moreover, in order to be suitably used as a plastic laminate having a high bending resistance for a substrate in the field of optoelectronics such as a liquid crystal display device and a touch panel, the hardness of the conductive film is 2 GP or more and / or the stiffness is 1. If the plastic laminate has a modulus (Young's modulus) of 15 GP or more, generally, even if the laminate is bent, the conductive film does not crack and the electrical resistance value is deteriorated. do not do. Preferably, the hardness is 3 GP or more, or / or the stiffness is 1.5 μN / nm or more, or / or the modulus (Young's modulus) is 20 GP or more.
[0046]
In general, it is said that an internal stress is generated in a formed film due to a difference in thermal expansion coefficient between the base material (underlying) and the film, and if it is large, the film is likely to crack. Various methods are known for measuring the internal stress of the film, but cannot be applied to the plastic laminate for the following various reasons.
(B) Measurement of the amount of deflection of the substrate after film formation is uncertain in the case of a plastic substrate because it is affected by heat and the like.
(B) The method of obtaining from the lattice constant and the face spacing of the crystal peak of thin film X-ray diffraction cannot be measured when the film is amorphous.
(C) Measurement by Raman scattering is difficult because the base material is plastic.
[0047]
Moreover, although the internal stress of the film is related to the occurrence of cracks at rest after film formation or the like, other factors are included in the occurrence of cracks when the plastic laminate is bent. One of them is good or bad film followability with respect to the substrate sheet when the plastic laminate is bent. If the followability of the film to the base sheet is poor, cracks are likely to occur. As an evaluation of its physical properties, hardness and elasticity can be considered, and it can be directly characterized as an influencing factor of the presence or absence of cracks in the film due to bending.
[0048]
In order to set the physical properties such as hardness of the conductive film to a specific value or more, the properties of the conductive film may be controlled, but the layer structure in the laminate and the properties of layers other than the conductive film also have a great influence. Note that since the substrate is plastic, the upper limit of the film formation temperature is low, and the physical properties of the conductive film are limited even if other film formation conditions are changed. On the other hand, it is relatively easy to change the physical properties of the cured film in a wide range such as changing the formulation and curing conditions.
(Layer structure of the laminate)
In the plastic laminate of the present invention, the above-mentioned photocurable resin (A), gas barrier film (B), and cured film (C) are laminated in this order, and in particular, a conductive film is formed on the photocurable resin layer. Are laminated. The most basic configuration of the laminate having such a configuration is shown in FIG. In addition, the plastic laminate of the present invention is not limited to that shown in FIG. 1, and further comprises a gas barrier film interposed between the photocurable resin layer and the conductive film, and the photocurable property shown in FIG. 2. The configuration of FIG. 3 in which a cured film is interposed between the resin layer and the conductive film, and the configuration of FIG. 4 in which a gas barrier film is interposed between the cured film and the conductive film are illustrated.
[0049]
When the gas barrier layer (B) is directly laminated on the photo-curing resin (A), the gas barrier property is improved. However, when the laminate is handled by the contact of A and B, the gas barrier layer is rubbed or scratched. In this case, the barrier property may be greatly reduced. When the cured film (C) is laminated on the gas barrier layer, not only the gas barrier property is further improved, but even if rubbing or scratching occurs during handling, the gas barrier property is hardly lowered, resulting in a stable gas barrier property. Can be given.
[0050]
When a liquid crystal display element is formed by laminating a conductive film on the laminate of the present invention, gas does not enter the cell, the liquid crystal is deteriorated, and bubbles are not generated in the cell. Furthermore, by putting a gas barrier film on the eye stage of the conductive film and the cured resin layer, the barrier property can be further improved, and as a result, the heat resistance of the conductive film can be improved. In addition, when a cured film is inserted between the conductive film and the photo-curing resin, the adhesion of the conductive film is improved and the ITO film is not peeled off, which is desirable. Furthermore, when a gas barrier film is inserted between the cured film and the conductive film, not only the gas barrier film is directly laminated on the cured resin layer, but also the heat resistance of the film is improved. It may be particularly preferable.
(Properties of laminate)
The plastic laminate of the present invention preferably has a light transmittance of 80% or more at a light wavelength of 550 nm. If the light transmittance is less than 80%, in the case of color display or the like, the screen becomes dark and difficult to use, and tends to be used only for applications such as monochrome display elements. Further, the birefringence of the plastic laminate is preferably 20 nm or less, particularly preferably 10 nm or less. When the thickness is larger than 20 nm, color unevenness of the display screen tends to occur when the display panel is used.
[0051]
On the other hand, the thickness of the plastic laminate is preferably 0.10 to 2.00 mm. Although the transparent conductive sheet has a large flexural modulus, if it is less than 0.10 mm, the sheet tends to bend due to its own weight, and there is a tendency that the manufacturing process of a liquid crystal display device using a conventional glass substrate cannot be used, and exceeds 2.00 mm. And it becomes the same weight as the conventional glass substrate of 1.5-0.7 mm, and will deviate from the objective of weight reduction.
[0052]
As an application example of the plastic laminate of the present invention, for example, when it is used as a substrate for a liquid crystal display device, it usually has a configuration in which liquid crystal is sandwiched between plastic laminates. Further, a manufacturing process is performed in which a liquid crystal layer is held by a substrate on which an insulating film is provided on a conductive film of a plastic laminate, and an alignment film is provided on the insulating film as necessary. A deflection plate is provided outside the substrate holding the liquid crystal layer. In addition, the electroluminescence display element is typically exemplified by a structure in which a light emitting layer, an insulating layer, and a back electrode are sequentially formed on the plastic laminate of the present invention, and the whole is covered with a gas barrier layer. In this case, zinc sulfide, cadmium sulfide, zinc selenide or the like is used for the light emitting layer, yttrium oxide, thallium oxide, silicon nitride or the like is used for the insulating layer, and aluminum or the like is used for the back electrode.
[0053]
【Example】
Hereinafter, the contents and effects of the present invention will be described in more detail with reference to examples. However, the present invention is not limited to the following examples unless it exceeds the gist. Moreover, the plastic laminated body obtained by the Example and the comparative example was evaluated with the following method.
<Thickness of film>
Regarding the gas barrier film and the conductive film of the laminate obtained by Examples and Comparative Examples, the cross section of the laminate was observed with a transmission electron microscope (H-600 type, manufactured by Hitachi, Ltd.), and the thickness of the thin film was measured. .
<Surface resistance value of conductive film>
The surface resistance value was measured using a 4-terminal resistance measuring instrument (Lorestar MP) manufactured by Mitsubishi Chemical Corporation.
<Bend resistance test of conductive film>
A plastic laminate with a size of 5 × 10 cm is wound around a stainless steel tube of φ25 mm along the long side with the conductive film on the inside, and then wound with the conductive film on the outside. The presence or absence of occurrence was examined, and the surface resistance value was measured by the above method.
<Indent test of conductive film>
Using a PicoIndenter manufactured by Hystron, with a load (μN) that makes the indenter indentation about 1 / 10th of the film thickness, indentation (indenter indentation) is performed once for 10 seconds and measured 5 times per sample. The average value was obtained. In each measurement, a sufficient distance between the measurement points was taken so that the influence of the indentation would not occur. Moreover, the sample was fully fixed to the sample stage.
<Heat resistance>
In the bigat softening test, the measurement conditions were an indenter cross-sectional area of 1.0 mm, a load of 5 kg, a heating rate of 50 ° C./hr, 120 ° C. or less, and an indenter of 0.4 mm or more, x, 0.2 to 0.4 mm The one that entered was Δ, and the one that was less than 0.1 mm and hardly entered was rated ○.
<Birefractive index>
An in-plane birefringence was measured at a wavelength of 632.8 nm using a birefringence measuring apparatus (ADR100, manufactured by Oak Seisakusho).
<Light transmittance>
The transmittance at a wavelength of 550 nm was measured using a spectrophotometer manufactured by Hitachi, Ltd.
<Roughness of ITO film surface (Ra)>
Using a surface roughness measuring instrument (Surf Comb 575A, manufactured by Tokyo Seimitsu Co., Ltd.), diamond needle (1 μm R, 90 ° cone), measuring length 0.5 mm, cutoff value 0.16 mm, measuring speed 0.06 mm / Measured under the conditions of sec and linear correction.
Example 1
Bisoxymethyltricyclo [5.2.1.02,6] Uniform mixing and stirring of 100 parts by weight of decanedimethacrylate, 0.05 part by weight of 2,4,6-trimethylbenzoyldiphenylphosphine oxide (“Lucirin TPO” manufactured by BASF) and 0.05 part by weight of benzophenone as a photoinitiator And then defoamed to obtain a composition. This composition was poured into an optical polishing glass mold using a silicon plate having a thickness of 0.4 mm as a spacer, and 40 J / cm was applied to the glass mold surface with a metal halide lamp having an output of 80 W / cm on the glass surface.2The glass mold was released after irradiation so as to obtain an energy of 1 to obtain a photocurable resin sheet having a thickness of about 0.4 mm.
[0054]
The resulting cured resin sheet (A) was subjected to an argon gas total pressure of 6.7E using an RF sputtering machine manufactured by ULVAC.-1A silicon oxide thin film (B) having a thickness of 10 nm was formed using Pa and the target material SIO. Further, the following components a, b, c, and d are mixed on the layer (B) in proportions of 62, 38, 5, and 0.3%, respectively, diluted with propylene glycol monomethyl ether, and applied by spin coating. 5 J / cm with a metal halide lamp with an output of 80 W / cm2The cured film (C) was laminated by irradiating so as to have the following energy.
Component a; bisoxymethyltricyclo [5.2.1.02,6 ] Decane diacrylate, Iupimer UV SA-1002 manufactured by Mitsubishi Chemical Corporation
Dicyclopentanyl diacrylate, Kayrad R684 manufactured by Nippon Kayaku Co., Ltd.
Component b: Trimethylolpropane triacrylate and epoxy acrylate mixture, Nippon Kayaku Kayrad R130
Component c: a mixture of 1-hydroxycyclohexyl phenyl ketone and bis (2,6-dimethoxybenzoyl) -2,4,4-trimethylpentylphosphine oxide, Irgacure 1800 manufactured by Ciba Geigy Japan
Component d: Polyether-modified silicon, granol 450 manufactured by Kyoeisha Chemical Co., Ltd.
When the oxygen transmission rate of the laminate having the layer configuration of A / B / C was measured under the conditions of 23 ° C. and 80% humidity using an oxygen mocon measuring device manufactured by Oxytran, the oxygen barrier was 0.1 cc / m.2-It was below day. For comparison, the oxygen permeability of the cured resin sheet (A) was measured to be 16 cc / m.2Day, and the oxygen transmission rate of the laminate having the same A / B layer configuration is 1.5 cc / m.2-It was day.
[0055]
Next, a cured coating (C) composed of the same components a, b, c and d as above is laminated on the surface of the A layer side of the laminate having the A / B / C layer structure, and then the same machine And oxygen partial pressure 1E-2Pa, total pressure 6.7E-1An ITO film having a thickness of 120 nm was formed using Pa and a target material ITO (ratio of tin oxide to indium oxide 95: 5) to obtain a plastic laminate. The evaluation results of the laminate are shown in Table-1. Further, the heat resistance, birefringence, light transmittance, and roughness of the ITO film surface of the laminate were measured, but all were good.
Example 2
A plastic laminate was obtained in the same manner as in Example 1 except that the order of lamination was changed to the order of ITO film, photocurable resin sheet, silicon oxide thin film, and cured film. The evaluation results of the laminate are shown in Table-1. Further, the heat resistance, birefringence, light transmittance, and roughness of the ITO film surface of the laminate were measured, but all were good.
Example 3
A plastic laminate was obtained in the same manner as in Example 1 except that the silicon oxide thin film and the ITO film were formed using a DC sputtering machine manufactured by ULVAC. The evaluation results of the laminate are shown in Table-1. Further, the heat resistance, birefringence, light transmittance, and roughness of the ITO film surface of the laminate were measured, but all were good.
[0056]
[Table 1]
[0057]
【The invention's effect】
The plastic laminate of the present invention has excellent chemical resistance and rigidity, can use the conventional glass substrate process, and has excellent chemical resistance of the substrate, so that the transparent conductive film can be peeled off and cracked. It has a particularly advantageous effect that it does not occur, is lighter than those using a glass substrate, and has excellent impact resistance, and its industrial utility value is extremely large.
[0058]
The plastic laminate of the present invention is preferably used as a substrate for a liquid crystal display device, and includes a simple matrix type such as TN (Twisted Nematic type), STN (Super Twisted Nematic type, ferroelectric liquid crystal) FLC (Ferroelectric Liquid Cristal) type, MIM ( It can be applied to liquid crystal display devices such as active matrix type such as Metal-Insulator-Metal type and TFT (Thin-Film Transistor) type.
[Brief description of the drawings]
FIG. 1 shows one embodiment of the plastic laminate of the present invention.
FIG. 2 shows one embodiment of the plastic laminate of the present invention.
FIG. 3 shows one embodiment of the plastic laminate of the present invention.
FIG. 3 shows an embodiment of the plastic laminate of the present invention.
[Explanation of symbols]
A: Photocurable resin
B: Gas barrier film
C: Cured film
I: Conductive film
Claims (13)
A:下式(1)及び(2)より選ばれる少なくとも1種のビス(メタ)アクリレートを含む組成物を活性エネルギー線により硬化させてなる光硬化性樹脂
B:ガスバリア膜
C:シリコーン系樹脂またはシランカップリング剤を含む液状硬化性組成物を硬化させてなる硬化被膜A plastic laminate comprising the following three layers A, B and C, and three layers laminated in this order.
A: A photocurable resin obtained by curing a composition containing at least one bis (meth) acrylate selected from the following formulas (1) and (2) with active energy rays
B: Gas barrier film C: Cured film formed by curing a liquid curable composition containing a silicone resin or a silane coupling agent
なることを特徴とするプラスチック積層体。
I:導電膜
A:下式(1)及び(2)より選ばれる少なくとも1種のビス(メタ)アクリレートを含む組成物を活性エネルギー線により硬化させてなる光硬化性樹脂
B:ガスバリア膜
C:シリコーン系樹脂またはシランカップリング剤を含む液状硬化性組成物を硬化させてなる硬化被膜A plastic laminate comprising the following four layers I, A, B and C, and four layers laminated in this order.
I: conductive film A: a photocurable resin obtained by curing a composition containing at least one bis (meth) acrylate selected from the following formulas (1) and (2) with active energy rays
B: Gas barrier film C: Cured film formed by curing a liquid curable composition containing a silicone resin or a silane coupling agent
I:導電膜
A:下式(1)及び(2)より選ばれる少なくとも1種のビス(メタ)アクリレートを含む組成物を活性エネルギー線により硬化させてなる光硬化性樹脂
B:ガスバリア膜
C:シリコーン系樹脂またはシランカップリング剤を含む液状硬化性組成物を硬化させてなる硬化被膜A plastic laminate comprising the following five layers I, B, A, B, and C, and five layers laminated in this order.
I: conductive film A: a photocurable resin obtained by curing a composition containing at least one bis (meth) acrylate selected from the following formulas (1) and (2) with active energy rays
B: Gas barrier film C: Cured film formed by curing a liquid curable composition containing a silicone resin or a silane coupling agent
I:導電膜
A:下式(1)及び(2)より選ばれる少なくとも1種のビス(メタ)アクリレートを含む組成物を活性エネルギー線により硬化させてなる光硬化性樹脂
B:ガスバリア膜
C:シリコーン系樹脂またはシランカップリング剤を含む液状硬化性組成物を硬化させてなる硬化被膜A plastic laminate comprising the following five layers I, C, A, B, and C, and five layers laminated in this order.
I: conductive film A: a photocurable resin obtained by curing a composition containing at least one bis (meth) acrylate selected from the following formulas (1) and (2) with active energy rays
B: Gas barrier film C: Cured film formed by curing a liquid curable composition containing a silicone resin or a silane coupling agent
I:導電膜
A:下式(1)及び(2)より選ばれる少なくとも1種のビス(メタ)アクリレートを含
む組成物を活性エネルギー線により硬化させてなる光硬化性樹脂
B:ガスバリア膜
C:シリコーン系樹脂またはシランカップリング剤を含む液状硬化性組成物を硬化させてなる硬化被膜A plastic laminate comprising the following six layers I, B, C, A, B and C, and six layers laminated in this order.
I: conductive film A: a photocurable resin obtained by curing a composition containing at least one bis (meth) acrylate selected from the following formulas (1) and (2) with active energy rays
B: Gas barrier film C: Cured film formed by curing a liquid curable composition containing a silicone resin or a silane coupling agent
H2)f−(CH2)g−を示す。但しeは1〜4の整数、fは1〜4の整数、gは0〜2の整数をそれぞれ示す。]
H 2) f - (CH 2 ) g - shows a. However, e shows the integer of 1-4, f shows the integer of 1-4, g shows the integer of 0-2, respectively. ]
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP00450798A JP3658962B2 (en) | 1998-01-13 | 1998-01-13 | Plastic laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP00450798A JP3658962B2 (en) | 1998-01-13 | 1998-01-13 | Plastic laminate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11314313A JPH11314313A (en) | 1999-11-16 |
| JP3658962B2 true JP3658962B2 (en) | 2005-06-15 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP00450798A Expired - Fee Related JP3658962B2 (en) | 1998-01-13 | 1998-01-13 | Plastic laminate |
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| JP (1) | JP3658962B2 (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002270880A (en) * | 2001-03-14 | 2002-09-20 | Shin Etsu Handotai Co Ltd | Solar cell module and method of manufacturing the same |
| JP2002368243A (en) * | 2001-06-11 | 2002-12-20 | Bridgestone Corp | Solar battery |
| JP4526794B2 (en) * | 2003-08-11 | 2010-08-18 | 三菱レイヨン株式会社 | Acrylic resin plate manufacturing method, transparent electrode plate for touch panel, and touch panel |
| JP4488783B2 (en) * | 2004-04-08 | 2010-06-23 | 尾池工業株式会社 | Transparent conductive film |
| JP4673038B2 (en) * | 2004-11-02 | 2011-04-20 | 三菱レイヨン株式会社 | Acrylic resin laminate, transparent electrode plate, and touch panel manufacturing method |
| KR20090057292A (en) * | 2006-08-31 | 2009-06-04 | 내셔날 인스티튜트 오브 어드밴스드 인더스트리얼 사이언스 앤드 테크놀로지 | Transparent Electrode Substrate for Solar Cell |
| JP2008085323A (en) * | 2006-08-31 | 2008-04-10 | National Institute Of Advanced Industrial & Technology | Transparent electrode substrate for solar cell |
| CN104508830A (en) * | 2012-07-19 | 2015-04-08 | 日立化成株式会社 | Composition for forming passivation layer, semiconductor substrate with passivation layer, method for manufacturing semiconductor substrate with passivation layer, solar cell element, method for manufacturing solar cell element, and solar cell |
| TWI608007B (en) * | 2012-07-19 | 2017-12-11 | 日立化成股份有限公司 | A composition for forming a passivation layer for a solar cell, a semiconductor substrate with a passivation layer for a solar cell, a method for producing a semiconductor substrate with a passivation layer for a solar cell, a solar cell element, a method for producing a solar cell element, a solar cell, and a use |
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| JPH11314313A (en) | 1999-11-16 |
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