JPH05326701A - Semiconductor pellet and semiconductor device using the same - Google Patents

Abstract

(57) [Abstract] [PROBLEMS] To provide a semiconductor pellet and a semiconductor device using the same, which can reduce assembly failure due to pellet standing in the semiconductor device assembling process. [Structure] A semiconductor pellet used for a glass diode, wherein the pellet cutting surface 2 of the semiconductor pellet 1 is
In order to make it difficult to stand on the basis of the pellet cutting surface 2, the pellet cutting surface 2 is provided obliquely to the pellet electrode surface 3. For example, it is formed by dicing so that the wafer plane fixed on the wafer stage, that is, the positional relationship between the pellet electrode surface 3 and the dicing blade is inclined.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor pellet for a semiconductor device, and particularly, in the process of assembling the semiconductor device,
The present invention relates to a semiconductor pellet capable of reducing defective assembly due to standing of a pellet and a technique effectively applied to a semiconductor device using the same.

[0002]

2. Description of the Related Art Conventionally, as a semiconductor device requiring a semiconductor pellet after dicing, for example, in a glass diode, a semiconductor pellet whose cut surface after dicing is perpendicular to a pellet electrode surface is used for assembly. There is.

An example of this type of assembly technique is the technique described in "LSI Handbook" P406 to P416, published by the Institute of Electronics and Communication Engineers, November 30, 1984.

[0004]

However, in the above-mentioned prior art, no consideration is given to preventing the semiconductor pellets from standing during the assembly of the semiconductor device. However, there is a problem in that the semiconductor pellets stand up below the pellet cutting surface, and assembly defects easily occur.

In view of this, the present inventor has noticed that, in assembling a semiconductor device, if the pellet cutting surface after dicing is not a surface perpendicular to the pellet electrode surface, the semiconductor pellets tend to fall over. It has been found that pellet standing defects can be reduced by not making the surface perpendicular to the pellet electrode surface.

That is, an object of the present invention is to provide a semiconductor pellet and a semiconductor device using the same, which can reduce the assembly failure due to the pellet standing in the assembly process of the semiconductor device.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0008]

Among the inventions disclosed in the present application, a brief description will be given to the outline of typical ones.
It is as follows.

That is, in the semiconductor pellet of the present invention, in the dicing process of the semiconductor device, the pellet cutting surface after dicing is not made perpendicular to the pellet electrode surface,
The pellet cutting surface is provided so that it is difficult to stand the semiconductor pellet on the basis of the pellet cutting surface.

In the semiconductor device of the present invention, the semiconductor pellets are used, and when the semiconductor device is assembled, the leads for external connection are connected so as to sandwich the pellet electrode surface.

[0011]

According to the above-mentioned semiconductor pellet and the semiconductor device using the same, the pellet cutting surface which makes it difficult to stand the semiconductor pellet is provided.
When assembling the semiconductor pellets, the semiconductor pellets fall down by themselves, so that defective assembly of the semiconductor device due to standing of the pellets can be reduced.

[0012]

[Embodiment 1] FIG. 1 is a side view showing a semiconductor pellet which is an embodiment of the present invention, FIG. 2 is an explanatory view showing a method for manufacturing a semiconductor pellet of the present embodiment, and FIG. 3 is a semiconductor pellet of the present embodiment. It is sectional drawing which shows the used semiconductor device.

First, the structure of the semiconductor pellet of this embodiment will be described with reference to FIG.

The semiconductor pellet of this embodiment is a semiconductor pellet used for, for example, a glass diode, and it is difficult for the pellet cutting surface 2 of the semiconductor pellet 1 to stand on the basis of the pellet cutting surface 2. It is provided so as to be oblique to the pellet electrode surface 3.

The pellet cutting surface 2 is fixed on the wafer stage 6 by fixing the wafer 5 attached to the masking sheet 4 as shown in FIG. 2 in the dicing process.
It is formed by dicing so that the positional relationship between the wafer plane, that is, the pellet electrode surface 3 and the dicing blade 7 is oblique.

Next, the operation of this embodiment will be described.

The semiconductor pellet 1 formed as described above
Through the assembly process, as shown in FIG.
Two lead wires by lower lead wire 9, glass sleeve 1
0 and the semiconductor pellet 1 constitute a glass diode.

In the assembling process in this case, first, the lower lead wire 9 is placed so that the longitudinal direction thereof is the direction of gravity and the glass sleeve 10 is fitted into the lower lead wire 9.

Further, a semiconductor sleeve 1 having a shape that easily falls due to its own weight based on the pellet cutting surface 2 is used as a glass sleeve 10.
It can be assembled by charging the inside, fitting the upper lead wire 8 into the glass sleeve 10 from above, and pressing the semiconductor pellet 1 to make it easier to collapse, and sandwiching the semiconductor pellet 1.

Therefore, according to the semiconductor pellet 1 of this embodiment, the pellet cutting surface 2 is formed so as to be inclined with respect to the pellet electrode surface 3, so that the glass sleeve 10 is charged in the assembly process. The semiconductor pellet 1 easily falls due to its own weight.
Since the upper lead wire 8 is fitted into the upper lead wire 8 so that the upper lead wire 8 is pressed down, the semiconductor device is less likely to fall down due to pellet standing.

[0021]

[Embodiment 2] FIG. 4 is a side view showing a semiconductor pellet according to another embodiment of the present invention, and FIG. 5 is an explanatory view showing a method for manufacturing a semiconductor pellet according to the present embodiment.

As shown in FIG. 4, the semiconductor pellet 1a of the present embodiment is oblique to the pellet electrode surface 3a so that the pellet cutting surface 2a is difficult to stand on the basis of the pellet cutting surface 2a. The pellet electrode surface 3a is formed in a trapezoidal shape that is narrower when viewed from the side surface.

That is, the semiconductor pellet 1a of this embodiment
As shown in FIG. 5, by tapering the blade portion at the tip of the dicing blade 7a for cutting the wafer 5a, and dicing the pellet electrode surface 3a and the rotating axis of the dicing blade 7a in parallel, The pellet cutting surface 2a of the semiconductor pellet 1a can be slanted and the side surface can be trapezoidal.

Therefore, according to the semiconductor pellet 1a of this embodiment, the pellet cutting surface 2a of the semiconductor pellet 1a is inclined and the side surface is trapezoidal, so that the semiconductor pellet 1a is prone to fall down. As in the case of Example 1, defective assembly of the semiconductor device due to standing of pellets can be reduced.

[0025]

[Embodiment 3] FIG. 6 is a side view showing a semiconductor pellet according to still another embodiment of the present invention, and FIG. 7 is an explanatory view showing a method for manufacturing a semiconductor pellet according to the present embodiment.

In the semiconductor pellet 1b of this embodiment, the pellet cutting surface 2b is formed in a curved shape so that it is difficult to stand on the basis of the pellet cutting surface 2b as shown in FIG. 3 and 2 is that the pellet cutting surface 2b is rounded.

That is, the semiconductor pellet 1b of this embodiment.
As shown in FIG. 7, by rounding the blade portion for cutting the wafer 5b at the tip of the dicing blade 7b and performing dicing so that the pellet electrode surface 3b and the rotation axis of the dicing blade 7b are parallel, The pellet cutting surface 2b of the semiconductor pellet 1b can be curved.

Therefore, according to the semiconductor pellet 1b of this embodiment, the semiconductor pellet 1b is likely to fall down because the pellet cutting surface 2b of the semiconductor pellet 1b has a curved shape. It is possible to reduce the defective assembly of the semiconductor device due to the standing of the pellet.

The invention made by the present inventor has been specifically described based on the first to third embodiments, but the present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the invention. It goes without saying that it is possible.

For example, the semiconductor pellet 1 of this embodiment
Regarding the cross-sectional shapes of 1a and 1b, the case where they are formed in a slanted or curved shape as shown in FIGS. 1, 4 and 6 has been described, but the present invention is not limited to the above-mentioned embodiment, and for example, As shown in FIG. 8, the semiconductor pellet 1 having a rounded or chamfered pellet cutting surface 2c is used.
In the case of c, etc., the pellet cutting surface is similarly applicable as long as the semiconductor pellet has a shape in which the semiconductor pellet easily falls.

The pellet cutting surfaces 2, 2a, 2b of the semiconductor pellets 1, 1a, 1b are replaced by the semiconductor pellets 1, 1
The step of giving a shape in which a and 1b are prone to fall is not limited to the dicing step, and it is possible to add a step of processing the pellet cut surface or utilize an arbitrary step before the semiconductor device is assembled.

In the above description, the case where the invention made by the present inventor is mainly applied to the semiconductor pellets 1, 1a, 1b, 1c used in the glass diode, which is the field of application thereof, has been described, but the present invention is not limited to this. However, the present invention can be widely applied to other semiconductor devices in which the installation state of the pellet electrode surface is regulated.

[0033]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.
It is as follows.

That is, in the dicing step of the semiconductor device, it is difficult to stand the semiconductor pellets on the basis of the pellet cutting surface without making the pellet cutting surface after the dicing step perpendicular to the pellet electrode surface. By providing the pellet cutting surface, when assembling the semiconductor pellet, the semiconductor pellet can be assembled in a state in which the semiconductor pellet does not stand up due to the tipping of the semiconductor pellet itself, so that defective assembly of the semiconductor device due to standing of the pellet can be reduced.

As a result, assembling defects of the semiconductor device due to standing of the pellet can be reduced, so that a semiconductor pellet and a semiconductor device using the same can be obtained, which can improve the product yield and throughput.

[Brief description of drawings]

FIG. 1 is a side view showing a semiconductor pellet that is Embodiment 1 of the present invention.

FIG. 2 is an explanatory diagram showing a method of manufacturing a semiconductor pellet of Example 1.

3 is a cross-sectional view showing a semiconductor device using the semiconductor pellet of Example 1. FIG.

FIG. 4 is a side view showing a semiconductor pellet that is Embodiment 2 of the present invention.

FIG. 5 is an explanatory diagram showing a method of manufacturing a semiconductor pellet of Example 2.

FIG. 6 is a side view showing a semiconductor pellet that is Embodiment 3 of the present invention.

FIG. 7 is an explanatory diagram showing a method of manufacturing a semiconductor pellet according to a third embodiment.

FIG. 8 is a side view showing a modified example of the semiconductor pellet of the present invention.

[Explanation of symbols] 1,1a, 1b, 1c Semiconductor pellets 2, 2a, 2b, 2c Pellet cutting surface 3, 3a, 3b Pellet electrode surface 4 Masking sheet 5, 5a, 5b Wafer 6 Wafer stage 7, 7a, 7b Dicing Blade 8 Upper lead wire 9 Lower lead wire 10 Glass sleeve

Claims (2)

[Claims] 1. In the dicing process of a semiconductor device, it is difficult to make the semiconductor pellet stand on the basis of the pellet cutting surface without making the pellet cutting surface after the dicing step perpendicular to the pellet electrode surface. A semiconductor pellet, characterized by being provided with various pellet cutting surfaces. 2. A semiconductor device using the semiconductor pellet according to claim 1, wherein when the semiconductor device is assembled, leads for external connection are connected so as to sandwich the pellet electrode surface.