JP6598671B2 - Cleaning composition for flux - Google Patents

Description

  The present disclosure relates to a flux cleaning composition, a flux residue cleaning method, and an electronic component manufacturing method.

  In recent years, regarding the mounting of electronic components on a printed wiring board or a ceramic substrate, the components are downsized from the viewpoint of low power consumption and high-speed processing, and the gap to be cleaned in solder flux cleaning has become narrower. In addition, lead-free solder has been used from the viewpoint of environmental safety, and accordingly, rosin-based flux is used.

  Patent Document 1 discloses an organic solvent, a metal part, an electronic part, a semiconductor part, and a semiconductor part containing 5 to 30% by weight of glyceryl ether having an alkyl group or an alkenyl group having 4 to 12 carbon atoms and 5% by weight or more of water. A water-containing cleaning composition for precision parts such as liquid crystal display panels is disclosed.

  In Patent Document 2, (A) glyceryl ether is 0.25 to 15.0% by weight, and (B) nonionic surfactant having HLB 12.0 to 18.0 is 1.0 to 60.0% by weight. %, (C) 1.0 to 10.0% by weight of hydrocarbon, (D) 1.0 to 20.0% by weight of glycol ether, and (E) water, and the component (B ) Is represented by the following formula: R—X— (EO) m (PO) n—H, and the weight ratio of the component (B) to the component (A) (component ( B) / component (A)) is 4/1 to 8/1, the cleaning composition is uniform, high in safety, excellent in cleaning properties of various soils in a narrow gap, repeated cleaning properties and rinsing properties, Disclosed is a hard surface detergent composition having good foam resistance during washing and rinsing.

  Patent Document 3 discloses a flux cleaning agent for soldered electronic parts made of benzyl alcohol.

  In Patent Document 4, when the content of the glycol compound is less than 1% by weight with respect to the total amount, the content of benzyl alcohol is in the range of 70 to 99.9% by weight and the content of amino alcohol is 0. When the glycol compound content is 1 to 40% by weight, the benzyl alcohol content is 15 to 99% by weight and the amino alcohol content is 0.1 to 30% by weight. A solder flux removing cleaning agent characterized by being in the range of 30% by weight is disclosed.

  Patent Document 5 includes (A) 50 to 70% by weight of benzyl alcohol, (B) 20 to 40% by weight of a specific water-soluble glycol ether, and (C) a nonionic surfactant 1 to 20 having an HLB of 12 to 18. % By weight, (D) 5 to 20% by weight of water, (E) alkanolamine, alkali salts, organic acid, antifoaming agent, containing at least 1% selected from the group consisting of thickeners, An industrial detergent composition characterized by blending the components (A) to (E) to 100% by weight is disclosed.

  Patent Document 6 discloses a detergent composition for a precision tool or a tool used for an assembling process, which contains a glyceryl ether having a hydrocarbon group having 1 to 18 carbon atoms.

Patent Document 7 discloses an electronic component and a precision component containing a specific polyoxyalkylene dialkyl ether, a specific polyoxyalkylene monoalkyl ether, and an amine compound and having a kinematic viscosity at 25 ° C. of 5 mm ² / s or less. Alternatively, a detergent composition that can be suitably used to remove dirt such as oil, machine oil, cutting oil, grease, liquid crystal, and rosin flux present on the solid surface of jigs and tools used in the assembly process is disclosed. ing.

JP 2004-2688 A JP 2010-155904 A JP-A-4-34000 International Publication No. 2005/021700 JP 2000-8080 A JP-A-6-346092 Japanese Patent Laid-Open No. 10-168488

  In recent years, due to miniaturization of semiconductor package substrates, solder bumps have become smaller and gaps with components to be connected have become narrower. And since the solder bump is miniaturized and the gap between the parts to be connected is narrowed, the cleaning composition disclosed in the above-mentioned patent document cannot be said to have sufficient flux residue detergency.

  Thus, the present disclosure provides a flux cleaning composition suitable for cleaning flux residues, a cleaning method using the same, and a cleaning method for electronic components.

  The present disclosure includes a compound represented by the following formula (I) (component A), a compound represented by the following formula (II) (component B), a compound represented by the following formula (III) (component C), It contains the compound represented by formula (IV) (component D), aromatic alcohol (component E), and water (component F), and the ratio of the mass of component E to the total mass of component C and component D ( It is related with the cleaning composition for flux whose component E / (component C + component D)) is 0.18 or more and 0.45 or less.

上記式（Ｉ）において、Ｒ₁は水素原子、メチル基、エチル基及びアミノエチル基から選ばれる少なくとも１種であり、Ｒ₂は水素原子、ヒドロキシエチル基、ヒドロキシプロピル基、メチル基及びエチル基から選ばれる少なくとも１種であり、Ｒ₃はヒドロキシエチル基及びヒドロキシプロピル基から選ばれる少なくとも１種である。

In the above formula (I), R ₁ is at least one selected from a hydrogen atom, a methyl group, an ethyl group and an aminoethyl group, and R ₂ is a hydrogen atom, a hydroxyethyl group, a hydroxypropyl group, a methyl group and an ethyl group. And R ₃ is at least one selected from a hydroxyethyl group and a hydroxypropyl group.

R ₄ —O— (CH ₂ CH ₂ O) _n —H (II)
In the above formula (II), R ₄ represents a hydrocarbon group having 4 to 7 carbon atoms, and n is an added mole number and an integer of 1 to 5 inclusive.

R ₅ —O— (CH ₂ CH ₂ O) _m —H (III)
In the above formula (III), R ₅ represents a hydrocarbon group having 8 or more and 12 or less carbon atoms, and m is an average added mole number, which is 4 or more and 8 or less.

R ₆ OCH ₂ —CH (OH) —CH ₂ OH (IV)
In the above formula (IV), R ₆ represents a hydrocarbon group having 6 to 11 carbon atoms.

  The present disclosure relates to a flux residue cleaning method including a step of cleaning an object to be cleaned having a flux residue with the cleaning composition according to the present disclosure.

  The present disclosure includes a step of mounting at least one component selected from a semiconductor chip, a chip-type capacitor, and a circuit board on a circuit board by soldering using a flux, and a solder bump for connecting the parts and the like. A flux residue cleaning method according to the present disclosure comprising at least one step selected from steps formed on a circuit board and at least one selected from a circuit board on which the component is mounted and a circuit board on which the solder bump is formed It is related with the manufacturing method of an electronic component including the process wash | cleaned by.

  According to the present disclosure, it is possible to provide a flux cleaning composition with excellent flux residue detergency.

  The present disclosure provides a specific amine (component A), a specific glycol ether (component B), a specific polyoxyethylene alkyl ether (component C), a specific glyceryl ether (component D) and an aromatic alcohol (component E). In the cleaning composition to be contained, by defining the ratio of the mass of component E to the total mass of component C and component D, it is based on the knowledge that the cleaning properties of the flux residue are improved as compared with the conventional case.

  That is, the present disclosure relates to a compound represented by formula (I) (component A), a compound represented by formula (II) (component B), and a compound represented by formula (III) (component C). The compound (component D) represented by the formula (IV), the aromatic alcohol (component E), and water (component F) are contained, and the mass of the component E and the total mass of the components C and D are The present invention relates to a flux cleaning composition (hereinafter also referred to as “cleaning composition according to the present disclosure”) having a ratio (component E / (component C + component D)) of 0.18 or more and 0.45 or less. According to the present disclosure, it is possible to obtain a flux cleaning composition with excellent flux residue cleaning properties. Furthermore, according to the present disclosure, it is possible to obtain a cleaning composition for flux that is excellent in stability and rinsing with water and that can suppress the influence of corrosion or the like on the solder metal.

  Although the details of the action mechanism of the effect in the cleaning composition according to the present disclosure are unclear, it is estimated as follows. That is, in the cleaning composition according to the present disclosure, in the presence of the component A and the component B, the component C, the component D, and the component E are contained at a specific mass ratio. Component E, component D and component E are oriented and present, and component E, which has high flux solubility but is difficult to dissolve in water, can be uniformly dispersed in the cleaning composition. It is estimated that the performance is improved. Furthermore, the occurrence of the above-described orientation can prevent the amine component (component A), which is considered to be a factor corroding the solder surface, from coming into contact with the solder more than necessary. Presumed not to happen. However, the present disclosure is not limited to this mechanism.

  Furthermore, in recent years, with the miniaturization of solder bumps and the gap between the parts to be connected becoming narrower, a highly functional flux that can suppress the generation of voids while maintaining printability, meltability, and cleaning properties (for example, Highly active flux) is used, but the cleaning composition according to the present disclosure can be suitably used for such highly functional flux residues.

  In the present disclosure, the “flux” contains rosin or a rosin derivative used for soldering, which is used to remove the oxide that obstructs the connection between a metal such as an electrode or wiring and a solder metal, and promote the connection. In this disclosure, “soldering” includes reflow method and flow method soldering. In the present disclosure, “solder flux” refers to a mixture of solder and flux. In the present disclosure, “flux residue” refers to a residue derived from flux remaining on a substrate after solder bumps are formed using flux and / or a substrate after soldering using flux. For example, when other components (for example, semiconductor chips, chip capacitors, other circuit boards, etc.) are stacked and mounted on the circuit board, there is a space (gap) between the circuit board and the other parts. It is formed. The flux used for the mounting can remain in this gap as a flux residue after being soldered by reflow or the like. In the present disclosure, “flux cleaning composition” refers to a cleaning composition for cleaning a flux residue after forming and / or soldering a solder bump using a flux or a solder flux. The solder is preferably lead (Pb) -free solder from the standpoint of a significant effect of detergency with the cleaning composition according to the present disclosure.

[Component A]
Component A in the cleaning composition according to the present disclosure is a compound represented by the following formula (I).

In the above formula (I), R ₁ is at least one selected from a hydrogen atom, a methyl group, an ethyl group and an aminoethyl group, and R ₂ is a hydrogen atom, a hydroxyethyl group, a hydroxypropyl group, a methyl group and an ethyl group. And R ₃ is at least one selected from a hydroxyethyl group and a hydroxypropyl group.

  Examples of component A include alkanolamines such as monoethanolamine and diethanolamine, and alkylated products and aminoalkylated products thereof. Specific examples of component A include monoethanolamine, monoisopropanolamine, N-methylmonoethanolamine, N-methylmonoisopropanolamine, N-ethylmonoethanolamine, and N-ethylmonoisopropanolamine from the viewpoint of improving detergency. , Diethanolamine, diisopropanolamine, N-dimethylmonoethanolamine, N-dimethylmonoisopropanolamine, N-methyldiethanolamine, N-methyldiisopropanolamine, N-diethylmonoethanolamine, N-diethylmonoisopropanolamine, N-ethyl Diethanolamine, N-ethyldiisopropanolamine, N- (β-aminoethyl) monoethanolamine, N- (β-aminoethyl) monoisopropanolamine, N- (β At least one selected from aminoethyl) diethanolamine and N- (β-aminoethyl) diisopropanolamine is preferable, and monoethanolamine, monoisopropanolamine, diethanolamine, N-methylmonoethanolamine, N-dimethylmonoethanolamine, N At least one selected from -ethyl monoethanolamine and N- (β-aminoethyl) monoethanolamine is more preferable, and at least one selected from N-methylmonoethanolamine and N-dimethylmonoethanolamine is more preferable.

  The content of Component A in the cleaning composition according to the present disclosure is preferably 0.2% by mass or more, more preferably 0.3% by mass or more, and more preferably 0.4% by mass or more from the viewpoint of improving the cleaning property. More preferably, 0.5% by mass or more is still more preferable, and from the viewpoint of improving the cleaning property and suppressing the corrosion of the solder metal, 10% by mass or less is preferable, 8% by mass or less is more preferable, and 5% by mass or less is further preferable. Preferably, 3 mass% or less is still more preferable.

[Component B]
Component B in the cleaning composition according to the present disclosure is a compound represented by the following formula (II).

R ₄ —O— (CH ₂ CH ₂ O) _n —H (II)

In the above formula (II), R ₄ represents a hydrocarbon group having 4 to 7 carbon atoms, and preferably a hydrocarbon group having 4 to 6 carbon atoms from the viewpoint of improving detergency and stability. An alkyl group of 6 or less is more preferable. n represents the number of added moles, and is an integer of 1 to 5, and is preferably an integer of 1 to 4 and more preferably an integer of 2 to 3 from the viewpoints of improvement in cleaning properties and stability.

  Component B includes, for example, ethylene glycol monoalkyl ether, diethylene glycol monoalkyl ether, triethylene glycol monoalkyl ether, tetraethylene glycol monoalkyl ether, pentaethylene glycol monoalkyl having a hydrocarbon group having 4 to 7 carbon atoms. Ether, ethylene glycol monophenyl ether, diethylene glycol monophenyl ether, triethylene glycol monophenyl ether, tetraethylene glycol monophenyl ether, pentaethylene glycol monophenyl ether, ethylene glycol monobenzyl ether, diethylene glycol monobenzyl ether, triethylene glycol monobenzyl Ether, tetraethylene glycol monobenzyl ether Le and pentaethylene glycol monobenzyl ether. Component B includes ethylene glycol monobutyl ether, diethylene glycol monobutyl ether, triethylene glycol monobutyl ether, monoethylene glycol monohexyl ether, and diethylene glycol monohexyl ether from the viewpoints of improving the detergency, reducing the viscosity of the detergent composition, and improving the stability. At least one selected from ethylene glycol monophenyl ether, diethylene glycol monophenyl ether, ethylene glycol monobenzyl ether and diethylene glycol monobenzyl ether, ethylene glycol monobutyl ether, diethylene glycol monobutyl ether, triethylene glycol monobutyl ether, monoethylene glycol mono Hexyl ether and diethylene glycol At least one selected from rumonohexyl ether is more preferable, at least one selected from diethylene glycol monobutyl ether, triethylene glycol monobutyl ether and diethylene glycol monohexyl ether is more preferable, and diethylene glycol monobutyl ether is still more preferable from the viewpoint of rinsing properties. .

  The content of Component B in the cleaning composition according to the present disclosure is 10% by mass or more from the viewpoint of improving cleaning properties, improving rinsing properties, decreasing viscosity of cleaning compositions, improving stability, and suppressing solder metal corrosion. Is preferable, 12 mass% or more is more preferable, 15 mass% or more is further preferable, and 20 mass% or more is further more preferable. The content of the component B is more preferably 25% by mass or more from the viewpoint of reducing the viscosity of the cleaning composition. The content of Component B is preferably 45% by mass or less, more preferably 40% by mass or less, and even more preferably 35% by mass or less, from the viewpoints of improvement in detergency, reduction in viscosity of the cleaning composition and improvement in stability.

[Component C]
Component C in the cleaning composition according to the present disclosure is a compound represented by the following formula (III).

R ₅ —O— (CH ₂ CH ₂ O) _m —H (III)

In the above formula (III), R ₅ represents a hydrocarbon group having 8 to 12 carbon atoms, and a hydrocarbon group having 8 to 10 carbon atoms is preferable from the viewpoint of improving detergency and stability. The following alkyl groups are more preferred. m represents the average number of added moles, and is a number of 4 or more and 8 or less, preferably 5 or more and 7 or less, and more preferably 5 or more and 6 or less from the viewpoints of improvement in detergency and stability.

Component C is a polyoxyethylene alkyl having a hydrocarbon group having 8 to 12 carbon atoms represented by the formula (III), and having an average added mole number (m) of ethylene oxide of 4 to 8 Examples include ethers, polyoxyethylene alkenyl ethers, polyoxyethylene alkylphenyl ethers, and the like, and polyoxyethylene alkyl ethers are preferred from the viewpoint of improving detergency. The number of carbon atoms of the hydrocarbon group of R ₅ is preferably 10 or less from the viewpoints of improvement in detergency, reduction in viscosity of the cleaning composition and improvement in stability. Specific examples of component C include, for example, polyoxyethylene 2-ethylhexyl ether, polyoxyethylene octyl ether, polyoxyethylene nonyl ether, polyoxyethylene decyl ether, polyoxyethylene 2-propylheptyl ether, polyoxyethylene 4- Examples include at least one selected from methyl propyl hexyl ether, polyoxyethylene 5-methylpropyl hexyl ether, and polyoxyethylene dodecyl ether. From the viewpoint of viscosity reduction and stability improvement of the detergent composition, polyoxyethylene 2 -Ethylhexyl ether is preferred.

  The content of the component C in the cleaning composition according to the present disclosure is preferably 10% by mass or more, and preferably 15% by mass from the viewpoints of improving the cleaning property, improving the rinsing property, reducing the viscosity of the cleaning composition, and improving the stability. The above is more preferable, 20% by mass or more is further preferable, and 50% by mass or less is preferable, 40% by mass or less is more preferable, and 30% by mass from the viewpoint of improving rinsing properties, decreasing the viscosity of the cleaning composition and improving stability. % Or less is more preferable.

[Component D]
Component D in the cleaning composition according to the present disclosure is a compound represented by the following formula (IV). According to the present disclosure, by using the component D, there is an advantage that excellent cleaning properties can be obtained for the flux residue.

R ₆ OCH ₂ —CH (OH) —CH ₂ OH (IV)

In the above formula (IV), R ₆ represents a hydrocarbon group having 6 to 11 carbon atoms, and is preferably a hydrocarbon group having 8 to 10 carbon atoms from the viewpoint of improving detergency and stability. The following alkyl groups are more preferred.

Component D is a glyceryl ether having a hydrocarbon group having 6 to 11 carbon atoms represented by the formula (IV), and alkyl glyceryl ether is preferable from the viewpoint of improving stability. From the viewpoint of improving the cleaning properties and stability, R ₆ is preferably a linear or branched alkyl group having 6 to 11 carbon atoms or an alkenyl group, more preferably an alkyl group having 6 to 10 carbon atoms, An alkyl group having 8 carbon atoms is more preferable. Examples of R ₆ include an alkyl group having 6 to 11 carbon atoms such as n-hexyl group, isohexyl group, n-heptyl group, n-octyl group, 2-ethylhexyl group, n-nonyl group, n-decyl group and the like. And at least one selected from a 2-ethylhexyl group and an n-decyl group is preferable, and a 2-ethylhexyl group is more preferable. Specific examples of component D include at least one selected from hexyl glyceryl ether, octyl glyceryl ether, 2-ethylhexyl glyceryl ether, nonyl glyceryl ether, decyl glyceryl ether, and undecyl glyceryl ether.

  The content of the component D in the cleaning composition according to the present disclosure is preferably 0.5% by mass or more, more preferably 1% by mass or more, from the viewpoints of improvement in detergency, rinsing property and stability. 0.5% by mass or more is more preferable, 2% by mass or more is more preferable, and from the same viewpoint, 15% by mass or less is preferable, 13% by mass or less is more preferable, 10% by mass or less is more preferable, and 7% by mass. % Or less is even more preferable.

[Component E]
The cleaning composition according to the present disclosure contains an aromatic alcohol (component E) from the viewpoint of improving detergency.

  Component E may be a compound having an aromatic ring and a hydroxyl group, and from the viewpoint of improving detergency, the carbon number of the aromatic alcohol of component E is preferably 7 or more, preferably 10 or less, and more preferably 9 or less. . Specific examples of component E include at least one selected from benzyl alcohol, phenethyl alcohol, 4-methylbenzyl alcohol, 4-ethylbenzyl alcohol, 2-phenyl-1-propanol, and 2-phenyl-2-propanol. From the viewpoint of improving detergency, at least one selected from benzyl alcohol, phenethyl alcohol and 4-ethylbenzyl alcohol is preferable, and benzyl alcohol is more preferable.

  The content of the component E in the cleaning composition according to the present disclosure is preferably a high content from the viewpoint of improving the cleaning performance, but from the viewpoint of improving stability, cleaning performance and rinsing performance, 1 mass. % Or more, preferably 2% by weight or more, more preferably 3% by weight or more, still more preferably 5% by weight or more, and from the same viewpoint, preferably 25% by weight or less, more preferably 20% by weight or less. Preferably, 15 mass% or less is more preferable.

[Mass ratio of component E to components C and D]
In the present disclosure, the ratio of the mass of component E to the total mass of component C and component D (component E / (component C + component D)) is 0 from the viewpoints of improving detergency, rinsing performance and stability. .18 or more, preferably 0.2 or more, more preferably 0.25 or more, and 0.45 or less, preferably 0.4 or less, and more preferably 0.35 or less.

[Mass ratio of component C to component D]
The ratio of the mass of component C to the mass of component D (component C / component D) is preferably 5 or more, more preferably 6 or more, still more preferably 7 or more, from the viewpoint of improving rinsing properties and stability. From the same viewpoint, 10 or less is preferable, 9.5 or less is more preferable, and 9 or less is more preferable.

[Component F]
Component F in the cleaning composition according to the present disclosure is water. As water, ion exchange water, RO water, distilled water, pure water, ultrapure water, or the like can be used. The content of Component F in the cleaning composition according to the present disclosure is preferably 10% by mass or more, more preferably 15% by mass or more, and even more preferably 20% by mass or more, from the viewpoints of improvement in detergency and stability. And from the same viewpoint, 60 mass% or less is preferable, 50 mass% or less is more preferable, 40 mass% or less is further more preferable, and 30 mass% or less is more preferable.

[Other components of cleaning composition]
The cleaning composition according to the present disclosure may contain other components as necessary. The content of other components in the cleaning composition according to the present disclosure is preferably 0% by mass to 2.0% by mass, more preferably 0% by mass to 1.5% by mass, and more preferably 0% by mass to 1%. Is more preferably 3% by mass or less, and still more preferably 0% by mass or more and 1.0% by mass or less.

  Examples of other components in the cleaning composition according to the present disclosure include hydrocarbons having 10 to 18 carbon atoms (component G) from the viewpoint of suppressing foamability. Component G includes, for example, at least one selected from dodecene and tetradecene from the same viewpoint. The content of the component G in the cleaning composition according to the present disclosure is preferably 0.5% by mass or more, more preferably 0.8% by mass or more, and 1.5% by mass from the viewpoint of suppressing foamability. Or less, more preferably 1.3% by mass or less, and even more preferably 1.0% by mass or less.

  Furthermore, the cleaning composition according to the present disclosure is, as necessary, such as hydroxyethylaminoacetic acid, hydroxyethyliminodiacetic acid, ethylenediaminetetraacetic acid, and the like, as long as it does not impair the effects of the present disclosure. Compounds with chelating ability such as aminocarboxylates, antiseptics, rust preventives, bactericides, antibacterial agents, silicone antifoaming agents, antioxidants, esters or alcohols such as coconut fatty acid methyl and benzyl acetate, etc. Can be contained.

[Production method of cleaning composition]
The cleaning composition according to the present disclosure can be produced by blending the components A to F and, if necessary, other components by a known method. Therefore, this indication is related with the manufacturing method of the detergent constituent including the process of blending at least the above-mentioned ingredients AF. In the present disclosure, “compounding” includes mixing the components A to F and other components as necessary at the same time or in any order. In the manufacturing method of the cleaning composition according to the present disclosure, the blending amount of each component can be the same as the content of each component in the cleaning composition according to the present disclosure described above. In the present disclosure, the “content of each component in the cleaning composition” refers to the content of each component at the time of cleaning, that is, when the cleaning composition is used for cleaning. The cleaning composition according to the present disclosure is manufactured and stored as a concentrated liquid from the viewpoints of addition work, storage and transportation, and the content of Component A to Component E described above during use (that is, the content during cleaning). It can be diluted with water (component F).

[PH of cleaning composition]
The pH of the cleaning composition according to the present disclosure is preferably pH 8 or higher and pH 14 or lower from the viewpoint of improving the cleaning power against the flux residue. If necessary, the pH is adjusted with inorganic acids such as nitric acid and sulfuric acid, organic acids such as oxycarboxylic acid, polyvalent carboxylic acid, aminopolycarboxylic acid and amino acid, and metal salts and ammonium salts thereof, ammonia, sodium hydroxide and water. It can adjust by mix | blending basic substances other than component A, such as a potassium oxide and an amine, with a desired quantity suitably.

[To be cleaned]
The cleaning composition according to the present disclosure is used for cleaning an object to be cleaned having a flux residue. Examples of an object to be cleaned having a flux residue include an object to be cleaned having reflowed solder. Specific examples of the object to be cleaned include, for example, an electronic component and its production intermediate, and specifically include a soldered electronic component and its production intermediate, and more specifically, the component is a solder. Soldered electronic component and its production intermediate, electronic component to which the component is connected via solder and its production intermediate, electronic component including flux residue in the gap between the soldered component and its production intermediate, An electronic component including a flux residue in a gap between components connected via solder, a manufacturing intermediate thereof, and the like can be given. The manufacturing intermediate is an intermediate product in a manufacturing process of an electronic component including a semiconductor package or a semiconductor device, and is at least selected from a semiconductor chip, a chip capacitor, and a circuit board by soldering using a flux, for example. It includes a circuit board on which one component is mounted and / or a circuit board on which solder bumps for soldering the components are formed. The gap in the object to be cleaned is, for example, a space formed between a circuit board and a component (semiconductor chip, chip capacitor, circuit board, etc.) soldered and mounted on the circuit board. The height (distance between components) refers to a space of, for example, 5 to 500 μm, 10 to 250 μm, or 20 to 100 μm. The width and depth of the gap depend on the size and interval of the components to be mounted and the electrodes (lands) on the circuit board.

[Flux residue cleaning method]
The present disclosure relates to a flux residue cleaning method including contacting an object to be cleaned having a flux residue with the cleaning composition according to the present disclosure (hereinafter also referred to as a cleaning method according to the present disclosure). The cleaning method according to the present disclosure includes a step of cleaning an object to be cleaned having a flux residue with the cleaning composition according to the present disclosure. Examples of the method for bringing the cleaning composition according to the present disclosure into contact with the object to be cleaned or the method for cleaning the object to be cleaned with the cleaning composition according to the present disclosure include, for example, contacting the object in the bathtub of an ultrasonic cleaning device Examples thereof include a method, a method of injecting the cleaning composition into a spray form and bringing it into contact (shower method). The cleaning composition according to the present disclosure can be used for cleaning as it is without being diluted. It is preferable that the cleaning method of the present disclosure includes a step of bringing an object to be cleaned into contact with the cleaning composition, rinsing with water, and drying. With the cleaning method of the present disclosure, it is possible to efficiently clean the flux residue remaining in the gaps between the soldered parts. The solder is preferably lead (Pb) -free solder from the standpoint of a significant effect of cleaning performance and penetration into a narrow gap by the cleaning method of the present disclosure. Further, from the same viewpoint, the cleaning method according to the present disclosure is disclosed in International Patent Publication No. 2006/025224, Japanese Patent Publication No. 6-75796, Japanese Unexamined Patent Application Publication No. 2014-144473, Japanese Unexamined Patent Application Publication No. 2004-230426, Japanese Unexamined Patent Application Publication No. 2013. It is preferably used for electronic components soldered using a flux described in JP-A-188761, JP-A-2013-173184, and the like. In the cleaning method of the present disclosure, it is preferable to irradiate ultrasonic waves when the cleaning composition according to the present disclosure and the object to be cleaned are in contact with each other because the cleaning power of the cleaning composition according to the present disclosure is easily exhibited. More preferably, the ultrasonic waves are relatively strong. From the same viewpoint, the ultrasonic frequency is preferably 26 to 72 Hz and 80 to 1500 W, more preferably 36 to 72 Hz and 80 to 1500 W.

[Method of manufacturing electronic parts]
A method of manufacturing an electronic component according to the present disclosure includes a step of mounting at least one component selected from a semiconductor chip, a chip-type capacitor, and a circuit board on a circuit board by soldering using a flux, and connecting the components and the like And at least one step selected from a step of forming solder bumps on the circuit board, and at least one step selected from a circuit board on which the component is mounted and a circuit board on which the solder bumps are formed. And a step of cleaning by a cleaning method. The soldering using the flux is performed with, for example, lead-free solder, and may be a reflow method or a flow method. The electronic component includes a semiconductor package in which no semiconductor chip is mounted, a semiconductor package in which a semiconductor chip is mounted, and a semiconductor device. The manufacturing method of the electronic component according to the present disclosure is caused by reducing the flux residue remaining in the gap of the soldered component, the periphery of the solder bump, and the like by performing the cleaning method of the present disclosure, and the flux residue remains. Therefore, it is possible to manufacture a highly reliable electronic component because a short circuit and poor adhesion between electrodes are suppressed. Furthermore, by performing the cleaning method of the present disclosure, it becomes easy to clean the flux residue remaining in the gaps between the soldered components, so that the cleaning time can be shortened and the manufacturing efficiency of electronic components can be improved.

[kit]
The present disclosure is a kit for use in the cleaning method according to the present disclosure and / or the method for manufacturing an electronic component according to the present disclosure, and among the components A to F constituting the cleaning composition according to the present disclosure. And at least one component of the kit is stored in an unmixed state with other components.

  As a kit according to the present disclosure, for example, a solution containing the component A (first liquid) and a solution containing the components B to F (second liquid) are stored in a state where they are not mixed with each other. And a kit (two-component detergent composition) in which these are mixed at the time of use. The first liquid and the second liquid may each contain an optional component as necessary. Examples of the optional component include a thickener, a dispersant, a rust inhibitor, a basic substance, a surfactant, a polymer compound, a solubilizer, an antioxidant, an antiseptic, an antifoaming agent, and an antibacterial agent. Can be mentioned.

  The present disclosure further relates to the following cleaning composition, cleaning method, and production method.

上記式（Ｉ）において、Ｒ₁は水素原子、メチル基、エチル基及びアミノエチル基から選ばれる少なくとも１種であり、Ｒ₂は水素原子、ヒドロキシエチル基、ヒドロキシプロピル基、メチル基及びエチル基から選ばれる少なくとも１種であり、Ｒ₃はヒドロキシエチル基及びヒドロキシプロピル基から選ばれる少なくとも１種である。
Ｒ₄-Ｏ-（ＣＨ₂ＣＨ₂Ｏ）_n-Ｈ （ＩＩ）
上記式（ＩＩ）において、Ｒ₄は炭素数４以上７以下の炭化水素基を示し、ｎは付加モル数であって１以上５以下の整数である。
Ｒ₅-Ｏ-（ＣＨ₂ＣＨ₂Ｏ）_m-Ｈ （ＩＩＩ）
上記式（ＩＩＩ）において、Ｒ₅は炭素数８以上１２以下の炭化水素基を示し、ｍは平均付加モル数であって４以上８以下の数である。
Ｒ₆ＯＣＨ₂−ＣＨ（ＯＨ）-ＣＨ₂ＯＨ （ＩＶ）
上記式（ＩＶ）において、Ｒ₆は炭素数６以上１１以下の炭化水素基を示す。 <1>
A compound represented by the following formula (I) (component A), a compound represented by the following formula (II) (component B), a compound represented by the following formula (III) (component C), and the following formula (IV) A compound represented by the formula (component D), an aromatic alcohol (component E), and water (component F),
A cleaning composition for flux, wherein the ratio of the mass of component E to the total mass of component C and component D (component E / (component C + component D)) is 0.18 to 0.45.

In the above formula (I), R ₁ is at least one selected from a hydrogen atom, a methyl group, an ethyl group and an aminoethyl group, and R ₂ is a hydrogen atom, a hydroxyethyl group, a hydroxypropyl group, a methyl group and an ethyl group. And R ₃ is at least one selected from a hydroxyethyl group and a hydroxypropyl group.
R ₄ —O— (CH ₂ CH ₂ O) _n —H (II)
In the above formula (II), R ₄ represents a hydrocarbon group having 4 to 7 carbon atoms, and n is an added mole number and an integer of 1 to 5 inclusive.
R ₅ —O— (CH ₂ CH ₂ O) _m —H (III)
In the above formula (III), R ₅ represents a hydrocarbon group having 8 or more and 12 or less carbon atoms, and m is an average added mole number, which is 4 or more and 8 or less.
R ₆ OCH ₂ —CH (OH) —CH ₂ OH (IV)
In the above formula (IV), R ₆ represents a hydrocarbon group having 6 to 11 carbon atoms.

<2> Component A includes monoethanolamine, monoisopropanolamine, N-methylmonoethanolamine, N-methylmonoisopropanolamine, N-ethylmonoethanolamine, N-ethylmonoisopropanolamine, diethanolamine, diisopropanolamine, N-dimethylmonoethanolamine, N-dimethylmonoisopropanolamine, N-methyldiethanolamine, N-methyldiisopropanolamine, N-diethylmonoethanolamine, N-diethylmonoisopropanolamine, N-ethyldiethanolamine, N-ethyldiisopropanol Amine, N- (β-aminoethyl) monoethanolamine, N- (β-aminoethyl) monoisopropanolamine, N- (β-aminoethyl) dietano At least one selected from the group consisting of ethanolamine and N- (β-aminoethyl) diisopropanolamine, monoethanolamine, monoisopropanolamine, diethanolamine, N-methylmonoethanolamine, N-dimethylmonoethanolamine, N-ethylmono At least one selected from ethanolamine and N- (β-aminoethyl) monoethanolamine is more preferable, and at least one selected from N-methylmonoethanolamine and N-dimethylmonoethanolamine is more preferable. <1> A cleaning composition for flux as described in 1.
<3> The content of component A is preferably 0.2% by mass or more, more preferably 0.3% by mass or more, further preferably 0.4% by mass or more, and further more preferably 0.5% by mass or more. The flux cleaning composition according to <1> or <2>.
<4> The content of component A is preferably 10% by mass or less, more preferably 8% by mass or less, further preferably 5% by mass or less, and further more preferably 3% by mass or less, from <1> to <3> The cleaning composition for fluxes in any one.
<5> In the above formula (II), R ₄ is preferably a hydrocarbon group having 4 to 6 carbon atoms, more preferably an alkyl group having 4 to 6 carbon atoms, and any one of <1> to <4> A cleaning composition for flux.
<6> In the above formula (II), n is preferably a number of 1 or more and 4 or less, more preferably a number of 2 or more and 3 or less, and the cleaning composition for flux according to any one of <1> to <5> object.
<7> Component B includes ethylene glycol monobutyl ether, diethylene glycol monobutyl ether, triethylene glycol monobutyl ether, monoethylene glycol monohexyl ether, diethylene glycol monohexyl ether, ethylene glycol monophenyl ether, diethylene glycol monophenyl ether, ethylene glycol monobenzyl At least one selected from ether and diethylene glycol monobenzyl ether is preferable, and at least one selected from ethylene glycol monobutyl ether, diethylene glycol monobutyl ether, triethylene glycol monobutyl ether, monoethylene glycol monohexyl ether and diethylene glycol monohexyl ether is preferable. The flux cleaning composition according to any one of <1> to <6>, more preferably at least one selected from diethylene glycol monobutyl ether, triethylene glycol monobutyl ether, and diethylene glycol monohexyl ether.
<8> The content of Component B is preferably 10% by mass or more, more preferably 12% by mass or more, still more preferably 15% by mass or more, still more preferably 20% by mass or more, and even more preferably 25% by mass or more. <1> to <7>. The flux cleaning composition according to any one of <1> to <7>.
<9> The content of component B is preferably 45% by mass or less, more preferably 40% by mass or less, and further preferably 35% by mass or less, and the flux cleaning agent according to any one of <1> to <8> Composition.
<10> In the formula (III), R ₅ represents a hydrocarbon group having 8 to 12 carbon atoms, preferably a hydrocarbon group having 8 to 10 carbon atoms, and more preferably an alkyl group having 8 to 10 carbon atoms. The cleaning composition for fluxes in any one of <1> to <9>.
<11> In the formula (III), m is preferably a number of 5 or more and 7 or less, more preferably a number of 5 or more and 6 or less, and the cleaning composition for flux according to any one of <1> to <10> .
<12> The flux cleaning composition according to any one of <1> to <11>, wherein in the formula (III), the hydrocarbon group of R ₅ preferably has 10 or less carbon atoms.
<13> As component C, polyoxyethylene 2-ethylhexyl ether, polyoxyethylene octyl ether, polyoxyethylene nonyl ether, polyoxyethylene decyl ether, polyoxyethylene 2-propylheptyl ether, polyoxyethylene 4-methylpropyl The cleaning composition for flux according to any one of <1> to <12>, which is at least one selected from hexyl ether, polyoxyethylene 5-methylpropyl hexyl ether, and polyoxyethylene dodecyl ether.
<14> The content of component C is preferably 10% by mass or more, more preferably 15% by mass or more, and further preferably 20% by mass or more, and the flux cleaning composition according to any one of <1> to <13> object.
<15> The content of component C is preferably 50% by mass or less, more preferably 40% by mass or less, and further preferably 30% by mass or less, and the flux cleaning agent according to any one of <1> to <14> Composition.
<16> In the formula (IV), R ₆ is preferably a hydrocarbon group having 8 to 10 carbon atoms, more preferably an alkyl group having 8 to 10 carbon atoms, according to any one of <1> to <15> A cleaning composition for flux.
<17> In the formula (IV), R ₆ is preferably a linear or branched alkyl group or alkenyl group having 6 to 11 carbon atoms, more preferably an alkyl group having 6 to 10 carbon atoms, and 8 carbon atoms. The flux cleaning composition according to any one of <1> to <16>, wherein the alkyl group is more preferable.
<18> Component D is at least one selected from hexyl glyceryl ether, octyl glyceryl ether, 2-ethylhexyl glyceryl ether, nonyl glyceryl ether, decyl glyceryl ether, and undecyl glyceryl ether, <1> to <17> The flux cleaning composition according to any one of the above.
<19> The content of component D is preferably 0.5% by mass or more, more preferably 1% by mass or more, further preferably 1.5% by mass or more, and further more preferably 2% by mass or more, from <1>. The cleaning composition for fluxes according to any one of <18>.
<20> The content of component D is preferably 15% by mass or less, more preferably 13% by mass or less, further preferably 10% by mass or less, and further more preferably 7% by mass or less, from <1> to <19> The cleaning composition for fluxes in any one.
<21> The cleaning composition for flux according to any one of <1> to <20>, wherein the aromatic alcohol of component E has preferably 7 or more, preferably 10 or less, and more preferably 9 or less.
<22> Component E is at least one selected from benzyl alcohol, phenethyl alcohol, 4-methylbenzyl alcohol, 4-ethylbenzyl alcohol, 2-phenyl-1-propanol, and 2-phenyl-2-propanol, The cleaning composition for flux according to any one of <1> to <21>, wherein at least one selected from benzyl alcohol, phenethyl alcohol, and 4-ethylbenzyl alcohol is preferable, and benzyl alcohol is more preferable.
<23> The content of component E is preferably 1% by mass or more, more preferably 2% by mass or more, further preferably 3% by mass or more, and further more preferably 5% by mass or more, from <1> to <22> The cleaning composition for fluxes in any one.
<24> The content of component E is preferably 25% by mass or less, more preferably 20% by mass or less, and further preferably 15% by mass or less, and the flux cleaner according to any one of <1> to <23> Composition.
<25> The ratio [component E / (component C + component D)] of the mass of component E and the total mass of component C and component D is preferably 0.2 or more, more preferably 0.25 or more, <1> To <24>. The flux cleaning composition according to any one of <24>.
<26> The ratio of the mass of component E to the total mass of component C and component D [component E / (component C + component D)] is preferably 0.4 or less, more preferably 0.35 or less, <1> To <25>. The flux cleaning composition according to any one of <25>.
<27> The ratio of the mass of component C to the mass of component D (component C / component D) is preferably 5 or greater, more preferably 6 or greater, and even more preferably 7 or greater, any of <1> to <26> A cleaning composition for flux according to claim 1.
<28> The ratio of the mass of component C to the mass of component D (component C / component D) is preferably 10 or less, more preferably 9.5 or less, and even more preferably 9 or less, <1> to <27> The flux cleaning composition according to any one of the above.
<29> The content of component F is preferably 10% by mass or more, more preferably 15% by mass or more, and further preferably 20% by mass or more, and the flux cleaning agent according to any one of <1> to <28> Composition.
<30> The content of component F is preferably 60% by mass or less, more preferably 50% by mass or less, further preferably 40% by mass or less, and further preferably 30% by mass or less, from <1> to <29> The cleaning composition for fluxes in any one.
<31> The cleaning composition according to the present disclosure further includes a hydrocarbon (component G) having or not having an unsaturated bond having 10 to 18 carbon atoms, according to any one of <1> to <30> The cleaning composition for fluxes as described.
<32> The cleaning composition for flux according to any one of <1> to <31>, wherein Component G is at least one selected from dodecene and tetradecene.
<33> The content of component G is preferably 0.5% by mass or more, and more preferably 0.8% by mass or more, and the flux cleaning composition according to any one of <1> to <32>.
<34> The content of component G is preferably 1.5% by mass or less, more preferably 1.3% by mass or less, and even more preferably 1.0% by mass or less, and any one of <1> to <33> A cleaning composition for flux as described in 1.
<35> The flux cleaning composition according to any one of <1> to <34>, wherein the pH is 8 or more and 14 or less.
<36> A flux residue cleaning method comprising a step of cleaning an object having a flux residue with the cleaning composition according to any one of <1> to <35>.
<37> The method for cleaning a flux residue according to <36>, wherein the object to be cleaned is a manufacturing intermediate of a soldered electronic component.
<38> A step of mounting at least one component selected from a semiconductor chip, a chip-type capacitor, and a circuit board on the circuit board by soldering using a flux, and a solder bump for connecting the parts and the like <36> or <37>, wherein at least one step selected from steps formed on a substrate and at least one step selected from a circuit board on which the component is mounted and a circuit board on which the solder bumps are formed are described The manufacturing method of an electronic component including the process wash | cleaned with the washing | cleaning method of the flux residue of.
<39> Use of the cleaning composition according to any one of <1> to <35> for manufacturing an electronic component.
<40> A kit in which at least one of the components A to F constituting the cleaning composition according to any one of <1> to <35> is stored in a state where it is not mixed with other components.

  Hereinafter, the present disclosure will be specifically described by way of examples. However, the present disclosure is not limited to the examples.

1. Preparation of cleaning composition (Examples 1-4, Comparative Examples 1-13)
The cleaning composition of Examples 1-4 and Comparative Examples 1-13 was prepared by mix | blending each component so that it might become a composition of following Table 1 in a 100 mL glass beaker, and mixing on the following conditions. The numerical value of each component in Table 1 indicates the content (% by mass) in the prepared cleaning composition unless otherwise specified.
・ Liquid temperature: 25 ℃
・ Stirrer: Magnetic stirrer (50mm rotor)
・ Rotation speed: 300rpm
・ Stirring time: 10 minutes

The following are used as components of the cleaning composition.
N-methylethanolamine (component A) (Nippon Emulsifier Co., Ltd., amino alcohol MMA)
・ Triethanolamine (non-component A) (manufactured by Nippon Shokubai Co., Ltd.)
・ Diethylene glycol monobutyl ether (component B) (Nippon Emulsifier Co., Ltd., butyl diglycol)
・ Diethylene glycol monohexyl ether (component B) (Nippon Emulsifier Co., Ltd., hexyl diglycol)
・ Ethylene glycol monoisopropyl ether (non-component B) (Nippon Emulsifier Co., Ltd., isopropyl glycol)
・ Diethylene glycol monoisopropyl ether (non-component B) (Nippon Emulsifier Co., Ltd., isopropyl diglycol)
Polyoxyethylene 2-ethylhexyl ether (component C) (Aoki Yushi Kogyo Co., Ltd., BROWNON EH-6, ethylene oxide average added mole number 6)
・ Benzyl alcohol (component E) (manufactured by LANXESS)
1-dodecene (component G) (Idemitsu Kosan Co., Ltd., Linearlene 12)
Water (component F) (pure water of 1 μS / cm or less produced with a pure water apparatus G-10DSTSET manufactured by Organo Corporation)
2-ethylhexyl glyceryl ether (component D) (produced by the following production method)
Cool 130 g of 2-ethylhexanol and 2.84 g of boron trifluoride ether complex to 0 ° C. with stirring. While maintaining the temperature at 0 ° C., 138.8 g of epichlorohydrin is added dropwise over 1 hour. After completion of dropping, excess alcohol is distilled off at 100 ° C. under reduced pressure (13 to 26 Pa). The reaction mixture is cooled to 50 ° C., and while maintaining the temperature at 50 ° C., 125 g of 48% aqueous sodium hydroxide is added dropwise over 1 hour and stirred for 3 hours. Then, 200 mL of water is added and the layers are separated. After removing the aqueous layer, it is further washed twice with 100 mL of water to obtain 208 g of crude 2-ethylhexyl glycidyl ether. 208 g of this crude 2-ethylhexyl glycidyl ether, 104.8 g of water, 5.82 g of lauric acid and 18.5 g of potassium hydroxide are placed in an autoclave and stirred at 140 ° C. for 5 hours. After dehydration at 100 ° C. under reduced pressure (6.67 kPa), 9.7 g of lauric acid and 2.72 g of potassium hydroxide were added, reacted at 160 ° C. for 15 hours, and then distilled under reduced pressure (53 to 67 Pa, 120 to 123 ° C.). To obtain 110.2 g of 2-ethylhexyl glyceryl ether.

2. Evaluation of Cleaning Composition Using the cleaning compositions of Examples 1 to 4 and Comparative Examples 1 to 13 prepared, tests were performed and evaluated for cleaning properties, stability, rinsing properties, and effects on solder metal.

[Detergency test]
A detergency test was performed to clean the test substrate under the following conditions.

<Test board>
The following flux is applied onto a copper wiring printed board (10 mm × 15 mm) using a screen plate. Thereafter, 10 microballs (Made by Senju Metal Industry Co., Ltd .: M705φ0.3 mm) are mounted, and a test substrate is prepared by reflowing at 250 ° C. in a nitrogen atmosphere.
[Flux composition]
Acid-modified ultra-light rosin (Arakawa Chemical Co., Ltd., Pine Crystal KE-604) 25% by mass, fully hydrogenated rosin (Eastman Chemical Co., Foral AX-E) 10% by mass, terpineol (Nippon Terpene Chemical Co., Ltd.) , Terpineol C) 10% by mass, hexyl diglycol (manufactured by Nippon Emulsifier Co., Ltd.) 30% by mass, dibromobutenediol (manufactured by Tokyo Chemical Industry Co., Ltd., trans-2,3-dibromo-2-butene-1,4-diol ) 2.5% by mass, dimer acid (manufactured by Arizona Chemical, UNIDYME14) 10% by mass, glutaric acid (manufactured by Tokyo Chemical Industry Co., Ltd.) 2.5% by mass, hydrogenated castor oil (manufactured by Toyokuni Oil Co., Ltd.) 4% by mass , Hexamethylene hydroxystearic acid amide (Nippon Kasei Co., Ltd., Sripacks ZHH 2 wt%, dextrin palmitate (Chiba Flour Milling Co., Rheopearl TL2) 2 wt%, hindered phenol-based antioxidant (BASF Corp., IRGANOX 245) 2 wt%
[Flux production method]
After mixing the solvent terpineol and hexyl diglycol, the remaining other components were added and dissolved to obtain a flux having the above composition.

<Washing method>
Washing was performed according to the following procedure. First, a cleaning tank, a first rinse tank, and a second rinse tank are prepared under the following conditions. The washing tank was obtained by adding 50 g of each cleaning composition to a 50 mL glass beaker containing one 50 mm rotator, putting it in a warm bath, and heating to 60 ° C. while stirring at a rotation speed of 100 rpm. The first rinsing tank and the second rinsing tank are prepared by preparing two 100 mL glass beakers each containing one 50 mm rotor, adding 100 g of pure water to each, putting them in a warm bath, and stirring them at a rotation speed of 100 rpm. Obtained by warming to ° C.
Next, the test substrate is held with tweezers, inserted into the cleaning tank, and immersed for 3 minutes while stirring at a rotation speed of 100 rpm. Next, the test substrate is held with tweezers, inserted into the first rinse tank, and immersed for 3 minutes while stirring at a rotation speed of 100 rpm. Further, the test substrate is held with tweezers, inserted into the second rinse tank, and immersed for 3 minutes while stirring at a rotation speed of 100 rpm. Finally, the test substrate is purged with nitrogen and dried.

<Evaluation of detergency>
After cleaning, the test substrate is observed with an optical microscope VHX-2000 (manufactured by Keyence Co., Ltd.), the presence or absence of a flux residue remaining around the solder bump is visually confirmed, and the cleaning property is evaluated according to the following criteria. The results are shown in Table 1 below.
[Evaluation criteria]
A: No cleaning residue B: One cleaning residue C: Two or more cleaning residues

<Evaluation of stability>
After preparing the cleaning composition, the state of the liquid (phase separation state) after standing for 5 minutes at a temperature of 25 ° C. is visually observed, and the stability is evaluated according to the following evaluation criteria. The results are shown in Table 1.
[Evaluation criteria]
○: Transparent △: Cloudiness ×: Separation

<Rinse evaluation>
The rinsing property was evaluated according to the following procedure. The evaluation results are shown in Table 1.
(1) A cleaning tank and a test substrate used for rinsing evaluation are prepared in the same manner as the cleaning tank and test substrate used for the above-described cleaning property evaluation, and a test substrate (hereinafter referred to as a substrate) is placed in the cleaning tank for 10 minutes. Immerse.
(2) Thereafter, the substrate is slowly pulled up over 20 seconds, and 500 g of pure water is put into a 500 mL glass beaker and immersed in a first rinse tank heated to 40 ° C. for 2 minutes without stirring.
(3) The substrate is slowly pulled up from the first rinsing tank over 20 seconds, and 500 g of pure water is put into a 500 mL glass beaker and immersed in a second rinsing tank heated to 40 ° C. for 2 minutes without stirring.
(4) The substrate is slowly pulled up from the second rinsing tank over 20 seconds, 500 g of pure water is put into a 500 mL glass beaker and immersed in an extraction tank heated to 40 ° C., and ultrasonically (38 kHz, 400 W) for 10 minutes. The substrate is processed, and the components of the cleaning composition adhering to the substrate surface are extracted.
(5) Next, the organic matter concentration of the water in the first and second rinsing tanks and the extracted water in the extraction tank is measured by a total organic carbon meter (TOC), and in the first rinsing tank, according to the following formula: Calculate the oil removal rate.
Oil removal rate in the first rinse tank (%)
= (Weight of organic substance in first rinsing tank) / (Weight of organic substance in first rinsing tank + Weight of organic substance in second rinsing tank + Weight of organic substance in extraction tank) × 100

<Evaluation of effects on solder metal>
The solder metal on the test substrate after the evaluation of the detergency was visually observed using an optical microscope VHX-2000 (manufactured by Keyence Corporation) and a desktop microscope, Miniscope TM3030 (manufactured by Hitachi High-Technologies Corporation), and the following evaluation was performed. Evaluate the effect on solder metal based on standards. The evaluation results are shown in Table 1.
[Evaluation criteria]
×: Influence on the solder metal due to corrosion etc. ○: No influence on the solder metal

  As shown in Table 1 above, the cleaning compositions of Examples 1 to 4 are more cleanable, stable and rinsed than Comparative Examples 1 to 3 and 6 to 13 which do not contain at least one of components A to E. And the influence on the solder metal was suppressed. Furthermore, the cleaning compositions of Examples 1 to 4 are more cleanable than the cleaning compositions of Comparative Examples 4 to 5 where Component E / (Component C + Component D) is not 0.18 to 0.45. It was excellent in stability and rinsing properties.

  By using this disclosure, flux residue can be cleaned well. For example, it is possible to shorten the flux residue cleaning process in the electronic component manufacturing process and improve the performance and reliability of the manufactured electronic component. The productivity of semiconductor devices can be improved.

Claims (6)

A compound represented by the following formula (I) (component A), a compound represented by the following formula (II) (component B), a compound represented by the following formula (III) (component C), and the following formula (IV) A compound represented by the formula (component D), an aromatic alcohol (component E), and water (component F),
A cleaning composition for flux, wherein the ratio of the mass of component E to the total mass of component C and component D (component E / (component C + component D)) is 0.18 to 0.45.

In the above formula (I), R ₁ is at least one selected from a hydrogen atom, a methyl group, an ethyl group and an aminoethyl group, and R ₂ is a hydrogen atom, a hydroxyethyl group, a hydroxypropyl group, a methyl group and an ethyl group. And R ₃ is at least one selected from a hydroxyethyl group and a hydroxypropyl group.
R ₄ —O— (CH ₂ CH ₂ O) _n —H (II)
In the above formula (II), R ₄ represents a hydrocarbon group having 4 to 7 carbon atoms, and n is an added mole number and an integer of 1 to 5 inclusive.
R ₅ —O— (CH ₂ CH ₂ O) _m —H (III)
In the above formula (III), R ₅ represents a hydrocarbon group having 8 or more and 12 or less carbon atoms, and m is an average added mole number, which is 4 or more and 8 or less.
R ₆ OCH ₂ —CH (OH) —CH ₂ OH (IV)
In the above formula (IV), R ₆ represents a hydrocarbon group having 6 to 11 carbon atoms.   The cleaning composition of Claim 1 whose component E is benzyl alcohol.   A method for cleaning a flux residue, comprising a step of cleaning an object having a flux residue with the cleaning composition according to claim 1.   The cleaning method according to claim 3, wherein the object to be cleaned is a manufacturing intermediate of a soldered electronic component.   A step of mounting at least one component selected from a semiconductor chip, a chip-type capacitor, and a circuit board on the circuit board by soldering using a flux, and solder bumps for connecting the parts etc. on the circuit board The method for cleaning a flux residue according to claim 3 or 4, comprising at least one step selected from the forming step, and at least one selected from a circuit board on which the component is mounted and a circuit board on which the solder bump is formed. And a method of manufacturing an electronic component, comprising:   Use of the cleaning composition according to claim 1 or 2 for the production of electronic parts.