JP6063107B2 - PCB waste processing method and processing equipment - Google Patents

Description

  The present invention, for example, pressure-sensitive copying paper contaminated with PCB (polychlorinated biphenyl), waste, sludge, PCB waste such as ballasts, transformers and capacitors as electrical equipment, and for storing these PCB wastes. Method for treating PCB waste suitable for detoxifying and recycling used steel drums and storage containers including plastic, corrugated, steel or wooden containers It relates to processing equipment.

  As is well known, PCB is a chemically very stable non-flammable substance, and has high electrical insulation properties and hardly volatilizes, so that it is an insulating oil for electrical components such as transformers and capacitors. In addition, it has been widely used as a heat medium in chemical plants, but is now prohibited from being used due to the adverse effects of PCBs on human bodies and the environment.

  However, the technology for detoxifying electrical equipment including PCB and sludge generated when insulating oil is regenerated using white clay has not been established, and has been stored for a long time. Yes. In addition, while PCB waste has been stored for a long period of time, PCBs may leak due to damage or corrosion deterioration of electrical equipment or its storage container. As a result, the soil where the electrical equipment is stored is contaminated with PCB, the waste used to wipe away the leaked PCB is contaminated, and such PCB contaminants are also stored as PCB waste. ing.

  Therefore, at present, the following PCB waste disposal methods have been proposed (see, for example, Patent Document 1). In this PCB waste processing method, first, insulating oil containing PCB is extracted from a storage container containing PCB waste such as electrical equipment, and then PCB waste is taken out from this storage container. Is cleaned with a cleaning agent. Then, using a plasma melting and decomposing furnace, the PCB waste is melted, and the PCB that remains and adheres to the PCB waste is decomposed. Furthermore, the insulating oil containing PCB extracted from the storage container and the cleaning agent containing PCB generated by the cleaning process of the storage container are decomposed.

2007-301416

  However, the conventional PCB waste processing method requires a cleaning operation for cleaning the storage container, and such a cleaning operation is troublesome and complicated. Furthermore, there is a possibility that the contamination of the PCB may be expanded by the cleaning operation, and a treatment for detoxifying the cleaning agent containing PCB generated by the cleaning operation is also required.

  Therefore, it is conceivable to melt the storage container in a plasma melting decomposition furnace without cleaning the storage container with a cleaning agent. However, when the storage container is large, it is necessary to increase the size of the plasma melting decomposition furnace in order to melt such a large storage container, which increases costs.

  On the other hand, it is assumed that PCB waste, which is the object to be treated, will be treated with a lot of ballasts, transformers, etc. In addition, it is assumed that other small electrical equipment including PCB, pressure sensitive paper, waste, sludge, etc. will be treated. doing. Moreover, even if it is a ballast, its shape, weight, internal components, and the like vary depending on the manufacturer, production time, specifications, and the like.

  Accordingly, the inventor of the present application makes it one of the tasks to perform the detoxification process of these various objects to be processed safely, appropriately, and quickly, and rationalizes the work process by manpower and the work process by machine. By combining them, it is also an issue to improve the processing capacity while giving priority to preventing the spread of contamination and ensuring safety.

  The present invention has been made to solve the above-described problems, and plasma melt decomposition is possible regardless of the size of PCB waste and the storage container that has been used to store this PCB waste. To provide a PCB waste processing method and its processing equipment capable of preventing the furnace from becoming excessively large and performing a detoxification process using a plasma smelting decomposition furnace of an appropriate size. It is an object.

  The PCB (polychlorinated biphenyl) waste processing method according to the first aspect of the present invention is a sealed container or a sealing resin bag having a size capable of supplying PCB waste contained in a storage container into a plasma melting decomposition furnace. A refilling step of refilling, and a melting and decomposing process of decomposing PCB by supplying the small-sized refilled PCB waste refilled in the enclosing container or the encapsulating resin bag into the plasma melting and decomposing furnace. It is characterized by comprising.

  According to the method for treating PCB waste according to the first invention, first, the PCB waste stored in the storage container is refilled into an enclosing container or an encapsulating resin bag having a size that can be supplied into the plasma melting decomposition furnace. Next, the small-sized refilled PCB waste refilled in the enclosing container or the encapsulating resin bag is supplied into the plasma melting decomposition furnace. As a result, the PCB contained in the PCB waste can be decomposed.

  The PCB waste processing method according to the second invention is the pre-process performed before the refilling step in the first invention, wherein the PCB waste contained in the storage container accommodated in the storage container, A classification process for classifying PCB waste contained in a small storage container accommodated in a small storage container of a predetermined size or less and PCB waste containing a large storage container accommodated in a larger storage container larger than that is provided. It is characterized by this.

  According to the method for treating PCB waste according to the second invention, first, PCB waste contained in a storage container is divided into PCB waste in a small storage container, and PCB waste in a large storage container larger than that. Classify into: Next, the PCB waste of the sorted PCB waste in the small storage container and the PCB waste of the PCB waste in the large storage container can be supplied into the plasma melting cracking furnace in separate work processes. It can be refilled into a sealed container or a sealed resin bag. If it does in this way, each refilling operation | work of PCB waste containing a small storage container and PCB waste containing a large storage container can be performed efficiently. For example, refilling of PCB waste containing a small storage container can be performed using a glove box, and refilling work of PCB waste containing a large storage container can be performed in a dismantling chamber.

  The PCB waste processing method according to the third invention is the first or second invention, wherein the refilling operation in the refilling step is performed using a glove box having a PCB sealing function, or It is characterized in that it is performed in a dismantling treatment chamber having a sealing function.

  According to the method for treating PCB waste according to the third aspect of the invention, the refilling operation for refilling the PCB waste into an enclosing container or an encapsulating resin bag having a size that can be supplied into the plasma melting and decomposing furnace is a sealing function of the PCB. By using the glove box having the above, it is possible to prevent the PCB from being affected by the operator. Further, by performing this refilling operation in a demolition processing chamber having a PCB sealing function, contamination by PCB can be limited to this demolition processing chamber, and expansion of contamination can be prevented.

  According to a fourth aspect of the present invention, there is provided a PCB waste processing method according to any one of the first to third aspects, wherein the PCB waste that has been extracted and emptied, or the PCB waste is stored. The crushing step of crushing the storage container in a state to be a PCB crush by a crusher, the discharge port of the crusher and the supply port of the plasma melting cracking furnace are connected via a supply device, and the supply device A supply step of supplying the PCB crushed material discharged from the discharge port of the crusher into the plasma melting decomposition furnace through the supply port, and the PCB crushing supplied into the plasma melting decomposition furnace And a melt-decomposition process step for melt-decomposing the product.

  According to the method for treating PCB waste according to the fourth aspect of the present invention, the storage container in which the PCB waste is taken out and emptied, or the storage container in which the PCB waste is accommodated, is crushed by a crusher and the PCB. The PCB can be decomposed by making it into a crushed material and supplying the PCB crushed material into a plasma melting and decomposing furnace using a supply device.

  In other words, if the storage container cannot be supplied into the plasma melting / decomposing furnace as it is, the PCB is sized so that the storage container can be crushed by a crusher and supplied into the plasma melting / decomposing furnace. Can be made. Accordingly, such a storage container can be melt-decomposed using a plasma melting / decomposing furnace having an appropriate size and scale.

  Of course, even if PCB waste is stored in the storage container, it can be crushed by a crusher. In addition, a storage container having a size larger than the standard can be crushed with a crusher after being disassembled to a size that can be passed through a crusher.

  Therefore, it is not necessary to wash the storage container that is of a size that cannot be supplied to the plasma melting cracking furnace and can be melt-decomposed and is contaminated with PCB, thereby reducing the labor of the operator. In addition, the spread of PCB contamination during cleaning can be prevented.

  And according to this supply apparatus, since the PCB crushed material discharged | emitted from the discharge port of a crusher can be supplied in a plasma melting cracking furnace via a supply port, PCB crushed material is put in a plasma melting cracking furnace. There is no need to refill another supply container in order to supply it. Therefore, the trouble of refilling the PCB crushed material into the supply container is unnecessary, and the cost of such a supply container can be reduced.

The PCB waste processing method according to a fifth aspect of the present invention is the method for processing PCB waste according to any one of the first to fourth aspects, wherein the small-sized refilled PCB waste produced in the refilling step is crushed by the crusher. A storage step for storing the previous storage container;
The small-sized refilled PCB waste stored in the storage step is supplied into the plasma melting cracking furnace at predetermined time intervals, or the storage container stored in the storage step is replaced with the crusher Then, the PCB crushed material is supplied into the plasma melting and decomposing furnace at a predetermined time interval to decompose the PCB.

  According to the method for treating PCB waste according to the fifth aspect of the invention, the small-sized refilled PCB waste can be stored, so that the stored small-sized refilled PCB waste can be stored at a predetermined time interval. It can be fed into a plasma melting cracking furnace. As a result, the fluctuation range of the amount of gas generated in the plasma melting cracking furnace can be reduced. Therefore, in order to keep the pressure in the cracking furnace substantially constant, for example, the rotational angle of the exhaust fan for exhausting the generated gas from the cracking furnace or the angle of the damper to change the opening degree of the exhaust port is controlled. Although adjustment is performed, the control amount of the rotational speed and the angle adjustment amount of the damper can be reduced. As a result, the plasma melting decomposition furnace and the exhaust gas treatment facility connected to the decomposition furnace can be stably operated.

  Then, the storage container is crushed by a crusher, and the PCB crushed material is supplied into the plasma melting cracking furnace at a predetermined time interval. It is possible to stably operate the exhaust gas treatment facility.

  According to a sixth aspect of the present invention, there is provided a PCB waste processing method according to the fourth or fifth aspect, wherein the PCB crushed material is discharged from the crusher through the supply device to the supply port of the plasma melting cracking furnace. The supply path is hermetically sealed with a partition wall from the outside.

  According to the method for treating PCB waste according to the sixth invention, the PCB crushed material discharged from the discharge port of the crusher can be automatically supplied to the supply port of the plasma melting cracking furnace by the supply device. An operator can be prevented from being contaminated with PCB crushed material. And since the supply path of the PCB crushed material from the discharge port of the crusher through the supply device to the supply port of the plasma melting cracking furnace is hermetically sealed with a partition wall between the outside and the PCB by the PCB crushed material Contamination can be prevented from spreading outside the partition wall.

  According to a seventh aspect of the present invention, there is provided a PCB waste processing method according to any one of the first to sixth aspects, wherein the generated gas generated when the PCB waste is melted and decomposed in the plasma melting cracking furnace is 1100 ° C. The heat retention chamber maintained at the above temperature is retained for 2 seconds or longer for processing.

  According to the method for treating PCB waste according to the seventh aspect of the present invention, the generated gas generated when the PCB waste is melt-decomposed in the plasma melting cracking furnace is generated in the heat retention chamber maintained at a temperature of 1100 ° C. or higher. It can be processed by being retained for more than a second. Thereby, PCB contained in PCB waste can be completely decomposed and rendered harmless.

  The PCB waste treatment facility according to the eighth aspect of the present invention supplies the PCB waste by crushing the PCB waste or the storage container used for storage of the PCB waste with a crusher. A PCB waste treatment facility that decomposes PCB by supplying it into a plasma melting and decomposing furnace using an apparatus, wherein the supplying device is configured to decompose the PCB crushed material discharged from an outlet of the crusher into the plasma melting and decomposing process. The supply path of the PCB crushed material from the discharge port of the crusher through the supply device to the supply port of the plasma melting cracking furnace can be supplied to the furnace supply port by a partition between the outside and the outside. It is hermetically sealed.

  According to the PCB waste processing facility according to the eighth aspect of the present invention, it operates in the same manner as the PCB waste processing method according to the fourth and sixth aspects of the present invention.

  According to a ninth aspect of the present invention, there is provided the PCB waste processing facility according to the eighth aspect, wherein the supply device includes a weighing machine capable of weighing the PCB crushed material discharged from the crusher by a predetermined weight. The PCB crushed material weighed by the predetermined weight by the weighing machine is supplied into the plasma melting decomposition furnace at a predetermined timing.

  According to the PCB waste processing facility according to the ninth aspect of the invention, the PCB crushed material discharged from the crusher can be weighed by a predetermined weight by the weighing machine provided in the supply device. Then, the PCB crushed material weighed by a predetermined weight by this weighing machine can be supplied into the plasma melting cracking furnace at a predetermined timing. As a result, the fluctuation range of the amount of gas generated in the plasma melting cracking furnace can be reduced. Therefore, in order to reduce the pressure fluctuation in the cracking furnace, for example, a damper is used to control the rotational speed of an exhaust fan for exhausting the generated gas from the cracking furnace or to change the opening degree of the exhaust port. However, the control amount of the rotational speed and the angle adjustment amount of the damper can be reduced. As a result, the plasma melting decomposition furnace and the exhaust gas treatment facility connected to the decomposition furnace can be stably operated.

  According to the PCB waste processing method and its processing equipment according to the present invention, the PCB waste is refilled into an enclosing container or encapsulating resin bag having a size that can be supplied into the plasma melting decomposition furnace, and the small refilled PCB is obtained. Since the PCB is decomposed by supplying waste into the plasma melting / disassembling furnace, the plasma melting / disassembling furnace has an appropriate size and processing capable of melting / disassembling the small-sized refilled PCB waste. Can be designed to competence. Furthermore, since the plasma melting and cracking furnace can be designed to have an appropriate size and processing capacity in this way, the exhaust gas treatment equipment for detoxifying the generated gas generated in the plasma melting and cracking furnace is also of an appropriate size and Can be designed for throughput. As a result, the plasma melting cracking furnace and the exhaust gas treatment facility can be prevented from becoming excessively large, and the facility cost can be reduced.

  Since this PCB waste is refilled and sealed in an enclosing container or an encapsulating resin bag, the PCB is refilled until the small-sized refilled PCB waste is supplied into the plasma melting decomposition furnace. Exposure can be prevented, and the spread of PCB contamination can be prevented.

It is a figure which shows the pre-processing process of the processing method of the PCB waste which concerns on one Embodiment of this invention. It is a figure which shows the detoxification process process of the processing method of the PCB waste which concerns on the same embodiment. It is a figure which shows the plasma melting cracking furnace, crushed material supply apparatus, and crusher which are used for the embodiment. It is a figure for demonstrating the procedure which supplies the crushed material supply apparatus PCB crushed material used for the same embodiment in a plasma melting cracking furnace, (a) is a figure which shows the open state of the 1st supply seal gate. (B) is a figure which shows the operation state of a 2nd crushed material feeder. It is a figure for demonstrating the procedure which supplies PCB crushed material in a plasma melting cracking furnace with the crushed material supply apparatus used for the embodiment, (a) is the stop state and measurement state of a 2nd crushed material feeder FIG. 6B is a diagram showing a closed state of the first supply seal gate. It is a figure for demonstrating the procedure which supplies the PCB crushed material in a plasma melting cracking furnace with the crushed material supply apparatus used for the embodiment, (a) shows opening preparation of the 2nd supply seal gate. FIG. 4B is a diagram showing an open state of the second supply seal gate. It is a figure for demonstrating the procedure which supplies PCB crushed material in a plasma melting cracking furnace with the crushed material supply apparatus used for the embodiment, (a) is a figure which shows the inclination state of a measurement container, (b) () Is a figure which shows the tilting return state of a measurement container. It is a figure for demonstrating the procedure which supplies PCB crushed material in a plasma melting cracking furnace by the crushed material supply apparatus used for the embodiment, and is a figure which shows the closed state of the 2nd supply seal gate. It is a figure which shows the amount of generated gas generated when PCB crushed material etc. are supplied in the plasma melting cracking furnace used for the embodiment at predetermined time intervals, and (a) shows the PCB crushed material etc. at 5 minute intervals. The figure which shows the amount of gas generated when it supplies by (1), (b) is the figure which shows before the synthesis | combination of the amount of generated gas when PCB crushed material etc. are supplied at intervals of 1 minute, (c) is PCB It is a figure which shows what synthesize | combined the generated gas amount generated when a crushed material etc. are supplied at intervals of 1 minute.

  Hereinafter, an embodiment of a PCB waste processing method and processing equipment according to the present invention will be described with reference to FIGS. This PCB waste treatment method includes, for example, pressure-sensitive copying paper, waste, sludge, ballasts as electrical equipment, transformers, condensers, and other PCB waste 11 contaminated with PCB (polychlorinated biphenyl), and these PCB wastes. Steel drums that have been used to store objects, and storage containers 12 including synthetic resin, cardboard, steel, or wooden containers can be detoxified or recycled. There is a pretreatment process performed in the pretreatment facility 10 shown in FIG. 1 and a detoxification treatment process performed in the detoxification treatment facility 37 shown in FIG.

  In the pretreatment process shown in FIG. 1, the PCB waste 13 and PCB waste 11 contained in the storage container and carried in the storage container 12 are supplied into the plasma melting decomposition furnace 14 (supply ports 15 and 16). It has a refilling step of refilling a sealed container 17 of a size that can be made and a resin bag 18 for sealing to produce a small-sized refilled PCB waste 19. This refilling step includes a contamination / demolition treatment chamber 20, This is performed in the second drum can inspection room 21 and the supply pretreatment facility 22.

  Then, as shown in (B)-(B), this small-sized refilled PCB waste 19 is supplied into the plasma melting decomposition furnace 14 in the detoxification treatment step shown in FIG. 11 and the PCB adhering to the enclosing container 17 and the encapsulating resin bag 18 containing the PCB waste 11 are decomposed.

  Further, in the pretreatment step shown in FIG. 1, the storage container 12 (the large storage container and the small storage container dismantled) from which the PCB waste 11 is taken out and emptied, and the PCB waste 11 and the dismantling are disassembled. A crushing step of crushing a storage container (crushing container 23) in a state in which a large storage container is accommodated by a crusher 24 to obtain a PCB crushed material 25 is provided. And as shown to (A)-(A), this PCB crushed material 25 is supplied in the plasma melting decomposition furnace 14 in the detoxification process shown in FIG. 2, and PCB is decomposed | disassembled.

  Next, the detoxification treatment step shown in FIG. 2 has a melt decomposition treatment step in which the small-sized refilled PCB waste 19 and the PCB crushed material 25 are melted and decomposed by the plasma melting decomposition furnace 14. In addition, an exhaust gas treatment process is also provided for detoxifying the generated gas that may contain harmful substances generated in the plasma melting and decomposing furnace 14 by the exhaust gas treatment facility 26. In this way, the PCB waste 13 with the storage container and the crushing container 23 that are accommodated in the storage container 12 and carried in can be detoxified.

  Next, the pretreatment process shown in FIG. 1 will be described in detail. The pretreatment facility in which this pretreatment process is performed includes an inspection room 27, an inspection room 28 such as a first drum can, a contamination / demolition processing room 20, an inspection room 21 such as a second drum can, a waste cargo handling room 29, and a pretreatment facility 22 for supply. , A supply waiting chamber 30, a crush waiting chamber 31, and a crushing facility chamber 32.

  First, in the pretreatment process shown in FIG. 1, the PCB waste 13 contained in the storage container that is carried in the storage container 12 is routed from receiving the processing object to storage depending on the type of the storage container 12. A classification step for classifying into two types A and B is provided.

  Class A is a PCB waste 33 with a small storage container that is carried in a small storage container that is smaller than the size of a drum can, and PCB waste that is carried in a storage container other than a drum can is also transported. Is included.

  Class B is a PCB waste 34 with a large storage container that is housed and transported in a large storage container larger than the size of a drum can or a large storage container (wooden box, cardboard box) with low sealing performance.

  The inspection room 27 is in a small storage container of type A that is sound after visually checking the soundness (the soundness of whether the PCB is leaking) of the received PCB wastes 33 and 34 in small and large storage containers. The PCB waste 33 is transported to the inspection chamber 28 such as the first drum can.

  However, the PCB waste 33 with a small storage container and the PCB waste 34 with a large B storage container confirmed to be unclean and contaminated are transported to the contamination / demolition processing chamber 20.

  The first drum can inspection room 28 removes, for example, the drum band on the receiving conveyor of the inspection glove box, and opens the lid of the drum can in the inspection glove box for the PCB waste 33 containing the A-type small storage container. It has a function to select the next process to be sent out by visually confirming PCB waste (difference from listed contents, presence or absence of leakage, necessity of sorting). In addition, a weighing machine for weighing the PCB waste 11 is installed. Then, on the delivery conveyor of the inspection glove box, for example, a lever-type band is attached to the drum can and conveyed to the waste cargo handling chamber 29 in the next process.

  In addition, the inspection glove box for opening the small storage container and each glove box described below have a PCB sealing function and leak in order to ensure the safety of the worker while maintaining the workability. A configuration in which prevention is ensured is used. In addition, if it is not possible to confirm what the PCB waste 11 is even after opening the small storage container (for example, it is wrapped in waste cloth and cannot be visually checked), the PCB waste is checked by an X-ray inspection apparatus. 11 can be confirmed.

  The contamination / demolition processing chamber 20 has a PCB sealing function, and accepts the B waste PCB 34 in a large storage container, and the A waste PCB 33 in a small storage container A confirmed to be contaminated. For the above, an operation (refilling step) of refilling the stored PCB waste 11 into a crushing container 23 such as a drum can and a refilling enclosure 17 such as a pail can is performed. In addition, the large storage container and the small storage container are disassembled and refilled into the crushing container 23 or the refilling enclosure 17 (refilling step).

  The crushing container refilled PCB waste 35 refilled in the crushing container 23 is crushed by the crusher 24 in the subsequent stage and supplied to the supply port 15 (see FIG. 3) of the plasma melting decomposition furnace 14. Then, the small-sized refilled PCB waste 19 refilled in the refill enclosure 17 is supplied into the cracking furnace 14 from the supply port 16 (see FIG. 3) of the plasma melting cracking furnace 14 as it is. .

  A weighing machine is also installed for weighing each weight before and after the refilling operation.

  The PCB waste 11 such as a bushing of a large electric device is crushed and refilled into a crushing container 23 or a refilling enclosure 17. And the operation | work which refills the sludge containing PCB also to these crushing containers 23 or the refilling enclosure 17 is performed.

  The inspection room 21 such as the second drum can has a supply unit weight that exceeds the supply unit weight to the plasma melting and decomposing furnace 14 among the ballast and the small electric equipment which are the electrical equipment sorted in the contamination / demolition processing room 20. A division (oil removal, cutting) operation for the following is performed. Further, an operation (refilling step) of refilling the divided PCB waste 11 into the crushing container 23 or the refilling enclosure 17 is also performed.

  The crushing container refilled PCB waste 35 refilled in the crushing container 23 is crushed by the crusher 24 at the subsequent stage and supplied to the plasma melting decomposition furnace 14. Then, the small-sized refilled PCB waste 19 refilled in the refill enclosure 17 is supplied into the cracking furnace 14 from the supply port 16 of the plasma melting cracking furnace 14 as it is.

  These ballasts and small electric devices are designed to allow oil removal and cutting operations using a ballast and small electric device dismantling glove box. In the glove box, a cutting machine, a punching machine, a conveying device, etc. is set up. The glove box is sealed inside so that the PCB does not expand.

  For example, the ballast cutting position (the gap between the transformer and the capacitor, which can be cut so that the PCB does not leak) can be specified by an X-ray inspection apparatus, and data indicating the specified cutting position is It can be transmitted to the cutting machine in the glove box. The cutting machine can automatically cut the ballast or the like based on this data.

  The waste handling chamber 29 is the PCB waste 33 in the A-type small storage container, the contamination / demolition processing chamber 20, and the second drum can inspection chamber 21 (stabilizer or small electric device dismantling glove box). Next, the refilled crushing container 23 and the refillable enclosure 17 fall under the category of the PCB waste 11 contained in the containers (stabilizer, small electric device, pressure sensitive paper, waste, sludge, etc.) Work to send out to the process is performed. In addition, a cargo rack (shelf) in which crushing containers 23 used in the contamination / dismantling processing chamber 20 are stored is also installed.

  The pre-supply treatment facility 22 takes out the PCB waste 11 from the PCB waste 33 in the A-type small storage container sent from the waste loading chamber 29 and supplies the PCB waste 11 to the plasma melting decomposition furnace 14. Work is performed to bring the supply unit weight below that which can be done. The supply pretreatment facility 22 includes a ballast sorting glove box (stabilizer pre-supply chamber) and a sludge sorting glove box (sludge pre-feed chamber).

  The ballast sorting glove box takes out the ballast and small electrical equipment (such as a ballast) from the small storage container 12 in a hermetically sealed glove box, individually weighs them, and supplies them to the plasma melting decomposition furnace 14. In accordance with the supply unit weight (size that can be passed through the supply port 16 of the cracking furnace 14), the resin bag 18 for refilling is refilled to produce a small-sized refilled PCB waste 19 (refilling). Process).

  The sludge sorting glove box is equipped with a hermetically sealed glove box, and the following operations are performed.

  For example, the pressure-sensitive paper and waste housed in a small storage container 12 such as a drum can have a unit weight for supply to the plasma melting cracking furnace 14 (limit weight and size that can be passed through the feed port 16 of the cracking furnace 14). At the same time, an operation of refilling the small storage container 12 into a refilling enclosure 17 such as a pail can (pre-supply process) is performed (refilling step).

  The sludge contained in a small storage container 12 such as a drum can is used for refilling a pail can or the like containing an adsorbent of about 50% of the supply unit weight (restricted weight) in consideration of the presence of moisture and the like. The operation of refilling the enclosure 17 (pre-supply process) is performed. The enclosure 17 such as a pail can is filled with sludge of supply unit weight (limit weight) (refilling step).

  In the case of liquid waste, an operation of refilling the adsorbent with a supply unit weight (restricted weight) and this liquid waste with a supply unit weight (restricted weight) into a sealed container 17 such as a pail can (pre-supply process) (Refilling step).

  The enclosure 17 employs a pail can with a stopper, for example. As this stopper, for example, a plastic rupture disk (rupture disk) is used. This rupture disk is designed to burst when the pressure in the enclosure 17 exceeds a certain level. Therefore, when the enclosure 17 is ruptured in the plasma melting decomposition furnace 14, the furnace pressure can be prevented from changing rapidly. On the other hand, when an airtight container is employed as the enclosed container 17, the furnace pressure may change abruptly when ruptured in the melting cracking furnace.

  In this way, by preventing the furnace pressure from changing suddenly, the plasma melting cracking furnace 14 shown in FIG. 2 described later and the exhaust gas treatment facility 26 connected to the cracking furnace 14 are operated relatively stably. Can do.

  The supply waiting room 30 is used to absorb the difference in the operation time and the number of days between the pretreatment process shown in FIG. 1 and the detoxification treatment process shown in FIG. In order to absorb the difference between the processing amount of the processing step and the processing amount of the detoxification processing step, it has a function as a buffer (storage step). Further, it has a cargo handling function capable of supplying PCB waste 11 and the like in accordance with the processing requirements of the plasma melting cracking furnace 14. The supply waiting cargo storage chamber 30 includes a supply waiting ballast loading rack and a supply waiting pail can loading rack. It also has a new pail can cargo rack that houses new pail cans for refilling.

  A large number of small-sized refilled PCB wastes 19 are accommodated in these supply waiting ballast racks and supply pail can loading racks. As shown in (B)-(B), these small-sized refilled PCB wastes 19 are supplied as they are to the plasma melting decomposition furnace 14 (melting decomposition process step).

  The crush waiting cargo storage chamber 31 is used to load the crushing container 23 and the small storage container 12 which are crushing treatment objects in order to stably operate the crusher 24 in the next process (storage process). . As the crushing container 23 and the small storage container 12, there are a drum can made of steel and synthetic resin, and a container made of plastic.

  This crushing container 23 is crushed by a crusher 24 in the next step and, as shown in (A)-(A), is supplied to the plasma melting cracking furnace 14 as a PCB crushed material 25 (feeding step), ( Melt decomposition process).

  As shown in FIG. 1, the crushing equipment chamber 32 is provided with a crusher 24, and the small storage container 12, the crushing container 23, or the PCB waste 11 from which the PCB waste 11 is taken out and emptied. This is a room for crushing the housed small storage container 12 and the crushing container 23 with the crusher 24 to obtain the PCB crushed material 25 (crushing step).

  As shown in FIG. 3, the crusher 24 has a discharge port 24 a of the crusher 24 and a supply port 15 of the plasma melting cracking furnace 14 connected via a crushed material supply device 36. The PCB crushed material 25 discharged from the discharge port 24a of the crusher 24 can be supplied into the decomposition furnace 14 via the supply port 15 of the plasma melting decomposition furnace 14 (supply process).

  Next, a case where a high-concentration PCB contaminant is handled in the contamination / demolition processing chamber 20 is compared with a case where it is handled by the crusher 24. We have confirmed that PCB stock solution, white clay, waste cloth, etc. wiped off PCB stock solution, which are high-concentration PCB contaminants, can be easily classified and refilled by a verification test. The main processing object in In other words, high-concentration PCB contaminants such as PCB undiluted solution and white clay do not need to be crushed by the crusher 24, and if passed through the crusher 24, the crusher 24 is contaminated with high-concentration PCB. is there.

  On the other hand, main crushing objects are a storage container 12 having a relatively low PCB concentration, a crushing container 23, and the like. The reason is that it was confirmed in the demonstration test that it would require an enormous labor force when attempting to dismantle them using human power or hand tools. Therefore, it was determined that it would be appropriate to supply them to the melting and decomposing furnace 14 without crushing or bagging them with the crusher 24.

  Next, the detoxification process shown in FIG. 2 will be described in detail. A detoxification treatment facility 37 in which this detoxification treatment step is performed includes a plasma melting decomposition furnace 14 and an exhaust gas treatment facility 26.

  The inside of the plasma melting and decomposing furnace 14 is maintained at about 1400 ° C., and the PCB contained in the PCB waste 11 is decomposed in this furnace (melting and decomposing process step). However, the temperature of the irradiated plasma is about 1500 ° C. or higher. As shown in FIG. 2, two first and second discharge passages 38 and 39 are formed in the lower portion of the plasma melting and cracking furnace 14. The two first and second discharge passages 38 and 39 have two first and second containers 40 and 41 in which molten waste (slag), which is detoxified by decomposing PCB in the furnace, is disposed outside. It can be taken out. The first discharge path 38 can discharge the molten glass out of the slag in the furnace and take it out to the first container 40. The second discharge path 39 can discharge molten metal out of the slag in the furnace and take it out to the second container 41. Those that have been solidified from molten glass and molten metal can be reused (appropriately processed) as resources after graduation determination and those determined to be harmless.

  In addition, the plasma melting and decomposing furnace 14 is sent from the crushing waiting cargo chamber 31 to the crushing machine 24, and is crushed and discharged. Small refilled PCB wastes 19 sent from a supply-pail (canned pail rack) are supplied into the furnace 14 at a pitch (interval) of about once per minute, for example, and are melted and decomposed. Is set to Of course, the supply interval of the small-sized refilled PCB waste 19 into the furnace 14 can be set to a time interval other than 1 minute.

  As shown in FIG. 2, the exhaust gas treatment facility 26 is for detoxifying the generated gas generated in the plasma melting cracking furnace 14, and includes a heat retention chamber 42, an exhaust gas heat exchanger 43, and a temperature reduction tower 44. , A bug filter 45 and a processing device 46. The bag dust and evaporation residue discharged from the exhaust gas treatment facility 26 are determined to be graduated, and those determined to be harmless are appropriately processed.

  The thermal residence chamber 42 is a thermal residence chamber 42 in which the generated gas generated when the PCB crushed material 25 and the PCB waste 11 are melted and decomposed in the plasma melting and decomposition furnace 14 is maintained at a temperature of 1100 ° C. or higher. It can be processed by being retained for 2 seconds or more. Thereby, the PCB contained in the PCB crushed material 25 and the PCB waste 11 can be completely decomposed and rendered harmless.

  Next, the operations of the PCB waste processing method (pretreatment process, detoxification process) configured as described above and the processing equipment (pretreatment equipment 10, detoxification equipment 37) are shown in FIG. This will be described with reference to FIG. According to the pretreatment process shown in FIG. 1, the PCB waste 11 (PCB waste 13 contained in the storage container) that is accommodated and carried in the storage container 12 can be supplied into the plasma melting decomposition furnace 14 (supply port 16). There is a refilling step of refilling the enclosing container 17 of the limit weight and size and the encapsulating resin bag 18 to produce a small-sized refilled PCB waste 19. Therefore, as shown in (B)-(B), this small-sized refilled PCB waste 19 can be supplied into the plasma melting cracking furnace 14 in the detoxification treatment step shown in FIG. The PCB waste 11 and the PCB adhering to the enclosing container 17 and the encapsulating resin bag 18 containing the PCB waste 11 can be decomposed.

  Further, in the pretreatment step shown in FIG. 1, the storage containers (the large storage container 12 and the small storage container 12 that have been disassembled), the PCB waste 11, and the PCB waste 11 being dismantled are removed. The crushing container 23 in a state in which the large storage container 12 is accommodated is crushed by a crusher 24 to obtain a crushed PCB 25. Therefore, as shown in (A)-(A), the PCB crushed material 25 can be supplied into the plasma melting and decomposing furnace 14 in the detoxification treatment step shown in FIG. PCB contained in the can be decomposed.

  Accordingly, the plasma melting / decomposing furnace 14 shown in FIG. 2 is designed to have an appropriate size and processing capacity capable of performing the melting / disassembling process of such a small-sized refilled PCB waste 19 and a PCB crushed material 25. Can do. Furthermore, since the plasma melting cracking furnace 14 can be designed to have an appropriate size and processing capacity in this way, the exhaust gas treatment facility 26 shown in FIG. 2 for detoxifying the generated gas generated in the plasma melting cracking furnace 14 is used. Can also be designed to an appropriate size and throughput. As a result, the plasma melting cracking furnace 14 and the exhaust gas treatment facility 26 can be prevented from becoming excessively large, and the facility cost can be reduced.

  Then, the PCB waste 11 is refilled into the enclosing container 17 or the encapsulating resin bag 18 and sealed so as to prevent PCB leakage. The PCB is exposed until it is supplied into the furnace 14 (for example, while being stored in the waste cargo storage chamber 29, the crush waiting cargo storage chamber 31 and the supply waiting cargo storage chamber 30 shown in FIG. 1). This can prevent the spread of PCB contamination.

  According to the pretreatment process shown in FIG. 1, the PCB waste 13 containing the storage container accommodated in the storage container 12 is routed from receiving the processing object to storage depending on the type of the storage container 12. They are classified into two forms, class A and class B (classification process). Class A is PCB waste 33 in a small storage container, and Class B is PCB waste 34 in a large storage container.

  Thereby, the PCB waste 11 of the PCB waste 33 with the small storage container and the PCB waste 11 of the PCB waste 34 with the large storage container are respectively supplied to the plasma melting and decomposing furnace 14 (supply) in separate work steps. It can be refilled into an enclosing container 17 or an encapsulating resin bag 18 of a size that can be supplied to the mouth 15).

  If it does in this way, each refilling operation | work of the PCB waste 33 with a small storage container and the PCB waste 34 with a large storage container can be performed efficiently. For example, the refilling operation of the PCB waste 33 with the small storage container can be performed by using the glove box of the pre-supply processing facility 22 shown in FIG. It can be carried out in the contamination / demolition treatment chamber 20.

  In this way, the refilling operation of refilling the PCB waste 11 into the enclosing container 17 or the encapsulating resin bag 18 having a size that can be supplied into the plasma melting and decomposing furnace 14 is performed by using a glove box having a PCB sealing function. By using it, it is possible to prevent the PCB operator from being affected. Further, by performing this refilling operation in the contamination / demolition processing chamber 20 having a PCB sealing function, it is possible to limit the contamination by PCB to the contamination / demolition processing chamber 20 and prevent the spread of contamination. it can.

  Next, the crusher 24 and the crushed material supply device 36 will be described with reference to FIG. The crusher 24 includes a small storage container 12, a crushing container 23 in which the PCB waste 11 is taken out and emptied, or a small storage container 12 in which the PCB waste 11 is accommodated, a crushing container 23 (hereinafter referred to as “crushing container 23”). These are simply referred to as “small storage containers 12 etc.”), and the PCB crushed material 25 can be produced.

  As shown in FIG. 3, the small storage container 12 and the like are transported from the crush waiting chamber 31 by the carry-in device 47 and supplied to the crusher 24 from the supply port 24 b of the crusher 24. The crusher 24 crushes the small storage container 12 and the like to produce a PCB crushed material 25, and the PCB crushed material 25 is supplied into the plasma melting decomposition furnace 14 by a crushed material supply device 36.

  As shown in FIG. 3, the crushed material supply device 36 can supply the PCB crushed material 25 discharged from the discharge port 24 a of the crusher 24 to the supply port 15 of the plasma melting cracking furnace 14. A crushed material feeder 48, a second crushed material feeder 49, and a weighing machine 50 are provided.

  According to the crushed material supply device 36, the PCB crushed material 25 discharged from the crusher 24 is received by the first crushed material feeder 48, and the first crushed material feeder 48 is operated, whereby the PCB crushed material 25 is removed. 2 It can be conveyed on the crushed material feeder 49. Then, by operating the second crushed material feeder 49, the PCB crushed material 25 can be supplied into the weighing container 50a provided in the weighing machine 50. Then, when a predetermined crushed PCB crushed material 25 is supplied to the weighing container 50a, a control unit (not shown) stops the second crushed material feeder 49.

  After that, the tilting drive unit 51 provided in the weighing machine 50 is actuated to tilt the weighing container 50a, and the PCB crushed material 25 in the weighing container 50a is passed through the supply chute 52 to the plasma melting cracking furnace. 14 can be supplied. Note that the tilting operation of the weighing container 50a is set to be performed at a predetermined time interval set in advance in the control unit, for example, at an interval of 1 minute.

  According to the crusher 24 and the crushed material supply device 36 configured as described above, the small storage container 12 shown in FIG. 3 is crushed by the crusher 24 to obtain a PCB crushed material 25. Can be automatically supplied into the plasma melt decomposition furnace 14 by the crushed material supply device 36, and the PCB contained in the PCB crushed material 25 can be decomposed.

  That is, when the large storage container 12 cannot be supplied into the plasma melting decomposition furnace 14 as it is, the large storage container 12 is first disassembled. Next, the small storage container 12 or the like that accommodates the disassembled material is crushed by the crusher 24. As a result, the PCB crushed material 25 having a size that can be supplied into the plasma melting cracking furnace 14 can be obtained. As a result, such a large storage container 12 can be melted and decomposed using a plasma melting and cracking furnace 14 having an appropriate size and scale. Of course, even if the PCB waste 11 other than the above is stored in the storage container 12, it can be crushed by the crusher 24.

  Therefore, it is not necessary to clean the storage container 12 that is supplied to the plasma melting / decomposing furnace 14 and cannot be subjected to the melting / decomposing process and is contaminated with the PCB, so that the labor of the operator is reduced. In addition, it is possible to prevent PCB contamination from being enlarged during cleaning.

  According to the crushed material supply device 36, the PCB crushed material 25 discharged from the discharge port 24 a of the crusher 24 can be supplied into the decomposition furnace 14 through the supply port 15 of the plasma melting decomposition furnace 14. Therefore, it is not necessary to refill the PCB crushed material 25 into another supply container in order to supply the plasma crushed material 25 into the plasma melting cracking furnace 14. Therefore, the trouble of refilling the PCB crushed material 25 with the supply container is unnecessary, and the cost of such a supply container can be reduced.

  Further, according to the crushing machine 24, the crushed material supply device 36 shown in FIG. 3, and the crushing waiting cargo box 31 shown in FIG. 1, the crushing waiting cargo box 31 stores a small storage container 12 and the like. Therefore, the small storage container 12 and the like can be supplied to the crusher 24 at a desired timing. The crusher 24 can crush the small storage container 12 and the like to produce a PCB crushing material 25, and the weighing machine 50 can remove the PCB crushing material 25 at a predetermined time interval (for example, every 1 minute). It can be automatically supplied into the plasma melting cracking furnace 14.

  As a result, the fluctuation range of the amount of gas generated in the plasma melting cracking furnace 14 can be reduced. Therefore, in order to keep the pressure in the cracking furnace 14 substantially constant, a damper is used to control, for example, the rotational speed of an exhaust fan for exhausting the generated gas from the cracking furnace 14, or to change the opening degree of the exhaust port. However, the control amount of the rotational speed and the angle adjustment amount of the damper can be reduced. As a result, the plasma melting cracking furnace 14 and the exhaust gas treatment facility 26 connected to the cracking furnace 14 can be stably operated.

  Further, similarly to the above, since the small-sized refilled PCB waste 19 can be stored in the supply waiting baggage chamber 30 shown in FIG. 1, as shown in FIG. The refilled PCB waste 19 is automatically supplied into the plasma melting and decomposing furnace 14 through the supply passage portion 54 at a predetermined time interval (for example, every one minute) by the refilled waste supply device 53. Can do. Also by this, the plasma melting cracking furnace 14 and the exhaust gas treatment facility 26 connected to the cracking furnace 14 can be stably operated in the same manner as described above. However, the refilled waste supply device 53 includes the third and fourth supply seal gate portions 55 and 56 having a double gate structure so that the generated gas in the plasma melting decomposition furnace 14 does not leak. .

  In addition, as shown in FIG. 3, the refilled waste supply device 53 is provided with the third and fourth supply seal gate portions 55 and 56 having a double gate structure. Before the encapsulating resin bag 18 of the small-sized refilled PCB waste 19 using the encapsulating resin bag 18 supplied into the plasma melt decomposition furnace 14 by the material supply device 53 is supplied to the melt decomposition furnace 14. It is to be exposed to high temperatures and not melt and break. By the third and fourth supply seal gate portions 55 and 56 of the double gate structure, the small-sized refilled PCB waste 19 is passed through the supply passage portion 54 in a state where the encapsulating resin bag 18 is not melted and torn. Thus, it can be automatically supplied into the melting cracking furnace 14.

FIGS. 9A, 9B, and 9C are diagrams for explaining that the fluctuation range of the amount of gas generated in the plasma melting cracking furnace 14 can be reduced. FIG. 9A shows that both the PCB crushed material 25 and the small-sized refilled PCB waste 19 in the measuring container 50a are separated by a predetermined weight at a predetermined time interval (for example, every 5 minutes). An example of the amount of gas (m ³ / hr) generated when the gas is supplied to the inside is shown.

At this time, the amount of gas generated by the PCB waste 11 in the cracking furnace 14 varies from 0 to 50 (m ³ / hr), and the variation range is 50 (m ³ / hr). In this case, the plasma melting cracking furnace 14 and the exhaust gas treatment facility 26 connected to the cracking furnace 14 cannot be operated relatively stably.

  Note that the PCB crushed material 25 and the small-sized refilled PCB waste material 19 that are sequentially supplied at a predetermined weight are prepared and stored in advance in the plasma melting and decomposing furnace 14 so as to generate the same volume of gas. Yes.

In FIG. 9B, both the PCB crushed material 25 in the weighing container 50a and the small-sized refilled PCB waste 19 are supplied into the plasma melting cracking furnace 14 at a predetermined time interval (for example, 1 minute interval). The amount of gas sometimes generated (m ³ / hr) is shown separately for each supply.

FIG. 9C is a combination of the generated gas amounts (m ³ / hr) separately shown for each supply shown in FIG. 9B. At this time, the amount of gas generated by the PCB waste 11 in the cracking furnace 14 varies between 35 and 50 (m ³ / hr), and the variation range is 15 (m ³ / hr). In this case, the plasma melting cracking furnace 14 and the exhaust gas treatment facility 26 connected to the cracking furnace 14 are operating relatively stably.

  Next, referring to FIG. 3, the first partition wall 57, the second partition wall 58, the third partition wall 59, and the fourth partition that hermetically seal the crusher 24 and the crushed material supply device 36 with the outside. The partition wall 60 will be described.

  As shown in FIG. 3, the first partition wall 57 includes a supply path 61 for the PCB crushed material 25 from the discharge port 24 a of the crusher 24 through the crushed material supply device 36 to the supply port 15 of the plasma melting cracking furnace 14. It is hermetically sealed with the outside. In other words, the first partition wall 57 hermetically seals the first crushed material feeder 48, the second crushed material feeder 49, and the weighing machine 50 included in the crushed material supply device 36.

  According to the crusher 24 and the crushed material supply device 36 configured as described above, the PCB crushed material 25 discharged from the discharge port 24a of the crusher 24 shown in FIG. Since it can supply automatically to the supply port 15 of the furnace 14, it can prevent that an operator carries out PCB contamination by the PCB crushing material 25. FIG. Then, the supply path 61 of the PCB crushed material 25 from the discharge port 24a of the crusher 24 through the crushed material supply device 36 to the supply port 15 of the plasma melting cracking furnace 14 is opened to the outside by the first partition wall 57. Since it is tightly sealed, it is possible to prevent the PCB contamination by the PCB crushed material 25 from spreading outside the first partition wall 57.

  As shown in FIG. 3, the second partition wall 58 is provided so as to further surround the crushed material supply device 36 hermetically sealed by the first partition wall 57 from the outside. The second partition wall 58 is hermetically sealed between the inside and the outside thereof, and PCB contamination due to the PCB crushed material 25 can be prevented from expanding to the outside of the second partition wall 58. In this embodiment, the second partition wall 58 is provided so as to surround a range from the discharge port 24 a of the crusher 24 to the outlet of the second crushed material feeder 49.

  As shown in FIG. 3, the third partition wall 59 surrounds the supply port 24b of the crusher 24 and the tip of the carry-in device 47 for supplying the small storage container 12 and the like to the supply port 24b from the outside. Is provided. The third partition wall 59 is hermetically sealed between the inside and the outside, and PCB contamination due to the PCB crushed material 25 staying at the supply port 24 b of the crusher 24 expands outside the third partition wall 59. Can be prevented. The leading end of the carry-in device 47 has a double gate structure. With this double gate structure, when the small storage container 12 or the like is carried into the third partition wall 59 from the outside, the inside of the third partition wall 59 is provided. PCB is not leaked to the outside.

  As shown in FIG. 3, the fourth partition wall 60 is provided so as to surround the pushing device 62 provided in the supply port 24 b of the crusher 24 from the outside. The fourth partition wall 60 is hermetically sealed between the inner side and the outer side, and PCB contamination due to the PCB crushed material 25 staying in the supply port 24 b of the crusher 24 passes through the pushing device 62 and is fourth. Expansion to the outside of the partition wall 60 can be prevented.

  Next, referring to FIG. 4 to FIG. 8, the crushed material supply device 36 weighs the PCB crushed material 25 by a predetermined weight, and puts the measured PCB crushed material 25 into the plasma melting cracking furnace 14 at a predetermined timing. The supply procedure will be described.

  In FIG. 4A, the first supply seal gate portion 63 is in a shortened state, the gate 63a of the first supply seal gate portion 63 is in the retracted position, and the supply port of the weighing machine 50 is in the open state. It has become. When the second crushed material feeder 49 operates in this state, the PCB crushed material 25 can be supplied to the weighing container 50a as shown in FIG. 4B.

  The second supply seal gate portion 64 is in the extended state, the gate 64a of the second supply seal gate portion 64 is in the forward position, and the supply port 15 of the supply chute 52 of the plasma melting decomposition furnace 14 is closed. It is in a state. Thereby, the inside of the plasma melting cracking furnace 14 can be sealed, and the gas generated in the cracking furnace 14 can be prevented from flowing out.

  FIG. 4B shows a state in which the second crushed material feeder 49 is operating and the PCB crushed material 25 is being supplied to the measuring container 50a. The weighing machine 50 sequentially measures the weight of the PCB crushed material 25 supplied to the weighing container 50a.

  FIG. 5A shows a state where a predetermined crushed PCB crushed material 25 is supplied to the weighing container 50a and the second crushed material feeder 49 is stopped. The measured value of the PCB crushed material 25 is transmitted to the control unit, and used for controlling the plasma melting decomposition furnace 14 and the exhaust gas treatment facility 26.

  In FIG. 5B, the first supply seal gate 63 is in the extended state, the gate 63a of the first supply seal gate 63 is in the forward position, and the supply port of the weighing machine 50 is in the closed state. It has become. In this state, the inner space of the weighing machine 50 is sealed.

In FIG. 6A, the gas in the inner space of the weighing machine 50 is exhausted and nitrogen N ₂ is filled in the inner space. Accordingly, it is possible to prevent the gas existing in the inner space of the weighing machine 50 from entering the plasma melting decomposition furnace 14 along with the PCB crushed material 25. In this way, preparation for opening the second supply seal gate portion 64 can be made.

  6B, the second supply seal gate portion 64 is in a shortened state, the gate 64a of the second supply seal gate portion 64 is in the retracted position, and the supply port 15 of the plasma melting cracking furnace 14 is It is open. At this time, since the supply port of the weighing machine 50 is closed, the gas in the plasma melting decomposition furnace 14 does not flow out.

  FIG. 7A shows a state in which the tilting drive unit 51 (not shown) is actuated to tilt the measuring container 50a and the PCB crushed material 25 in the measuring container 50a is supplied into the plasma melting cracking furnace 14. Yes.

  FIG. 7B shows a state in which the tilting drive unit 51 (not shown) is activated to return the tilted weighing container 50a to the original horizontal position.

  In FIG. 8, the second supply seal gate portion 64 is in an extended state, the gate 64a of the second supply seal gate portion 64 is in the forward position, and the supply port 15 of the plasma melting cracking furnace 14 is closed. It has become.

  In this way, one cycle in which the crushed material supply device 36 measures the PCB crushed material 25 by a predetermined weight and supplies the measured PCB crushed material 25 into the plasma melting cracking furnace 14 at predetermined time intervals is completed. Therefore, by repeatedly performing the operations shown in FIGS. 4 to 8 at a predetermined time interval (for example, every 1 minute), the PCB crushed material 25 is moved by a predetermined weight as shown in FIGS. 9B and 9C. The plasma melt decomposition furnace 14 can be supplied at a predetermined time interval (for example, every one minute).

  Next, as the 1st and 2nd crushed material feeders 48 and 49 with which the crushed material supply apparatus 36 is equipped, for example, the vibration feeder is employ | adopted, The reason is demonstrated.

  In other words, although the properties (bulk density, crushed particle size, crushed shape, etc.) of the PCB crushed material 25 are not constant, the same first and second crushed material feeders 48 and 49 and the weighing machine 50 are used. Thus, it is necessary to measure the weight within a predetermined weight range defined for each PCB crushed material 25 and supply it to the melting cracking furnace 14. The reason for this will be described later.

  Therefore, when vibration feeders are employed as the first and second crushed material feeders 48 and 49, the operation, stop, amplitude width, etc. of each vibration feeder can be set to appropriate setting values using an inverter and a timer. . Then, by setting these set values for each PCB crushed material 25 having different properties, each PCB crushed material 25 having different properties can be set in a predetermined weight range preset for each PCB crushed material 25. It can be metered into the melt decomposition furnace 14. This has been confirmed in demonstration tests.

  Next, the first and second crushed material feeders 48 and 49 are required to be easily decontaminated against PCB contamination. However, if a vibratory feeder is used, this object can be achieved. In other words, the vibration feeder is configured such that the hook-like portion is vibrated by the vibration driving portion, and the PCB crushed material 25 passes through the hook-like portion. Therefore, it is the bowl-shaped part that is contaminated by the PCB crushed material 25, and this bowl-shaped part can easily perform the decontamination work and can achieve the above-mentioned object.

  Moreover, the supply path of the PCB crushed material 25 in the crushed material supply device 36 shown in FIG. 3 has the bowl-shaped portions of the first and second crushed material feeders 48 and 49. And since this hook-shaped part is a vibration part, each hook-shaped part and the fixing | fixed part are sealingly connected by the sheet-like flexible joint. Accordingly, each bowl-shaped portion can be vibrated as set, and the supply path for the PCB crushed material 25 can be sealed.

  And this flexible joint uses the thing of a multilayer structure, and the pressure layer is formed in the multilayer part, for example. The pressure in the pressure layer is detected by a pressure detection unit, and when the detected pressure in the pressure layer becomes lower than a preset lower limit pressure, a signal to that effect is output and displayed. It is like that. Accordingly, the operator can be notified of abnormalities such as damage to the flexible joint, and the flexible joint can be repaired at an early stage.

  Next, the crushed material supply device 36 shown in FIG. 3 measures each PCB crushed material 25 having different properties within a predetermined weight range set in advance for each PCB crushed material 25, and then in the melting cracking furnace 14. The purpose of weighing within a predetermined weight range set in advance for each PCB crushed material 25 will be described.

That is, it is preferable to make the fluctuation range of the amount of gas generated in the plasma melting cracking furnace 14 shown in FIG. 9C as small as possible, and as one of the methods for realizing it, the PCB crushed material in the measuring container 50a 25 is supplied to the plasma melting cracking furnace 14 at a predetermined time interval (for example, 1 minute interval), the amount of gas generated (m ³ / hr) (or a waveform indicating the amount of generated gas) is There is a method of making them approximately equal.

  However, the PCB crushed materials 25 having different properties have different gas generation amounts per weight generated when supplied into the furnace 14, and therefore, a predetermined gas generation amount when supplied into the furnace 14. It is necessary to set the weighing weight in the weighing machine 50 for each PCB crushed material 25 so as to obtain a waveform indicating

  Therefore, the weighing weight is set in the weighing machine 50 for each PCB crushed material 25, and thereby, the plasma melting cracking furnace 14, the exhaust fan, and the exhaust gas treatment equipment 26 connected to the cracking furnace 14 are relatively stable. To be able to drive.

  However, in the above embodiment, as shown in FIGS. 9B and 9C, the PCB crushed material 25 and the small-sized refilled PCB waste 19 are supplied into the plasma melting cracking furnace 14 at intervals of 1 minute. This supply interval can be changed according to the amount of gas generated in the cracking furnace 14 generated by one supply. In short, it is preferable to set the supply time interval so that the fluctuation range of the generated gas amount shown in FIG.

  As described above, the PCB waste processing method and the processing equipment according to the present invention are not limited to the size of the PCB waste and the storage container that has been used to store the PCB waste. Such a PCB waste can be prevented from becoming excessively large and has an excellent effect of being able to carry out these detoxification treatments using an appropriately sized plasma melting cracking furnace. It is suitable for applying to the processing method and its processing equipment.

10 Pretreatment Equipment 11 PCB Waste 12 Storage Container 13 PCB Waste in Storage Container 14 Plasma Melting Decomposition Furnace 15, 16 Supply Port 17 Enclosed Container 18 Encapsulating Resin Bag 19 Small Refilled PCB Waste 20 Contamination / Demolition Processing Chamber 21 Inspection room for second drums, etc. 22 Pre-treatment facility for supply 23 Crushing container 24 Crusher 24a Discharge port 24b Supply port 25 Crushed PCB material 26 Exhaust gas treatment facility 27 Inspection room 28 Inspection room for first drum can 29 Waste disposal room 30 Supply Waiting room 31 Crushing waiting room 32 Crushing equipment room 33 PCB waste with small storage container 34 PCB waste with large storage container 35 Refilled PCB waste for crushing container 36 Crushed material supply equipment 37 Detoxification processing equipment 38 1 discharge path 39 2nd discharge path 40 1st container 41 2nd container 42 heat retention chamber 43 exhaust gas Exchanger 44 Decreasing tower 45 Bag filter 46 Processing device 47 Carry-in device 48 First crushed material feeder 49 Second crushed material feeder 50 Weighing machine 50a Measuring container 51 Tilt drive unit 52 Supply chute 53 Refilled waste supply device 54 Supply Passage portion 55 Third supply seal gate portion 56 Fourth supply seal gate portion 57 First partition wall 58 Second partition wall 59 Third partition wall 60 Fourth partition wall 61 Supply path 62 Push-in device 63 First supply seal gate portion 63a Gate 64 Second supply seal gate part 64a Gate

Claims (10)

Refill at least a part of the PCB waste containing the storage container contained in the storage container into an enclosing container or an encapsulating resin bag having a size that can be supplied into the plasma melting decomposition furnace. A refilling step to make a small refilled PCB waste containing PCB waste of supply unit weight ;
The PCB waste containing the storage container that has not been made into the small-sized refilled PCB waste is refilled in a crushing container, and the emptied storage container or it is disassembled and stored in the crushing container A crushing step of crushing an object to be crushed by a crusher into a PCB crushed material,
While supplying the small-sized refilled PCB waste into the plasma melting cracking furnace, the PCB crushed material discharged from the crusher is weighed within a predetermined weight range, and the measured PCB crushed material is A melting and decomposing process for decomposing PCB by repeating one supply cycle to be supplied into the plasma melting and decomposing furnace at predetermined time intervals ;
With
The predetermined weight, or the predetermined weight and the predetermined time interval is a value at which the amount of gas generated in the plasma melting cracking furnace becomes substantially equal every time the PCB crushed material is supplied at the predetermined time interval. PCB waste disposal method. A pre-process performed before the refilling process,
PCB waste containing storage container, PCB waste containing small storage container accommodated in small storage container having a predetermined size or less, and large storage container accommodated in large storage container larger than the predetermined size 2. The method for treating PCB waste according to claim 1, further comprising a classification step of classifying into PCB waste.   3. The PCB according to claim 1, wherein the refilling operation in the refilling step is performed using a glove box having a PCB sealing function or in a dismantling process chamber having a PCB sealing function. Waste disposal method. The small-sized refilled PCB waste made in the refilling step, or a storage step for storing the storage container before being crushed by the crusher,
The small-sized refilled PCB waste stored in the storage step is supplied into the plasma melting cracking furnace at predetermined time intervals, or the storage container stored in the storage step is replaced with the crusher The PCB waste material according to any one of claims 1 to 3, wherein the PCB waste is supplied to the plasma melting cracking furnace at a predetermined time interval to decompose the PCB. Processing method.   The supply path of the PCB crushed material from the discharge port of the crusher to the supply port of the plasma melting cracking furnace is hermetically sealed with a partition wall between the outside and the outside. A method for treating PCB waste according to any one of the above.   The generated gas generated when the PCB waste is melt-decomposed in the plasma melting / decomposing furnace is treated by being retained for 2 seconds or more in a heat retention chamber maintained at a temperature of 1100 ° C. or higher. Item 6. A method for treating PCB waste according to any one of Items 1 to 5.   The PCB waste according to any one of claims 1 to 6, wherein the object to be crushed is one having a low PCB concentration as compared with high-concentration PCB contaminants in the PCB stock solution, white clay, and PCB stock solution wiping waste. Processing method. The PCB waste or the storage container used to store this PCB waste is crushed with a crusher to make a PCB crushed material, and this PCB crushed material is supplied into a plasma melting cracking furnace by a supply device to decompose the PCB. A PCB waste treatment facility for processing,
The supply device supplies the PCB crushed material discharged from the discharge port of the crusher to the supply port of the plasma melting cracking furnace,
The supply path of the PCB crushed material from the discharge port of the crusher through the supply device to the supply port of the plasma melting cracking furnace is hermetically sealed with a partition wall between the outside and the outside.
The supply device includes a weighing machine that measures the PCB crushed material discharged from the crusher within a predetermined weight range, and the plasma crushed material is measured at predetermined time intervals on the PCB crushed material measured by the weighing machine. Configured to supply into the furnace,
The predetermined weight or the predetermined weight and the predetermined time interval are set such that the amount of gas generated in the plasma melting cracking furnace becomes substantially equal for each supply of the PCB crushed material at the predetermined time interval. PCB waste treatment facility characterized by that.   A first crushed material feeder that receives the PCB crushed material discharged from the crusher, and a second crushed material feeder that supplies the PCB crushed material received from the first crushed material feeder to the weighing machine. The second crushed material feeder is configured to stop the supply of the PCB crushed material when the PCB waste measured by the weighing machine reaches the predetermined weight. The PCB waste treatment facility according to claim 8.   10. The PCB according to claim 8, wherein the PCB waste to be crushed by the crusher is a PCB waste having a PCB concentration lower than that of the high-concentration PCB contaminants of the PCB stock solution, the white clay, and the PCB stock solution wiping waste. Waste treatment facility.