JP5760405B2 - ポリアミド樹脂組成物およびそれからなる成形品 - Google Patents
ポリアミド樹脂組成物およびそれからなる成形品 Download PDFInfo
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- JP5760405B2 JP5760405B2 JP2010263480A JP2010263480A JP5760405B2 JP 5760405 B2 JP5760405 B2 JP 5760405B2 JP 2010263480 A JP2010263480 A JP 2010263480A JP 2010263480 A JP2010263480 A JP 2010263480A JP 5760405 B2 JP5760405 B2 JP 5760405B2
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- JP
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- Prior art keywords
- polyamide resin
- resin composition
- acid
- impact resistance
- copolymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 229920006122 polyamide resin Polymers 0.000 title claims description 112
- 239000011342 resin composition Substances 0.000 title claims description 43
- RWRDLPDLKQPQOW-UHFFFAOYSA-N Pyrrolidine Chemical compound C1CCNC1 RWRDLPDLKQPQOW-UHFFFAOYSA-N 0.000 claims description 48
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 claims description 46
- 238000006116 polymerization reaction Methods 0.000 claims description 40
- 239000000463 material Substances 0.000 claims description 32
- 238000005452 bending Methods 0.000 claims description 19
- 150000003839 salts Chemical class 0.000 claims description 18
- 239000000203 mixture Substances 0.000 claims description 16
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 15
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims description 13
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 12
- 230000009477 glass transition Effects 0.000 claims description 12
- 239000002245 particle Substances 0.000 claims description 12
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 claims description 10
- 239000000178 monomer Substances 0.000 claims description 9
- 238000005259 measurement Methods 0.000 claims description 8
- 238000002156 mixing Methods 0.000 claims description 7
- 238000006068 polycondensation reaction Methods 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims description 5
- 125000004018 acid anhydride group Chemical group 0.000 claims description 4
- 239000011256 inorganic filler Substances 0.000 claims description 4
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 4
- 229920001038 ethylene copolymer Polymers 0.000 claims description 2
- 239000004609 Impact Modifier Substances 0.000 claims 1
- 229920001577 copolymer Polymers 0.000 description 61
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 35
- 239000005977 Ethylene Substances 0.000 description 35
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 27
- -1 2-methyl-1,5-diaminopentane Diamine Chemical class 0.000 description 23
- 229920001778 nylon Polymers 0.000 description 22
- 239000004677 Nylon Substances 0.000 description 21
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 16
- 125000004432 carbon atom Chemical group C* 0.000 description 14
- 238000010521 absorption reaction Methods 0.000 description 11
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 10
- 125000001931 aliphatic group Chemical group 0.000 description 10
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 9
- 230000000694 effects Effects 0.000 description 9
- 239000000243 solution Substances 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- 239000000835 fiber Substances 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 8
- 238000002844 melting Methods 0.000 description 8
- 230000008018 melting Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 238000000465 moulding Methods 0.000 description 8
- 239000000047 product Substances 0.000 description 8
- 239000007790 solid phase Substances 0.000 description 8
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 7
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 7
- 229920000642 polymer Polymers 0.000 description 7
- 238000003756 stirring Methods 0.000 description 7
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 6
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 150000001993 dienes Chemical class 0.000 description 6
- 239000002994 raw material Substances 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 239000004215 Carbon black (E152) Substances 0.000 description 5
- 229920003189 Nylon 4,6 Polymers 0.000 description 5
- 229920000305 Nylon 6,10 Polymers 0.000 description 5
- 229920002302 Nylon 6,6 Polymers 0.000 description 5
- 125000003277 amino group Chemical group 0.000 description 5
- 239000002216 antistatic agent Substances 0.000 description 5
- 125000000524 functional group Chemical group 0.000 description 5
- 229930195733 hydrocarbon Natural products 0.000 description 5
- 239000000155 melt Substances 0.000 description 5
- 229920002554 vinyl polymer Polymers 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 4
- 229920002292 Nylon 6 Polymers 0.000 description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical class C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 239000012299 nitrogen atmosphere Substances 0.000 description 4
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 4
- 229920000098 polyolefin Polymers 0.000 description 4
- KOUDKOMXLMXFKX-UHFFFAOYSA-N sodium oxido(oxo)phosphanium hydrate Chemical compound O.[Na+].[O-][PH+]=O KOUDKOMXLMXFKX-UHFFFAOYSA-N 0.000 description 4
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 4
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 4
- LWBHHRRTOZQPDM-UHFFFAOYSA-N undecanedioic acid Chemical compound OC(=O)CCCCCCCCCC(O)=O LWBHHRRTOZQPDM-UHFFFAOYSA-N 0.000 description 4
- 238000001291 vacuum drying Methods 0.000 description 4
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 3
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 3
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- 229920000299 Nylon 12 Polymers 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- SHPVGWLRFPFLNE-UHFFFAOYSA-N butane-1,4-diamine;hexanedioic acid Chemical compound NCCCCN.OC(=O)CCCCC(O)=O SHPVGWLRFPFLNE-UHFFFAOYSA-N 0.000 description 3
- 239000011575 calcium Substances 0.000 description 3
- 229910052791 calcium Inorganic materials 0.000 description 3
- 150000001732 carboxylic acid derivatives Chemical group 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 description 3
- 239000003063 flame retardant Substances 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000004898 kneading Methods 0.000 description 3
- 229910052744 lithium Inorganic materials 0.000 description 3
- 239000011976 maleic acid Substances 0.000 description 3
- 229920003145 methacrylic acid copolymer Polymers 0.000 description 3
- 229910052700 potassium Inorganic materials 0.000 description 3
- 239000011591 potassium Substances 0.000 description 3
- 229910052708 sodium Inorganic materials 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- OJOWICOBYCXEKR-APPZFPTMSA-N (1S,4R)-5-ethylidenebicyclo[2.2.1]hept-2-ene Chemical compound CC=C1C[C@@H]2C[C@@H]1C=C2 OJOWICOBYCXEKR-APPZFPTMSA-N 0.000 description 2
- PRBHEGAFLDMLAL-GQCTYLIASA-N (4e)-hexa-1,4-diene Chemical compound C\C=C\CC=C PRBHEGAFLDMLAL-GQCTYLIASA-N 0.000 description 2
- OYDGRFZMWQLWGV-UHFFFAOYSA-N 1-(2-cyclopenta-1,3-dien-1-ylethyl)cyclopenta-1,3-diene Chemical compound C=1C=CCC=1CCC1=CC=CC1 OYDGRFZMWQLWGV-UHFFFAOYSA-N 0.000 description 2
- PBLZLIFKVPJDCO-UHFFFAOYSA-N 12-aminododecanoic acid Chemical compound NCCCCCCCCCCCC(O)=O PBLZLIFKVPJDCO-UHFFFAOYSA-N 0.000 description 2
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 2
- SDJHPPZKZZWAKF-UHFFFAOYSA-N 2,3-dimethylbuta-1,3-diene Chemical compound CC(=C)C(C)=C SDJHPPZKZZWAKF-UHFFFAOYSA-N 0.000 description 2
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 2
- WTQBISBWKRKLIJ-UHFFFAOYSA-N 5-methylidenebicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(=C)CC1C=C2 WTQBISBWKRKLIJ-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- IPRJXAGUEGOFGG-UHFFFAOYSA-N N-butylbenzenesulfonamide Chemical compound CCCCNS(=O)(=O)C1=CC=CC=C1 IPRJXAGUEGOFGG-UHFFFAOYSA-N 0.000 description 2
- BTZVDPWKGXMQFW-UHFFFAOYSA-N Pentadecanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCCC(O)=O BTZVDPWKGXMQFW-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 125000003368 amide group Chemical group 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 239000010425 asbestos Substances 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- VHRGRCVQAFMJIZ-UHFFFAOYSA-N cadaverine Chemical compound NCCCCCN VHRGRCVQAFMJIZ-UHFFFAOYSA-N 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000002826 coolant Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- TVIDDXQYHWJXFK-UHFFFAOYSA-N dodecanedioic acid Chemical compound OC(=O)CCCCCCCCCCC(O)=O TVIDDXQYHWJXFK-UHFFFAOYSA-N 0.000 description 2
- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 238000005755 formation reaction Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- QQHJDPROMQRDLA-UHFFFAOYSA-N hexadecanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCCCC(O)=O QQHJDPROMQRDLA-UHFFFAOYSA-N 0.000 description 2
- 229920006158 high molecular weight polymer Polymers 0.000 description 2
- 238000005984 hydrogenation reaction Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 2
- 239000000347 magnesium hydroxide Substances 0.000 description 2
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 2
- 239000012046 mixed solvent Substances 0.000 description 2
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 2
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 229910052895 riebeckite Inorganic materials 0.000 description 2
- 238000007363 ring formation reaction Methods 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 2
- 239000012086 standard solution Substances 0.000 description 2
- HQHCYKULIHKCEB-UHFFFAOYSA-N tetradecanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCC(O)=O HQHCYKULIHKCEB-UHFFFAOYSA-N 0.000 description 2
- 229920000428 triblock copolymer Polymers 0.000 description 2
- XFNJVJPLKCPIBV-UHFFFAOYSA-N trimethylenediamine Chemical compound NCCCN XFNJVJPLKCPIBV-UHFFFAOYSA-N 0.000 description 2
- 239000003981 vehicle Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 150000007934 α,β-unsaturated carboxylic acids Chemical class 0.000 description 2
- PMJHHCWVYXUKFD-SNAWJCMRSA-N (E)-1,3-pentadiene Chemical compound C\C=C\C=C PMJHHCWVYXUKFD-SNAWJCMRSA-N 0.000 description 1
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 description 1
- VYXHVRARDIDEHS-UHFFFAOYSA-N 1,5-cyclooctadiene Chemical compound C1CC=CCCC=C1 VYXHVRARDIDEHS-UHFFFAOYSA-N 0.000 description 1
- 239000004912 1,5-cyclooctadiene Substances 0.000 description 1
- PWGJDPKCLMLPJW-UHFFFAOYSA-N 1,8-diaminooctane Chemical compound NCCCCCCCCN PWGJDPKCLMLPJW-UHFFFAOYSA-N 0.000 description 1
- DGZQEAKNZXNTNL-UHFFFAOYSA-N 1-bromo-4-butan-2-ylbenzene Chemical class CCC(C)C1=CC=C(Br)C=C1 DGZQEAKNZXNTNL-UHFFFAOYSA-N 0.000 description 1
- NVZWEEGUWXZOKI-UHFFFAOYSA-N 1-ethenyl-2-methylbenzene Chemical compound CC1=CC=CC=C1C=C NVZWEEGUWXZOKI-UHFFFAOYSA-N 0.000 description 1
- PPWUTZVGSFPZOC-UHFFFAOYSA-N 1-methyl-2,3,3a,4-tetrahydro-1h-indene Chemical compound C1C=CC=C2C(C)CCC21 PPWUTZVGSFPZOC-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- IGGDKDTUCAWDAN-UHFFFAOYSA-N 1-vinylnaphthalene Chemical compound C1=CC=C2C(C=C)=CC=CC2=C1 IGGDKDTUCAWDAN-UHFFFAOYSA-N 0.000 description 1
- GUOSQNAUYHMCRU-UHFFFAOYSA-N 11-Aminoundecanoic acid Chemical compound NCCCCCCCCCCC(O)=O GUOSQNAUYHMCRU-UHFFFAOYSA-N 0.000 description 1
- QFGCFKJIPBRJGM-UHFFFAOYSA-N 12-[(2-methylpropan-2-yl)oxy]-12-oxododecanoic acid Chemical compound CC(C)(C)OC(=O)CCCCCCCCCCC(O)=O QFGCFKJIPBRJGM-UHFFFAOYSA-N 0.000 description 1
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- 235000011176 polyphosphates Nutrition 0.000 description 1
- 229920000137 polyphosphoric acid Polymers 0.000 description 1
- 229940005657 pyrophosphoric acid Drugs 0.000 description 1
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- 238000011002 quantification Methods 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
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- YGSDEFSMJLZEOE-UHFFFAOYSA-M salicylate Chemical compound OC1=CC=CC=C1C([O-])=O YGSDEFSMJLZEOE-UHFFFAOYSA-M 0.000 description 1
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- 238000009864 tensile test Methods 0.000 description 1
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 1
- MSVPBWBOFXVAJF-UHFFFAOYSA-N tetradecane-1,14-diamine Chemical compound NCCCCCCCCCCCCCCN MSVPBWBOFXVAJF-UHFFFAOYSA-N 0.000 description 1
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- BPSKTAWBYDTMAN-UHFFFAOYSA-N tridecane-1,13-diamine Chemical compound NCCCCCCCCCCCCCN BPSKTAWBYDTMAN-UHFFFAOYSA-N 0.000 description 1
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Description
(i)(A)テトラメチレンジアミンとセバシン酸を主要成分として含有する単量体を重縮合して得られるポリアミド樹脂100重量部に対して、(B)耐衝撃性改良材5〜100重量部を配合してなるポリアミド樹脂組成物であって、(B)耐衝撃性改良材がグリシジル基、カルボキシル基、カルボキシル基の金属塩、酸無水物基から選ばれる少なくとも1種で変性されたエチレン系共重合体を含み、該ポリアミド樹脂組成物を周波数1Hz、曲げモードで動的粘弾性測定したときに得られる、ポリアミド樹脂のガラス転移温度に対応するtanδのピークトップの値が0.13以下であるポリアミド樹脂組成物、
(ii)(B)耐衝撃性改良材のガラス転移温度が−20℃以下である(i)に記載のポリアミド樹脂組成物、
(iii)(B)耐衝撃性改良材の分散粒子径が0.010μm〜1.0μmである(i)または(ii)に記載のポリアミド樹脂組成物、
(iv)(A)ポリアミド樹脂中のピロリジン含有量が5.0×10−5mol/g以下である(i)〜(iii)いずれかに記載のポリアミド樹脂組成物、
(v)(A)ポリアミド樹脂中のアミノ末端基量が1.0×10−5〜7.0×10−5mol/gである(i)〜(iv)いずれかに記載のポリアミド樹脂組成物、
(vi)(A)ポリアミド樹脂の0.01g/mlとした98%硫酸溶液の25℃における相対粘度が2.0〜5.0である(i)〜(v)いずれかに記載のポリアミド樹脂組成物、
(vii)(A)ポリアミド樹脂が溶融重合により製造された(i)〜(vi)いずれかに記載のポリアミド樹脂組成物、
(viii)さらに、無機充填材を配合してなる(i)〜(vii)いずれかに記載のポリアミド樹脂組成物、および
(ix)(i)〜(viii)いずれかに記載のポリアミド樹脂組成物からなる成形品である。
98%硫酸中、0.01g/ml濃度、25℃でオストワルド式粘度計を用いて測定を行った。
セイコーインスツル社製 ロボットDSCRDC220を用い、ポリアミド樹脂を約5mg精秤し、窒素雰囲気下、次の条件で測定した。融点+35℃に昇温して溶融状態とした後、20℃/分の降温速度で、30℃まで降温して3分間保持した後、20℃/分の昇温速度で融点+35℃まで昇温したときに観測される吸熱ピークの温度(融点:Tm)を求めた。
ポリアミド樹脂約0.5gを精秤し、フェノール・エタノール混合溶媒(83.5:16.5、体積比)25mlに溶解後、0.02N塩酸水溶液を用いて滴定した。
ポリアミド樹脂約0.06gを精秤し、臭化水素酸水溶液中、150℃で3時間加水分解を行った。得られた処理液に、40%水酸化ナトリウム水溶液、トルエンを加え、次いでクロロギ酸エチルを添加して撹拌した。上澄みのトルエン溶液を抽出し測定溶液とした。定量はピロリジン標準溶液を用いた。測定条件を以下に示した。
装置:島津GC−14A
カラム:NB−1(GLサイエンス社製)60m×0.25mm
検出器:FID(水素炎イオン化検出器)
オーブン温度:150℃から330℃まで10℃/分で昇温
試料注入部温度:250℃
検出部温度:330℃
キャリアガス:He
試料注入量:3.0μl。
ASTM D638に従い、引張試験機テンシロンUTA2.5T(オリエンテック社製)を用い、厚さ1/8インチのASTM1号ダンベル試験片について、クロスヘッド速度10mm/minで引張試験を行い、引張強度、引張破断伸度を求めた。
ASTM D790に従い、曲げ試験機テンシロンRTA−1T(オリエンテック社製)を用い、厚さ1/4インチの棒状試験片について、クロスヘッド速度3mm/minで曲げ試験を行い、曲げ強度、曲げ弾性率を求めた。なお、吸水時曲げ特性は、60℃、相対湿度95%の雰囲気下で25時間処理した棒状試験片について、同様の測定を行った。
ASTM D256に従い、23℃における1/8インチ厚ノッチ付き成形品のIzod衝撃強度を測定した。
ASTM D648−82に従い、東洋精機社製HDT−TESTERを用いて、厚さ1/4インチの棒状試験片について、試験荷重18.6kgfでの荷重たわみ温度を測定した。
3mm厚の成形品から、長さ55mm、幅13mmの試験片を切り出し、セイコーインスツル社製DMS6100を用い、曲げモードにて、周波数1Hz、チャック間距離20mm、昇温速度2℃/分、−150℃〜210℃で測定し、ポリアミド樹脂組成物中の耐衝撃性改良材、およびポリアミド樹脂のガラス転移温度に対応するtanδのピークトップの温度を求めた。なお、ポリアミド樹脂のガラス転移温度については、tanδのピークトップの値も示した。ただし、実施例6、比較例6において、(B)成分として使用した“ハイミラン”(登録商標)1706のガラス転移温度は、ポリアミド樹脂のそれと重なり、ポリアミド樹脂組成物の粘弾性測定からガラス転移温度を求めることができないため、(B)成分のガラス転移温度としては、“ハイミラン”1706単体で測定した値を示した。
射出成形により作製したASTM1号ダンベルから、厚み約80nmの薄片を切削し、透過型電子顕微鏡で倍率1万倍にて観察して得られた写真から、任意の分散粒子100個について画像処理ソフト「Scion Image」(Scion Corporation 社製)を用いて、各々の粒子の最大径と最小径の平均値を分散粒子径とし、これら100個の数平均値を算出した。
メタノール3Lにセバシン酸(小倉合成工業)300.0g(1.48mol)を添加し、60℃で溶解させた。ここに、あらかじめ調製したテトラメチレンジアミン(広栄化学工業)130.8g(1.48mol)をメタノール1Lに溶解した溶液を2時間かけて滴下した。3時間撹拌を続けた後、静置下で室温に放置し、析出した塩を沈降させた。その後、ろ過、メタノール洗浄を行い、50℃で24時間真空乾燥して、ナイロン410塩を得た。
エタノール3Lにアジピン酸(東京化成)280.7g(1.92mol)を添加し、60℃で溶解させた。ここに、あらかじめ調製したテトラメチレンジアミン(広栄化学工業)169.3g(1.92mol)をエタノール1Lに溶解した溶液を2時間かけて滴下した。3時間撹拌を続けた後、静置下で室温に放置し、析出した塩を沈降させた。その後、ろ過、エタノール洗浄を行い、50℃で24時間真空乾燥して、ナイロン46塩を得た。
参考例1で作製したナイロン410塩700g、テトラメチレンジアミン2.12g、次亜リン酸ナトリウム1水和物0.3065gを、撹拌翼付きの内容積が3Lの圧力容器に仕込んで密閉し、窒素置換した。この圧力容器を密閉したまま、加熱を開始し、15.6kg/cm2に到達した後、放圧を開始し、60分かけて缶内圧をゼロにした。その後、窒素雰囲気下、255〜270℃で2時間溶融重合した。圧力容器底部の吐出口から内容物をガット状にして取り出し、これを80℃で24時間真空乾燥して、ηr=2.88のナイロン410を得た。
参考例1で作製したナイロン410塩750g、テトラメチレンジアミン11.4g、次亜リン酸ナトリウム0.329g、イオン交換水750gを、撹拌翼付きの内容積が3Lの圧力容器に仕込んで密閉し、窒素置換した。加熱を開始して、缶内圧力が3.0kg/cm2に到達した後、水分を系外に放出させながら缶内圧力を3.0kg/cm2に保持した。缶内温度が245℃に到達した時点で放圧を開始し、5分間かけて缶内圧力をゼロにした。その後、窒素雰囲気下、250〜270℃で2時間溶融重合した。圧力容器底部の吐出口から内容物をガット状にして取り出し、これを80℃で24時間真空乾燥して、ηr=3.07のナイロン410を得た。
参考例1で作製したナイロン410塩700g、次亜リン酸ナトリウム1水和物0.3065gを、撹拌翼付きの内容積が3Lの圧力容器に仕込んで密閉し、窒素置換した。この圧力容器を密閉したまま、加熱を開始し、19.1kg/cm2に到達した後、放圧を開始し、80分かけて缶内圧をゼロにした。その後、窒素雰囲気下、255〜270℃で4時間溶融重合した。圧力容器底部の吐出口から内容物をガット状にして取り出し、これを80℃で24時間真空乾燥して、ηr=2.77のナイロン410を得た。
参考例1で作製したナイロン410塩700g、テトラメチレンジアミン4.25g、次亜リン酸ナトリウム1水和物0.3065g、イオン交換水70gを、撹拌翼付きの内容積が3Lの圧力容器に仕込んで密閉し、窒素置換した。この圧力容器を密閉したまま、加熱を開始し、内温223℃、15.0kg/cm2に到達後、水分を系外に放出させながら缶内圧力を15.0kg/cm2で30分保持した。その後、反応容器から内容物をクーリングベルト上に吐出した。これを80℃で24時間真空乾燥して得られた低次縮合物を220℃、100Paで24時間固相重合し、ナイロン410(ηr=3.06)を得た。
参考例2で作製したナイロン46塩700g、テトラメチレンジアミン5.27g、次亜リン酸ナトリウム1水和物0.2962g、イオン交換水70gを、撹拌翼付きの内容積が3Lの圧力容器に仕込んで密閉し、窒素置換した。この圧力容器を密閉したまま、加熱を開始し、内温225℃、15.0kg/cm2に到達後、水分を系外に放出させながら缶内圧力を15.0kg/cm2で30分保持した。その後、反応容器から内容物をクーリングベルト上に吐出した。これを80℃で24時間真空乾燥して得られた低次縮合物を260℃、100Paで20時間固相重合し、ナイロン46(ηr=3.10)を得た。
ポリアミド樹脂と耐衝撃性改良材を、表1〜2に示す組成となるように配合して、プリブレンドした。シリンダー温度:ポリアミド樹脂の融点+20℃、スクリュー回転数:200rpmに設定した二軸押出機(池貝鉄鋼製PCM−30型)へ供給し溶融混練した。押出されたガットはペレタイズした後、80℃で24時間真空乾燥した。これを、射出成形(住友重機社製SG75H−MIV、シリンダー温度:ポリアミド樹脂の融点+20℃、金型温度:80℃に設定)して種々の試験片を作製し、機械物性を評価した。結果を表1〜2に示す。
ナイロン610:ηr=2.70、アミノ末端基=3.51×10 −5 mol/g
ナイロン66:ηr=2.78、アミノ末端基=3.29×10 −5 mol/g
ナイロン6:ηr=2.75、アミノ末端基=5.90×10 −5 mol/g
耐衝撃性改良材:酸変性エチレン/ブテン−1共重合体(三井化学製“タフマー”(登録商標)MH5020)
耐衝撃性改良材:エチレン/ブテン−1共重合体(三井化学製“タフマー”(登録商標)TX−610)
耐衝撃性改良材:エチレン/メタクリル酸/メタクリル酸亜鉛塩共重合体(三井・デュポンポリケミカル製“ハイミラン”(登録商標)1706)
耐衝撃性改良材:グリシジルメタクリレート変性ポリエチレン共重合体(住友化学製“ボンドファースト”(登録商標)BF−7L)
Claims (9)
- (A)テトラメチレンジアミンとセバシン酸を主要成分として含有する単量体を重縮合して得られるポリアミド樹脂100重量部に対して、(B)耐衝撃性改良材5〜100重量部を配合してなるポリアミド樹脂組成物であって、(B)耐衝撃性改良材がグリシジル基、カルボキシル基、カルボキシル基の金属塩、酸無水物基から選ばれる少なくとも1種で変性されたエチレン系共重合体を含み、該ポリアミド樹脂組成物を周波数1Hz、曲げモードで動的粘弾性測定したときに得られる、ポリアミド樹脂のガラス転移温度に対応するtanδのピークトップの値が0.13以下であるポリアミド樹脂組成物。
- (B)耐衝撃性改良材のガラス転移温度が−20℃以下である請求項1に記載のポリアミド樹脂組成物。
- (B)耐衝撃性改良材の分散粒子径が0.010μm〜1.0μmである請求項1または2に記載のポリアミド樹脂組成物。
- (A)ポリアミド樹脂中のピロリジン含有量が5.0×10 −5 mol/g以下である請求項1〜3いずれかに記載のポリアミド樹脂組成物。
- (A)ポリアミド樹脂中のアミノ末端基量が1.0×10 −5 〜7.0×10 −5 mol/gである請求項1〜4いずれかに記載のポリアミド樹脂組成物。
- (A)ポリアミド樹脂の0.01g/mlとした98%硫酸溶液の25℃における相対粘度が2.0〜5.0である請求項1〜5いずれかに記載のポリアミド樹脂組成物。
- (A)ポリアミド樹脂が溶融重合により製造された請求項1〜6いずれかに記載のポリアミド樹脂組成物。
- さらに、無機充填材を配合してなる請求項1〜7いずれかに記載のポリアミド樹脂組成物。
- 請求項1〜8いずれかに記載のポリアミド樹脂組成物からなる成形品。
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| JP5807456B2 (ja) * | 2011-08-31 | 2015-11-10 | 東レ株式会社 | ポリアミド410繊維およびそれからなる繊維構造体 |
| MX2014004568A (es) * | 2011-10-17 | 2014-07-09 | Dsm Ip Assets Bv | Cepillo que contiene monofilamentos que contienen poliamida-410. |
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