JP4599111B2 - 灯具光源用ledランプ - Google Patents
灯具光源用ledランプ Download PDFInfo
- Publication number
- JP4599111B2 JP4599111B2 JP2004223707A JP2004223707A JP4599111B2 JP 4599111 B2 JP4599111 B2 JP 4599111B2 JP 2004223707 A JP2004223707 A JP 2004223707A JP 2004223707 A JP2004223707 A JP 2004223707A JP 4599111 B2 JP4599111 B2 JP 4599111B2
- Authority
- JP
- Japan
- Prior art keywords
- lamp
- led
- light source
- led lamp
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
- H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/141—Light emitting diodes [LED]
- F21S41/147—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device
- F21S41/148—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device the main emission direction of the LED being perpendicular to the optical axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/141—Light emitting diodes [LED]
- F21S41/151—Light emitting diodes [LED] arranged in one or more lines
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Description
2…LEDチップ
3…ベース
3a…キャビティ
3b…配線パターン
4…絶縁層
5…端子板
6…透明シリコーン樹脂
6a…蛍光体
6b…硬質しリコーン樹脂
6c…酸化シリコン(SiO2)
7…金線
8…フラットカバー
20…ヘッドライト
21…反射鏡
22…ヒートシンク
Claims (7)
- 回転放物面系反射鏡を有する車両用前照灯に用いられるLED光源であって、
発光形状が矩形でレンズ作用を実質的に生じないほぼ面一の平面を有し、その短辺と長辺との比が1:2〜1:6の範囲であり、
前記車両用前照灯における取り付け位置が、その長手方向を前記反射鏡の水平方向の中心線と直交させ、且つ、前記反射鏡の焦点よりも適宜に前方に位置させていることを特徴とする灯具光源用LEDランプ。 - 前記灯具光源用LEDランプは、1個が略正方形のLEDチップを2個〜6個直線状に整列させてベース上にマウントすることで構成されていることを特徴とする請求項1記載の灯具光源用LEDランプ。
- 前記灯具光源用LEDランプは、短辺と長辺との比が1:2〜1:6の範囲とした1個のLEDチップのマウントにより構成されていることを特徴とする請求項1記載の灯具光源用LEDランプ。
- 前記ベースの前記LEDチップをマウントする位置には、上記略正方形としたLEDチップの必要数、若しくは、短辺と長辺との比が1:2〜1:6の範囲内とされたと1個のLEDチップをマウントするのに適合するキャビティが設けられ、該キャビティも短辺と長辺との比が1:2〜1:6の範囲としてあることを特徴とする請求項2記載の灯具光源用LEDランプ。
- 前記LEDチップがマウントされたキャビティ内には蛍光体が混和された透明シリコーン樹脂が充填されていることを特徴とする請求項4記載の灯具光源用LEDランプ。
- 前記キャビティ内に充填される透明シリコーン樹脂は、硬度の異なる2種類以上のシリコーン樹脂により、外側ほど高い硬度とする階層状として充填されていることを特徴とする請求項4又は請求項5何れかに記載の灯具光源用LEDランプ。
- 前記シリコーン樹脂内に混和される蛍光体は複数種類であることを特徴とする請求項4〜6何れかに記載の灯具光源用LEDランプ。
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004223707A JP4599111B2 (ja) | 2004-07-30 | 2004-07-30 | 灯具光源用ledランプ |
| DE102005026949.4A DE102005026949B4 (de) | 2004-07-30 | 2005-06-10 | LED-Lampe als Lichtquelle für eine Beleuchtungseinheit |
| US11/187,841 US7932523B2 (en) | 2004-07-30 | 2005-07-25 | LED lamp for light source of lighting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004223707A JP4599111B2 (ja) | 2004-07-30 | 2004-07-30 | 灯具光源用ledランプ |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010113408A Division JP4945658B2 (ja) | 2010-05-17 | 2010-05-17 | 車両用前照灯 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006048934A JP2006048934A (ja) | 2006-02-16 |
| JP4599111B2 true JP4599111B2 (ja) | 2010-12-15 |
Family
ID=35731116
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004223707A Expired - Fee Related JP4599111B2 (ja) | 2004-07-30 | 2004-07-30 | 灯具光源用ledランプ |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US7932523B2 (ja) |
| JP (1) | JP4599111B2 (ja) |
| DE (1) | DE102005026949B4 (ja) |
Families Citing this family (46)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10335077A1 (de) * | 2003-07-31 | 2005-03-03 | Osram Opto Semiconductors Gmbh | LED-Modul |
| KR100764148B1 (ko) * | 2006-01-17 | 2007-10-05 | 루시미아 주식회사 | 시트상 형광체와 그 제조방법 및 이를 이용한 발광장치 |
| EP2012652B1 (en) | 2006-04-26 | 2016-04-13 | Philips Intellectual Property & Standards GmbH | Light delivery device with improved conversion element |
| JP4962884B2 (ja) * | 2006-06-06 | 2012-06-27 | 三国電子有限会社 | 面光源装置ならびにプリズムシートと液晶表示装置 |
| JP4812543B2 (ja) * | 2006-06-28 | 2011-11-09 | 株式会社小糸製作所 | 車両用灯具 |
| DE102006038552A1 (de) * | 2006-08-17 | 2008-02-21 | Robert Bosch Gmbh | Beleuchtungsmodul und Verfahren zur Herstellung eines Beleuchtungsmoduls |
| US20100309646A1 (en) * | 2006-10-19 | 2010-12-09 | Panasonic Corporation | Light-emitting device and display unit and lighting unit using the same |
| TW200824142A (en) * | 2006-11-22 | 2008-06-01 | Lighthouse Technology Co Ltd | High power diode holder and thereof package is described |
| JP4678364B2 (ja) | 2006-12-05 | 2011-04-27 | スタンレー電気株式会社 | 光源装置及び車両前照灯 |
| JP5158472B2 (ja) | 2007-05-24 | 2013-03-06 | スタンレー電気株式会社 | 半導体発光装置 |
| JP4984058B2 (ja) | 2007-05-25 | 2012-07-25 | スタンレー電気株式会社 | 光源装置及び車両前照灯 |
| DE102007025749A1 (de) * | 2007-06-01 | 2008-12-11 | Wacker Chemie Ag | Leuchtkörper-Silicon-Formteil |
| EP2031657A1 (en) * | 2007-08-31 | 2009-03-04 | ILED Photoelectronics, Inc. | Package structure for a high-luminance light source |
| DE102007059471A1 (de) | 2007-12-11 | 2009-06-18 | Osram Gesellschaft mit beschränkter Haftung | Scheinwerferlampe und deren Verwendung |
| DE102007044628A1 (de) | 2007-09-19 | 2009-04-02 | Osram Gesellschaft mit beschränkter Haftung | Scheinwerferlampe und deren Verwendung |
| US20100213809A1 (en) * | 2007-09-19 | 2010-08-26 | Osram Gesellschaft Mit Beschraenkter Haftung | Headlamp and its use |
| DE102007046339A1 (de) * | 2007-09-27 | 2009-04-02 | Osram Opto Semiconductors Gmbh | Lichtquelle mit veränderlicher Abstrahlcharakteristik |
| TWI416755B (zh) * | 2008-05-30 | 2013-11-21 | 晶元光電股份有限公司 | 光源模組、其對應之光棒及其對應之液晶顯示裝置 |
| US8567988B2 (en) * | 2008-09-29 | 2013-10-29 | Bridgelux, Inc. | Efficient LED array |
| JP2010262750A (ja) * | 2009-04-30 | 2010-11-18 | Koito Mfg Co Ltd | 車両用灯具 |
| TWI381564B (zh) * | 2009-08-06 | 2013-01-01 | 億光電子工業股份有限公司 | 發光二極體 |
| JP5379615B2 (ja) * | 2009-09-09 | 2013-12-25 | パナソニック株式会社 | 照明装置 |
| KR101164368B1 (ko) | 2009-09-28 | 2012-07-09 | 한국광기술원 | 발광다이오드 패키지 및 이의 제조방법 |
| JP5572013B2 (ja) | 2010-06-16 | 2014-08-13 | スタンレー電気株式会社 | 発光装置およびその製造方法 |
| US8455907B2 (en) | 2010-06-16 | 2013-06-04 | Stanley Electric Co., Ltd. | Semiconductor light emitting device having an optical plate including a meniscus control structure and method of manufacturing |
| JP5488310B2 (ja) * | 2010-07-30 | 2014-05-14 | 市光工業株式会社 | 車両用灯具の半導体型光源の光源ユニット、車両用灯具 |
| JP2012033823A (ja) | 2010-08-02 | 2012-02-16 | Stanley Electric Co Ltd | 発光装置およびその製造方法 |
| JP5622494B2 (ja) | 2010-09-09 | 2014-11-12 | スタンレー電気株式会社 | 発光装置およびその製造方法 |
| US8432088B2 (en) | 2011-01-03 | 2013-04-30 | Crs Electronics | Permanent conversion adapter for lighting fixtures |
| US8581287B2 (en) | 2011-01-24 | 2013-11-12 | Stanley Electric Co., Ltd. | Semiconductor light emitting device having a reflective material, wavelength converting layer and optical plate with rough and plane surface regions, and method of manufacturing |
| JP2011124608A (ja) * | 2011-02-16 | 2011-06-23 | Toshiba Lighting & Technology Corp | 照明装置 |
| TW201240161A (en) * | 2011-03-17 | 2012-10-01 | Lextar Electronics Corp | Light emiting diode package structure and manufacturing method thereof |
| JP6004747B2 (ja) * | 2011-06-28 | 2016-10-12 | 株式会社小糸製作所 | 発光モジュール |
| US8921872B2 (en) * | 2011-12-09 | 2014-12-30 | Sony Corporation | Display unit and method of manufacturing the same, electronic apparatus, illumination unit, and light-emitting device and method of manufacturing the same |
| KR102034575B1 (ko) | 2012-03-19 | 2019-10-21 | 루미리즈 홀딩 비.브이. | 인광체의 도포 전 및 후의 발광 장치들에 대한 싱귤레이션 |
| US20140048824A1 (en) | 2012-08-15 | 2014-02-20 | Epistar Corporation | Light-emitting device |
| US9356070B2 (en) | 2012-08-15 | 2016-05-31 | Epistar Corporation | Light-emitting device |
| JP6068073B2 (ja) | 2012-09-18 | 2017-01-25 | スタンレー電気株式会社 | Ledアレイ |
| JP6097084B2 (ja) | 2013-01-24 | 2017-03-15 | スタンレー電気株式会社 | 半導体発光装置 |
| US10663142B2 (en) * | 2014-03-31 | 2020-05-26 | Bridgelux Inc. | Light-emitting device with reflective ceramic substrate |
| KR102346798B1 (ko) * | 2015-02-13 | 2022-01-05 | 삼성전자주식회사 | 반도체 발광장치 |
| DE102015106444A1 (de) * | 2015-04-27 | 2016-10-27 | Osram Opto Semiconductors Gmbh | Optoelektronische Bauelementanordnung und Verfahren zur Herstellung einer Vielzahl von optoelektronischen Bauelementanordnungen |
| JP2016225374A (ja) * | 2015-05-27 | 2016-12-28 | 四国計測工業株式会社 | Led発光装置 |
| US10382820B2 (en) * | 2016-04-01 | 2019-08-13 | Huawei Technologies Co., Ltd. | Apparatus and method for bandwidth allocation as a function of a sensed characteristic of a user |
| JP7101547B2 (ja) * | 2018-06-27 | 2022-07-15 | 株式会社小糸製作所 | 車両用前照灯 |
| KR20210113870A (ko) * | 2020-03-09 | 2021-09-17 | 엘지이노텍 주식회사 | 조명모듈 및 이를 구비한 조명장치 |
Family Cites Families (40)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4011575A (en) * | 1974-07-26 | 1977-03-08 | Litton Systems, Inc. | Light emitting diode array having a plurality of conductive paths for each light emitting diode |
| JPH0883869A (ja) * | 1994-09-09 | 1996-03-26 | Sony Corp | 半導体装置およびその製造方法 |
| US6600175B1 (en) * | 1996-03-26 | 2003-07-29 | Advanced Technology Materials, Inc. | Solid state white light emitter and display using same |
| DE19638667C2 (de) | 1996-09-20 | 2001-05-17 | Osram Opto Semiconductors Gmbh | Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement |
| CN1534803B (zh) | 1996-06-26 | 2010-05-26 | 奥斯兰姆奥普托半导体股份有限两合公司 | 具有发光变换元件的发光半导体器件 |
| US6613247B1 (en) | 1996-09-20 | 2003-09-02 | Osram Opto Semiconductors Gmbh | Wavelength-converting casting composition and white light-emitting semiconductor component |
| JP3065263B2 (ja) | 1996-12-27 | 2000-07-17 | 日亜化学工業株式会社 | 発光装置及びそれを用いたled表示器 |
| US6204523B1 (en) | 1998-11-06 | 2001-03-20 | Lumileds Lighting, U.S., Llc | High stability optical encapsulation and packaging for light-emitting diodes in the green, blue, and near UV range |
| JP2000174350A (ja) * | 1998-12-10 | 2000-06-23 | Toshiba Corp | 光半導体モジュール |
| TW498148B (en) | 1999-06-25 | 2002-08-11 | Koninkl Philips Electronics Nv | Vehicle headlamp and a vehicle |
| CN100344728C (zh) | 1999-07-23 | 2007-10-24 | 电灯专利信托有限公司 | 光源的发光物质及其相关的光源 |
| JP2001127346A (ja) | 1999-10-22 | 2001-05-11 | Stanley Electric Co Ltd | 発光ダイオード |
| JP2001196639A (ja) | 2000-01-12 | 2001-07-19 | Sanyo Electric Co Ltd | Led発光素子及びその製造方法 |
| JP2001210872A (ja) | 2000-01-26 | 2001-08-03 | Sanyo Electric Co Ltd | 半導体発光装置及びその製造方法 |
| JP2002050800A (ja) * | 2000-05-24 | 2002-02-15 | Nichia Chem Ind Ltd | 発光装置及びその形成方法 |
| JP2001345483A (ja) | 2000-05-31 | 2001-12-14 | Toshiba Lighting & Technology Corp | 発光ダイオード |
| US6737801B2 (en) * | 2000-06-28 | 2004-05-18 | The Fox Group, Inc. | Integrated color LED chip |
| DE10039433B4 (de) * | 2000-08-11 | 2017-10-26 | Osram Opto Semiconductors Gmbh | Halbleiterchip für die Optoelektronik |
| US6998281B2 (en) * | 2000-10-12 | 2006-02-14 | General Electric Company | Solid state lighting device with reduced form factor including LED with directional emission and package with microoptics |
| WO2002031865A1 (en) * | 2000-10-13 | 2002-04-18 | Emcore Corporation | Method of making an electrode |
| US6841931B2 (en) * | 2001-04-12 | 2005-01-11 | Toyoda Gosei Co., Ltd. | LED lamp |
| US6642652B2 (en) * | 2001-06-11 | 2003-11-04 | Lumileds Lighting U.S., Llc | Phosphor-converted light emitting device |
| JP4114331B2 (ja) * | 2001-06-15 | 2008-07-09 | 豊田合成株式会社 | 発光装置 |
| JP4431932B2 (ja) | 2001-07-16 | 2010-03-17 | スタンレー電気株式会社 | 灯具 |
| JP4089866B2 (ja) * | 2001-10-12 | 2008-05-28 | スタンレー電気株式会社 | 投光ユニットおよび該投光ユニットを具備するled車両用照明灯具 |
| JP3707688B2 (ja) | 2002-05-31 | 2005-10-19 | スタンレー電気株式会社 | 発光装置およびその製造方法 |
| US7048412B2 (en) | 2002-06-10 | 2006-05-23 | Lumileds Lighting U.S., Llc | Axial LED source |
| JP2004047748A (ja) | 2002-07-12 | 2004-02-12 | Stanley Electric Co Ltd | 発光ダイオード |
| JP4024628B2 (ja) * | 2002-09-03 | 2007-12-19 | 株式会社小糸製作所 | 車両用前照灯 |
| JP4143732B2 (ja) * | 2002-10-16 | 2008-09-03 | スタンレー電気株式会社 | 車載用波長変換素子 |
| JP4071089B2 (ja) | 2002-11-06 | 2008-04-02 | 株式会社小糸製作所 | 車両用前照灯 |
| JP4040955B2 (ja) * | 2002-11-06 | 2008-01-30 | 株式会社小糸製作所 | 車両用前照灯及びその製造方法 |
| JP4182783B2 (ja) * | 2003-03-14 | 2008-11-19 | 豊田合成株式会社 | Ledパッケージ |
| KR20040092512A (ko) * | 2003-04-24 | 2004-11-04 | (주)그래픽테크노재팬 | 방열 기능을 갖는 반사판이 구비된 반도체 발광장치 |
| JP4335621B2 (ja) | 2003-04-25 | 2009-09-30 | スタンレー電気株式会社 | 車両用灯具 |
| US7157745B2 (en) * | 2004-04-09 | 2007-01-02 | Blonder Greg E | Illumination devices comprising white light emitting diodes and diode arrays and method and apparatus for making them |
| JP4138586B2 (ja) | 2003-06-13 | 2008-08-27 | スタンレー電気株式会社 | 光源用ledランプおよびこれを用いた車両用前照灯 |
| JP4024721B2 (ja) | 2003-06-20 | 2007-12-19 | 株式会社小糸製作所 | 車両用灯具及び光源モジュール |
| US6909239B2 (en) * | 2003-07-08 | 2005-06-21 | The Regents Of The University Of California | Dual LED/incandescent security fixture |
| US7070301B2 (en) * | 2003-11-04 | 2006-07-04 | 3M Innovative Properties Company | Side reflector for illumination using light emitting diode |
-
2004
- 2004-07-30 JP JP2004223707A patent/JP4599111B2/ja not_active Expired - Fee Related
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2005
- 2005-06-10 DE DE102005026949.4A patent/DE102005026949B4/de not_active Expired - Fee Related
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Also Published As
| Publication number | Publication date |
|---|---|
| US20060022211A1 (en) | 2006-02-02 |
| DE102005026949A1 (de) | 2006-03-23 |
| JP2006048934A (ja) | 2006-02-16 |
| DE102005026949B4 (de) | 2021-02-11 |
| US7932523B2 (en) | 2011-04-26 |
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