JP4281837B2 - COIL UNIT, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE - Google Patents

Description

  The present invention relates to a coil unit related to contactless power transmission using a coil, a manufacturing method thereof, an electronic device, and the like.

  Non-contact power transmission that uses electromagnetic induction and enables power transmission even without a contact of a metal part is known. As an application example of this non-contact power transmission, charging of a mobile phone or charging of household equipment (for example, a handset of a telephone) has been proposed.

In the non-contact power transmission, there is a problem of heat generation of the transmission coil, and a technique for suppressing the heat generation has been proposed (Patent Documents 1-5). Patent Document 1 discloses a design method for suppressing heat generation in non-contact charging. Patent Document 2 discloses a technique for suppressing heat generation by the configuration of a coil and a magnetic material. Patent Document 3 discloses a contactless charging device including an air cooling mechanism. Patent Document 4 discloses a structure in which ceramic is placed between a primary side coil and a secondary side coil to dissipate heat. Patent Document 5 discloses a structure of a housing with improved heat dissipation.
JP-A-8-103028 JP-A-8-148360 JP 11-98705 A JP 2003-272938 Japanese Patent Laid-Open No. 2005-110357

  In this non-contact power transmission, since a magnetic field is transmitted between coils, when a metal is brought close to the metal, the magnetic field is absorbed by the metal, resulting in a decrease in efficiency and induction heating in the metal itself. Thereby, the subject that the metal most suitable for a heat dissipation use cannot be used occurred.

  Some embodiments of the present invention provide a coil unit excellent in heat dissipation, a manufacturing method thereof, and an electronic device.

  A coil unit according to an aspect of the present invention includes a planar coil, a magnetic member provided below the planar coil, a magnetic flux leakage prevention member provided below the magnetic member, and the magnetic flux leakage prevention member. The heat sink is provided below, and the magnetic flux leakage prevention member and the heat sink can be electrically insulated.

  According to this configuration, the heat radiation plate is provided between the planar coil and the magnetic member and the magnetic flux leakage prevention member, and the space is not provided between the planar coil and the heat radiation plate. Therefore, the heat generated by the planar coil can be effectively radiated. Moreover, since there is a magnetic flux leakage prevention member, it is possible to avoid induction heating due to the heat sink receiving the magnetic flux. Furthermore, since the magnetic flux leakage prevention member and the heat sink, both of which are made of metal or the like, are electrically insulated, it is possible to prevent the heat sink from functioning as a member that receives the magnetic flux.

  In one aspect of the present invention, the magnetic flux leakage prevention member and the heat radiating plate can be insulated by a double-sided adhesive tape.

  According to this configuration, since the magnetic flux leakage prevention member and the heat radiating plate are insulated by the double-sided adhesive tape, it is not necessary to provide a separate insulator, and assembly is facilitated.

  In one aspect of the present invention, it may further include a printed circuit board on which the heat radiating plate is mounted and a conductive pattern connected to the planar coil is formed.

  According to this configuration, since the conductive pattern is provided on the printed circuit board, the electrical connection with the element that controls the planar coil can be easily performed.

  In one aspect of the present invention, at least one mounting component is mounted on the printed circuit board on the surface on which the heat sink is mounted, and the upper surface position of the planar coil is in the at least one mounting component. Can be set higher than the maximum height.

  According to this configuration, since the upper surface position of the planar coil is set higher than the upper surfaces of the other mounted components, assembly is facilitated. Further, the upper surface of the planar coil can be brought closer to the counterpart coil unit.

  In one aspect of the present invention, the component having the maximum height among the at least one mounted component may be a capacitor component connected to the planar coil. The capacitor component needs to be set large in size from the viewpoint of securing electric capacity. Therefore, when the mounted component is a capacitor component, one embodiment of the present invention is effective.

  In one aspect of the present invention, a temperature detection element for detecting the temperature of the heat sink can be mounted on a surface different from the surface on which the heat sink is mounted of the printed circuit board. As a result, even if a foreign object or the like enters and the temperature of the heat sink becomes abnormally high due to the temperature rise of the planar coil, the abnormality can be detected.

  In one aspect of the present invention, an element that cuts off power supply to the planar coil based on the temperature of the heat sink is mounted on a surface different from the surface on which the heat sink is mounted of the printed circuit board. Can do. According to this, the circuit which interrupts | blocks electric power supply can be comprised simply and reliably.

  In one aspect of the present invention, the printed circuit board may be provided with a positioning portion guided by an assembly jig that houses the heat radiating plate, the magnetic flux leakage prevention member, the magnetic member, and the planar coil. Thereby, assembly of a planar coil etc. becomes easy.

  In one aspect of the present invention, a spacer member is disposed on the top surface of the magnetic member, and the spacer member includes a hole that accommodates the planar coil, and the top surface of the planar coil, the top surface of the spacer member, Can be substantially flush. Thus, the transmission surface can be flattened by making the upper surface of the planar coil substantially the same as the upper surface of the spacer member. Moreover, it can avoid that a planar coil is damaged because a certain member hits the corner | angular part of a planar coil.

  In one aspect of the present invention, the magnetic flux leakage prevention member and the heat dissipation plate have substantially the same planar size, and the heat dissipation member can be thicker than the magnetic flux leakage prevention member. When the planar sizes are substantially the same, the magnetic flux can be reliably captured by the magnetic leakage member. Moreover, the heat dissipation of a heat sink can be improved more by setting a heat sink thicker than a magnetic flux leak prevention member.

  An electronic device according to another aspect of the present invention is an electronic device including a coil unit and an exterior body that houses the coil unit, and the exterior body has a hole on a surface facing the planar coil. The hole is covered with a protective cover, and the reinforcing body is formed at a position facing the maximum height position of the at least one mounted component, and the thickness of the reinforcing part is the thickness of the protective cover. The height from the printed circuit board to the outer surface of the protective cover is H1, the maximum height of the at least one mounting component with respect to the printed circuit board is H2, and the reinforcing portion H1> H2 + H3, where H3 is H3.

  By reducing the thickness of the protective cover and increasing the thickness of the reinforcing portion, other mounting parts can be reliably protected by the reinforcing portion. Further, since the reinforcing portion is provided, it is possible to suppress the exterior body on the mounted component from being depressed, and the exterior body in the vicinity of the transmission surface can be flattened. In addition, by setting so that H1> H2 + H3, a space can be secured between the mounted component and the reinforcing portion, and damage to the mounted component can be suppressed.

  The coil unit manufacturing method according to still another aspect of the present invention includes a step (A) of sequentially storing the planar coil, the magnetic member, and the magnetic flux leakage preventing member in a housing portion of an assembly jig, and the step ( After (A), the step (B) of housing the heat sink in the housing portion in a state of being electrically insulated from the magnetic flux leakage prevention member, and the housing portion side of the assembly jig after the step (B) The assembly jig and the printed circuit board are combined, and the planar coil, the magnetic member, the magnetic flux leakage prevention member, and the heat radiating plate are mounted on the printed circuit board.

  According to this, after accommodating a planar coil, a magnetic member, a magnetic flux leakage prevention member, and a heat sink in an assembling jig, a printed circuit board is stacked, and a planar coil or the like is assembled to the printed circuit board one by one. It becomes easier compared to assembly.

  In the manufacturing method according to still another aspect of the present invention, the planar coil, the magnetic member, the magnetic leakage member, and the heat radiating plate are housed in the assembly member in this order. It is also included in the scope of the present invention to intervene these members.

  In the manufacturing method according to still another aspect of the present invention, the insulating double-sided adhesive for insulating the magnetic flux leakage prevention member and the heat radiating plate between the step (A) and the step (B). A step of receiving the tape may be included.

  In the manufacturing method which concerns on the further another aspect of this invention, the process of accommodating the said spacer member in the said accommodating part may be included before the said process (A).

  In the manufacturing method according to still another aspect of the present invention, the printed circuit board may have a positioning portion, and the assembly jig may have a positioning portion corresponding to the positioning portion of the printed circuit board. When there is a positioning portion in this manner, positioning can be facilitated and assembly is facilitated.

A coil unit according to still another aspect of the present invention includes:
Coils,
A magnetic member on which the first magnetic flux generated by the coil is incident;
A magnetic flux leakage prevention member into which a second magnetic flux generated by the magnetic member based on the first magnetic flux is incident;
A heat radiating plate for radiating heat generated in the coil;
Including
The magnetic flux leakage prevention member and the heat radiating plate can be electrically insulated.

  In the coil unit according to still another aspect of the present invention, a heat radiating plate is provided between the planar coil and the heat radiating plate via a magnetic member and a magnetic flux leakage prevention member. Therefore, the heat generated by the planar coil can be effectively radiated. Moreover, since there is a magnetic flux leakage prevention member, it is possible to avoid induction heating due to the heat sink receiving the magnetic flux. Furthermore, since the magnetic flux leakage prevention member and the heat sink, both of which are made of metal or the like, are electrically insulated, it is possible to prevent the heat sink from functioning as a member that receives the magnetic flux. Moreover, various embodiments of the coil unit according to one aspect of the present invention described above can also be applied to a coil unit according to still another aspect of the present invention.

  An electronic apparatus according to still another aspect of the present invention can include the coil unit described above.

  Hereinafter, preferred embodiments of the present invention will be described in detail. The present embodiment described below does not unduly limit the contents of the present invention described in the claims, and all the configurations described in the present embodiment are indispensable as means for solving the present invention. Not necessarily.

  FIG. 1 is a diagram schematically illustrating the charger 10 and the charger 20. Charging from the charger 10 to the to-be-charged device 20 is performed by non-contact power transmission using an electromagnetic induction effect generated between the coil of the coil unit 12 of the charger 10 and the coil of the coil unit 22 of the electronic device 20. Is called.

  One feature of the present embodiment is the configuration of a coil unit. Hereinafter, the coil unit will be specifically described.

  FIG. 2 is a schematic exploded perspective view of the coil units 12 and 22. FIG. 3 is a schematic cross-sectional view of the coil units 12 and 22 taken along line AA in FIG. FIG. 4 is a diagram schematically showing a partial cross section of the charger 10 or the charger 22 in the coil unit 22.

  The coil units 12 and 22 are formed on a printed circuit board 80 in a state in which a heat radiating plate 70, a shielded magnetic member 50, and a coil, for example, a planar coil 30 are sequentially overlapped.

  The planar coil 30 is not particularly limited as long as it is a planar coil. For example, an air-core coil in which a single-core or multi-core coated coil wire is wound on a plane can be applied. The planar coil 30 may be formed by one coil, but as shown in FIGS. 2 to 4, a plurality of layers of coils 32 a and 32 b may be formed. By connecting the coils 32a and 32b in series, mutual inductance can be used in addition to self-inductance, and the coil diameter can be reduced. When a plurality of layers of the coils 32a and 32b are provided, the space between the coils 32a and 32b can be fixed by the double-sided adhesive tape 34.

  A spacer member 40 can be provided around the planar coil 30. A hole 44 is formed in the spacer member 40, and the planar coil 30 is accommodated in the hole 44. The spacer member 40 is provided with a notch 44 from which a lead wire of the planar coil 30 is drawn. The upper surface of the planar coil 30 and the upper surface of the spacer member 40 are substantially flush. By providing the spacer member 40 in this way, the transmission surface can be flattened, and damage to the planar coil 30 (particularly damage to corners of the planar coil) can be reduced. Further, it is possible to prevent something from being caught at the end of the planar coil 30 and to prevent the planar coil 30 from being peeled off. The material of the spacer member 40 is not particularly limited as long as it has high heat resistance against coil heat generation and does not have a dielectric constant, and examples thereof include polyethylene terephthalate resin.

  A shielded magnetic member 50 is provided under the planar coil 30. The shielded magnetic member 50 includes a magnetic member 52 and a magnetic flux leakage prevention member 54 provided therebelow.

  The magnetic member 52 functions to receive magnetic flux and has a function of increasing inductance. The material of the magnetic member 52 is preferably a soft magnetic material, and a ferrite soft magnetic material or a metal soft magnetic material can be applied.

  The magnetic flux leakage prevention member 54 has a role of absorbing magnetic flux that the magnetic member 52 could not capture or magnetic flux leaked from around the magnetic member 52. Alternatively, when the magnetic flux generated by the planar coil 30 is the first magnetic flux, the first magnetic flux is incident on the magnetic member 52, and the magnetic flux leakage prevention member 54 is magnetically coupled to the magnetic member 52 based on the first magnetic flux. It can also be defined that the second magnetic flux generated by is incident. In this case, the magnetic flux leakage prevention member 54 has a role of absorbing the second magnetic flux.

  The material of the magnetic flux leakage prevention member 54 is not particularly limited as long as it can absorb magnetic flux, and examples thereof include a non-magnetic material such as aluminum. Transmission characteristics are affected by what is formed in contact with the magnetic member. Therefore, it is preferable to define the material and size of the magnetic flux leakage prevention member 54 according to the required transmission characteristics. Providing the magnetic flux leakage prevention member 54 prevents magnetic flux from leaking to the heat radiating plate 70 and the like provided thereunder, so that induction heating can be prevented from being generated by a metal such as the heat radiating plate 70.

  A heat radiating plate 70 is provided under the magnetic flux leakage prevention member 54 via an insulating double-sided adhesive tape 60. The heat radiating plate 70 has a role of radiating heat generated by the planar coil 30. The material of the heat sink 70 is not limited as long as it has a high thermal conductivity, and a metal such as Al (aluminum) can be applied. Furthermore, since the heat radiating plate 70 is in contact with the planar coil 30 via the magnetic member and the magnetic leakage member 54, heat generated by the planar coil 30 can be radiated.

  When the planar size of the heat radiating plate 70 is substantially the same as that of the magnetic leakage prevention member 54, the heat radiating plate 70 may be thicker than the magnetic flux leakage prevention member 54. Since the plane sizes are substantially the same, the magnetic leakage member 54 can reliably capture the magnetic flux. Further, by setting the heat sink 70 thicker than the magnetic flux leakage prevention member 54, the heat dissipation of the heat sink 70 can be further enhanced.

  Since the magnetic flux leakage prevention member 54 and the heat radiating plate 70 are insulated by being provided via the insulating double-sided adhesive tape 60, the heat radiating plate 70 does not affect the transmission characteristics. That is, if it is not insulated in this way, the heat radiating plate 70 will also serve as the magnetic flux leakage prevention member 54 and affect the transmission characteristics. However, the insulating double-sided adhesive tape 60 is provided. By electrically insulating, the magnetic flux leakage prevention member 54 and the heat radiating plate 70 can be reliably separated from each other in terms of function. For this reason, any material selected as the material of the heat sink 70 does not affect the transmission characteristics. As a result, according to the present embodiment, the degree of freedom in selecting the material of the heat sink 70 can be increased. As the insulating double-sided adhesive tape 60, a known one can be applied.

  The heat sink 70 is attached to the printed circuit board 80 via a double-sided adhesive tape 84. A mounting component 82b is attached to the printed circuit board 80, and a conductive pattern for connecting the mounting component 82b and the planar coil 30 is formed. For example, the mounting component 82b includes the capacitors C1 and C2 described in FIG. 1 of JP-A-2005-6460 when the charger side is taken as an example, and the capacitors C3 and C4 shown in FIG. 1 when the charger is taken as an example. Can do. This type of capacitor is formed by, for example, a film capacitor.

  A temperature detection element 86 such as a thermistor for detecting the temperature of the planar coil 30 is mounted on the back surface of the printed circuit board 80 (a surface different from the surface on which the heat sink 70 is mounted). Even if foreign matter or the like enters the coil and the temperature of the coil becomes abnormally high, the abnormality can be detected by the temperature detection element 86. When the abnormal temperature of the planar coil 30 is detected by the temperature detection element 86, control for stopping transmission can be executed. Instead of the temperature detection element 86, an element that cuts off the energization of the planar coil 30 when the temperature becomes higher than a predetermined value based on the temperature of the heat radiating plate 70 may be provided. As this type of element, it is possible to use a fuse element that is blown by a high temperature, or a thermistor that increases or decreases its resistance value due to a high temperature to suppress or cut off current.

  As described above, the heat radiating plate 70 is interposed between the planar coil 30 and the printed circuit board 80. Therefore, as shown in FIG. 3, the planar coil 30 can be set such that the upper surface position A1 of the planar coil 30 is higher than the maximum height A2 in at least one mounted component, as shown in FIG. It has an easy configuration. As described above, when the upper surface position A1 of the planar coil 30 can be set higher than the maximum height A2 in at least one mounted component, the module can be easily assembled. Moreover, the upper surface of the planar coil 30 can be brought closer to the counterpart coil unit.

  Next, the relationship between the exterior body 14 and the coil unit will be described with reference to FIG.

  The exterior body 14 has a hole 14 c on the surface facing the planar coil 30. The hole 14 c is covered with a protective cover 16. A reinforcing portion 14b is formed in the outer body 14 at a position opposite to the maximum height position of the mounting component 82b, and the thickness H3 of the reinforcing portion 14b is formed to be thicker than the thickness H4 of the protective cover 16. By reducing the thickness of the protective cover 16 and increasing the thickness of the reinforcing portion 14b, the transmission distance can be shortened, and other mounting components can be reliably protected by the reinforcing portion. Further, the presence of the reinforcing portion 14b can prevent the outer body 14 on the mounting component 82b from being depressed, and the outer body near the transmission surface can be flattened.

  When the height from the circuit board to the outer surface of the protective cover is H1, the maximum height of the mounting component 82b with respect to the printed circuit board 80 is H2, and the thickness of the reinforcing portion is H3, H1> H2 + H3 can do. By setting in this way, a space can be secured between the mounting component 82b and the reinforcing portion 14b, and damage to the mounting component 82b can be suppressed.

  As shown in FIG. 2, the printed circuit board 80 is provided with a positioning portion, for example, a positioning hole 82a, next to the region where the planar coil 30 is mounted. The presence of the hole 82a facilitates the formation of the coil unit as will be described later.

(Production method)
Next, the manufacturing method of a coil unit is demonstrated using FIGS.

  The example which manufactures a coil unit using the assembly jig 90 shown in FIG. 5 is demonstrated. The assembling jig 90 is provided with a recess 92, and the recess 92 can accommodate the components of the coil unit. In addition, the assembling jig 90 is provided with a positioning guide projection 94. This will be specifically described below.

  First, as shown in FIGS. 6 and 7, the spacer member 40, the planar coil member 30, the magnetic member 52, the magnetic leakage member 54, the insulating adhesive double-sided tape 60, the heat radiating plate 70, The adhesive double-sided tape 84 is accommodated sequentially. Next, as shown in FIGS. 8 and 9, the printed circuit board 80 and the assembly jig 90 are aligned with each other on the concave portion 92 side of the jig 90. For this alignment, the protrusion 94 of the assembly jig 90 is inserted into the positioning hole 82 a of the printed circuit board 80. Thereby, positioning becomes easy. After the mounting, the assembly jig is removed, so that the components housed in the assembly jig 90 are mounted on the printed circuit board 80 via the double-sided adhesive sheet 84 as shown in FIG.

(Application example of electronic equipment)
This embodiment can be applied to all electronic devices that perform power transmission and signal transmission. For example, wristwatches, electric toothbrushes, electric shavings, cordless phones, personal handyphones, mobile personal computers, PDAs (Personal Digital Assistants) The present invention can be applied to a to-be-charged device including a secondary battery such as an electric bicycle and a charging device for charging it.

  Although the present embodiment has been described in detail as described above, those skilled in the art can easily understand that many modifications can be made without departing from the novel matters and effects of the present invention. Accordingly, all such modifications are intended to be included in the scope of the present invention. For example, a term described at least once together with a different term having a broader meaning or the same meaning in the specification or the drawings can be replaced with the different term in any part of the specification or the drawings.

  Although the present embodiment relates to contactless power transmission, it can be similarly applied to contactless signal transmission using the electromagnetic induction principle.

  In the above description of the embodiment, the example in which the present invention is applied to both the coil unit on the charging device side and the coil unit on the charged device side has been described, but the present invention may be applied to only one of them.

It is a figure which shows a charger and a to-be-charged device typically. It is a schematic diagram of the exploded perspective view of a coil unit. It is a cross-sectional schematic diagram of the coil unit along the AA line of FIG. It is a figure which shows typically the partial cross section of the charger in a coil unit, or a to-be-charged device. It is a figure which shows an assembly | attachment jig typically. It is a schematic diagram which shows the manufacturing process of a coil unit. It is a schematic diagram which shows the manufacturing process of a coil unit. It is a schematic diagram which shows the manufacturing process of a coil unit. It is a schematic diagram which shows the manufacturing process of a coil unit. It is a schematic diagram which shows the manufacturing process of a coil unit.

Explanation of symbols

10 charger, 20 charger, 12 first coil unit, 14 exterior body,
14a hole part, 14b reinforcement part, 16 protective cover, 22 2nd coil unit,
30 planar coil, 40 spacer member, 50 shielded magnetic member,
52 magnetic member, 54 magnetic flux leakage prevention member, 60 insulating double-sided adhesive tape,
70 heat sink, 80 circuit board, 82a hole for positioning, 82b mounting component,
84 Double-sided adhesive tape, 86 Temperature detection element, 90 Assembly jig, 92 Concavity,
94 Protrusion for positioning

Claims (17)

A planar coil;
A magnetic member provided below the planar coil;
A magnetic flux leakage prevention member provided below the magnetic member;
A heat sink provided below the magnetic flux leakage prevention member;
Have
A coil unit, wherein the magnetic flux leakage prevention member and the heat radiating plate are electrically insulated. In claim 1,
The coil unit, wherein the magnetic flux leakage prevention member and the heat radiating plate are insulated by a double-sided adhesive tape. In claim 1 or 2,
The coil unit further comprising a printed circuit board on which the heat radiating plate is mounted and a conductive pattern connected to the planar coil is formed. In claim 3,
On the printed circuit board, at least one mounting component is mounted on a surface on which the heat sink is mounted,
The coil unit is characterized in that an upper surface position of the planar coil is set higher than a maximum height in the at least one mounted component. In claim 4,
Of the at least one mounted component, the component having the maximum height is a capacitor component connected to the planar coil. In any of claims 3 to 5,
A coil unit, wherein a temperature detecting element for detecting a temperature of the heat radiating plate is mounted on a surface different from a surface on which the heat radiating plate is mounted of the printed circuit board. In any of claims 3 to 5,
An element that cuts off power supply to the planar coil based on the temperature of the heat sink coil is mounted on a surface different from the surface on which the heat sink is mounted of the printed circuit board. Coil unit. In any of claims 3 to 7,
A coil unit, wherein the printed circuit board is provided with a positioning portion guided by an assembly jig that houses the heat radiating plate, the magnetic flux leakage prevention member, the magnetic member, and the planar coil. In any one of Claims 1 thru | or 8.
A spacer member is disposed on the upper surface of the magnetic member,
The said spacer member contains the hole part which accommodates the said planar coil, The upper surface of the said planar coil and the upper surface of the said spacer member are substantially flush | planar, The coil unit characterized by the above-mentioned. In any one of Claims 1 thru | or 9,
The coil unit, wherein the magnetic flux leakage prevention member and the heat radiating plate have substantially the same planar size, and the heat radiation member is thicker than the magnetic flux leakage prevention member. An electronic apparatus comprising the coil unit according to any one of claims 3 to 8 and an exterior body that houses the coil unit,
The exterior body has a hole on the surface facing the planar coil, and the hole is covered with a protective cover,
A reinforcing portion is formed at a position where the exterior body faces a maximum height position of the at least one mounting component, and the thickness of the reinforcing portion is formed to be thicker than the thickness of the protective cover,
The height from the printed circuit board to the outer surface of the protective cover is H1, the maximum height of the at least one mounting component based on the printed circuit board is H2, and the thickness of the reinforcing portion is H3. An electronic device characterized in that H1> H2 + H3. A method of manufacturing a coil unit according to any one of claims 3 to 8,
Step (A) of sequentially storing the planar coil, the magnetic member, and the magnetic flux leakage prevention member in the housing portion of the assembly jig;
After the step (A), a step (B) of housing the heat sink in the housing portion in a state of being electrically insulated from the magnetic flux leakage prevention member;
After the step (B), the assembly jig and the printed circuit board are combined on the housing part side of the assembly jig, and the planar coil, the magnetic member, the magnetic flux leakage prevention member, Installing a heat sink;
The manufacturing method of the coil unit characterized by including. In claim 12,
A coil comprising a step of accommodating the insulating double-sided adhesive tape for insulating the magnetic flux leakage prevention member and the heat radiating plate between the step (A) and the step (B). Unit manufacturing method. In claim 12 or 13,
Before the said process (A), the process of accommodating the said spacer member in the said accommodating part is included, The manufacturing method of the coil unit characterized by the above-mentioned. In any of claims 12 to 14,
A method of manufacturing a coil unit, comprising: a positioning part on the printed circuit board; and the assembly jig having a positioning guide part corresponding to the positioning part of the printed circuit board. Coils,
A magnetic member on which the first magnetic flux generated by the coil is incident;
A magnetic flux leakage prevention member into which a second magnetic flux generated by the magnetic member based on the first magnetic flux is incident;
A heat radiating plate for radiating heat generated in the coil;
Including
A coil unit, wherein the magnetic flux leakage prevention member and the heat radiating plate are electrically insulated.   An electronic device comprising the coil unit according to claim 16.

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