Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic perspective view of a coil module according to a first embodiment of the present invention.
Fig. 2 is an exploded perspective view of the coil module of fig. 1.
Fig. 3 is a further exploded perspective view of the coil module of fig. 2.
Fig. 4 is a further exploded perspective view of the coil module of fig. 3.
Fig. 5 is an enlarged perspective view of the coil assembly and jumper assembly of fig. 4.
Fig. 6 is an enlarged view of a VI portion in fig. 5.
Fig. 7 is an enlarged perspective view of another view of the coil assembly and jumper assembly of fig. 6.
Fig. 8 is an enlarged view of a portion VIII in fig. 7.
Fig. 9 is an exploded perspective view of the coil assembly and jumper assembly of fig. 5.
Fig. 10 is an enlarged perspective view of the jumper assembly of fig. 9.
Fig. 11 is an exploded perspective view of the jumper assembly of fig. 10.
Fig. 12 is a schematic perspective view of another view of the jumper assembly of fig. 11.
Fig. 13 is a schematic front view of the coil assembly and jumper assembly of fig. 5.
Fig. 14 is an enlarged view of the XIV portion in fig. 13.
Fig. 15 is a cross-sectional view of the coil module of fig. 1.
Fig. 16 is a partial enlarged view of the coil module of fig. 15.
Fig. 17 is a schematic front view of a coil assembly according to a second embodiment of the present invention.
Fig. 18 is an enlarged view of a portion XVIII in fig. 17.
Fig. 19 is a schematic front view of a coil assembly according to a third embodiment of the present invention.
Fig. 20 is an enlarged view of the XX portion in fig. 19.
Fig. 21 is an exploded perspective view of a coil module according to a fourth embodiment of the present invention.
Fig. 22 is a schematic perspective view of a wireless charging device according to an embodiment of the invention.
Fig. 23 is a schematic perspective view of an electronic device according to another embodiment of the present invention.
Fig. 24 is a schematic view showing a state in which the wireless charging apparatus in fig. 22 charges the electronic device in fig. 23.
The main reference numerals indicate 100, coil modules; 30, a coil assembly; 32, a first flexible circuit board; 35, coil bundles, 352, coil part, 3522, metal wiring, 354, a first connecting end, 356, a second connecting end, 40, a jumper assembly, 41, an isolating film, 42, a second flexible circuit board, 422, a first strip-shaped sheet, 424, a second strip-shaped sheet, 43, a second protective film, 432, a first protective sheet, 434, a second protective sheet, 436, a third protective sheet, 44, a first wiring harness, 442, a first welding point, 443, a first welding part, 445, a first contact point, 46, a second wiring harness, 462, a second welding point, 463, a second welding part, 465, a second contact point, 50, a supporting layer, 52, a first surface, 520, a containing groove, 522, a first containing section, 524, a second containing section, 526, a third containing section, 54, a second surface, 60, a first insulating layer, 62, a first avoiding groove, 70, a first protective film, 72, a avoiding hole, 80, a cover film, 82, a second avoiding groove, 84, a second cover groove, 200, a first welding part, 465, a second contact point, 50, a supporting layer, 52, a first surface, 520, a first surface, a third containing section, 54, a second surface, a receiving groove, 522, a first insulating layer, a first containing section, a first insulating layer, a second containing section, a third containing section, a first holding section, a third, a first holding section, a first holding section, a first, a second holding section, a first, a third, a first holding section, a first, a third, a holding section, a third, a first, a third, a holding, a third, a holding, a first, a third, a holding, a third, a holding, and a third, and a holding, and a third, and a stand, stand, stand.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without any inventive effort, are intended to be within the scope of the invention.
Furthermore, the following description of the embodiments refers to the accompanying drawings, which illustrate specific embodiments in which the application may be practiced. Directional terms, such as "upper", "lower", "front", "rear", "left", "right", "inner", "outer", "side", etc., in the present application are merely referring to the directions of the attached drawings, and thus, directional terms are used for better, more clear explanation and understanding of the present application, rather than indicating or implying that the apparatus or element being referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present application.
In the description of the present application, unless explicitly stated and limited otherwise, the terms "mounted," "connected," and "disposed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected, mechanically connected, directly connected, indirectly connected via an intermediary, or in communication between two elements. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.
Referring to fig. 1 to 4, a first embodiment of the present invention provides a coil module 100, which includes a coil assembly 30, a jumper assembly 40, a supporting layer 50, a first insulating adhesive layer 60, a first protective film 70, a cover film 80, a isolating film 41, a second protective film 43, a second insulating adhesive 91 and a heat dissipation film 95, wherein the coil assembly 30 includes a first flexible circuit board 32 and a coil bundle 35 disposed on the first flexible circuit board 32, the coil bundle 35 includes a coil portion 352, a first connection end 354 connected to one end of the coil portion 352, and a second connection end 356 connected to the other end of the coil portion 352, the first connection end 354 is disposed on the first flexible circuit board 32, the second connection end 356 extends out of an edge of the first flexible circuit board 32, the jumper assembly 40 includes a second flexible circuit board 42, a first wire bundle 44 and a second wire bundle 46, the first wire bundle 44 and the second wire bundle 46 are disposed on the second flexible circuit board 42 at a distance from each other, one end of the first wire bundle 44 is connected to the first connection end 354, one end of the second wire bundle 46 is connected to the second connection end 356, and the second connection end 356 is connected to the other end of the second connection end 356, so that the first wire bundle 41 is disposed between the first flexible circuit board 32 and the second flexible circuit board.
It is understood that the coil module 100 may be applied to a non-contact power receiving device, which may be, but not limited to, an electronic device such as a mobile phone, a smart watch, a tablet computer, or a smart wearable device, and the coil module 100 may supply power to a battery of the non-contact power receiving device. The coil module 100 can also be applied to a non-contact power transmission device, which is a wireless charging device, and the coil module 100 can charge a non-contact power receiving device.
The support layer 50 is laminated on the heat dissipation film 95, the second insulating adhesive 91 is connected between the support layer 50 and the heat dissipation film 95, the first flexible circuit board 32 is arranged on one side of the support layer 50 facing away from the heat dissipation film 95, the first insulating adhesive layer 60 is connected between the first flexible circuit board 32 and the support layer 50, the first protective film 70 covers the surface of the coil portion 352 facing away from the second flexible circuit board 42, the first protective film 70 is used for protecting the surface of the coil assembly 30 from being corroded by external substances, the wear resistance and the pollution resistance of the coil assembly 30 are improved, the reliability and the service life of the coil assembly 30 are improved, the second protective film 43 covers the surface of the second flexible circuit board 42 facing away from the first flexible circuit board 32, the second protective film 43 is used for protecting the surfaces of the second flexible circuit board 42, the first wire harness 44 and the second wire harness 46 from being corroded by external substances, the wear resistance and the pollution resistance of the jumper assembly 40 are improved, the reliability and the service life of the jumper assembly 40 are improved, the cover film 80 covers the surface of the support layer 50 facing away from the outside substances, the wear resistance and the pollution resistance of the coil assembly 50 are improved, the wear resistance and the service life of the jumper wire assembly 100 are improved, and the wear resistance and the service life of the coil assembly is improved.
The first flexible circuit board 32 and the second flexible circuit board 42 of the coil module 100 provided by the invention are separated by the isolation film 41, one end of the first wire harness 44 is connected to the first connection end 354 of the coil portion 352, and one end of the second wire harness 46 is connected to the second connection end 356 of the coil portion 352, so as to form a complete loop. Compared with the prior art in which a winding coil is stacked by at least two layers of coils, and two opposite sides of the coil are respectively stuck with a covering film, and then a glue layer is stuck on the surface of the covering film, which is away from the coil, the coil module 100 provided by the invention only adopts the coil bundles 35 arranged in the first flexible circuit board 32 on one side, compared with the prior art in which the coil is stacked by two layers of coils, the coil module 100 provided by the invention reduces one layer of coil bundles, so that the thickness of the coil module 30 is reduced, and the whole thickness of the coil module 100 is reduced, and the isolating film 41 of the coil module 100 replaces the covering film and the glue layer on one side of the coil in the prior art, so that one film layer is reduced, and the whole thickness of the coil module 100 is further reduced, so as to meet the development trend of thinning of electronic equipment provided with the coil module 100. Secondly, the coil assembly 30 adopts a single-sided wiring mode, so that the thickness of the rest stacked layers is reduced, and a space is provided for increasing the wiring copper thickness of the coil part 352, thereby reducing the alternating current resistance of the coil assembly 30, reducing the temperature of the coil assembly 30 during working, improving the temperature rise, improving the charging efficiency and reducing the loss. In addition, only one cover film 80 is required to be arranged on one coil part 352, so that the cover film is not required to be arranged on the surface of the first flexible circuit board 32, which is away from the coil part 352, and the thickness of the coil module 100 is further reduced, so that the requirement of non-contact power transmission of lightweight portable equipment can be met. The thickness refers to the dimensions of the elements of the coil module 100 in the stacking direction.
As shown in fig. 5-12, one end of the first wire harness 44 is welded to the first connecting end 354 and one end of the second wire harness 46 is welded to the second connecting end 356. Specifically, a first welding point 442 is disposed at one end of the first wire harness 44, opposite side surfaces of the first flexible circuit board 32 are exposed from the first connection end 354, the first welding point 442 is welded to the first connection end 354 through a first welding portion 443, a second welding point 462 is disposed at one end of the second wire harness 46, the second connection end 356 extends out of the edge of the first flexible circuit board 32, and the second welding point 462 is welded to the second connection end 356 through a second welding portion 463, so as to form a loop between the coil bundle 35 and the first wire harness 44 and the second wire harness 46 of the second flexible circuit board 42.
Optionally, the first connection end 354 of the coil bundle 35 is closer to the center line L of the first flexible circuit board 32 than the second connection end 356, the first wire bundle 44 is spaced parallel to the second wire bundle 46, the length of the first wire bundle 44 is greater than the length of the second wire bundle 46, and the first wire bundle 44 and the second wire bundle 46 are two jumpers of the coil module 100, respectively. The first wire harness 44 is parallel to the first flexible circuit board 32, one end of the first wire harness 44 provided with the first welding point 442 is parallel to and spaced from the surface of the first flexible circuit board 32, and the other end of the first wire harness 44 away from the first welding point 442 protrudes out of the edge of the first flexible circuit board 32. The first wire harness 44 and the second wire harness 46 are arranged in parallel at intervals, which is convenient for processing and also convenient for connection with the circuitry of the contactless charging device.
The coil portion 352 includes a plurality of metal traces 3522, the plurality of metal traces 3522 are formed by one metal trace on one side of the first flexible circuit board 32 from outside to inside to form a spiral coil, and the plurality of metal traces 3522 can be wound clockwise or counter-clockwise. Since the multi-turn metal wire 3522 can be wound in a clockwise or counterclockwise direction to form the spiral coil portion 352, the wire of the metal wire 3522 is not limited, and the coil portion 352 can be manufactured according to actual needs. In this embodiment, the multi-turn metal trace 3522 can be clockwise looped. The metal tracks 3522 are spaced apart from one another, each metal track 3522 being circular and the metal tracks 3522 being coaxial. The plurality of turns of metal traces 3522 may expose opposite surfaces of the first flexible circuit board 32. The first connecting end 354 is located inside the coil portion 352, the second connecting end 356 is located at an outer edge of the coil portion 352, and the second connecting end 356 extends away from an end of the metal trace 3522. In this embodiment, the cross section of the metal trace 3522 is rectangular. In other embodiments, the turns of metal traces 3522 can also be rectangular, polygonal, elliptical, or the like. Since the metal trace 3522 may be circular, rectangular, polygonal, elliptical, or the like, the coil portion 352 may be designed as a spiral coil of various different shapes as needed for implementation.
In the present embodiment, the isolation film 41 is a strip-shaped insulating sheet that conforms to the surface of the second flexible circuit board 42 facing the first flexible circuit board 32 so as to completely insulate the first flexible circuit board 32 from the second flexible circuit board 42. The separator 41 may be, but is not limited to, an insulating organic fiber sheet, a polymer insulating sheet, a composite insulating sheet, or the like.
As shown in fig. 9-12, the second flexible circuit board 42 includes a first strip 422 and a second strip 424 at opposite ends thereof, the length of the first strip 422 is greater than the length of the second strip 424, the width of the second strip 424 is greater than the width of the first strip 422, the first wire harness 44 is disposed on one side of the second flexible circuit board 42, the first wire harness 44 is disposed on the first strip 422 and the second strip 424, the second wire harness 46 is disposed on the other side of the second flexible circuit board 42, and the second wire harness 46 is disposed on the second strip 424, and the first strip 422 is attached to the surface of the isolation film 41 facing away from the first flexible circuit board 32. Because the width of the first strip 422 of the second flexible circuit board 42 is smaller than the width of the second strip 424, and the second wire harness 46 is only arranged on the second strip 424, the area of the second flexible circuit board 42 is smaller, the volume of the coil module 100 occupied by the second flexible circuit board 42 can be reduced, the miniaturization and the thinning of the coil module 100 are facilitated, and the material required for manufacturing the second flexible circuit board 42 can be saved. The first weld 442 is located at an end of the first strip 422 remote from the second strip 424 and the second weld 462 is located at an end of the second wire harness 46 proximate to the first strip 422. The first wire harness 44 is provided with a first contact point 445 at one end facing away from the first welding point 442, the first contact point 445 exposes the outer peripheral surface of the supporting layer 50, the second wire harness 46 is provided with a second contact point 465 at one end facing away from the second welding point 462, the second contact point 465 exposes the outer peripheral surface of the supporting layer 50, and the first contact point 445 and the second contact point 465 are used for being connected with a circuit system of a non-contact charging device.
In this embodiment, the first flexible circuit board 32 is circular, the length direction of the second flexible circuit board 42 is parallel to the radial direction of the first flexible circuit board 32, and one end of the second flexible circuit board 42 away from the center line of the first flexible circuit board 32 extends out of the outer periphery of the first flexible circuit board 32. Because the second flexible circuit board 42 extends along the radial direction of the first flexible circuit board 32, the first wire harness 44 and the second wire harness 46 extend along the radial direction of the first flexible circuit board 32, so that the lengths of the second flexible circuit board 42, the first wire harness 44 and the second wire harness 46 are shorter, the manufacturing materials can be saved, and the charging efficiency can be improved. In this embodiment, the first wire harness 44 has a rectangular cross section. In other embodiments, the cross-section of the first strands 44 may be, but is not limited to, circular, polygonal, kidney-shaped, etc. In other embodiments, the first flexible circuit board 32 may be, but is not limited to, rectangular, oval, polygonal, irregular, etc.
The second protective film 43 covers the surface of the second flexible circuit board 42 facing away from the first flexible circuit board 32, and the thickness of the isolation film 41 is smaller than or equal to the thickness of the second protective film 43, so that the overall thickness of the coil module 100 can be further reduced. The second protective film 43 is in a strip shape and includes a strip-shaped first protective sheet 432, a strip-shaped second protective sheet 434, and a third protective sheet 436, the first protective sheet 432 is connected between the second protective sheet 434 and the third protective sheet 436, the shape of the second protective film 43 is identical to the shape of the second flexible circuit board 42, specifically, the shape of the first protective sheet 432 is identical to the shape of the first strip-shaped sheet 422, the shape of the second protective sheet 434 is identical to the shape of the second strip-shaped sheet 424, and the shape of the third protective sheet 436 is identical to the shape of the first welding point 442. When the second protective film 43 covers the second flexible circuit board 42, the first protective sheet 432 covers the first strip 422, the second protective sheet 434 covers the second strip 424, and the third protective sheet 436 covers the first solder joint 442. The second protective film 43 may be, but not limited to, an ultrathin black cover film, a polyimide film, an FPC cover film, or the like, and the thickness of the second protective film 43 is 3 μm to 7.5 μm.
As shown in fig. 9 and fig. 13-14, the coil portion 352 is formed on the first flexible circuit board 32 by one metal trace in a clockwise loop, and the current flows from the first contact point 445 through the second harness 46, the second soldering point 462, the second soldering portion 463, the second connection end 356, and then along the loop metal trace 3522, the first connection end 354, the first soldering portion 443, the first soldering point 442, and the first harness 44.
As shown in fig. 4, the coil module 100 further includes a supporting layer 50, the supporting layer 50 includes a first surface 52 and a second surface 54 disposed opposite to each other, the first flexible circuit board 32 is stacked on the first surface 52, the first surface 52 is provided with a receiving groove 520, and the second flexible circuit board 42 is received in the receiving groove 520. The accommodating groove 520 is a strip-shaped groove corresponding to the second flexible circuit board 42, one end of the accommodating groove 520 penetrates through the outer side surface of the supporting layer 50, and the opposite end of the accommodating groove 520 is close to the center of the first surface 52. The width of the accommodating groove 520 is greater than or equal to the width of the second flexible circuit board 42, and the accommodating groove 520 penetrates through the second surface 54 of the supporting layer 50, so that the second flexible circuit board 42 can be completely accommodated in the accommodating groove 520. That is, when the coil assembly 30 is placed on the supporting layer 50, the second flexible circuit board 42 is accommodated in the accommodating groove 520, and the first surface 52 is supported on the first flexible circuit board 32, so that the thickness of the coil module 100 can be reduced. The shape of the supporting layer 50 may be the same as or different from the shape of the first flexible circuit board 32, and in this embodiment, the supporting layer 50 is a rectangular nano-wafer. The support layer 50 may be, but is not limited to, a circular nano-wafer, a polygonal nano-wafer, an elliptical nano-wafer, an irregular nano-wafer, or the like. The area of the first surface 52 is greater than or equal to the area of the first flexible circuit board 32 so that the first flexible circuit board 32 can fall entirely within the area of the first surface 52. The supporting layer 50 can absorb energy from an electromagnetic field, convert the energy into electric energy and transmit the electric energy to a receiving end so as to improve the electric energy transmission efficiency, and can transmit the electric energy in a longer distance range so as to enlarge the application field of wireless electric energy transmission, in addition, the supporting layer 50 is helpful for heat dissipation of the coil module 100, the electric energy transmission speed and efficiency are further improved, the supporting layer 50 has high saturation magnetic flux density and relative magnetic permeability, the volume and the quality of the magnetic energy coupling mechanism can be greatly reduced on the basis of ensuring the shielding effect so as to be suitable for the wireless charging environment of the portable electronic equipment, and the supporting layer 50 can also effectively reduce energy loss in the electric energy transmission process and reduce heating and electromagnetic interference to the surrounding environment of the coil module 100. In other embodiments, the support layer 50 may be made of materials other than nanocrystalline materials that have the above-described effects.
As shown in fig. 4 and 11, the accommodating groove 520 includes a first accommodating section 522, a second accommodating section 524 and a third accommodating section 526 which are mutually communicated, the first accommodating section 522 is located between the second accommodating section 524 and the third accommodating section 526, the third accommodating section 526 is closer to the center of the first surface 52 relative to the second accommodating section 524, and one end of the second accommodating section 524, which faces away from the third accommodating section 526, penetrates through the outer side surface of the supporting layer 50. The first accommodating section 522 is opposite to the first strip-shaped piece 422, the width of the first accommodating section 522 is greater than or equal to the width of the first strip-shaped piece 422, the second accommodating section 524 is opposite to the second strip-shaped piece 424, the width of the second accommodating section 524 is greater than or equal to the width of the second strip-shaped piece 424, the third accommodating section 526 is opposite to the first welding point 442, the width of the third accommodating section 526 is greater than or equal to the width of the first welding point 442, that is, when the second flexible circuit board 42 is accommodated in the accommodating groove 520, the first strip-shaped piece 422 can be accommodated in the first accommodating section 522, the second strip-shaped piece 424 can be accommodated in the second accommodating section 524, and the first welding point 442 can be accommodated in the third accommodating section 526.
In the present embodiment, the accommodating groove 520 penetrates through the second surface 54, and the isolation film 41 and the second flexible circuit board 42 are both accommodated in the accommodating groove 520. It can be understood that when the depth of the receiving groove 520 is greater than or equal to the sum of the thicknesses of the second flexible circuit board 42 and the isolation film 41, both the isolation film 41 and the second flexible circuit board 42 are received in the receiving groove 520, and when the depth of the receiving groove 520 is less than the sum of the thicknesses of the second flexible circuit board 42 and the isolation film 41, only the second flexible circuit board 42 is received in the receiving groove 520.
In some embodiments, the receiving groove 520 is located on the first surface 52 of the support layer 50, and the receiving groove 520 does not penetrate through the second surface 54 of the support layer 50.
As shown in fig. 4, the first insulating adhesive layer 60 is disposed between the first flexible circuit board 32 and the first surface 52, the first insulating adhesive layer 60 is provided with a first avoiding groove 62 corresponding to the second flexible circuit board 42, the isolation film 41 is accommodated in the first avoiding groove 62, and the isolation film 41 not only can effectively insulate and isolate the first flexible circuit board 32 from the second flexible circuit board 42, but also can reduce the thickness of the coil module 100. The shape of the first insulating adhesive layer 60 is consistent with the shape of the first flexible circuit board 32, and in this embodiment, the shape of the first insulating adhesive layer 60 is consistent with the shape of the coil portion 352, that is, the first insulating adhesive layer 60 is a ring-shaped sheet. One end of the first avoidance groove 62 penetrates through the inner cavity of the first insulating adhesive layer 60, and the opposite end of the first avoidance groove 62 penetrates through the outer circumferential surface of the first insulating adhesive layer 60. The first relief groove 62 has a shape corresponding to the shape of the isolation diaphragm 41, and the first insulating adhesive layer 60 is connected between the first flexible circuit board 32 and the first surface 52 when the coil assembly 30 is disposed on the first surface 52 of the support layer 50. Compared with the prior art that an insulating film is arranged between the coil and the supporting layer, and insulating adhesive glue needs to be respectively arranged on two opposite side surfaces of the insulating film, the thickness of the coil module 100 can be reduced by only adopting the first insulating adhesive layer 60 to replace the insulating adhesive glue on the two opposite side surfaces of the insulating film and the insulating film, the isolating film 41 can be accommodated in the first avoiding groove 62, and the second flexible circuit board 42 is accommodated in the accommodating groove 520, so that the thickness of the coil module 100 can be further reduced.
Optionally, the coil module 100 further includes a first protective film 70, where the first protective film 70 covers a surface of the coil portion 352 facing away from the second flexible circuit board 42, and the thickness of the isolation film 41 is smaller than that of the first protective film 70. It can be understood that, in the related art, the opposite sides of the coil are respectively attached with a protective film to protect the coil, while the coil module 100 of the present application only has the first protective film 70 disposed on the surface of the coil portion 352 facing away from the second flexible circuit board 42, so that the overall thickness of the coil assembly 30 can be reduced, and the thickness of the isolation film 41 is smaller than that of the first protective film 70, so that the thickness of the coil module 100 can be reduced. In this embodiment, the shape of the first protective film 70 is identical to the shape of the coil portion 352, that is, the first protective film 70 is a ring-shaped film, and the center of the first protective film 70 is provided with the clearance hole 72. In this embodiment, the first protective film 70 is a polyimide film. In other embodiments, the first protective film 70 may also employ, but is not limited to, a polycarbonate film, a polyethylene terephthalate film, a polymethyl methacrylate film, or the like.
Optionally, the coil module 100 further includes a cover film 80, where the cover film 80 covers a surface of the support layer 50 facing away from the second flexible circuit board 42, the cover film 80 is provided with a second avoidance groove 82 facing the coil portion 352, and the first protection film 70 is accommodated in the second avoidance groove 82. The cover film 80 is used to protect the surface of the supporting layer 50 from being corroded by external substances, increase the wear resistance and dirt resistance of the coil module 100, and improve the reliability and service life of the coil module 100. The shape of the cover film 80 is identical to the shape of the first surface 52 of the support layer 50, and in this embodiment, the cover film 80 is a rectangular cover film. In other embodiments, the cover film 80 may be, but is not limited to, a circular cover film, a polygonal cover film, an elliptical cover film, an irregular cover film, or the like. The shape of the second avoidance groove 82 is identical to that of the first protective film 70 so that the first protective film 70 can be completely accommodated in the second avoidance groove 82. When the second avoiding groove 82 is formed in the cover film 80, the cover film 80 forms a circular cover 84 around the inner periphery of the second avoiding groove 82. When the first protective film 70 is accommodated in the second avoidance groove 82, the outer peripheral surface of the first protective film 70 is in sealing engagement with the outer peripheral surface of the second avoidance groove 82, and the outer peripheral surface of the circular cover 84 is in sealing engagement with the inner peripheral surface of the avoidance hole 72, so that the first protective film 70 and the cover film 80 can completely cover the first flexible circuit board 32 and the supporting layer 50 together. Since the first protective film 70 is directly accommodated in the second avoiding groove 82 of the cover film 80, that is, the first protective film 70 replaces the cover film 80 and the polyester film on the coil portion 352, the first protective film 70 is prevented from occupying the whole thickness of the coil module 100, and the whole thickness of the coil module 100 is further reduced. The cover film 80 may be, but not limited to, an ultrathin black cover film, a polyimide film, an FPC cover film, or the like, and in this embodiment, a polyester film is used for the cover film 80. The first protective film 70 and the cover film 80 can protect the surface of the first flexible circuit board 32 from the attack of foreign substances, increase the wear resistance and the stain resistance of the coil part 352 and the first flexible circuit board 32, and improve the reliability and the service life of the coil part 352 and the first flexible circuit board 32.
As shown in fig. 3-4 and 11, the second insulating adhesive 91 is attached to the second surface 54 of the supporting layer 50, the second insulating adhesive 91 is provided with a third avoiding groove 910 opposite to the second flexible circuit board 42, and the second protective film 43 is accommodated in the third avoiding groove 910, so as to reduce the overall thickness of the coil module 100. The third avoidance groove 910 comprises a first avoidance section 912, a second avoidance section 914 and a third avoidance section 916 which are communicated with each other, the second avoidance section 914 is located between the first avoidance section 912 and the third avoidance section 916, the third avoidance section 916 is closer to the center of the second insulating glue 91 relative to the second avoidance section 914, and one end of the second avoidance section 914, deviating from the third avoidance section 916, penetrates through the outer side face of the second insulating glue 91. When the second insulating adhesive 91 is adhered to the second surface 54, the first avoiding section 912 faces the first accommodating section 522, the second avoiding section 914 faces the second accommodating section 524, and the third avoiding section 916 faces the third accommodating section 526. The width of the first avoidance section 912 is greater than or equal to the width of the first protection sheet 432, the width of the second avoidance section 914 is greater than or equal to the width of the second protection sheet 434, and the width of the third avoidance section 916 is greater than or equal to the width of the third protection sheet 436, that is, when the second insulating adhesive 91 is adhered to the second surface 54, the first protection sheet 432 can be accommodated in the first avoidance section 912, the second protection sheet 434 can be accommodated in the second avoidance section 914, and the third protection sheet 436 can be accommodated in the third avoidance section 916.
The third avoiding groove 910 may penetrate the surface of the second insulating adhesive 91 facing away from the supporting layer 50, and the third avoiding groove 910 may not penetrate the surface of the second insulating adhesive 91 facing away from the supporting layer 50. In this embodiment, the third avoiding groove 910 penetrates through the surface of the second insulating adhesive 91 facing away from the supporting layer 50.
As shown in fig. 4, the heat dissipation film 95 is disposed on the surface of the second insulating adhesive 91 facing away from the supporting layer 50, that is, the heat dissipation film 95 is attached to the surface of the second insulating adhesive 91 facing away from the supporting layer 50, and the heat dissipation film 95 is attached to the surface of the second protective film 43 facing away from the second flexible circuit board 42. The heat dissipation film 95 is used for dissipating heat of the coil assembly 30 during operation, preventing the coil assembly 30 from overheating, thereby protecting the normal operation of the coil assembly 30 and prolonging the service life thereof. The shape of the heat dissipation film 95 is consistent with the shape of the support layer 50, so that the heat dissipation film 95 can be completely attached to the second surface 54 of the support layer 50. In this embodiment, the heat dissipation film 95 is a rectangular heat dissipation plate, specifically, heat dissipation graphite is used for the heat dissipation film 95, so that the heat dissipation efficiency of the coil module 100 can be improved. In other embodiments, the heat dissipation film 95 may also employ, but is not limited to, a thermally conductive silicone sheet, thermally conductive silicone grease, or the like.
1-4 And 15-16, when the coil module 100 is assembled, the heat dissipation film 95 is attached to the second surface 54 of the supporting layer 50 through the second insulating adhesive 91, so that the third avoiding groove 910 faces the accommodating groove 520, specifically, the first avoiding section 912 faces and communicates with the first accommodating section 522, the second avoiding section 914 faces and communicates with the second accommodating section 524, the third avoiding section 916 faces and communicates with the third accommodating section 526, the coil assembly 30 and the jumper assembly 40 are mounted to the supporting layer 50 through the first insulating adhesive layer 60, the first flexible circuit board 32 is positioned on the first surface 52 through the first insulating adhesive layer 60, the first avoiding groove 62 faces and communicates with the accommodating groove 520, the isolating film 41 is accommodated in the first avoiding groove 62, the jumper assembly 40 is accommodated in the accommodating groove 520, and the second protective film 43 is accommodated in the third avoiding groove 910, so that the first flexible circuit board 32 is supported on the first surface 52, thereby ensuring the flatness of the whole coil assembly 30, improving the wireless power transmission efficiency, improving the temperature rise and improving the power transmission thickness of the coil module 100, and further reducing the user experience of the coil module 100. The second flexible circuit board 42 extends out of the outer side surface of the supporting layer 50 from one end of the coil assembly 30 such that the first contact point 445 and the second contact point 465 are exposed, the first protective film 70 covers the surface of the first flexible circuit board 32 facing away from the supporting layer 50, the cover film 80 covers the first surface 52 of the supporting layer 50 and the first flexible circuit board 32 such that the first protective film 70 is accommodated in the second avoidance groove 82, the circular cover 84 is accommodated in the avoidance hole 72 of the first protective film 70, and the first protective film 70 and the cover film 80 jointly protect the coil assembly 30 and the supporting layer 50.
In the application, the second protective film 43 is accommodated in the third avoiding groove 910, the second flexible circuit board 42 is accommodated in the accommodating groove 520, the isolating film 41 is accommodated in the first avoiding groove 62, and the first protective film 70 is accommodated in the second avoiding groove 82 of the cover film 80, so that the overall thickness of the coil module 100 is thinner.
As shown in fig. 17 and 18, the structure of the coil module in the second embodiment of the present invention is similar to that of the coil module 100 in the first embodiment, except that the structure of the first flexible circuit board 32a in the second embodiment is slightly different from that of the first flexible circuit board 32 in the first embodiment. Specifically, the first flexible circuit board 32a in the second embodiment is rectangular, the coil portion 352a is rectangular, multiple windings of spaced metal wires are formed by one metal wire around one side of the first flexible circuit board 32a from the outside to the inside, the multiple windings of metal wires form a spiral coil, each winding of metal wire is rectangular, and the multiple windings of metal wires can be wound clockwise or counter-clockwise. In this embodiment, the metal traces are clocked around.
In other embodiments, a plurality of turns of spaced metal traces are formed by one metal trace on one side of the first flexible circuit board 32a around the metal trace from the outside to the inside in a reverse clock, the plurality of turns of metal traces forming helical coils, each turn of metal trace being rectangular.
The actions and advantageous effects of the coil module in the second embodiment are the same as those of the coil module in the first embodiment, and will not be described in detail herein.
As shown in fig. 19 and 20, the coil module in the third embodiment of the present invention has a similar structure to the coil module 100 in the first embodiment, except that the metal trace of the coil part 352b in the third embodiment has a direction opposite to that of the metal trace of the coil part 352 in the first embodiment, and the coil part 352b in the third embodiment is formed by winding one metal trace on one side of the first flexible circuit board 32 from the outside to the inside to form a spiral coil, and the metal traces are wound in a reverse clock. The metal wires are mutually spaced, each circle of metal wire is round, and the metal wires are coaxial.
The actions and advantageous effects of the coil module in the third embodiment are the same as those of the coil module in the first embodiment, and will not be described in detail here.
In other embodiments, the first flexible circuit board 32 may be, but not limited to, elliptical, polygonal, etc., and the individual turns of the metal traces of the coil portion may be, but not limited to, elliptical, polygonal, etc.
As shown in fig. 21, the coil module in the fourth embodiment of the present application has a similar structure to the coil module in the first embodiment, except that the first surface 52 of the supporting layer 50 in the fourth embodiment is provided with a space slot 523, the receiving slot 520 is communicated with the space slot 523, the depth of the space slot 523 is greater than or equal to the thickness of the first insulating adhesive layer 60, and when the coil assembly 30 is mounted on the first surface 52 of the supporting layer 50, the first insulating adhesive layer 60 is received in the space slot 523, and the surface of the first flexible circuit board 32 facing the second flexible circuit board 42 is coplanar with the first surface 52, thereby further reducing the overall thickness of the coil module.
In other embodiments, the depth of the avoidance slot 523 is equal to the sum of the thickness of the first insulating adhesive layer 60 and the thickness of the first flexible circuit board 32, when the coil assembly 30 is mounted on the first surface 52 of the supporting layer 50, the first insulating adhesive layer 60 and the first flexible circuit board 32 are both accommodated in the avoidance slot 523, and the surface of the first flexible circuit board 32 facing away from the second flexible circuit board 42 is coplanar with the first surface 52, so that the overall thickness of the coil assembly can be further reduced, the wireless power transmission efficiency can be improved, the charging temperature rise can be further improved, and the user experience can be improved.
Referring to fig. 22, an embodiment of the present application further provides a wireless charging device 200, where the wireless charging device 200 includes the coil module 100, the housing 202 and the circuit board 204 in any of the above embodiments, the coil module 100 and the circuit board 204 are disposed in the housing 202, the coil module 100 is electrically connected to the circuit board 204, and the coil module 100 is used for non-contact power transmission. The housing 202 is provided with a charging platform, and the coil module 100 is close to the inner surface of the charging platform or is disposed on the charging platform. When the wireless charging device 200 charges the to-be-charged device placed on the charging platform, the coil module 100 generates a magnetic field, and the coil in the to-be-charged device and the magnetic field generate electromagnetic induction, so as to generate current, and the electromagnetic energy is converted into electric energy to charge the battery in the to-be-charged device.
Because the thickness of the coil module 100 is thinner, the overall thickness of the wireless charging device 200 can be reduced, so as to meet the requirement of the lightweight design of the wireless charging device 200.
As shown in fig. 23, another embodiment of the present application further provides an electronic device 400, where the electronic device 400 includes the coil module 100, the housing 402, the motherboard 404 and the battery 406 in any of the above embodiments, the coil module 100, the motherboard 404 and the battery 406 are all disposed in the housing 402, the coil module 100 and the battery 406 are all electrically connected to the motherboard 404, and the battery 406 is used for providing power to electronic components such as the motherboard 404. The coil module 100 is used for contactless power reception to supply power to the battery 406. When the battery 406 of the electronic device 400 needs to be charged, the electronic device 400 is placed on the charging platform of the wireless charging device, so that the coil module 100 on the electronic device 400 is opposite to the coil module 100 of the wireless charging device, and after the wireless charging device is electrified, the coil module 100 of the wireless charging device generates a changing magnetic field, and the coil module 100 on the electronic device 400 senses the magnetic field to generate current to charge the battery 406.
Optionally, the coil module 100 is disposed proximate to or on an inner surface of the housing 402.
In this embodiment, the electronic device 400 is a mobile phone, the electronic device 400 further includes a display screen 405, the battery 406 provides power to the display screen 405, and the display screen 405 is electrically connected to the motherboard. In other embodiments, the electronic device 400 may be, but is not limited to, a tablet computer, a smart watch, or an intelligent wearable device, which needs to be charged, and the coil module 100 is disposed in each type of electronic product.
The thickness of the coil module 100 in the electronic device 400 is thinner, so that the overall thickness of the electronic device 400 can be reduced, the requirement of light-weight design of the electronic device 400 is met, and the layout of other electronic elements in the electronic device 400 is facilitated.
As shown in fig. 24, when the wireless charging device 200 is used to charge the electronic device 400, the electronic device 400 is placed on the charging platform of the wireless charging device 200, the wireless charging device 200 is connected to an external power source, the coil module 100 of the wireless charging device 200 generates a magnetic field, and the coil module 100 in the electronic device 400 senses the magnetic field to generate a current to charge the battery 406 of the electronic device 400.
The foregoing is a description of embodiments of the present invention, and it should be noted that, for those skilled in the art, modifications and variations can be made without departing from the principles of the embodiments of the present invention, and such modifications and variations are also considered to be within the scope of the present invention.