JP2002003698A - Phenol resin molding material - Google Patents
Phenol resin molding materialInfo
- Publication number
- JP2002003698A JP2002003698A JP2000187092A JP2000187092A JP2002003698A JP 2002003698 A JP2002003698 A JP 2002003698A JP 2000187092 A JP2000187092 A JP 2000187092A JP 2000187092 A JP2000187092 A JP 2000187092A JP 2002003698 A JP2002003698 A JP 2002003698A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- molding material
- parts
- weight
- graphite powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012778 molding material Substances 0.000 title claims abstract description 29
- 239000005011 phenolic resin Substances 0.000 title claims abstract description 18
- 229920005989 resin Polymers 0.000 claims abstract description 53
- 239000011347 resin Substances 0.000 claims abstract description 53
- 229920003987 resole Polymers 0.000 claims abstract description 30
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229920003986 novolac Polymers 0.000 claims abstract description 19
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 14
- 229920001568 phenolic resin Polymers 0.000 claims description 14
- GXGJIOMUZAGVEH-UHFFFAOYSA-N Chamazulene Chemical group CCC1=CC=C(C)C2=CC=C(C)C2=C1 GXGJIOMUZAGVEH-UHFFFAOYSA-N 0.000 abstract description 5
- 239000000463 material Substances 0.000 abstract description 2
- 238000009413 insulation Methods 0.000 abstract 1
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 8
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 229910000019 calcium carbonate Inorganic materials 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 239000002023 wood Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 238000013329 compounding Methods 0.000 description 3
- 238000010292 electrical insulation Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 2
- 239000001993 wax Substances 0.000 description 2
- QSSXJPIWXQTSIX-UHFFFAOYSA-N 1-bromo-2-methylbenzene Chemical compound CC1=CC=CC=C1Br QSSXJPIWXQTSIX-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- CAYGQBVSOZLICD-UHFFFAOYSA-N hexabromobenzene Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1Br CAYGQBVSOZLICD-UHFFFAOYSA-N 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 125000000325 methylidene group Chemical group [H]C([H])=* 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- -1 paraffins Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、機械的特性、電気
的特性、摺動特性に優れたアンモニアフリーのフェノー
ル樹脂成形材料に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ammonia-free phenolic resin molding material having excellent mechanical, electrical and sliding properties.
【０００２】[0002]
【従来の技術】従来から、四フッ化エチレン樹脂や鱗片
状黒鉛粉末といった摺動特性に優れる物質を配合したフ
ェノール樹脂成形材料を成形して得られる成形部品は、
摺動性に優れ、機構部品として使用されてきた。そし
て、使用される部品の強度の向上志向から、より一層の
高強度化の要求が高まり、さらに電気絶縁性も低下しな
い成形材料が望まれてきた。2. Description of the Related Art Conventionally, molded parts obtained by molding a phenol resin molding material containing a substance having excellent sliding properties, such as tetrafluoroethylene resin and flaky graphite powder, are:
It has excellent slidability and has been used as a mechanical component. Further, from the desire to improve the strength of the components used, there is a growing demand for higher strength, and a molding material that does not reduce the electrical insulation has been desired.
【０００３】ところで、高強度のためにガラス繊維を高
充填したフェノール樹脂成形材料は、上市されてはいる
が、摺動特性に問題がある。すなわち、ガラス繊維を高
充填することで、機械的強度は向上するものの、摺動特
性が低下するため、機械的強度と摺動特性を両立させる
ことは大変困難であった。また、四フッ化エチレン樹脂
や鱗片状黒鉛粉末を配合したフェノール樹脂成形材料
は、摺動特性は向上するものの、機械的強度の低下が著
しく、特に鱗片状黒鉛粉末を配合したものについては電
気絶縁性も低下するため、前述の要求に応えるのは難し
い現状であった。[0003] By the way, phenolic resin molding materials filled with glass fibers for high strength have been put on the market, but have problems in sliding characteristics. That is, although the mechanical strength is improved by highly filling the glass fiber, the sliding characteristics are reduced, and it is very difficult to achieve both the mechanical strength and the sliding characteristics. In addition, the phenolic resin molding material blended with tetrafluoroethylene resin or flaky graphite powder has improved sliding properties, but the mechanical strength is significantly reduced. Therefore, it has been difficult to meet the above-mentioned demands because of the deterioration of the properties.
【０００４】[0004]
【発明が解決しようとする課題】本発明は、上記の事情
に鑑みてなされたもので、高い機械的強度を保持し、電
気絶縁性も良好であって、かつ摺動特性に優れたアンモ
ニアフリーのフェノール樹脂成形材料を提供しようとす
るものである。DISCLOSURE OF THE INVENTION The present invention has been made in view of the above circumstances, and is an ammonia-free material having high mechanical strength, good electrical insulation, and excellent sliding characteristics. To provide a phenolic resin molding material.
【０００５】[0005]
【課題を解決するための手段】本発明者らは、上記の課
題を達成しようと鋭意研究を重ねた結果、特定のレゾー
ル樹脂、特定のノボラック樹脂、それに土状黒鉛粉末を
特定量配合することによって、機械的強度、電気絶縁性
および摺動特性に優れた成形材料が得られることを見い
だし、本発明を完成したものである。Means for Solving the Problems The inventors of the present invention have conducted intensive studies to achieve the above-mentioned object, and as a result, a specific amount of a specific resol resin, a specific novolak resin, and a specific amount of earth graphite powder have been added. As a result, the present inventors have found that a molding material having excellent mechanical strength, electrical insulation properties and sliding properties can be obtained, thereby completing the present invention.
【０００６】即ち、本発明は、（Ａ）レゾール樹脂、
（Ｂ）ノボラック樹脂および（Ｃ）土状黒鉛粉末を必須
成分とし、全体の成形材料に対して上記（Ａ）レゾール
樹脂を３０〜５０重量部、（Ｂ）ノボラック樹脂を５〜
１５重量部、（Ｃ）土状黒鉛粉末を０．１〜４０重量部
の割合で含有することを特徴とするフェノール樹脂成形
材料であり、そのフェノール樹脂成形材料における
（Ａ）レゾール樹脂が、メチレン結合型レゾール樹脂及
び／又はジメチレンエーテル結合型レゾール樹脂であ
り、（Ｂ）ノボラック樹脂の数平均分子量が、１０００
〜１５００であるものである。That is, the present invention provides (A) a resole resin,
(B) Novolak resin and (C) earth graphite powder as essential components, 30 to 50 parts by weight of (A) resol resin and (B) 5 to 5 parts by weight of the entire molding material.
A phenolic resin molding material characterized by containing 15 parts by weight and (C) 0.1 to 40 parts by weight of earth graphite powder, wherein (A) the resole resin in the phenolic resin molding material comprises methylene (B) a novolak resin having a number average molecular weight of 1,000.
１1500.
【０００７】以下、本発明を詳細に説明する。Hereinafter, the present invention will be described in detail.
【０００８】本発明に用いる（Ａ）レゾール樹脂として
は、フェノール、アルキル基置換フェノールなどのレゾ
ール樹脂であって、例えばショウノールＢＲＭ−４７
０、ＢＲＰ４０６（昭和高分子社製、商品名）等が挙げ
られ、メチレン結合型レゾール樹脂でもジメチレンエー
テル結合型レゾール樹脂でもよく、それぞれ単独又は併
用してもよいが、ジメチレンエーテル結合型レゾール樹
脂をレゾール樹脂中３０重量％以上使用するのが好まし
い。このレゾール樹脂の配合割合は、全体の成形材料に
対して３０〜５０重量部含有するように配合する。The resole resin (A) used in the present invention is a resole resin such as phenol or an alkyl-substituted phenol, such as Shaunol BRM-47.
0, BRP406 (manufactured by Showa Polymer Co., Ltd., trade name), etc., and may be a methylene-bonded resole resin or a dimethylene ether-bonded resole resin, and may be used alone or in combination. Preferably, the resin is used in an amount of 30% by weight or more in the resol resin. The compounding ratio of this resol resin is such that it is contained in an amount of 30 to 50 parts by weight based on the whole molding material.
【０００９】本発明に用いる（Ｂ）ノボラック樹脂とし
ては、フェノール、アルキル基置換フェノールなどのノ
ボラック樹脂であって、機械的強度の向上に効果のある
数平均分子量１０００〜１５００のものであれば好まし
く使用でき、特に１２００〜１４００のものが好まし
い。（Ａ）レゾール樹脂と（Ｂ）ノボラック樹脂の併用
率は、７０：３０〜９５：５であれば使用可能であり、
特に７５：２５〜９０：１０の範囲が好ましい。レゾー
ル樹脂の比率を高くすると、強度が低下し、ノボラック
樹脂の比率を高くすると硬化特性が悪くなる。従って上
記範囲が好ましい。このノボラック樹脂の配合割合は、
全体の成形材料に対して５〜１５重量部配合する。The novolak resin (B) used in the present invention is preferably a novolak resin such as phenol or an alkyl group-substituted phenol having a number average molecular weight of 1,000 to 1500, which is effective in improving mechanical strength. They can be used, and those having a molecular weight of 1200 to 1400 are particularly preferable. The combined ratio of (A) the resole resin and (B) the novolak resin can be used as long as it is 70:30 to 95: 5.
Particularly, the range of 75:25 to 90:10 is preferable. When the ratio of the resol resin is increased, the strength is reduced, and when the ratio of the novolak resin is increased, the curing properties are deteriorated. Therefore, the above range is preferable. The compounding ratio of this novolak resin is
It is blended in an amount of 5 to 15 parts by weight based on the whole molding material.
【００１０】本発明に用いる（Ｃ）土状黒鉛粉末として
は、平均粒径が１〜１０μｍで、最大粒径が５０μｍ以
下であることが望ましい。より好ましくは、平均粒径１
〜４μｍ、最大粒径が３０μｍ以下である。土状黒鉛粉
末の固定炭素量は、８０〜９５％であることが望まし
く、より好ましくは８５〜９０％である。The (C) earth graphite powder used in the present invention preferably has an average particle size of 1 to 10 μm and a maximum particle size of 50 μm or less. More preferably, the average particle size is 1
４4 μm, and the maximum particle size is 30 μm or less. The fixed carbon content of the earth graphite powder is preferably 80 to 95%, more preferably 85 to 90%.
【００１１】土状黒鉛粉末の配合割合は、全体の成形材
料に対して、０．１〜４０重量％含有させることが必要
であり、より好ましくは、１０〜３０重量％の範囲内で
ある。その配合量が、０．１重量％未満では、摺動特性
が低下し好ましくない。また、４０重量％を超えると、
摺動特性は向上するものの、機械的強度に劣り好ましく
ない。The mixing ratio of the ground graphite powder must be 0.1 to 40% by weight, more preferably 10 to 30% by weight, based on the whole molding material. If the compounding amount is less than 0.1% by weight, the sliding characteristics deteriorate, which is not preferable. If it exceeds 40% by weight,
Although the sliding characteristics are improved, the mechanical strength is inferior and is not preferred.
【００１２】本発明のフェノール樹脂成形材料は、前述
した（Ａ）レゾール樹脂、（Ｂ）ノボラック樹脂および
（Ｃ）土状黒鉛粉末を含有するが、本発明の目的に反し
ない範囲において、また必要に応じて、例えば、木粉、
パルプ、合繊等の有機質充填材、炭酸カルシウム、クレ
ー、タルク等の無機質充填剤、天然ワックス類、合成ワ
ックス類、直鎖脂肪酸の金属塩、酸アミド、エステル
類、パラフィン類等の離型剤、塩化パラフィン、ブロム
トルエン、ヘキサブロムベンゼン、三酸化アンチモン等
の難燃剤、種々の硬化促進剤等を適宜添加配合すること
ができる。The phenolic resin molding material of the present invention contains the above-mentioned (A) resole resin, (B) novolak resin and (C) earth graphite powder. Depending on, for example, wood flour,
Organic fillers such as pulp and synthetic fiber, inorganic fillers such as calcium carbonate, clay and talc, release agents such as natural waxes, synthetic waxes, metal salts of linear fatty acids, acid amides, esters, paraffins, Flame retardants such as paraffin chloride, bromotoluene, hexabromobenzene, antimony trioxide and the like, various curing accelerators and the like can be appropriately added and blended.
【００１３】本発明のフェノール樹脂成形材料は、通
常、次のようにして製造される。前述した（Ａ）レゾー
ル樹脂、（Ｂ）ノボラック樹脂、（Ｃ）土状黒鉛粉末、
その他添加剤を加えて混合し、均一に分散させた後、混
練機で加熱混練し、次いで冷却固化させて適当な大きさ
に粉砕し成形材料とする。The phenolic resin molding material of the present invention is usually produced as follows. (A) a resole resin, (B) a novolak resin, (C) a ground graphite powder,
After adding and mixing other additives and dispersing them uniformly, the mixture is heated and kneaded by a kneader, then solidified by cooling and pulverized to an appropriate size to obtain a molding material.
【００１４】[0014]
【作用】本発明のアンモニアフリーのフェノール樹脂成
形材料は、レゾール樹脂に高分子量のノボラック樹脂を
併用することによって、土状黒鉛粉末で摺動性を向上さ
せているにもかかわらず、機械的強度に優れたものとす
ることができた。また、土状黒鉛粉末を用いることで、
所望の電気特性を維持することができた。The ammonia-free phenolic resin molding material of the present invention has a high mechanical strength in spite of the fact that the slidability is improved by using a ground graphite powder by using a high molecular weight novolak resin in combination with a resole resin. Was excellent. Also, by using earthy graphite powder,
Desired electrical characteristics could be maintained.
【００１５】[0015]
【発明の実施の形態】次に本発明を実施例によって具体
的に説明するが、本発明は、下記実施例に限定されるも
のではない。以下、「部」とは、特に説明のないかぎ
り、「重量部」を意味する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described specifically by way of examples, but the present invention is not limited to the following examples. Hereinafter, “parts” means “parts by weight” unless otherwise specified.
【００１６】実施例１ ジメチレンエーテル結合型レゾール樹脂のショウノール
ＢＲＭ−４７０（昭和高分子社製、商品名）１５部、メ
チレン結合型レゾール樹脂２５部、数平均分子量１３０
０のノボラック樹脂１０部、土状黒鉛粉末２０部、木粉
１８部、炭酸カルシウム５部、その他添加剤７部を常温
で混合し、さらに熱ロールで混練して冷却した後、粉砕
してフェノール樹脂成形材料を製造した。Example 1 15 parts of dimethylene ether-bonded resole resin, Shaunol BRM-470 (trade name, manufactured by Showa Polymer Co., Ltd.), 25 parts of methylene-bonded resole resin, number average molecular weight 130
Novolak resin 10 parts, earth graphite powder 20 parts, wood powder 18 parts, calcium carbonate 5 parts, and other additives 7 parts were mixed at room temperature, further kneaded and cooled with a hot roll, and then pulverized to obtain phenol. A resin molding material was manufactured.
【００１７】比較例１ ジメチレンエーテル結合型レゾール樹脂のショウノール
ＢＲＭ−４７０（昭和高分子社製、商品名）１５部、メ
チレン結合型レゾール樹脂２５部、数平均分子量７００
のノボラック樹脂１０部、土状黒鉛粉末２０部、木粉１
８部、炭酸カルシウム５部、その他添加剤７部を常温で
混合し、さらに熱ロールで混練して冷却した後、粉砕し
てフェノール樹脂成形材料を製造した。Comparative Example 1 Shownol BRM-470, a dimethylene ether-bonded resol resin (trade name, manufactured by Showa Polymer Co., Ltd.), 15 parts, methylene-bonded resole resin, 25 parts, number average molecular weight 700
Novolak resin 10 parts, earth graphite powder 20 parts, wood powder 1
8 parts, 5 parts of calcium carbonate and 7 parts of other additives were mixed at room temperature, kneaded with a hot roll, cooled, and then pulverized to produce a phenolic resin molding material.
【００１８】比較例２ ジメチレンエーテル結合型レゾール樹脂のショウノール
ＢＲＭ−４７０（昭和高分子社製、商品名）１５部、メ
チレン結合型レゾール樹脂２５部、数平均分子量１３０
０のノボラック樹脂１０部、鱗片状黒鉛粉末２０部、木
粉１８部、炭酸カルシウム５部、その他添加剤７部を常
温で混合し、さらに熱ロールで混練して冷却した後、粉
砕してフェノール樹脂成形材料を製造した。Comparative Example 2 15 parts of dimethylene ether-bonded resole resin, Shaunol BRM-470 (trade name, manufactured by Showa Polymer Co., Ltd.), 25 parts of methylene-bonded resole resin, number average molecular weight 130
Novolak resin 10 parts, flaky graphite powder 20 parts, wood powder 18 parts, calcium carbonate 5 parts, and other additives 7 parts were mixed at room temperature, further kneaded and cooled with a hot roll, and then pulverized to obtain phenol. A resin molding material was manufactured.
【００１９】実施例および比較例１〜２で製造したフェ
ノール樹脂成形材料を用いて射出成形で１７０℃に加熱
した金型中で成形硬化させて成形部品とした。得られた
成形部品について、機械的特性、電気的特性、摩擦係数
を試験した。その結果を表１に示したが、本発明は、諸
特性に優れ、かつバランスのとれた特性を示し、本発明
の効果を確認することができた。The phenolic resin molding materials produced in Examples and Comparative Examples 1 and 2 were molded and cured in a mold heated to 170 ° C. by injection molding to obtain molded parts. The obtained molded parts were tested for mechanical properties, electrical properties, and coefficient of friction. The results are shown in Table 1. As shown in the table, the present invention was excellent in various characteristics and exhibited well-balanced characteristics, thereby confirming the effects of the present invention.
【００２０】[0020]
【表１】 [Table 1]
【００２１】[0021]
【発明の効果】以上の説明および表１から明らかなよう
に、本発明のアンモニアフリーのフェノール樹脂成形材
料は、高い機械的強度、電気的特性を保持しながら摺動
性に優れたものである。As is clear from the above description and Table 1, the ammonia-free phenolic resin molding material of the present invention has excellent slidability while maintaining high mechanical strength and electrical properties. .
Claims (2)
樹脂および（Ｃ）土状黒鉛粉末を必須成分とし、全体の
成形材料に対して上記（Ａ）レゾール樹脂を３０〜５０
重量部、（Ｂ）ノボラック樹脂を５〜１５重量部、
（Ｃ）土状黒鉛粉末を０．１〜４０重量部の割合で含有
することを特徴とするフェノール樹脂成形材料。1. An essential component comprising (A) a resole resin, (B) a novolak resin and (C) a ground graphite powder, and (A) the resole resin in an amount of 30 to 50 with respect to the whole molding material.
Parts by weight, (B) 5 to 15 parts by weight of novolak resin,
(C) A phenolic resin molding material characterized by containing earth graphite powder in a ratio of 0.1 to 40 parts by weight.
レゾール樹脂及び／又はジメチレンエーテル結合型レゾ
ール樹脂であり、（Ｂ）ノボラック樹脂の数平均分子量
が、１０００〜１５００である請求項１記載のフェノー
ル樹脂成形材料。2. The resin according to claim 1, wherein (A) the resole resin is a methylene bond type resole resin and / or a dimethylene ether bond type resole resin, and (B) the novolak resin has a number average molecular weight of 1,000 to 1500. Phenolic resin molding material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000187092A JP2002003698A (en) | 2000-06-22 | 2000-06-22 | Phenol resin molding material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000187092A JP2002003698A (en) | 2000-06-22 | 2000-06-22 | Phenol resin molding material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002003698A true JP2002003698A (en) | 2002-01-09 |
Family
ID=18687134
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000187092A Pending JP2002003698A (en) | 2000-06-22 | 2000-06-22 | Phenol resin molding material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002003698A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007138040A (en) * | 2005-11-18 | 2007-06-07 | Asahi Organic Chem Ind Co Ltd | Phenol resin molding material for sliding member and resin-made sliding component using the same |
| US20140073732A1 (en) * | 2011-09-06 | 2014-03-13 | Sumitomo Bakelite Co., Ltd. | Phenolic resin molding compound |
| JP2018080267A (en) * | 2016-11-16 | 2018-05-24 | 旭有機材株式会社 | Molding material for slide member, slide member and method for manufacturing the same |
-
2000
- 2000-06-22 JP JP2000187092A patent/JP2002003698A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007138040A (en) * | 2005-11-18 | 2007-06-07 | Asahi Organic Chem Ind Co Ltd | Phenol resin molding material for sliding member and resin-made sliding component using the same |
| US20140073732A1 (en) * | 2011-09-06 | 2014-03-13 | Sumitomo Bakelite Co., Ltd. | Phenolic resin molding compound |
| US9228084B2 (en) * | 2011-09-06 | 2016-01-05 | Sumitomo Bakelite Co., Ltd. | Phenolic resin molding compound |
| JP2018080267A (en) * | 2016-11-16 | 2018-05-24 | 旭有機材株式会社 | Molding material for slide member, slide member and method for manufacturing the same |
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