GB8918192D0 - Semiconductor devices - Google Patents

Semiconductor devices

Info

Publication number: GB8918192D0
Authority: GB; United Kingdom
Prior art keywords: semiconductor devices; semiconductor; devices
Prior art date: 1988-08-10
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

GB898918192A

Other versions

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Marconi Electronic Devices Ltd

Original Assignee

Marconi Electronic Devices Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1988-08-10

Filing date

1989-08-09

Publication date

1989-09-20

1989-08-09 Application filed by Marconi Electronic Devices Ltd filed Critical Marconi Electronic Devices Ltd

1989-09-20 Publication of GB8918192D0 publication Critical patent/GB8918192D0/en

1990-02-14 Publication of GB2221792A publication Critical patent/GB2221792A/en

1992-02-12 Application granted granted Critical

1992-02-12 Publication of GB2221792B publication Critical patent/GB2221792B/en

2009-08-09 Anticipated expiration legal-status Critical

Status Expired - Fee Related legal-status Critical Current

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3731—Ceramic materials or glass
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01042—Molybdenum [Mo]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]

Landscapes

Engineering & Computer Science (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Chemical & Material Sciences (AREA)
Physics & Mathematics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Materials Engineering (AREA)
Ceramic Engineering (AREA)
Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

GB8918192A 1988-08-10 1989-08-09 Electrical connections for semiconductor devices Expired - Fee Related GB2221792B (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
GB888818957A GB8818957D0 (en)	1988-08-10	1988-08-10	Semiconductor devices

Publications (3)

Publication Number	Publication Date
GB8918192D0 true GB8918192D0 (en)	1989-09-20
GB2221792A GB2221792A (en)	1990-02-14
GB2221792B GB2221792B (en)	1992-02-12

Family

ID=10641884

Family Applications (2)

Application Number	Title	Priority Date	Filing Date
GB888818957A Pending GB8818957D0 (en)	1988-08-10	1988-08-10	Semiconductor devices
GB8918192A Expired - Fee Related GB2221792B (en)	1988-08-10	1989-08-09	Electrical connections for semiconductor devices

Family Applications Before (1)

Application Number	Title	Priority Date	Filing Date
GB888818957A Pending GB8818957D0 (en)	1988-08-10	1988-08-10	Semiconductor devices

Country Status (2)

Country	Link
DE (1)	DE3926238C2 (en)
GB (2)	GB8818957D0 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5049981A (en) *	1990-10-19	1991-09-17	At&T Bell Laboratories	Heat sink for electronic circitry
GB9425725D0 (en) *	1994-12-20	1995-02-22	Brierley Garstang Ltd B	Pre-cast concrete box culvert

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE1153461B (en) *	1960-06-23	1963-08-29	Siemens Ag	Semiconductor device
GB1004020A (en) *	1964-04-24	1965-09-08	Standard Telephones Cables Ltd	Improvements in or relating to the mounting of electrical components
WO1983000949A1 (en) *	1981-09-01	1983-03-17	Motorola Inc	Improved glass bonding means and method
JPS60100439A (en) *	1983-11-05	1985-06-04	Mitsubishi Electric Corp	Resin sealed type semiconductor device

1988
- 1988-08-10 GB GB888818957A patent/GB8818957D0/en active Pending
1989
- 1989-08-09 DE DE19893926238 patent/DE3926238C2/en not_active Expired - Fee Related
- 1989-08-09 GB GB8918192A patent/GB2221792B/en not_active Expired - Fee Related

Also Published As

Publication number	Publication date
DE3926238A1 (en)	1990-02-15
GB2221792B (en)	1992-02-12
DE3926238C2 (en)	1998-12-24
GB2221792A (en)	1990-02-14
GB8818957D0 (en)	1988-09-14

Publication	Publication Date	Title
IL86162A0 (en)	1988-11-15	Customizable semiconductor devices
GB8713440D0 (en)	1987-07-15	Semiconductor device
GB8609337D0 (en)	1986-05-21	Semiconductor devices
GB2213988B (en)	1992-02-05	Semiconductor device
GB8803924D0 (en)	1988-03-23	Semiconductor devices
EP0279605A3 (en)	1989-06-07	Semiconductor device
GB8713386D0 (en)	1987-07-15	Semiconductor device
GB2209870B (en)	1992-02-05	Semiconductor devices
GB8612010D0 (en)	1986-06-25	Semiconductor devices
GB2188479B (en)	1990-05-23	Semiconductor devices
GB8713388D0 (en)	1987-07-15	Semiconductor device
GB8713382D0 (en)	1987-07-15	Semiconductor device
GB2215125B (en)	1991-04-24	Semiconductor device
GB8819949D0 (en)	1988-09-21	Semiconductor devices
EP0334759A3 (en)	1990-01-24	Semiconductor device
GB8918867D0 (en)	1989-09-27	Semiconductor element
EP0346120A3 (en)	1990-07-18	Semiconductor device
KR910009358B1 (en)	1991-11-12	Semiconductor devices
GB8719817D0 (en)	1987-09-30	Semiconductor devices
EP0305121A3 (en)	1990-03-28	Semiconductor device
GB8717734D0 (en)	1987-09-03	Semiconductor device
KR930001219B1 (en)	1993-02-22	Semiconductor device
GB8712971D0 (en)	1987-07-08	Semiconductor device
GB8829161D0 (en)	1989-01-25	Semiconductor device manufacture
GB8811583D0 (en)	1988-06-22	Semiconductor devices

Legal Events

Date	Code	Title	Description
1992-10-14	732	Registration of transactions, instruments or events in the register (sect. 32/1977)
1999-12-08	732E	Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
2001-09-05	732E	Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
2006-04-26	PCNP	Patent ceased through non-payment of renewal fee	Effective date: 20050809