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GB0019073D0 - Microconnector - Google Patents

Microconnector

Info

Publication number
GB0019073D0
GB0019073D0 GBGB0019073.6A GB0019073A GB0019073D0 GB 0019073 D0 GB0019073 D0 GB 0019073D0 GB 0019073 A GB0019073 A GB 0019073A GB 0019073 D0 GB0019073 D0 GB 0019073D0
Authority
GB
United Kingdom
Prior art keywords
microconnector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB0019073.6A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MOORE DAVID F
Syms Richard R A
Original Assignee
MOORE DAVID F
Syms Richard R A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MOORE DAVID F, Syms Richard R A filed Critical MOORE DAVID F
Priority to GBGB0019073.6A priority Critical patent/GB0019073D0/en
Publication of GB0019073D0 publication Critical patent/GB0019073D0/en
Priority to AU2001264134A priority patent/AU2001264134A1/en
Priority to PCT/GB2001/002653 priority patent/WO2002013253A1/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01061—Promethium [Pm]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
GBGB0019073.6A 2000-08-03 2000-08-03 Microconnector Ceased GB0019073D0 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
GBGB0019073.6A GB0019073D0 (en) 2000-08-03 2000-08-03 Microconnector
AU2001264134A AU2001264134A1 (en) 2000-08-03 2001-06-14 Microconnectors and method for their production
PCT/GB2001/002653 WO2002013253A1 (en) 2000-08-03 2001-06-14 Microconnectors and method for their production

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB0019073.6A GB0019073D0 (en) 2000-08-03 2000-08-03 Microconnector

Publications (1)

Publication Number Publication Date
GB0019073D0 true GB0019073D0 (en) 2000-09-27

Family

ID=9896916

Family Applications (1)

Application Number Title Priority Date Filing Date
GBGB0019073.6A Ceased GB0019073D0 (en) 2000-08-03 2000-08-03 Microconnector

Country Status (3)

Country Link
AU (1) AU2001264134A1 (en)
GB (1) GB0019073D0 (en)
WO (1) WO2002013253A1 (en)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7056131B1 (en) 2003-04-11 2006-06-06 Neoconix, Inc. Contact grid array system
US7113408B2 (en) 2003-06-11 2006-09-26 Neoconix, Inc. Contact grid array formed on a printed circuit board
US7244125B2 (en) 2003-12-08 2007-07-17 Neoconix, Inc. Connector for making electrical contact at semiconductor scales
US7628617B2 (en) 2003-06-11 2009-12-08 Neoconix, Inc. Structure and process for a contact grid array formed in a circuitized substrate
US7114961B2 (en) 2003-04-11 2006-10-03 Neoconix, Inc. Electrical connector on a flexible carrier
US6916181B2 (en) 2003-06-11 2005-07-12 Neoconix, Inc. Remountable connector for land grid array packages
US8584353B2 (en) 2003-04-11 2013-11-19 Neoconix, Inc. Method for fabricating a contact grid array
US20070020960A1 (en) 2003-04-11 2007-01-25 Williams John D Contact grid array system
US6869290B2 (en) 2003-06-11 2005-03-22 Neoconix, Inc. Circuitized connector for land grid array
US7070419B2 (en) 2003-06-11 2006-07-04 Neoconix Inc. Land grid array connector including heterogeneous contact elements
US7025601B2 (en) 2004-03-19 2006-04-11 Neoconix, Inc. Interposer and method for making same
US7090503B2 (en) 2004-03-19 2006-08-15 Neoconix, Inc. Interposer with compliant pins
US7383632B2 (en) 2004-03-19 2008-06-10 Neoconix, Inc. Method for fabricating a connector
US7347698B2 (en) 2004-03-19 2008-03-25 Neoconix, Inc. Deep drawn electrical contacts and method for making
US7354276B2 (en) 2004-07-20 2008-04-08 Neoconix, Inc. Interposer with compliant pins
FR2893448A1 (en) * 2005-11-15 2007-05-18 St Microelectronics Sa SEMICONDUCTOR DEVICE WITH MULTIPLE CHIPS OF ASSEMBLED INTEGRATED CIRCUITS AND METHOD OF ASSEMBLING AND ELECTRICALLY CONNECTING INTEGRATED CIRCUIT CHIPS
US7357644B2 (en) 2005-12-12 2008-04-15 Neoconix, Inc. Connector having staggered contact architecture for enhanced working range
EP2244291A1 (en) 2009-04-20 2010-10-27 Nxp B.V. Multilevel interconnection system
US8641428B2 (en) 2011-12-02 2014-02-04 Neoconix, Inc. Electrical connector and method of making it
US9680273B2 (en) 2013-03-15 2017-06-13 Neoconix, Inc Electrical connector with electrical contacts protected by a layer of compressible material and method of making it

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59230741A (en) * 1983-06-15 1984-12-25 株式会社日立製作所 shape memory composite material
US5802699A (en) * 1994-06-07 1998-09-08 Tessera, Inc. Methods of assembling microelectronic assembly with socket for engaging bump leads
US5903059A (en) * 1995-11-21 1999-05-11 International Business Machines Corporation Microconnectors

Also Published As

Publication number Publication date
AU2001264134A1 (en) 2002-02-18
WO2002013253A1 (en) 2002-02-14

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)