AU2001264134A1 - Microconnectors and method for their production - Google Patents
Microconnectors and method for their productionInfo
- Publication number
- AU2001264134A1 AU2001264134A1 AU2001264134A AU6413401A AU2001264134A1 AU 2001264134 A1 AU2001264134 A1 AU 2001264134A1 AU 2001264134 A AU2001264134 A AU 2001264134A AU 6413401 A AU6413401 A AU 6413401A AU 2001264134 A1 AU2001264134 A1 AU 2001264134A1
- Authority
- AU
- Australia
- Prior art keywords
- microconnectors
- production
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01061—Promethium [Pm]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB0019073 | 2000-08-03 | ||
| GBGB0019073.6A GB0019073D0 (en) | 2000-08-03 | 2000-08-03 | Microconnector |
| PCT/GB2001/002653 WO2002013253A1 (en) | 2000-08-03 | 2001-06-14 | Microconnectors and method for their production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2001264134A1 true AU2001264134A1 (en) | 2002-02-18 |
Family
ID=9896916
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2001264134A Abandoned AU2001264134A1 (en) | 2000-08-03 | 2001-06-14 | Microconnectors and method for their production |
Country Status (3)
| Country | Link |
|---|---|
| AU (1) | AU2001264134A1 (en) |
| GB (1) | GB0019073D0 (en) |
| WO (1) | WO2002013253A1 (en) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6916181B2 (en) | 2003-06-11 | 2005-07-12 | Neoconix, Inc. | Remountable connector for land grid array packages |
| US7113408B2 (en) | 2003-06-11 | 2006-09-26 | Neoconix, Inc. | Contact grid array formed on a printed circuit board |
| US20070020960A1 (en) | 2003-04-11 | 2007-01-25 | Williams John D | Contact grid array system |
| US7244125B2 (en) | 2003-12-08 | 2007-07-17 | Neoconix, Inc. | Connector for making electrical contact at semiconductor scales |
| US7056131B1 (en) | 2003-04-11 | 2006-06-06 | Neoconix, Inc. | Contact grid array system |
| US8584353B2 (en) | 2003-04-11 | 2013-11-19 | Neoconix, Inc. | Method for fabricating a contact grid array |
| US7114961B2 (en) | 2003-04-11 | 2006-10-03 | Neoconix, Inc. | Electrical connector on a flexible carrier |
| US7628617B2 (en) | 2003-06-11 | 2009-12-08 | Neoconix, Inc. | Structure and process for a contact grid array formed in a circuitized substrate |
| US7070419B2 (en) | 2003-06-11 | 2006-07-04 | Neoconix Inc. | Land grid array connector including heterogeneous contact elements |
| US6869290B2 (en) | 2003-06-11 | 2005-03-22 | Neoconix, Inc. | Circuitized connector for land grid array |
| TWI309094B (en) | 2004-03-19 | 2009-04-21 | Neoconix Inc | Electrical connector in a flexible host and method for fabricating the same |
| US7090503B2 (en) | 2004-03-19 | 2006-08-15 | Neoconix, Inc. | Interposer with compliant pins |
| US7025601B2 (en) | 2004-03-19 | 2006-04-11 | Neoconix, Inc. | Interposer and method for making same |
| US7347698B2 (en) | 2004-03-19 | 2008-03-25 | Neoconix, Inc. | Deep drawn electrical contacts and method for making |
| US7354276B2 (en) | 2004-07-20 | 2008-04-08 | Neoconix, Inc. | Interposer with compliant pins |
| FR2893448A1 (en) * | 2005-11-15 | 2007-05-18 | St Microelectronics Sa | SEMICONDUCTOR DEVICE WITH MULTIPLE CHIPS OF ASSEMBLED INTEGRATED CIRCUITS AND METHOD OF ASSEMBLING AND ELECTRICALLY CONNECTING INTEGRATED CIRCUIT CHIPS |
| US7357644B2 (en) | 2005-12-12 | 2008-04-15 | Neoconix, Inc. | Connector having staggered contact architecture for enhanced working range |
| EP2244291A1 (en) | 2009-04-20 | 2010-10-27 | Nxp B.V. | Multilevel interconnection system |
| US8641428B2 (en) | 2011-12-02 | 2014-02-04 | Neoconix, Inc. | Electrical connector and method of making it |
| US9680273B2 (en) | 2013-03-15 | 2017-06-13 | Neoconix, Inc | Electrical connector with electrical contacts protected by a layer of compressible material and method of making it |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59230741A (en) * | 1983-06-15 | 1984-12-25 | 株式会社日立製作所 | shape memory composite material |
| US5802699A (en) * | 1994-06-07 | 1998-09-08 | Tessera, Inc. | Methods of assembling microelectronic assembly with socket for engaging bump leads |
| US5903059A (en) * | 1995-11-21 | 1999-05-11 | International Business Machines Corporation | Microconnectors |
-
2000
- 2000-08-03 GB GBGB0019073.6A patent/GB0019073D0/en not_active Ceased
-
2001
- 2001-06-14 WO PCT/GB2001/002653 patent/WO2002013253A1/en not_active Ceased
- 2001-06-14 AU AU2001264134A patent/AU2001264134A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| GB0019073D0 (en) | 2000-09-27 |
| WO2002013253A1 (en) | 2002-02-14 |
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