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FR3034579B3 - Boitier pour diode laser. - Google Patents

Boitier pour diode laser.

Info

Publication number
FR3034579B3
FR3034579B3 FR1651202A FR1651202A FR3034579B3 FR 3034579 B3 FR3034579 B3 FR 3034579B3 FR 1651202 A FR1651202 A FR 1651202A FR 1651202 A FR1651202 A FR 1651202A FR 3034579 B3 FR3034579 B3 FR 3034579B3
Authority
FR
France
Prior art keywords
case
laser diode
diode
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1651202A
Other languages
English (en)
Other versions
FR3034579A3 (fr
Inventor
Hsun-Fu Lee
Hou-Chieh Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of FR3034579A3 publication Critical patent/FR3034579A3/fr
Application granted granted Critical
Publication of FR3034579B3 publication Critical patent/FR3034579B3/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02355—Fixing laser chips on mounts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02355—Fixing laser chips on mounts
    • H01S5/0237—Fixing laser chips on mounts by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02476—Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/068—Stabilisation of laser output parameters
    • H01S5/06825—Protecting the laser, e.g. during switch-on/off, detection of malfunctioning or degradation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H01S5/02212—Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
FR1651202A 2015-03-31 2016-02-15 Boitier pour diode laser. Active FR3034579B3 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW104204856U TWM517941U (zh) 2015-03-31 2015-03-31 用於雷射二極體之封裝結構

Publications (2)

Publication Number Publication Date
FR3034579A3 FR3034579A3 (fr) 2016-10-07
FR3034579B3 true FR3034579B3 (fr) 2017-04-28

Family

ID=55346336

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1651202A Active FR3034579B3 (fr) 2015-03-31 2016-02-15 Boitier pour diode laser.

Country Status (8)

Country Link
US (1) US9496679B2 (fr)
JP (1) JP3202736U (fr)
DE (1) DE202016100298U1 (fr)
FR (1) FR3034579B3 (fr)
GB (1) GB2537006B (fr)
MY (1) MY176818A (fr)
PH (1) PH22016000060U3 (fr)
TW (1) TWM517941U (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI580139B (zh) * 2015-03-31 2017-04-21 Hou Chieh Lee 用於雷射二極體之封裝結構
JP6304282B2 (ja) 2016-02-16 2018-04-04 日亜化学工業株式会社 半導体レーザ装置
US10578274B2 (en) 2016-06-10 2020-03-03 General Electric Company Lens array assembly and method for making the same
CN111352192B (zh) * 2018-12-20 2021-08-10 青岛海信宽带多媒体技术有限公司 一种光模块
WO2022259903A1 (fr) * 2021-06-09 2022-12-15 ローム株式会社 Dispositif électroluminescent à semi-conducteur
CN113671780A (zh) * 2021-08-31 2021-11-19 青岛海信激光显示股份有限公司 发光单元、光源系统和激光投影设备
TWI896308B (zh) * 2024-08-23 2025-09-01 承奕科技股份有限公司 具有高效散熱器的固態雷射及該高效散熱器

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004179273A (ja) * 2002-11-26 2004-06-24 Nec Corp 半導体レーザチップ部品及びこれを用いた半導体レーザモジュール
TWI300559B (en) * 2004-06-29 2008-09-01 Tdk Corp Heat-conducting member, laser diode attachment auxiliary member, optical head using the same, and optical recording/reproducing apparatus using the same
TWM441261U (en) * 2012-05-18 2012-11-11 Truelight Corp Laser diode array die structure and has the laser diode array die structure of package device
DE102012213193B4 (de) * 2012-07-26 2023-09-14 Coretronic Corporation Anordnung von optischen halbleiterelementen
TWI536512B (zh) * 2012-12-26 2016-06-01 鴻海精密工業股份有限公司 投影用鐳射晶片封裝結構

Also Published As

Publication number Publication date
PH22016000060U1 (en) 2016-07-08
MY176818A (en) 2020-08-21
US20160294157A1 (en) 2016-10-06
US9496679B2 (en) 2016-11-15
PH22016000060Y1 (en) 2016-07-08
DE202016100298U1 (de) 2016-05-23
GB2537006B (en) 2019-10-16
GB201601326D0 (en) 2016-03-09
JP3202736U (ja) 2016-02-18
TWM517941U (zh) 2016-02-21
FR3034579A3 (fr) 2016-10-07
GB2537006A (en) 2016-10-05
PH22016000060U3 (en) 2016-09-02

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