FI20030506L - Machinable copper alloy - Google Patents
Machinable copper alloy Download PDFInfo
- Publication number
- FI20030506L FI20030506L FI20030506A FI20030506A FI20030506L FI 20030506 L FI20030506 L FI 20030506L FI 20030506 A FI20030506 A FI 20030506A FI 20030506 A FI20030506 A FI 20030506A FI 20030506 L FI20030506 L FI 20030506L
- Authority
- FI
- Finland
- Prior art keywords
- copper alloy
- machinable copper
- machinable
- alloy
- copper
- Prior art date
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Conductive Materials (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FI20030506A FI117289B (en) | 2003-04-03 | 2003-04-03 | Machined copper alloy |
| TW093108495A TW200422411A (en) | 2003-04-03 | 2004-03-29 | Machinable copper alloy |
| PCT/FI2004/000197 WO2004087974A1 (en) | 2003-04-03 | 2004-04-01 | Machinable copper alloy |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FI20030506A FI117289B (en) | 2003-04-03 | 2003-04-03 | Machined copper alloy |
| FI20030506 | 2003-04-03 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| FI20030506A0 FI20030506A0 (en) | 2003-04-03 |
| FI20030506L true FI20030506L (en) | 2004-10-04 |
| FI117289B FI117289B (en) | 2006-08-31 |
Family
ID=8565918
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FI20030506A FI117289B (en) | 2003-04-03 | 2003-04-03 | Machined copper alloy |
Country Status (3)
| Country | Link |
|---|---|
| FI (1) | FI117289B (en) |
| TW (1) | TW200422411A (en) |
| WO (1) | WO2004087974A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105081001A (en) * | 2015-10-03 | 2015-11-25 | 淄博夸克医药技术有限公司 | Continuous extruding producing process of non-oxygen copper bar |
| JP2020094241A (en) * | 2018-12-13 | 2020-06-18 | 三菱マテリアル株式会社 | Pure copper material, member for electronic and electrical device, member for heat release |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62253743A (en) * | 1986-04-24 | 1987-11-05 | Daido Steel Co Ltd | Free-cutting oxygen-free copper |
| US4734254A (en) * | 1986-12-15 | 1988-03-29 | The Nippert Company | Enhanced machining anneal resistant copper alloy |
| JPH062058A (en) * | 1992-06-23 | 1994-01-11 | Furukawa Electric Co Ltd:The | Crystal grain growth suppressing oxygen free copper |
| JP2001152267A (en) * | 1999-11-18 | 2001-06-05 | Kobe Steel Ltd | Copper alloy rolled foil |
-
2003
- 2003-04-03 FI FI20030506A patent/FI117289B/en active IP Right Grant
-
2004
- 2004-03-29 TW TW093108495A patent/TW200422411A/en unknown
- 2004-04-01 WO PCT/FI2004/000197 patent/WO2004087974A1/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2004087974A1 (en) | 2004-10-14 |
| FI20030506A0 (en) | 2003-04-03 |
| FI117289B (en) | 2006-08-31 |
| TW200422411A (en) | 2004-11-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FG | Patent granted |
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