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FI20030506A0 - Copper alloy that can be machined - Google Patents

Copper alloy that can be machined

Info

Publication number
FI20030506A0
FI20030506A0 FI20030506A FI20030506A FI20030506A0 FI 20030506 A0 FI20030506 A0 FI 20030506A0 FI 20030506 A FI20030506 A FI 20030506A FI 20030506 A FI20030506 A FI 20030506A FI 20030506 A0 FI20030506 A0 FI 20030506A0
Authority
FI
Finland
Prior art keywords
machined
copper alloy
alloy
copper
Prior art date
Application number
FI20030506A
Other languages
Finnish (fi)
Swedish (sv)
Other versions
FI20030506L (en
FI117289B (en
Inventor
Ilm. Myoeh.
Original Assignee
Outokumpu Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Outokumpu Oy filed Critical Outokumpu Oy
Priority to FI20030506A priority Critical patent/FI117289B/en
Publication of FI20030506A0 publication Critical patent/FI20030506A0/en
Priority to TW093108495A priority patent/TW200422411A/en
Priority to PCT/FI2004/000197 priority patent/WO2004087974A1/en
Publication of FI20030506L publication Critical patent/FI20030506L/en
Application granted granted Critical
Publication of FI117289B publication Critical patent/FI117289B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
FI20030506A 2003-04-03 2003-04-03 Machined copper alloy FI117289B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FI20030506A FI117289B (en) 2003-04-03 2003-04-03 Machined copper alloy
TW093108495A TW200422411A (en) 2003-04-03 2004-03-29 Machinable copper alloy
PCT/FI2004/000197 WO2004087974A1 (en) 2003-04-03 2004-04-01 Machinable copper alloy

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20030506 2003-04-03
FI20030506A FI117289B (en) 2003-04-03 2003-04-03 Machined copper alloy

Publications (3)

Publication Number Publication Date
FI20030506A0 true FI20030506A0 (en) 2003-04-03
FI20030506L FI20030506L (en) 2004-10-04
FI117289B FI117289B (en) 2006-08-31

Family

ID=8565918

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20030506A FI117289B (en) 2003-04-03 2003-04-03 Machined copper alloy

Country Status (3)

Country Link
FI (1) FI117289B (en)
TW (1) TW200422411A (en)
WO (1) WO2004087974A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105081001A (en) * 2015-10-03 2015-11-25 淄博夸克医药技术有限公司 Continuous extruding producing process of non-oxygen copper bar
JP2020094241A (en) * 2018-12-13 2020-06-18 三菱マテリアル株式会社 Pure copper material, member for electronic and electrical device, member for heat release

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62253743A (en) * 1986-04-24 1987-11-05 Daido Steel Co Ltd Free-cutting oxygen-free copper
US4734254A (en) * 1986-12-15 1988-03-29 The Nippert Company Enhanced machining anneal resistant copper alloy
JPH062058A (en) * 1992-06-23 1994-01-11 Furukawa Electric Co Ltd:The Crystal grain growth suppressing oxygen free copper
JP2001152267A (en) * 1999-11-18 2001-06-05 Kobe Steel Ltd Copper alloy rolled foil

Also Published As

Publication number Publication date
FI20030506L (en) 2004-10-04
TW200422411A (en) 2004-11-01
FI117289B (en) 2006-08-31
WO2004087974A1 (en) 2004-10-14

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