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ES2123435B1 - Sistema de disipacion termica en circuito impreso de 800 micras. - Google Patents

Sistema de disipacion termica en circuito impreso de 800 micras.

Info

Publication number
ES2123435B1
ES2123435B1 ES09602287A ES9602287A ES2123435B1 ES 2123435 B1 ES2123435 B1 ES 2123435B1 ES 09602287 A ES09602287 A ES 09602287A ES 9602287 A ES9602287 A ES 9602287A ES 2123435 B1 ES2123435 B1 ES 2123435B1
Authority
ES
Spain
Prior art keywords
printed circuit
microns
dissipation system
thermal dissipation
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES09602287A
Other languages
English (en)
Other versions
ES2123435A1 (es
Inventor
Carrete Alberto Aragones
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lear Automotive EEDS Spain SL
Original Assignee
Lear Automotive EEDS Spain SL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lear Automotive EEDS Spain SL filed Critical Lear Automotive EEDS Spain SL
Priority to ES09602287A priority Critical patent/ES2123435B1/es
Priority to EP97500170A priority patent/EP0840372A3/en
Priority to KR1019970053992A priority patent/KR19980033018A/ko
Priority to JP9292860A priority patent/JPH10135673A/ja
Publication of ES2123435A1 publication Critical patent/ES2123435A1/es
Application granted granted Critical
Publication of ES2123435B1 publication Critical patent/ES2123435B1/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

SISTEMA DE DISIPACION TERMICA EN CIRCUITO IMPRESO DE 800 MICRAS. TAL Y COMO PUEDE VERSE EN LA FIGURA UNICA QUE SE ACOMPAÑA, SE HA PRESCINDIDO TOTALMENTE DE LOS RADIADORES ANTERIORMENTE CITADOS, A BASE DE HACER SERVIR EL MISMO CIRCUITO IMPRESO DE POTENCIA (11) COMO ELEMENTO SOPORTE Y CONEXION ELECTRICA, NO SOLO DE LOS COMPONENTES ELECTRICOS Y ELECTRONICOS (14), SINO A LA VEZ, Y DE UNA FORMA CALCULADA, COMO ELEMENTO DISIPADOR DEL CALOR, VALIENDOSE PARA ELLO DE LA CAPACIDAD DE TRANSMISION DE LA PARTE CONDUCTORA DE DICHO CIRCUITO (11).
ES09602287A 1996-10-29 1996-10-29 Sistema de disipacion termica en circuito impreso de 800 micras. Expired - Lifetime ES2123435B1 (es)

Priority Applications (4)

Application Number Priority Date Filing Date Title
ES09602287A ES2123435B1 (es) 1996-10-29 1996-10-29 Sistema de disipacion termica en circuito impreso de 800 micras.
EP97500170A EP0840372A3 (en) 1996-10-29 1997-10-09 Thermal dissipation system in 800 micrometer printed circuit
KR1019970053992A KR19980033018A (ko) 1996-10-29 1997-10-21 800 마이크론 인쇄회로의 열 방산 시스템
JP9292860A JPH10135673A (ja) 1996-10-29 1997-10-24 ８００ミクロン膜のプリント回路基板の放熱システム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ES09602287A ES2123435B1 (es) 1996-10-29 1996-10-29 Sistema de disipacion termica en circuito impreso de 800 micras.

Publications (2)

Publication Number Publication Date
ES2123435A1 ES2123435A1 (es) 1999-01-01
ES2123435B1 true ES2123435B1 (es) 1999-09-16

Family

ID=8296524

Family Applications (1)

Application Number Title Priority Date Filing Date
ES09602287A Expired - Lifetime ES2123435B1 (es) 1996-10-29 1996-10-29 Sistema de disipacion termica en circuito impreso de 800 micras.

Country Status (4)

Country Link
EP (1) EP0840372A3 (es)
JP (1) JPH10135673A (es)
KR (1) KR19980033018A (es)
ES (1) ES2123435B1 (es)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110290630B (zh) * 2018-03-19 2021-07-27 正芯科技有限公司 功率模块组装结构
KR102169904B1 (ko) * 2018-09-07 2020-10-26 유정년 제어 장치 및 이를 포함하는 제어 시스템

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5753947A (en) * 1980-09-17 1982-03-31 Hitachi Ltd Transistor and electronic device containing it
FI85783C (fi) * 1989-02-17 1992-05-25 Nokia Mobira Oy Kylningskonstruktion foer transistor.
FI88452C (fi) * 1990-03-29 1993-05-10 Nokia Mobile Phones Ltd Konstruktion foer att foerbaettra avkylning av en effekttransistor
JPH04233258A (ja) * 1990-07-23 1992-08-21 Internatl Business Mach Corp <Ibm> 超小型電子回路パッケージ
DE59005035D1 (de) * 1990-12-12 1994-04-21 Siemens Ag Leiterplatte für elektronische Steuergeräte und Verfahren zum Herstellen einer solchen Leiterplatte.
US5310351A (en) * 1992-10-29 1994-05-10 Mcadow Theodore Relay support circuit board unit
GB9225260D0 (en) * 1992-12-03 1993-01-27 Int Computers Ltd Cooling electronic circuit assemblies
JP3155885B2 (ja) * 1994-06-08 2001-04-16 電気化学工業株式会社 回路基板
JPH08279664A (ja) * 1995-04-04 1996-10-22 Unisia Jecs Corp 電子部品実装基板

Also Published As

Publication number Publication date
JPH10135673A (ja) 1998-05-22
EP0840372A2 (en) 1998-05-06
ES2123435A1 (es) 1999-01-01
KR19980033018A (ko) 1998-07-25
EP0840372A3 (en) 1999-02-17

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