ES2095486T3 - Aparato electrico, especialmente aparato de conexion y de control para automoviles. - Google Patents
Aparato electrico, especialmente aparato de conexion y de control para automoviles.Info
- Publication number
- ES2095486T3 ES2095486T3 ES92918773T ES92918773T ES2095486T3 ES 2095486 T3 ES2095486 T3 ES 2095486T3 ES 92918773 T ES92918773 T ES 92918773T ES 92918773 T ES92918773 T ES 92918773T ES 2095486 T3 ES2095486 T3 ES 2095486T3
- Authority
- ES
- Spain
- Prior art keywords
- heat
- power component
- automobiles
- electrical apparatus
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005057 refrigeration Methods 0.000 abstract 2
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09354—Ground conductor along edge of main surface
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10446—Mounted on an edge
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
EL APARATO ELECTRICO DISPONE DE UN CIRCUITO IMPRESO (10), AL QUE TAMBIEN LE CORRESPONDE UN COMPONENTE DE POTENCIA GENERADOR DE PERDIDA DE CALOR (11). PARA PODER DISIPAR LA PERDIDA DE CALOR DEL COMPONENTE DE POTENCIA, ESTE SE ENCUENTRA SOBRE UNA CAPA CONDUCTORA DE CALOR (13), LA CUAL ESTA DISPUESTA A SU VEZ SOBRE LA PARTE SUPERIOR (12) DEL CIRCUITO IMPRESO. SOBRE ESTA CAPA CONDUCTORA DE CALOR, SE ENCUENTRA TAMBIEN UNA PARTE DE LA CUBIERTA (18, 19) DE LA CARCASA UTILIZADA COMO SUPERFICIE REFRIGERADORA. LA SUPERFICIE REFRIGERADORA PUEDE SER, SIN EMBARGO, TAMBIEN UN ELEMENTO DE REFRIGERACION INDEPENDIENTE. LA CONDUCCION DEL CALOR SE REALIZA CONSECUENTEMENTE A TRAVES DE LA CAPA CONDUCTORA DE CALOR (13) HACIA EL ELEMENTO DE REFRIGERACION (18,19), DE FORMA QUE ESTE ULTIMO PUEDE SER DISPUESTO Y CONFORMADO INDEPENDIENTEMENTE DEL TIPO Y FORMA DEL COMPONENTE DE POTENCIA.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE4131515 | 1991-09-21 | ||
| DE4131515 | 1991-09-21 | ||
| DE4222838A DE4222838C2 (de) | 1991-09-21 | 1992-07-11 | Elektrisches Gerät, insbesondere Schalt- und Steuergerät für Kraftfahrzeuge |
| DE4222838 | 1992-07-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| ES2095486T3 true ES2095486T3 (es) | 1997-02-16 |
| ES2095486T5 ES2095486T5 (es) | 2010-07-09 |
Family
ID=25907572
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES92918773T Expired - Lifetime ES2095486T5 (es) | 1991-09-21 | 1992-09-09 | Aparato electrico, en especial aparato de conmutacion y control para vehiculos de motor. |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6222732B1 (es) |
| EP (1) | EP0558712B2 (es) |
| JP (1) | JPH06503210A (es) |
| ES (1) | ES2095486T5 (es) |
| WO (1) | WO1993006705A1 (es) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ES2160505A1 (es) * | 1999-08-09 | 2001-11-01 | Mecanismos Aux Es Ind S L | Caja de interconexiones de automovil con disipacion termica mejorada. |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4432057A1 (de) * | 1994-09-09 | 1996-03-14 | Bosch Gmbh Robert | Vorrichtung zur Ableitung der thermischen Verlustleistung eines elektronischen oder elektromechanischen Bauelementes |
| JP2000082774A (ja) * | 1998-06-30 | 2000-03-21 | Sumitomo Electric Ind Ltd | パワ―モジュ―ル用基板およびその基板を用いたパワ―モジュ―ル |
| US6320723B1 (en) * | 1999-06-24 | 2001-11-20 | Seagate Technology Llc | Protective cover for a disc drive printed circuit board wherein the cover and a circuit board component are thermally connected |
| JP4142227B2 (ja) * | 2000-01-28 | 2008-09-03 | サンデン株式会社 | 車両用電動圧縮機のモータ駆動用インバータ装置 |
| JP3923703B2 (ja) * | 2000-03-29 | 2007-06-06 | ローム株式会社 | 放熱手段を有するプリント配線板 |
| US6377462B1 (en) * | 2001-01-09 | 2002-04-23 | Deere & Company | Circuit board assembly with heat sinking |
| DE10150581A1 (de) * | 2001-10-12 | 2003-04-17 | Schlafhorst & Co W | Garnsensor |
| DE10152475A1 (de) * | 2001-10-24 | 2003-05-08 | Hella Kg Hueck & Co | Wärmeleitendes Verbindungsstück |
| DE10162600A1 (de) * | 2001-12-20 | 2003-07-10 | Bosch Gmbh Robert | Gehäuseanordnung für ein elektrisches Gerät |
| US6587346B1 (en) * | 2002-01-31 | 2003-07-01 | Visteon Global Technologies, Inc. | Combination electrical power distribution and heat dissipating device |
| US6583988B1 (en) * | 2002-02-05 | 2003-06-24 | Whelen Engineering Company, Inc. | Encapsulated power supply |
| WO2003094586A1 (de) * | 2002-04-29 | 2003-11-13 | Siemens Aktiengesellschaft | Leiterplatte mit smd-bauelement und kühlkörper |
| US6797889B1 (en) * | 2002-05-30 | 2004-09-28 | Johnson Controls Automotive Electronics | Assembly of power circuits and numerical data printed on a multilayer board |
| US7190589B2 (en) * | 2004-10-19 | 2007-03-13 | Cinch Connectors, Inc. | Electronic control enclosure |
| CN1993032A (zh) * | 2005-12-27 | 2007-07-04 | 华硕电脑股份有限公司 | 具有高电磁兼容性之电子装置 |
| JP2007324200A (ja) * | 2006-05-30 | 2007-12-13 | Yazaki Corp | 回路基板およびそれを備えた電気接続箱 |
| US7561430B2 (en) * | 2007-04-30 | 2009-07-14 | Watlow Electric Manufacturing Company | Heat management system for a power switching device |
| DE102007025957A1 (de) * | 2007-06-04 | 2008-12-11 | Robert Bosch Gmbh | Verfahren und Vorrichtung zum Festlegen eines eine elektrische Schaltung oder dergleichen aufweisenden Flächensubstrats in einer Einbauposition |
| US20090091889A1 (en) * | 2007-10-09 | 2009-04-09 | Oman Todd P | Power electronic module having improved heat dissipation capability |
| DE102008026627B3 (de) * | 2008-06-03 | 2009-10-29 | Siemens Aktiengesellschaft | Kühlsystem für LED-Chip-Anordnung |
| KR20100007470A (ko) * | 2008-07-14 | 2010-01-22 | 엘지전자 주식회사 | 플라즈마 디스플레이 장치 |
| US8804337B2 (en) * | 2012-03-26 | 2014-08-12 | Hamilton Sundstrand Space Systems International, Inc. | Structural assembly for cold plate cooling |
| DE102013107977B4 (de) * | 2013-04-29 | 2021-01-07 | Avl Software And Functions Gmbh | Vorrichtung zum Verbinden eines Gerätes mit einer integrierten Elektronikbaugruppe |
| US10019046B2 (en) * | 2015-08-17 | 2018-07-10 | Asia Vital Components Co., Ltd. | Internal frame structure with heat insulation effect and electronic apparatus with the internal frame structure |
| DE102017212968B4 (de) * | 2016-08-05 | 2024-02-01 | Robert Bosch Gmbh | Gehäuseaufbau für eine elektronische steuereinheit und herstellungsverfahren |
| CN108990251B (zh) * | 2017-06-02 | 2020-12-25 | 台达电子工业股份有限公司 | 印刷电路板组装结构及其组装方法 |
| DE102017214267B4 (de) * | 2017-08-16 | 2025-02-20 | Mahle International Gmbh | Kühlvorrichtung und Verfahren zum Herstellen der Kühlvorrichtung |
| JP6852649B2 (ja) * | 2017-10-24 | 2021-03-31 | 株式会社オートネットワーク技術研究所 | 回路構成体及び回路構成体の製造方法 |
| DE102018217607A1 (de) | 2018-10-15 | 2020-04-16 | Continental Automotive Gmbh | Halbleiterbauelement-Anordnung, Verfahren zu deren Herstellung sowie Entwärmungseinrichtung |
| DE102019215523A1 (de) | 2019-10-10 | 2021-04-15 | Vitesco Technologies GmbH | Leistungshalbleiterbauteil sowie Verfahren zur Herstellung eines Leistungshalbleiterbauteils |
| EP3876688B1 (en) * | 2020-03-03 | 2024-01-31 | Honeywell International Inc. | Standoff for circuit board having temperature-variable electrical element |
| CN113490368B (zh) * | 2021-07-07 | 2023-03-21 | 台达电子企业管理(上海)有限公司 | 电源装置及大功率照明系统 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3061760A (en) * | 1959-12-10 | 1962-10-30 | Philco Corp | Electrical apparatus |
| US3631325A (en) † | 1970-06-15 | 1971-12-28 | Sperry Rand Corp | Card module and end wall treatment facilitating heat transfer and sliding |
| DE2214163A1 (de) | 1972-03-23 | 1973-10-11 | Bosch Gmbh Robert | Elektrische schaltungsanordnung |
| US3885304A (en) | 1972-03-23 | 1975-05-27 | Bosch Gmbh Robert | Electric circuit arrangement and method of making the same |
| DE2226395A1 (de) † | 1972-05-31 | 1973-12-13 | Bosch Gmbh Robert | Elektrische schaltungsanordnung |
| US3919602A (en) | 1972-03-23 | 1975-11-11 | Bosch Gmbh Robert | Electric circuit arrangement and method of making the same |
| IT1008331B (it) * | 1973-03-28 | 1976-11-10 | Rca Corp | Pannello composito a circuito stampato |
| US4204247A (en) * | 1978-09-22 | 1980-05-20 | Cps, Inc. | Heat dissipating circuit board assembly |
| US4339260A (en) * | 1981-01-12 | 1982-07-13 | Owens-Illinois, Inc. | Environmentally protected electronic control for a glassware forming machine |
| DE3115017A1 (de) | 1981-04-14 | 1982-11-04 | Blaupunkt-Werke Gmbh, 3200 Hildesheim | Elektronisches bauelement |
| DE8114325U1 (de) † | 1981-05-14 | 1982-09-30 | Siemens AG, 1000 Berlin und 8000 München | Wärmeableitungsvorrichtung |
| DE3210019C2 (de) | 1982-03-19 | 1984-04-19 | Ford-Werke AG, 5000 Köln | Gehäuse für eine Heizungs- oder Klimaanlage für Kraftfahrzeuge |
| US4475145A (en) * | 1982-07-12 | 1984-10-02 | Rockwell International Corporation | Circuit board heatsink assembly and technique |
| DE3305167C2 (de) † | 1983-02-15 | 1994-05-05 | Bosch Gmbh Robert | Elektrische Schaltungsanordnung mit einer Leiterplatte |
| DE3437774A1 (de) † | 1984-10-16 | 1986-04-17 | Telefonbau & Normalzeit Gmbh | Anordnung zur kuehlung von auf senkrecht stehenden einreihigen schaltungsmodulen aufgebrachten leistungshalbleitern |
| US4823235A (en) * | 1986-02-06 | 1989-04-18 | Fujitsu Limited | Earth connection device in metal core printed circuit board |
| FR2620587B1 (fr) † | 1987-09-16 | 1993-07-02 | Telemecanique Electrique | Circuit imprime equipe d'un drain thermique |
| US4811165A (en) | 1987-12-07 | 1989-03-07 | Motorola, Inc. | Assembly for circuit modules |
| DE3832856A1 (de) † | 1988-09-28 | 1990-03-29 | Standard Elektrik Lorenz Ag | Leiterplatte mit einem waermeleitenden element |
| US4941067A (en) * | 1989-04-07 | 1990-07-10 | Motorola Inc. | Thermal shunt for electronic circuits |
| US5019941A (en) * | 1989-11-03 | 1991-05-28 | Motorola, Inc. | Electronic assembly having enhanced heat dissipating capabilities |
| JPH04121793U (ja) * | 1991-04-17 | 1992-10-30 | パイオニア株式会社 | ヒートシンク・基板アセンブリ |
-
1992
- 1992-09-09 ES ES92918773T patent/ES2095486T5/es not_active Expired - Lifetime
- 1992-09-09 WO PCT/DE1992/000721 patent/WO1993006705A1/de not_active Ceased
- 1992-09-09 US US08/064,010 patent/US6222732B1/en not_active Expired - Lifetime
- 1992-09-09 EP EP92918773A patent/EP0558712B2/de not_active Expired - Lifetime
- 1992-09-09 JP JP5505680A patent/JPH06503210A/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ES2160505A1 (es) * | 1999-08-09 | 2001-11-01 | Mecanismos Aux Es Ind S L | Caja de interconexiones de automovil con disipacion termica mejorada. |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0558712B2 (de) | 2010-04-07 |
| US6222732B1 (en) | 2001-04-24 |
| JPH06503210A (ja) | 1994-04-07 |
| WO1993006705A1 (de) | 1993-04-01 |
| ES2095486T5 (es) | 2010-07-09 |
| EP0558712B1 (de) | 1996-12-11 |
| EP0558712A1 (de) | 1993-09-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FG2A | Definitive protection |
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