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ES2179815T3 - Dispositivo y procedimiento para la transferencia de microestructuras. - Google Patents

Dispositivo y procedimiento para la transferencia de microestructuras.

Info

Publication number
ES2179815T3
ES2179815T3 ES00920712T ES00920712T ES2179815T3 ES 2179815 T3 ES2179815 T3 ES 2179815T3 ES 00920712 T ES00920712 T ES 00920712T ES 00920712 T ES00920712 T ES 00920712T ES 2179815 T3 ES2179815 T3 ES 2179815T3
Authority
ES
Spain
Prior art keywords
tool
substrate
measuring
relation
supports
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES00920712T
Other languages
English (en)
Inventor
Frank Reuther
Alf Springer
Lutz Muller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jenoptik AG
Original Assignee
Jenoptik Jena GmbH
Jenoptik AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jenoptik Jena GmbH, Jenoptik AG filed Critical Jenoptik Jena GmbH
Application granted granted Critical
Publication of ES2179815T3 publication Critical patent/ES2179815T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping

Landscapes

  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Surface Treatment Of Glass (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)

Abstract

Dispositivo para la transferencia de microestructuras desde una herramienta hasta un sustrato que se desea estructurar, con soportes graduables entre sí para la herramienta y para el sustrato, en una dirección en la que resulta una variación de la distancia entre la herramienta y el sustrato, caracterizado porque, para la medición de lugares elegidos en por lo menos un plano de medición, respecto al cual está orientada en perpendicular la dirección de graduación de los soportes, está previsto un sistema de medición (8) que puede ser introducido entre los soportes, que está en relación espacial fija respecto a la herramienta (46) en una posición de medición, y porque el sustrato (34) puede ser desplazado en paralelo al plano de medición para la alineación respecto a la herramienta (46).
ES00920712T 1999-05-27 2000-04-15 Dispositivo y procedimiento para la transferencia de microestructuras. Expired - Lifetime ES2179815T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19925175A DE19925175C1 (de) 1999-05-27 1999-05-27 Einrichtung und Verfahren zur Übertragung von Mikrostrukturen

Publications (1)

Publication Number Publication Date
ES2179815T3 true ES2179815T3 (es) 2003-02-01

Family

ID=7909945

Family Applications (1)

Application Number Title Priority Date Filing Date
ES00920712T Expired - Lifetime ES2179815T3 (es) 1999-05-27 2000-04-15 Dispositivo y procedimiento para la transferencia de microestructuras.

Country Status (10)

Country Link
US (1) US6699425B1 (es)
EP (1) EP1115545B1 (es)
JP (1) JP4054534B2 (es)
KR (1) KR100406104B1 (es)
AT (1) ATE220606T1 (es)
DE (2) DE19925175C1 (es)
DK (1) DK1115545T3 (es)
ES (1) ES2179815T3 (es)
TW (1) TW476700B (es)
WO (1) WO2000073035A1 (es)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10233462B4 (de) * 2002-07-24 2009-01-22 Forschungszentrum Karlsruhe Gmbh Vorrichtung zum Prägen und zur Entformung von Strukturkörpern
DE10323365A1 (de) * 2003-05-21 2004-12-09 Robert Bürkle GmbH Vorrichtung zur Herstellung geprägter Substrate
DE10356427B4 (de) * 2003-11-30 2017-03-09 Dieffenbacher Maschinenfabrik Gmbh, Zaisenhausen Verfahren zum deckungsgleichen Ablegen von aus Dekorfolien und Trägerplatten bestehenden Presspaketen
DE102004002014A1 (de) * 2004-01-14 2005-08-11 Pepperl + Fuchs Gmbh Winklige Wandlereinheit und Verfahren zu deren Herstellung sowie winkliges Schaltgerät und Vorrichtung zum Nachweis von Objekten
JP4700996B2 (ja) * 2005-04-19 2011-06-15 東芝機械株式会社 転写装置
US7648354B2 (en) * 2005-04-28 2010-01-19 Toshiba Kikai Kabushiki Kaisha Transfer apparatus having gimbal mechanism and transfer method using the transfer apparatus
JP4729338B2 (ja) * 2005-05-10 2011-07-20 東芝機械株式会社 転写装置
JP4701008B2 (ja) * 2005-05-25 2011-06-15 東芝機械株式会社 ジンバル機構を備えた転写装置
JP6450790B2 (ja) * 2017-03-02 2019-01-09 ファナック株式会社 表示システムおよび表示方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH664030A5 (de) * 1984-07-06 1988-01-29 Landis & Gyr Ag Verfahren zur erzeugung eines makroskopischen flaechenmusters mit einer mikroskopischen struktur, insbesondere einer beugungsoptisch wirksamen struktur.
DE4205944A1 (de) * 1992-02-24 1993-08-26 Schneider Klaus Verfahren zur einstellung der gegenseitigen lage eines films und einer leiterplatte sowie vorrichtung zur durchfuehrung des verfahrens
US5337151A (en) * 1992-07-28 1994-08-09 Optical Radiation Corporation Double-sided circuit board exposure machine and method with optical registration and material variation compensation
FR2703558B1 (fr) * 1993-03-31 1995-06-30 Automa Tech Sa Installation d'exposition à la lumière d'une plaque de circuit imprimé double face à travers les clichés.
FR2748887B1 (fr) * 1996-05-15 1998-08-21 Automa Tech Sa Installation d'exposition a la lumiere d'une plaque de circuit imprime double face a travers des cliches
DE19648844C1 (de) * 1996-11-26 1997-09-18 Jenoptik Jena Gmbh Einrichtung und Verfahren zur Abformung mikrosystemtechnischer Strukturen

Also Published As

Publication number Publication date
WO2000073035A1 (de) 2000-12-07
EP1115545A1 (de) 2001-07-18
DK1115545T3 (da) 2002-11-11
EP1115545B1 (de) 2002-07-17
JP2003500253A (ja) 2003-01-07
KR20010072056A (ko) 2001-07-31
JP4054534B2 (ja) 2008-02-27
ATE220606T1 (de) 2002-08-15
US6699425B1 (en) 2004-03-02
TW476700B (en) 2002-02-21
DE50000283D1 (de) 2002-08-22
KR100406104B1 (ko) 2003-11-14
DE19925175C1 (de) 2000-05-25

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