[go: up one dir, main page]

ES2095079T3 - Procedimiento para la soldadura de tableros de circuitos impresos a baja presion. - Google Patents

Procedimiento para la soldadura de tableros de circuitos impresos a baja presion.

Info

Publication number
ES2095079T3
ES2095079T3 ES93920519T ES93920519T ES2095079T3 ES 2095079 T3 ES2095079 T3 ES 2095079T3 ES 93920519 T ES93920519 T ES 93920519T ES 93920519 T ES93920519 T ES 93920519T ES 2095079 T3 ES2095079 T3 ES 2095079T3
Authority
ES
Spain
Prior art keywords
printed circuit
circuit boards
soldering
pct
low pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES93920519T
Other languages
English (en)
Inventor
Ernst Wandke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Linde GmbH
Original Assignee
Linde GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Linde GmbH filed Critical Linde GmbH
Application granted granted Critical
Publication of ES2095079T3 publication Critical patent/ES2095079T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/012—Soldering with the use of hot gas
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

LA INVENCION SE REFIERE A UN PROCEDIMIENTO PARA LA SOLDADURA DE PLACAS DE CIRCUITO IMPRESO O SIMILARES EQUIPADAS CON COMPONENTES, DE FORMA ESPECIAL SIN FUNDENTE, EN DONDE EL PROCESO DE SOLDADURA Y LAS ETAPAS PRECEDENTES, INTERMEDIAS O SIGUIENTES, TIENEN LUGAR BAJO DEPRESION Y BAJO EL EFECTO DE PLASMA DE UN PROCESO ESPECIAL EN ATMOSFERA DE GAS.
ES93920519T 1992-03-20 1993-03-17 Procedimiento para la soldadura de tableros de circuitos impresos a baja presion. Expired - Lifetime ES2095079T3 (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4209134 1992-03-20
DE4225378A DE4225378A1 (de) 1992-03-20 1992-07-31 Verfahren zum verloeten von leiterplatten unter niederdruck

Publications (1)

Publication Number Publication Date
ES2095079T3 true ES2095079T3 (es) 1997-02-01

Family

ID=25913057

Family Applications (1)

Application Number Title Priority Date Filing Date
ES93920519T Expired - Lifetime ES2095079T3 (es) 1992-03-20 1993-03-17 Procedimiento para la soldadura de tableros de circuitos impresos a baja presion.

Country Status (7)

Country Link
US (1) US5492265A (es)
EP (1) EP0631713B1 (es)
AT (1) ATE145314T1 (es)
DE (2) DE4225378A1 (es)
DK (1) DK0631713T3 (es)
ES (1) ES2095079T3 (es)
WO (1) WO1993019575A1 (es)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4338225A1 (de) * 1993-11-09 1995-05-11 Linde Ag Verfahren zum Wellenlöten mit bleifreien Lotmaterialien
US5499754A (en) 1993-11-19 1996-03-19 Mcnc Fluxless soldering sample pretreating system
DE4421996A1 (de) * 1994-06-23 1996-01-04 Linde Ag Verfahren und Vorrichtung zum kombinierten Wellen- und Reflow-Löten von Leiterplatten und dergleichen
US6245189B1 (en) 1994-12-05 2001-06-12 Nordson Corporation High Throughput plasma treatment system
US5609290A (en) * 1995-04-20 1997-03-11 The University Of North Carolina At Charlotte Fluxless soldering method
FR2735053B1 (fr) 1995-06-09 1997-07-25 Air Liquide Procede et dispositif de brasage a la vague integrant une operation de fluxage par voie seche
US5899737A (en) * 1996-09-20 1999-05-04 Lsi Logic Corporation Fluxless solder ball attachment process
US5961031A (en) * 1997-11-21 1999-10-05 The University Of North Carolina At Charlotte Method and apparatus for forming hydrogen fluoride
US6446855B1 (en) * 1999-02-18 2002-09-10 Speedline Technologies, Inc. Compact reflow and cleaning apparatus
US6354481B1 (en) * 1999-02-18 2002-03-12 Speedline Technologies, Inc. Compact reflow and cleaning apparatus
US6972071B1 (en) 1999-07-13 2005-12-06 Nordson Corporation High-speed symmetrical plasma treatment system
US6468833B2 (en) * 2000-03-31 2002-10-22 American Air Liquide, Inc. Systems and methods for application of substantially dry atmospheric plasma surface treatment to various electronic component packaging and assembly methods
US6709522B1 (en) 2000-07-11 2004-03-23 Nordson Corporation Material handling system and methods for a multichamber plasma treatment system
US6533577B2 (en) 2001-02-02 2003-03-18 Cvd Equipment Corporation Compartmentalized oven
US6841033B2 (en) * 2001-03-21 2005-01-11 Nordson Corporation Material handling system and method for a multi-workpiece plasma treatment system
DE10210216A1 (de) * 2002-03-08 2003-10-16 Behr Gmbh & Co Verfahren zum Löten von Aluminium
US6827249B2 (en) * 2002-09-30 2004-12-07 Newport Corporation Fluxless tube seal
DE10316513B4 (de) * 2003-04-09 2015-07-09 Endress + Hauser Gmbh + Co. Kg Durchlauf-Lötofen und Verfahren zum Erwärmen von Leiterplatten in einem Durchlauf-Lötofen
DE102007016102A1 (de) * 2007-04-03 2008-10-09 Linde Ag Vorrichtung und Verfahren zur Behandlung von Metallschmelzen
EP2022591B1 (de) * 2007-08-03 2010-07-14 Siemens Aktiengesellschaft Verfahren zur Erzeugung einer lötfähigen metallischen Oberfläche und Lötverfahren
US8844793B2 (en) * 2010-11-05 2014-09-30 Raytheon Company Reducing formation of oxide on solder
WO2013004439A1 (de) 2011-07-01 2013-01-10 Reinhausen Plasma Gmbh Vorrichtung und verfahren zur plasmabehandlung von oberflächen
DE102011106762A1 (de) * 2011-07-05 2013-01-10 Sensor-Technik Wiedemann Gmbh Verfahren zum Wellenlöten von Produkten sowie Lötmaske
DE202011107022U1 (de) * 2011-10-21 2012-04-05 Asscon Systemtechnik-Elektronik Gmbh Vorrichtung zum Löten
CN104425289B (zh) * 2013-09-11 2017-12-15 先进科技新加坡有限公司 利用激发的混合气体的晶粒安装装置和方法
US9161459B2 (en) * 2014-02-25 2015-10-13 Illinois Tool Works Inc. Pre-heater latch and seal mechanism for wave solder machine and related method
DE102014110720A1 (de) * 2014-07-29 2016-02-04 Illinois Tool Works Inc. Lötmodul
DE102020119877A1 (de) 2020-07-28 2022-02-03 Siegfried Hofmann Gmbh Vorrichtung zur Verlagerung wenigstens einer Baugruppe zwischen einem Bereitstellungsbereich und einem Arbeitsbereich
DE102020129831A1 (de) 2020-11-12 2022-05-12 Endress+Hauser SE+Co. KG Verfahren zum Auflöten eines Bauelements auf eine Oberfläche einer ersten Leiterplatte

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH662007A5 (en) * 1983-12-21 1987-08-31 Bbc Brown Boveri & Cie Method of soldering semiconductor components
US4577398A (en) * 1984-09-07 1986-03-25 Trilogy Computer Development Partners, Ltd. Method for mounting a semiconductor chip
US4921157A (en) * 1989-03-15 1990-05-01 Microelectronics Center Of North Carolina Fluxless soldering process
DE4032328A1 (de) * 1989-11-06 1991-09-19 Wls Karl Heinz Grasmann Weichl Verfahren und vorrichtung zur verarbeitung von zu verloetenden fuegepartnern
DE4041270A1 (de) * 1990-12-21 1992-06-25 Grasmann Karl Heinz Wls Verfahren und vorrichtung zur verarbeitung von elektronischen flachbaugruppen, insbesondere mit bauelementen bestueckten leiterplatten
US5223691A (en) * 1991-06-03 1993-06-29 Motorola, Inc. Plasma based soldering method requiring no additional heat sources or flux
US5409543A (en) * 1992-12-22 1995-04-25 Sandia Corporation Dry soldering with hot filament produced atomic hydrogen

Also Published As

Publication number Publication date
ATE145314T1 (de) 1996-11-15
US5492265A (en) 1996-02-20
EP0631713A1 (de) 1995-01-04
DK0631713T3 (da) 1997-03-17
DE4225378A1 (de) 1993-09-23
EP0631713B1 (de) 1996-11-13
DE59304489D1 (de) 1996-12-19
WO1993019575A1 (de) 1993-09-30

Similar Documents

Publication Publication Date Title
ES2095079T3 (es) Procedimiento para la soldadura de tableros de circuitos impresos a baja presion.
US4515304A (en) Mounting of electronic components on printed circuit boards
MY124297A (en) Flux composition and corresponding soldering method
YU48977B (sh) Ploča štampanog kola i postupak za precizno sklapanje i lemljenje elektronskih komponenata na površini ploče štampanog kola
EP0714721A3 (en) Applying flux to a solder wave for wave soldering an element
CA2011000A1 (en) Solder assembly of components
EP0257792A3 (en) Composition and method for stripping films from printed circuit boards
MX2009004793A (es) Fundente para suelda libre de plomo, y metodo de soldeo.
MY121435A (en) Surface mounting part
DE3465033D1 (en) Improvements in or relating to vapour phase soldering
DE3465566D1 (en) Method of soldering printed circuit boards in an inert gas atmosphere
CA2018496A1 (en) Method of attaching electronic components
WO1998052399A1 (en) Apparatus and method for mounting electronic parts
EP0394588A3 (en) Solder terminal
EP0420050A3 (en) Method of soldering of components on circuit boards
TW200614894A (en) Pcb including a star shaped through-hole solder pad
DE58904794D1 (de) Verfahren zum loeten eines drahtlosen bauelementes sowie leiterplatte mit angeloetetem, drahtlosem bauelement.
CA1177972A (en) Mounting of electronic components on printed circuit boards
ATE235113T1 (de) Elektrisches leiterplatten-bauteil und verfahren zur automatischen bestückung von leiterplatten mit solchen bauteilen
EP0762812A3 (en) Method of improved oven reflow soldering
CA2157225A1 (en) Method and apparatus for fluxing and soldering terminals on a printed circuit board
MY113963A (en) Method of soldering lead terminal to substrate
JPS6454799A (en) Mounting structure for electronic component part
WO1998041069A3 (de) Flachbaugruppe und verfahren zum nachträglichen aufbringen von zusatzbauelementen auf eine leiterplatte
JPS6425499A (en) Mounting of electronic component

Legal Events

Date Code Title Description
FG2A Definitive protection

Ref document number: 631713

Country of ref document: ES