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EP3138161B1 - Contact element for an electric connection, copper strip for producing a plurality of contact elements - Google Patents

Contact element for an electric connection, copper strip for producing a plurality of contact elements Download PDF

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Publication number
EP3138161B1
EP3138161B1 EP15718369.0A EP15718369A EP3138161B1 EP 3138161 B1 EP3138161 B1 EP 3138161B1 EP 15718369 A EP15718369 A EP 15718369A EP 3138161 B1 EP3138161 B1 EP 3138161B1
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EP
European Patent Office
Prior art keywords
contact
copper
circuit
circuit arrangement
connection
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Active
Application number
EP15718369.0A
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German (de)
French (fr)
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EP3138161A1 (en
Inventor
Olivier POLA
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aumovio Microelectronic GmbH
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Conti Temic Microelectronic GmbH
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Publication of EP3138161A1 publication Critical patent/EP3138161A1/en
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H01R12/585—Terminals having a press fit or a compliant portion and a shank passing through a hole in the printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0207—Ultrasonic-, H.F.-, cold- or impact welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending

Definitions

  • the present invention relates to a contact element for electrical connection and a circuit arrangement with at least one said contact element. Furthermore, the invention relates to a copper strip for producing a plurality of said contact elements.
  • Circuit arrangements include circuit components of different types and designs, such as. B. circuit board, conductors, power components or sockets. These circuit components must be electrically connected to each other so that the circuits can perform certain functions. For this purpose, the circuit arrangements have contact elements which are provided for the formation of stable electrical connections between circuit components.
  • document EP 0 945 937 A2 describes an electrical connection with a contact portion and a connection portion, wherein the contact portion of a first, comparatively soft material and the connection portion of a second, comparatively hard material. About the soft contact portion of the electrical connection is inserted in an opening of a grommet. The electrical connection is mounted on a printed circuit board via the hard connection section.
  • a contact element for electrical connection comprises a first contact region of a first, electrically conductive copper material (copper or copper alloy) for electrical connection to a first circuit component.
  • the compact member further includes a second contact region of a second electrically conductive copper material (copper or copper alloy) for electrical connection to a second circuit component.
  • the first and the second contact area have different material hardnesses.
  • the first and the second contact region are connected to one another via a material connection.
  • a contact region consists of a copper material
  • the respective contact region contains the corresponding copper material in the predominant percentage by weight.
  • a contact element consists almost entirely of a copper material, except for production-related material contamination or material additives that the contact element from external influences, such. As corrosion by moisture, or protect against fatigue.
  • material hardness primarily means a mechanical resistance of a material forming the aforementioned first or second copper material. Contrary to the general distinction between the term “strength” and the term “material hardness” in this application, the term secondarily also means a strength of the material which represents a resistance of the material, ie the first or the second copper material, to mechanical deformation and separation.
  • the text section that "the first and the second contact area are connected to each other via a material connection”, means in this application that the two contact areas not necessarily adjacent to each other at the location of the material connection, but that between the two contact areas quite a section of the Contact element may be present, through which the cohesive connection extends and over which the two contact areas are integrally connected to one another.
  • the first and second contact areas on the respective contacting side do not exclusively comprise surfaces which are completely contacted, but may also have free surfaces which are not contacted.
  • the two contact areas extend flush with each other in the longitudinal direction of the contact element, wherein the longitudinal direction is transverse or oblique to the direction of the cohesive connection.
  • the invention is based on the idea that to form an electrical connection between two circuit components with different connection methods a contact element with contact areas for forming the electrical connections to the respective two circuit components is required, in which the two contact areas must meet different mechanical and material requirements, which presuppose different connection methods.
  • the contact element is formed with two contact regions with different materials, then these two contact regions must be connected to one another mechanically and electrically conductively, so that a stable electrical connection can be ensured between the two circuit components, which electrically connects the contact element.
  • a cohesive connection allows a stable mechanical connection of contact areas made of different materials, which also has a very low contact resistance at the junction.
  • Copper materials ie copper or copper alloy, have proven in the context of this invention to be the materials for contact regions which both have a high electrical conductivity and are optimally suited for a cohesive connection. Since the copper materials are generally available inexpensively, and contact elements can be manufactured at low cost with contact areas with different copper materials.
  • the first copper material has a material hardness up to 110 HV, in particular up to 100 HV, especially up to 95 HV.
  • the hardness unit "HV” means the Vickers hardness.
  • the copper material with a low material hardness up to 110 HV, or 100 HV or 95 HV allows the first contact area to form a material connection with the first circuit component, without mechanically affecting the first circuit component too much.
  • the first copper material is a raw copper according to standard DIN EN 1976/98.
  • the first copper material is a toughened electrolyte copper.
  • the first copper material is a Cu-ETP ("Electrolytic-Tough-Pitch Copper").
  • the Cu-ETP also referred to as E-Cu, formerly known as E-Cu58 or E-Cu57, is an oxygen-containing (toughened) copper produced by electrolytic refining which has a very high conductivity for heat and electricity and thus ideally suited for a contact element.
  • the second copper material has a material hardness of 130 HV to 300 HV, especially from 170 HV to 200 HV.
  • the second copper material contains tin, preferably with a weight percentage above 0.15%, especially above 1%, especially above 5%.
  • the second copper material contains tin at a weight percentage of up to 22%, especially up to 20%, up to 15%, up to 12%, up to 10% or up to 9%, especially up to 7%.
  • the second copper material is a tin bronze, especially CuSn6. Tin bronze is also available as a low-cost mass-produced item in various designs.
  • additives such as. As magnesium, nickel, zinc and / or silicon, may be contained in the second copper material.
  • copper alloys may be used as the second copper material suitable for forming press fit connections. These include, for example, CuSnO.15, CuSn4, CuSn5, CuSn6, CuMg, CuSn3Zn9, CuNiSi.
  • the first and the second contact region are connected to one another in a material-bonded manner via an electron beam-welded connection.
  • An electron beam welded joint between the two contact areas of different copper materials has an electrical contact resistance which is lower than the electrical resistance in the two contact areas.
  • the electron beam welded connection allows a mechanically very stable connection between the two contact areas.
  • a circuit arrangement comprising a first circuit component and a second circuit component. Furthermore, the circuit arrangement comprises at least one contact element described above.
  • the first contact region of the contact element via a cohesive connection esp. An ultrasonic welding or solder joint, with the first circuit component is electrically conductive and mechanically stable connected.
  • the second contact region of the contact element is electrically conductively and mechanically stably connected to the second circuit component via a frictional connection, in particular a press-fit connection (press-fit connection).
  • the copper strip comprises a first elongated strip of a first copper material and a second elongated strip of a second copper material.
  • the copper strip also has a material connection extending in the longitudinal direction of the first and second strips.
  • about the cohesive connection of the first and the second strip are materially connected to each other, electrically conductive and mechanically stable.
  • the cohesive connection is formed as an electron beam welded connection.
  • the contact elements described above can be punched out with a simple punching machine in a simple punching operation.
  • FIG. 1 in which a portion of a circuit arrangement SA is shown schematically.
  • the circuit arrangement SA comprises a circuit carrier ST1, which in this embodiment is designed as a ceramic substrate. On a surface OF1 of the circuit carrier ST1, a conductor track LB for current transmission is arranged, which forms a first circuit component of the circuit arrangement SA.
  • a power semiconductor device LH On a side facing away from the circuit carrier ST1 surface OF2 of the conductor LB is a power semiconductor device LH, such. B. power transistor, arranged, which is mechanically and electrically conductively connected via a solder joint LV to the conductor LB.
  • a contact element KE is further arranged on the same surface OF2 of the conductor LB and in addition to the power semiconductor device LH.
  • the contact element KE is L-shaped and has a first contact region B1 and a second contact region B2 which are perpendicular to one another.
  • the first and the second contact region B1, B2 are connected to one another in an integrally bonded, electrically conductive and mechanically stable manner via an electron beam welded joint EV, which is located at the bending edge of the contact element KE between the two contact regions B1, B2.
  • the first contact area B1 lies on the surface OF2 of the conductor track LB and is mechanically and electrically conductively connected to the conductor track LB via an ultrasonically welded connection UV.
  • the first contact area B1 consists of E copper (Cu-ETP) and has a low material hardness of less than 110HV (Vickers hardness).
  • the low material hardness in the first contact region B1 reduces the risk of delamination (delamination, detachment) of the conductor track LB from the circuit carrier ST1 or a material break in the circuit carrier ST1.
  • the second contact region B2 is in the form of a press-fit pin and is plugged into a metallized through-connection DK of a further circuit carrier ST2, which forms a second circuit component of the circuit arrangement SA.
  • the second contact region B2 forms with a metallization MT on the inner wall of the feedthrough DK a non-positive press-fit connection PV (press-fit connection).
  • the second contact region B2 consists of a tin bronze CuSn6 with tin in a weight fraction of about 6 and has a high material hardness greater than 130 HV and less than 300 HV (Vickers hardness).
  • the high material hardness in the second contact region B2 enables a stable press-fit connection PV between the contact element KE and the circuit carrier ST2.
  • FIG. 2 referenced in which a section of a copper band KB for producing a variety of in FIG. 1 illustrated contact elements KE shown schematically.
  • the copper tape KB is formed as a long and narrow band and includes a first elongated strip SR1 made of the aforementioned first copper material, that is, E copper (Cu-ETP). Further, the copper tape KB includes a second elongated strip SR2 made of the aforementioned second copper material, namely, the tin bronze CuSn6.
  • first and second strips SR1, SR2 are materially connected via an electron beam welded joint EV, which extends in the longitudinal direction LR of the first and second strips SR1, SR2.
  • the contact elements KE one after another are punched out of this copper strip KB in the longitudinal direction LR thereof, the sections stamped out of the area of the first strip SR1 denoting the respective first contact areas B1 of the contact elements KE and the sections punched out of the area of the second strip SR2 form second contact areas B2 of the contact elements KE.
  • the punched-out contact elements KE are bent at the electron beam welded joint EV L-shaped.
  • the contact elements KE can be produced inexpensively in simple manufacturing steps as a mass-produced.

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  • Manufacturing & Machinery (AREA)
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Description

Die vorliegende Erfindung betrifft ein Kontaktelement für elektrische Verbindung sowie eine Schaltungsanordnung mit zumindest einem genannten Kontaktelement. Ferner betrifft die Erfindung ein Kupferband zur Herstellung einer Vielzahl von genannten Kontaktelementen.The present invention relates to a contact element for electrical connection and a circuit arrangement with at least one said contact element. Furthermore, the invention relates to a copper strip for producing a plurality of said contact elements.

Schaltungsanordnungen umfassen Schaltungskomponenten unterschiedlicher Typen und Ausführungen, wie z. B. Schaltungsträger, Leiterbahnen, Leistungsbauelemente oder Steckbuchsen. Diese Schaltungskomponenten müssen die miteinander elektrisch verbunden sein, damit die Schaltungsanordnungen bestimmte Funktionen durchführen können. Hierzu weisen die Schaltungsanordnungen Kontaktelemente, die zur Bildung stabiler elektrischer Verbindungen zwischen Schaltungskomponenten vorgesehen sind.Circuit arrangements include circuit components of different types and designs, such as. B. circuit board, conductors, power components or sockets. These circuit components must be electrically connected to each other so that the circuits can perform certain functions. For this purpose, the circuit arrangements have contact elements which are provided for the formation of stable electrical connections between circuit components.

Elektrische Verbindungen mit den unterschiedlichen Schaltungskomponenten erfordern entsprechend unterschiedliche Verbindungsmethoden, die wiederum unterschiedliche mechanische Anforderungen voraussetzen. Die Kontaktelemente müssen daher derart ausgeführt sein, dass diese unterschiedliche mechanische Anforderungen erfüllen.Electrical connections with the different circuit components require correspondingly different connection methods, which in turn require different mechanical requirements. The contact elements must therefore be designed such that they meet different mechanical requirements.

Wie in technischen Vorrichtungen üblich, gibt es zudem Anforderungen, die elektrischen Verbindungen zwischen den Schaltungskomponenten in einfacher Weise kostengünstig zu gestalten.As usual in technical devices, there are also requirements to make the electrical connections between the circuit components in a simple manner cost.

Dokument EP 0 945 937 A2 beschreibt einen elektrischen Anschluss mit einem Kontaktabschnitt und einem Anschlussabschnitt, wobei der Kontaktabschnitt aus einem ersten, vergleichsweise weichen Material und der Anschlussabschnitt aus einem zweiten, vergleichsweise harten Material bestehen. Über den weichen Kontaktabschnitt ist der elektrische Anschluss in einer Öffnung einer Dichtungstülle eingesteckt. Über den harten Anschlussabschnitt ist der elektrische Anschluss an einer Leiterplatte montiert. Damit besteht die Aufgabe der vorliegenden Erfindung darin, eine Möglichkeit bereitzustellen, die einfache und kostengünstige elektrische Verbindungen zwischen Schaltungskomponenten ermöglicht.document EP 0 945 937 A2 describes an electrical connection with a contact portion and a connection portion, wherein the contact portion of a first, comparatively soft material and the connection portion of a second, comparatively hard material. About the soft contact portion of the electrical connection is inserted in an opening of a grommet. The electrical connection is mounted on a printed circuit board via the hard connection section. Thus, the object of the present invention is to provide a way that enables simple and inexpensive electrical connections between circuit components.

Diese Aufgabe wird durch Gegenstände der unabhängigen Ansprüche gelöst. Vorteilhafte Ausgestaltungen sind Gegenstand der Unteransprüche.This object is solved by subject matters of the independent claims. Advantageous embodiments are the subject of the dependent claims.

Gemäß einem ersten Aspekt der Erfindung wird ein Kontaktelement für elektrische Verbindung bereitgestellt. Das Kontaktelement umfasst einen ersten Kontaktbereich aus einem ersten, elektrisch leitenden Kupfermaterial (Kupfer oder Kupferlegierung) zur elektrischen Verbindung zu einer ersten Schaltungskomponente. Das Kompaktelement umfasst ferner einen zweiten Kontaktbereich aus einem zweiten elektrisch leitenden Kupfermaterial (Kupfer oder Kupferlegierung) zur elektrischen Verbindung zu einer zweiten Schaltungskomponente. Dabei weisen der erste und der zweite Kontaktbereich unterschiedliche Materialhärten auf. Ferner sind der erste und der zweite Kontaktbereich über eine stoffschlüssige Verbindung miteinander verbunden.According to a first aspect of the invention, a contact element for electrical connection is provided. The contact element comprises a first contact region of a first, electrically conductive copper material (copper or copper alloy) for electrical connection to a first circuit component. The compact member further includes a second contact region of a second electrically conductive copper material (copper or copper alloy) for electrical connection to a second circuit component. In this case, the first and the second contact area have different material hardnesses. Furthermore, the first and the second contact region are connected to one another via a material connection.

Hierbei bedeutet der Satz: "ein Kontaktbereich besteht aus einem Kupfermaterial", dass der jeweilige Kontaktbereich das entsprechende Kupfermaterial im überwiegenden Gewichtsprozentanteil enthält. Demnach besteht ein Kontaktelement nahezu vollständig aus einem Kupfermaterial, bis auf fertigungstechnisch bedingte Materialverunreinigungen oder Materialzusätze, die das Kontaktelement vor äußeren Einflüssen, wie z. B. Korrosion durch Feuchtigkeit, oder vor Materialermüdung schützen.Here, the phrase "a contact region consists of a copper material" means that the respective contact region contains the corresponding copper material in the predominant percentage by weight. Accordingly, a contact element consists almost entirely of a copper material, except for production-related material contamination or material additives that the contact element from external influences, such. As corrosion by moisture, or protect against fatigue.

Der Begriff "Materialhärte" bedeutet primär einen mechanischen Widerstand eines Werkstoffs, der das zuvor genannte erste oder das zuvor genannte zweite Kupfermaterial ausbildet. Entgegen der allgemein erachteten Unterscheidung zu dem Begriff "Festigkeit" kann der Begriff "Materialhärte" in dieser Anmeldung sekundär auch eine Festigkeit des Werkstoffs bedeuten, die eine Widerstandsfähigkeit des Werkstoffs, also des ersten oder des zweiten Kupfermaterials, gegenüber mechanische Verformung und Trennung darstellt.The term "material hardness" primarily means a mechanical resistance of a material forming the aforementioned first or second copper material. Contrary to the general distinction between the term "strength" and the term "material hardness" in this application, the term secondarily also means a strength of the material which represents a resistance of the material, ie the first or the second copper material, to mechanical deformation and separation.

Der Textabschnitt, dass "der erste und der zweite Kontaktbereich über eine stoffschlüssige Verbindung miteinander verbunden sind", bedeutet in dieser Anmeldung, dass die beiden Kontaktbereiche zueinander nicht zwangsläufig an der Stelle der stoffschlüssigen Verbindung angrenzen, sondern dass zwischen den beiden Kontaktbereichen durchaus ein Abschnitt des Kontaktelements vorhanden sein kann, durch den sich die stoffschlüssige Verbindung erstreckt und über den die beiden Kontaktbereiche miteinander stoffschlüssig verbunden sind.The text section that "the first and the second contact area are connected to each other via a material connection", means in this application that the two contact areas not necessarily adjacent to each other at the location of the material connection, but that between the two contact areas quite a section of the Contact element may be present, through which the cohesive connection extends and over which the two contact areas are integrally connected to one another.

Der erste und der zweite Kontaktbereich umfassen auf der jeweiligen kontaktierenden Seite nicht ausschließlich Flächen, die vollständig kontaktiert werden, sondern können auch freie Flächen aufweisen, die nicht kontaktiert sind. Insbesondere erstrecken sich die beiden Kontaktbereiche zueinander in Längsrichtung des Kontaktelements flächenbündig, wobei die Längsrichtung quer bzw. schräg zur Verlaufsrichtung der stoffschlüssigen Verbindung liegt.The first and second contact areas on the respective contacting side do not exclusively comprise surfaces which are completely contacted, but may also have free surfaces which are not contacted. In particular, the two contact areas extend flush with each other in the longitudinal direction of the contact element, wherein the longitudinal direction is transverse or oblique to the direction of the cohesive connection.

Der Erfindung liegt der Gedanke zugrunde, dass zur Bildung elektrischer Verbindung zwischen zwei Schaltungskomponenten mit unterschiedlichen Verbindungsmethoden ein Kontaktelement mit Kontaktbereichen zur Bildung der elektrischen Verbindungen zu den jeweiligen zwei Schaltungskomponenten erforderlich ist, bei dem die beiden Kontaktbereiche unterschiedliche mechanische und materielle Anforderungen erfüllen müssen, welche die unterschiedlichen Verbindungsmethoden voraussetzen.The invention is based on the idea that to form an electrical connection between two circuit components with different connection methods a contact element with contact areas for forming the electrical connections to the respective two circuit components is required, in which the two contact areas must meet different mechanical and material requirements, which presuppose different connection methods.

Damit die beiden Kontaktbereiche diese unterschiedlichen Anforderungen erfüllen können, müssen diese unterschiedliche Materialien aufweisen, die den entsprechenden Anforderungen genügen.In order for the two contact areas to be able to meet these different requirements, they must have different materials which satisfy the corresponding requirements.

Wird das Kontaktelement mit zwei Kontaktbereichen mit unterschiedlichen Materialien ausgebildet, so müssen diese beiden Kontaktbereiche miteinander mechanisch und elektrisch leitend verbunden sein, damit eine stabile elektrische Verbindung zwischen den beiden Schaltungskomponenten sichergestellt werden kann, die das Kontaktelement miteinander elektrisch verbindet.If the contact element is formed with two contact regions with different materials, then these two contact regions must be connected to one another mechanically and electrically conductively, so that a stable electrical connection can be ensured between the two circuit components, which electrically connects the contact element.

Eine mögliche Lösung, bei der die beiden Kontaktbereiche zunächst als separate Bauteile aus unterschiedlichen elektrisch leitenden Materialien hergestellt und anschließend miteinander bspw. mittels Schrauben fixiert werden, erwies sich als aufwendig und kostenintensiv.One possible solution, in which the two contact areas are first produced as separate components made of different electrically conductive materials and then subsequently fixed to one another by means of screws, for example, proved to be complicated and cost-intensive.

Damit die elektrischen Verbindungen zwischen Schaltungskomponenten einfach und kostengünstig gestaltet werden können, müssen die Kontaktelemente als Massenware kostengünstig und ohne großen Aufwand herstellbar sein.Thus, the electrical connections between circuit components can be made simple and inexpensive, the contact elements must be mass-produced inexpensively and easily.

Im Rahmen dieser Erfindung wurde erkannt, dass eine stoffschlüssige Verbindung zwischen den beiden Kontaktbereichen eines Kontaktelements eine einfache und kostengünstige Lösung darstellt.In the context of this invention, it has been recognized that a cohesive connection between the two contact regions of a contact element represents a simple and cost-effective solution.

Eine stoffschlüssige Verbindung ermöglicht eine stabile mechanische Verbindung von Kontaktbereichen aus unterschiedlichen Materialien, die zudem einen sehr niedrigen Übergangswiderstand an der Verbindungsstelle aufweist.A cohesive connection allows a stable mechanical connection of contact areas made of different materials, which also has a very low contact resistance at the junction.

Kupfermaterialien, also Kupfer oder Kupferlegierung, erwiesen sich im Rahmen dieser Erfindung als die Materialien für Kontaktbereiche, die sowohl eine hohe elektrische Leitfähigkeit aufweisen als auch für eine stoffschlüssige Verbindung optimal geeignet sind. Da die Kupfermaterialien in der Regel kostengünstig erhältlich sind, können auch Kontaktelemente mit Kontaktbereichen mit unterschiedlichen Kupfermaterialien kostengünstig hergestellt werden.Copper materials, ie copper or copper alloy, have proven in the context of this invention to be the materials for contact regions which both have a high electrical conductivity and are optimally suited for a cohesive connection. Since the copper materials are generally available inexpensively, and contact elements can be manufactured at low cost with contact areas with different copper materials.

Damit wurde ein Kontaktelement für elektrische Verbindung bereitgestellt, die einfache und kostengünstige elektrische Verbindungen zwischen Schaltungskomponenten ermöglicht.Thus, a contact element for electrical connection has been provided which enables simple and inexpensive electrical connections between circuit components.

Gemäß einer bevorzugten Ausgestaltung weist das erste Kupfermaterial eine Materialhärte bis 110 HV, insbesondere bis 100 HV, speziell bis 95 HV, auf. Hierbei bedeutet die Härteeinheit "HV" die Vickershärte.According to a preferred embodiment, the first copper material has a material hardness up to 110 HV, in particular up to 100 HV, especially up to 95 HV. Here, the hardness unit "HV" means the Vickers hardness.

Das Kupfermaterial mit einer geringen Materialhärte bis 110 HV, oder 100 HV bzw. 95 HV ermöglicht dem ersten Kontaktbereich zur Bildung einer stoffschlüssigen Verbindung mit der ersten Schaltungskomponente, ohne dabei die erste Schaltungskomponente mechanisch viel zu stark zu beeinflussen.The copper material with a low material hardness up to 110 HV, or 100 HV or 95 HV allows the first contact area to form a material connection with the first circuit component, without mechanically affecting the first circuit component too much.

Vorzugsweise ist das erste Kupfermaterial ein Roh-Kupfer nach Norm DIN EN 1976/98. Insbesondere ist das erste Kupfermaterial ein zähgepoltes Elektrolytkupfer. Vorzugsweise ist das erste Kupfermaterial ein Cu-ETP (in Englisch "Electrolytic-Tough-Pitch Copper") . Das Cu-ETP, das im Übrigens auch als E-Cu, ehemals auch als E-Cu58 oder E-Cu57 bezeichnet wurde, ist ein durch elektrolytische Raffination hergestelltes, sauerstoffhaltiges (zähgepoltes) Kupfer, das eine sehr hohe Leitfähigkeit für Wärme und Elektrizität aufweist und somit bestens für ein Kontaktelement geeignet ist.Preferably, the first copper material is a raw copper according to standard DIN EN 1976/98. In particular, the first copper material is a toughened electrolyte copper. Preferably, the first copper material is a Cu-ETP ("Electrolytic-Tough-Pitch Copper"). Incidentally, the Cu-ETP, also referred to as E-Cu, formerly known as E-Cu58 or E-Cu57, is an oxygen-containing (toughened) copper produced by electrolytic refining which has a very high conductivity for heat and electricity and thus ideally suited for a contact element.

Das zweite Kupfermaterial aufweist eine Materialhärte von 130 HV bis 300 HV, speziell von 170 HV bis 200 HV.The second copper material has a material hardness of 130 HV to 300 HV, especially from 170 HV to 200 HV.

Das Kupfermaterial mit einer hohen Materialhärte von 130-300 HV, speziell von 170 HV bis 200 HV, ermöglicht dem zweiten Kontaktbereich zur Bildung einer einfachen kraftschlüssigen Verbindung, bspw. einer Einpressverbindung (Press-Fit-Verbindung), mit der zweiten Schaltungskomponente, die auch eine starke mechanische Beanspruchung standhält.The copper material with a high material hardness of 130-300 HV, especially from 170 HV to 200 HV, allows the second contact area to form a simple non-positive connection, for example a press-fit connection, with the second circuit component, too a strong mechanical stress withstands.

Gemäß noch einer weiteren bevorzugten Ausgestaltung enthält das zweite Kupfermaterial Zinn, vorzugsweise mit einem Gewichtsprozentanteil von über 0.15%, insbesondere über 1%, speziell über 5%. Vorzugsweise enthält das zweite Kupfermaterial Zinn mit einem Gewichtsprozentanteil von bis 22%, insbesondere bis 20%, bis 15%, bis 12%, bis 10% oder bis 9%, speziell bis 7%. Vorzugsweise ist das zweite Kupfermaterial eine Zinnbronze, speziell CuSn6. Zinnbronze ist ebenfalls als kostengünstige Massenware in verschiedenen Ausführungen erhältlich.According to yet another preferred embodiment, the second copper material contains tin, preferably with a weight percentage above 0.15%, especially above 1%, especially above 5%. Preferably, the second copper material contains tin at a weight percentage of up to 22%, especially up to 20%, up to 15%, up to 12%, up to 10% or up to 9%, especially up to 7%. Preferably, the second copper material is a tin bronze, especially CuSn6. Tin bronze is also available as a low-cost mass-produced item in various designs.

Zusätzlich zu oder anstelle von Zinn können auch andere Zusätze, wie z. B. Magnesium, Nickel, Zink und/oder Silicium, in dem zweiten Kupfermaterial enthalten sein.In addition to or instead of tin, other additives, such as. As magnesium, nickel, zinc and / or silicon, may be contained in the second copper material.

Insbesondere können Kupferlegierungen als das zweite Kupfermaterial verwendet werden, die zur Bildung von Einpressverbindungen (Press-fit Anschlüsse) geeignet sind. Hierzu gehören bspw. CuSn0.15, CuSn4, CuSn5, CuSn6, CuMg, CuSn3Zn9, CuNiSi.In particular, copper alloys may be used as the second copper material suitable for forming press fit connections. These include, for example, CuSnO.15, CuSn4, CuSn5, CuSn6, CuMg, CuSn3Zn9, CuNiSi.

Gemäß noch einer weiteren bevorzugten Ausgestaltung sind der erste und der zweite Kontaktbereich über eine elektronenstrahlgeschweißte Verbindung miteinander stoffschlüssig verbunden.According to yet another preferred embodiment, the first and the second contact region are connected to one another in a material-bonded manner via an electron beam-welded connection.

Eine elektronenstrahlgeschweißte Verbindung zwischen den beiden Kontaktbereichen aus unterschiedlichen Kupfermaterialien weist einen elektrischen Übergangswiderstand auf, der niedriger als der elektrische Widerstand in den beiden Kontaktbereichen ist. Zudem ermöglicht die elektronenstrahlgeschweißte Verbindung eine mechanisch sehr stabile Verbindung zwischen den beiden Kontaktbereichen.An electron beam welded joint between the two contact areas of different copper materials has an electrical contact resistance which is lower than the electrical resistance in the two contact areas. In addition, the electron beam welded connection allows a mechanically very stable connection between the two contact areas.

Gemäß einem weiteren Aspekt der Erfindung wird eine Schaltungsanordnung bereitgestellt. Dabei umfasst die Schaltungsanordnung eine erste Schaltungskomponente und eine zweite Schaltungskomponente. Ferner umfasst die Schaltungsanordnung zumindest ein zuvor beschriebenes Kontaktelement. Dabei ist der erste Kontaktbereich des Kontaktelements über eine stoffschlüssige Verbindung, insb. eine Ultraschallschweiß- oder Lötverbindung, mit der ersten Schaltungskomponente elektrisch leitend und mechanisch stabil verbunden. Der zweite Kontaktbereich des Kontaktelements ist über eine kraftschlüssige Verbindung, insb. eine Einpressverbindung (Press-fit Verbindung), mit der zweiten Schaltungskomponente elektrisch leitend und mechanisch stabil verbunden.According to a further aspect of the invention, a circuit arrangement is provided. In this case, the circuit arrangement comprises a first circuit component and a second circuit component. Furthermore, the circuit arrangement comprises at least one contact element described above. In this case, the first contact region of the contact element via a cohesive connection, esp. An ultrasonic welding or solder joint, with the first circuit component is electrically conductive and mechanically stable connected. The second contact region of the contact element is electrically conductively and mechanically stably connected to the second circuit component via a frictional connection, in particular a press-fit connection (press-fit connection).

Gemäß noch einem weiteren Aspekt der Erfindung wird ein Kupferband zur Herstellung einer Vielzahl von zuvor beschriebenen Kontaktelementen bereitgestellt. Dabei umfasst das Kupferband einen ersten länglichen Streifen aus einem ersten Kupfermaterial und einen zweiten länglichen Streifen aus einem zweiten Kupfermaterial. Das Kupferband weist ferner eine stoffschlüssige Verbindung auf, die sich in Längsrichtung des ersten und des zweiten Streifens erstreckt. Über die stoffschlüssige Verbindung sind der erste und der zweite Streifen miteinander stoffschlüssig, elektrisch leitend und mechanisch stabil verbunden. Vorzugsweise ist die stoffschlüssige Verbindung als eine elektronenstrahlgeschweißte Verbindung ausgebildet.According to yet another aspect of the invention, there is provided a copper tape for making a plurality of previously described contact elements. In this case, the copper strip comprises a first elongated strip of a first copper material and a second elongated strip of a second copper material. The copper strip also has a material connection extending in the longitudinal direction of the first and second strips. About the cohesive connection of the first and the second strip are materially connected to each other, electrically conductive and mechanically stable. Preferably, the cohesive connection is formed as an electron beam welded connection.

Aus einem derartigen Kupferband können die zuvor beschriebenen Kontaktelemente mit einer einfachen Stanzmaschine in einem einfachen Stanzvorgang ausgestanzt werden.From such a copper band, the contact elements described above can be punched out with a simple punching machine in a simple punching operation.

Vorteilhafte Ausgestaltungen des oben beschriebenen Kontaktelements sind, soweit im Übrigen auf die oben genannte Schaltungsanordnung, das oben genannte Kupferband übertragbar, auch als vorteilhafte Ausgestaltungen der Schaltungsanordnung bzw. des Kupferbandes anzusehen.Advantageous embodiments of the contact element described above are, as far as the above-mentioned circuit arrangement, the above-mentioned copper band transferable, also to be regarded as advantageous embodiments of the circuit arrangement and the copper strip.

Im Folgenden werden beispielhafte Ausführungsformen der Erfindung bezugnehmend auf die beiliegenden Zeichnungen näher erläutert. Es zeigen:

Figur 1
eine Schaltungsanordnung mit einem Kontaktelement gemäß einer Ausführungsform der Erfindung in einer schematischen Seitenansicht;
Figur 2
einen Abschnitt eines Kupferbandes gemäß einer Ausführungsform der Erfindung in einer schematischen Draufsicht.
In the following, exemplary embodiments of the invention are explained in more detail with reference to the accompanying drawings. Show it:
FIG. 1
a circuit arrangement with a contact element according to an embodiment of the invention in a schematic side view;
FIG. 2
a section of a copper strip according to an embodiment of the invention in a schematic plan view.

Zunächst wird auf Figur 1 verwiesen, in der ein Abschnitt einer Schaltungsanordnung SA schematisch dargestellt ist.First, it will open FIG. 1 referenced, in which a portion of a circuit arrangement SA is shown schematically.

Die Schaltungsanordnung SA umfasst einen Schaltungsträger ST1, der in dieser Ausführungsform als Keramiksubstrat ausgebildet ist. Auf einer Oberfläche OF1 des Schaltungsträgers ST1 ist eine Leiterbahn LB zur Stromübertragung angeordnet, die eine erste Schaltungskomponente der Schaltungsanordnung SA ausgebildet.The circuit arrangement SA comprises a circuit carrier ST1, which in this embodiment is designed as a ceramic substrate. On a surface OF1 of the circuit carrier ST1, a conductor track LB for current transmission is arranged, which forms a first circuit component of the circuit arrangement SA.

Auf einer dem Schaltungsträger ST1 abgewandten Oberfläche OF2 der Leiterbahn LB ist ein Leistungshalbleiterbauelement LH, wie z. B. Leistungstransistor, angeordnet, der über eine Lötverbindung LV mit der Leiterbahn LB mechanisch und elektrisch leitend verbunden ist.On a side facing away from the circuit carrier ST1 surface OF2 of the conductor LB is a power semiconductor device LH, such. B. power transistor, arranged, which is mechanically and electrically conductively connected via a solder joint LV to the conductor LB.

Auf der gleichen Oberfläche OF2 der Leiterbahn LB und neben dem Leistungshalbleiterbauelement LH ist ferner ein Kontaktelement KE angeordnet.On the same surface OF2 of the conductor LB and in addition to the power semiconductor device LH, a contact element KE is further arranged.

Das Kontaktelement KE ist L-förmig ausgebildet und weist einen ersten Kontaktbereich B1 und einen zweiten Kontaktbereich B2 auf, die zueinander senkrecht liegen. Dabei sind der erste und der zweite Kontaktbereich B1, B2 über eine elektronenstrahlgeschweißte Verbindung EV miteinander stoffschlüssig, elektrisch leitend und mechanisch stabil verbunden, die sich an der Biegekante des Kontaktelements KE zwischen den beiden Kontaktbereichen B1, B2 befindet.The contact element KE is L-shaped and has a first contact region B1 and a second contact region B2 which are perpendicular to one another. In this case, the first and the second contact region B1, B2 are connected to one another in an integrally bonded, electrically conductive and mechanically stable manner via an electron beam welded joint EV, which is located at the bending edge of the contact element KE between the two contact regions B1, B2.

Der erste Kontaktbereich B1 liegt auf der Oberfläche OF2 der Leiterbahn LB und ist über eine ultraschallgeschweißte Verbindung UV mit der Leiterbahn LB mechanisch und elektrisch leitend verbunden.The first contact area B1 lies on the surface OF2 of the conductor track LB and is mechanically and electrically conductively connected to the conductor track LB via an ultrasonically welded connection UV.

Der erste Kontaktbereich B1 besteht aus E-Kupfer (Cu-ETP) und weist eine niedrige Materialhärte kleiner als 110HV (Vickershärte) auf.The first contact area B1 consists of E copper (Cu-ETP) and has a low material hardness of less than 110HV (Vickers hardness).

Die niedrige Materialhärte bei dem ersten Kontaktbereich B1 verringert die Gefahr einer Delamination (Enthaftung, Ablösen) der Leiterbahn LB von dem Schaltungsträger ST1 bzw. eines Materialbruchs bei dem Schaltungsträger ST1.The low material hardness in the first contact region B1 reduces the risk of delamination (delamination, detachment) of the conductor track LB from the circuit carrier ST1 or a material break in the circuit carrier ST1.

Der zweite Kontaktbereich B2 ist in Form von einem Einpressstift ausgebildet und ist in eine metallisierte Durchkontaktierung DK eines weiteren Schaltungsträgers ST2 eingesteckt, der eine zweite Schaltungskomponente der Schaltungsanordnung SA ausbildet.The second contact region B2 is in the form of a press-fit pin and is plugged into a metallized through-connection DK of a further circuit carrier ST2, which forms a second circuit component of the circuit arrangement SA.

Dabei bildet der zweite Kontaktbereich B2 mit einer Metallisierung MT an der Innenwand der Durchkontaktierung DK eine kraftschlüssige Einpressverbindung PV (Press-fit-Verbindung) aus.In this case, the second contact region B2 forms with a metallization MT on the inner wall of the feedthrough DK a non-positive press-fit connection PV (press-fit connection).

Der zweite Kontaktbereich B2 besteht aus einer Zinnbronze CuSn6 mit Zinn in einem Gewichtsanteil von ca. 6 und weist eine hohe Materialhärte grösser als 130 HV und kleiner als 300 HV (Vickershärte) auf.The second contact region B2 consists of a tin bronze CuSn6 with tin in a weight fraction of about 6 and has a high material hardness greater than 130 HV and less than 300 HV (Vickers hardness).

Die hohe Materialhärte bei dem zweiten Kontaktbereich B2 ermöglicht eine stabile Einpressverbindung PV zwischen dem Kontaktelement KE und dem Schaltungsträger ST2.The high material hardness in the second contact region B2 enables a stable press-fit connection PV between the contact element KE and the circuit carrier ST2.

Nun wird auf Figur 2 verwiesen, in der ein Abschnitt eines Kupferbandes KB zur Herstellung einer Vielzahl von in Figur 1 dargestellten Kontaktelementen KE schematisch dargestellt.Now it will open FIG. 2 referenced in which a section of a copper band KB for producing a variety of in FIG. 1 illustrated contact elements KE shown schematically.

Das Kupferband KB ist als ein langes und schmales Band ausgebildet und umfasst einen ersten länglichen Streifen SR1 aus dem zuvor genannten ersten Kupfermaterial, also E-Kupfer (Cu-ETP). Ferner umfasst das Kupferband KB einen zweiten länglichen Streifen SR2 aus dem zuvor genannten zweiten Kupfermaterial, nämlich der Zinnbronze CuSn6.The copper tape KB is formed as a long and narrow band and includes a first elongated strip SR1 made of the aforementioned first copper material, that is, E copper (Cu-ETP). Further, the copper tape KB includes a second elongated strip SR2 made of the aforementioned second copper material, namely, the tin bronze CuSn6.

Dabei sind der erste und der zweite Streifen SR1, SR2 über eine elektronenstrahlgeschweißte Verbindung EV stoffschlüssig verbunden, die sich in Längsrichtung LR des ersten und des zweiten Streifens SR1, SR2 erstreckt.In this case, the first and second strips SR1, SR2 are materially connected via an electron beam welded joint EV, which extends in the longitudinal direction LR of the first and second strips SR1, SR2.

Aus diesem Kupferband KB werden die Kontaktelemente KE eins nach dem Anderen in dessen Längsrichtung LR ausgestanzt, wobei die aus dem Bereich des ersten Streifens SR1 gestanzten Abschnitte die jeweiligen ersten Kontaktbereiche B1 der Kontaktelemente KE und die aus dem Bereich des zweiten Streifens SR2 gestanzten Abschnitte die jeweiligen zweiten Kontaktbereiche B2 der Kontaktelemente KE ausbilden.The contact elements KE one after another are punched out of this copper strip KB in the longitudinal direction LR thereof, the sections stamped out of the area of the first strip SR1 denoting the respective first contact areas B1 of the contact elements KE and the sections punched out of the area of the second strip SR2 form second contact areas B2 of the contact elements KE.

Anschließend werden die ausgestanzten Kontaktelemente KE an der elektronenstrahlgeschweißten Verbindung EV L-förmig gebogen.Subsequently, the punched-out contact elements KE are bent at the electron beam welded joint EV L-shaped.

Damit können die Kontaktelemente KE in einfachen Fertigungsschritten als Massenware kostengünstig hergestellt werden.Thus, the contact elements KE can be produced inexpensively in simple manufacturing steps as a mass-produced.

Claims (8)

  1. Circuit arrangement (SA), comprising
    - a first circuit component (LB),
    - a second circuit component (ST2),
    - a contact element (KE) for an electrical connection, with
    • a first contact region (B1) of a first copper material for electrically connecting to a first circuit component (LB),
    • a second contact region (B2) of a second copper material for electrically connecting to a second circuit component (ST2),
    • wherein the first (B1) and second (B2) contact regions have different material hardnesses, and are interconnected by a materially bonded connection (EV);
    characterized in that
    - the first copper material has a material hardness of up to 110 HV;
    - the second copper material has a material hardness of 130 HV to 300 HV; and
    - the first contact region (B1) of Circuit arrangement (SA) is connected to the first circuit component (LB) in an electrically conductive and mechanically stable arrangement, by means of a bonded connection (UV), and the second contact region (B2) of Circuit arrangement (SA) is connected to the second circuit component (ST2) in an electrically conductive and mechanically stable arrangement, by means of a friction-locked connection (PV) .
  2. Circuit arrangement (SA) according to Claim 1, wherein the first copper material has a material hardness of up to 95 HV.
  3. Circuit arrangement (SA) according to Claim 1 or 2, wherein the first copper material is a tough-pitch electrolytic copper (Cu-ETP)
  4. Circuit arrangement (SA) according to one of the preceding claims, wherein the second copper material has a material hardness of 170 to 200 HV.
  5. Circuit arrangement (SA) according to one of the preceding claims, wherein the second copper material contains tin.
  6. Circuit arrangement (SA) according to Claim 5, wherein the second copper material contains a percentage by weight of tin of 5 to 7.
  7. Circuit arrangement (SA) according to one of the preceding claims, wherein the first (B1) and the second (B2) contact regions are mutually bonded in an electrically conductive and mechanical manner by an electron beam welded joint (EV).
  8. Circuit arrangement (SA) according to one of the preceding claims, wherein the first contact region (B1) of Circuit arrangement (SA) is connected to the first circuit component (LB) in an electrically conductive and mechanically stable arrangement, by means of an ultrasound welded joint or soldered joint, and the second contact region (B2) of Circuit arrangement (SA) is connected to the second circuit component (ST2) in an electrically conductive and mechanically stable arrangement, by means of a press-fit connection.
EP15718369.0A 2014-04-30 2015-04-28 Contact element for an electric connection, copper strip for producing a plurality of contact elements Active EP3138161B1 (en)

Applications Claiming Priority (2)

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DE102014208226.9A DE102014208226B4 (en) 2014-04-30 2014-04-30 Contact element, circuit arrangement with such a contact element and copper tape for producing a plurality of contact elements
PCT/EP2015/059229 WO2015165914A1 (en) 2014-04-30 2015-04-28 Contact element for an electric connection, copper strip for producing a plurality of contact elements

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US9991618B2 (en) 2018-06-05
ES2703211T3 (en) 2019-03-07
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US20170054235A1 (en) 2017-02-23
WO2015165914A1 (en) 2015-11-05
DE102014208226B4 (en) 2020-07-23
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DE102014208226A1 (en) 2015-11-05
EP3138161A1 (en) 2017-03-08

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