[go: up one dir, main page]

EP3138161A1 - Contact element for an electric connection, copper strip for producing a plurality of contact elements - Google Patents

Contact element for an electric connection, copper strip for producing a plurality of contact elements

Info

Publication number
EP3138161A1
EP3138161A1 EP15718369.0A EP15718369A EP3138161A1 EP 3138161 A1 EP3138161 A1 EP 3138161A1 EP 15718369 A EP15718369 A EP 15718369A EP 3138161 A1 EP3138161 A1 EP 3138161A1
Authority
EP
European Patent Office
Prior art keywords
contact
copper
contact element
connection
copper material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP15718369.0A
Other languages
German (de)
French (fr)
Other versions
EP3138161B1 (en
Inventor
Olivier POLA
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aumovio Microelectronic GmbH
Original Assignee
Conti Temic Microelectronic GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Conti Temic Microelectronic GmbH filed Critical Conti Temic Microelectronic GmbH
Publication of EP3138161A1 publication Critical patent/EP3138161A1/en
Application granted granted Critical
Publication of EP3138161B1 publication Critical patent/EP3138161B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H01R12/585—Terminals having a press fit or a compliant portion and a shank passing through a hole in the printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0207—Ultrasonic-, H.F.-, cold- or impact welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending

Definitions

  • the present invention relates to a contact element for electrical connection and a circuit arrangement with at least one said contact element. Furthermore, the invention relates to a copper strip for producing a plurality of said contact elements.
  • Circuit arrangements include circuit components of different types and designs, such as. B. circuit board, conductors, power components or sockets. These circuit components must be electrically connected to each other so that the circuits can perform certain functions. For this purpose, the circuit arrangements have contact elements which are provided for the formation of stable electrical connections between circuit components.
  • a contact element for electrical connection comprises a first contact region of a first, electrically conductive copper material (copper or copper alloy) for electrical connection to a first circuit component.
  • the compact member further includes a second contact region of a second electrically conductive copper material (copper or copper alloy) for electrical connection to a second circuit component.
  • the first and the second contact area have different material hardnesses.
  • the first and the second contact region are connected to one another via a material connection.
  • contact area consists of a copper material
  • the phrase "contact area consists of a copper material” means that the respective contact area contains the corresponding end of a copper material in the predominant weight percent ⁇ share Accordingly, there is a contact element almost entirely of a copper material, except for manufacturing ⁇ technically related material impurities or material additives. which protect the contact element from external influences, such as corrosion by moisture, or from material fatigue.
  • the term “material hardness” primarily means a mechanical resistance of a material forming the aforementioned first or second copper material, Contrary to the generally accepted distinction to the term “strength”, the term “material hardness” in this application also secondarily includes strength of the material mean, which is a Wi ⁇ derstandsever of the material, that is the first or the second copper material against mechanical deformation and separation.
  • the text section that "the first and the second contact area are connected to each other via a cohesive connection” means in this application that the two contact areas not necessarily adjacent to each other at the location of cohesive connection, but that between the two contact areas quite a section of the Contact ⁇ elements may be present, through which the cohesive connection extends and over which the two contact areas are connected to each other cohesively.
  • the first and second contact areas on the respective contacting side do not exclusively comprise surfaces which are completely contacted, but may also have free surfaces which are not contacted.
  • the two contact areas extend in relation to each other
  • the longitudinal direction of the contact element flush wherein the longitudinal direction is transverse or oblique to the direction of the cohesive connection.
  • the invention is based on the idea that to form an electrical connection between two circuit components with different connection methods a contact element with contact areas for forming the electrical connections to the respective two circuit components is required, in which the two contact areas must meet different mechanical and material requirements, which presuppose different connection methods.
  • the contact element is formed with two contact areas with different materials, then these two contact areas must be connected to one another mechanically and electrically conductively, so that a stable electrical connection can be ensured between the two circuit components, which electrically connects the contact element.
  • Copper materials ie copper or copper alloy, have proven in the context of this invention as the materials for contact areas, which both have a high electrical conductivity and are optimally suited for a cohesive connection. Since the copper materials are generally available at low cost, contact elements with contact areas with different copper materials can be produced cost-effectively.
  • the first copper material has a material hardness up to 110 HV, in particular up to 100 HV, especially up to 95 HV.
  • the hardness unit "HV" means the Vickers hardness.
  • the copper material with a low material hardness up to 110 HV, or 100 HV or 95 HV allows the first contact area to form a material connection with the first circuit component, without mechanically affecting the first circuit component too much.
  • the first copper material is a raw copper according to standard DIN EN 1976/98.
  • the first copper material is a toughened electrolyte copper.
  • the first copper material is a Cu-ETP ("Electrolytic-Tough").
  • the copper-ETP also known as E-Cu, formerly known as E-Cu58 or E-Cu57, is an oxygenated (toughened) copper produced by electrolytic refining that has a very high conductivity for heat and electricity and thus is best suited for a contact ⁇ element.
  • the second copper material has a material hardness of at least 130 HV, in particular at least 150 HV, or preferably above 170 HV.
  • the second copper material a Mate ⁇ rialhärte of not more than 300 HV, more preferably not more than 250 HV, and preferably not more than 200 HV.
  • the second copper material contains tin, preferably with a weight percentage of over 0.15%, in particular over 1%, especially over 5%.
  • the second copper material contains tin at a weight percentage of up to 22%, especially up to 20%, up to 15%, up to 12%, up to 10% or up to 9%, especially up to 7%.
  • the second copper material is a tin bronze, especially CuSn6. Tin bronze is also available as a low-cost mass-produced item in various designs.
  • additives such as. As magnesium, nickel, zinc and / or silicon, may be contained in the second copper material.
  • copper alloys can be used as the second copper material that are suitable for forming press-fit connections. These include, for example, CuSnO.15, CuSn4, CuSn5, CuSn6, CuMg, CuSn3Zn9, CuNiSi.
  • the first and the second contact region via a electron beam welded connection with each other are cohesively ver ⁇ tied.
  • An electron beam welded joint between the two contact areas of different copper materials has an electrical contact resistance which is lower than the electrical resistance in the two contact areas.
  • the electron beam welded connection allows a mechanically very stable connection between the two contact areas.
  • a scarf ⁇ tion arrangement comprises a first circuit component and a second circuit component. Furthermore, the circuit arrangement comprises at least one contact element described above.
  • the first contact region of the contact element via a material locking connection ⁇ , esp. An ultrasonic welding or solder joint, electrically connected to the first circuit component conductive and mechanically stable connected.
  • the second contact ⁇ region of the contact element is electrically connected via a frictional connection, esp. A press-fit (press-fit connection), with the second circuit component and mechanically stable.
  • the copper strip comprises a first elongated strip of a first copper material and a second elongated strip of a second copper material.
  • the copper strip also has a material connection extending in the longitudinal direction of the first and second strips.
  • about the cohesive connection of the first and the second strip are material ⁇ conclusive, electrically conductive and mechanically stable connected.
  • the cohesive connection is formed as an electron beam welded joint. From such a copper band, the contact elements described above can be punched out with a simple punching machine in a simple punching operation.
  • Figure 1 shows a circuit arrangement with a contact element according to an embodiment of the invention in a schematic side view
  • Figure 2 shows a portion of a copper strip according to a
  • the circuit arrangement SA comprises a circuit carrier ST1, which in this embodiment is designed as a ceramic substrate. On a surface OF1 of the circuit substrate STl, a conductor track LB for current transmission is arranged, which forms a first circuit component of the circuit arrangement SA.
  • a power semiconductor device LH On a side facing away from the circuit carrier STL surface OF2 of the conductor LB is a power semiconductor device LH, such. B. power transistor, arranged, which is mechanically and electrically conductively connected via a solder joint LV to the conductor LB.
  • a contact element KE On the same surface OF2 of the conductor LB and in addition to the power semiconductor device LH, a contact element KE is further arranged.
  • the contact element KE is L-shaped and has a first contact area Bl and a second contact area B2, which are perpendicular to each other.
  • the first and second contact portions Bl, B2 via a elektronenstrahlge- welded connection EV are integrally with each other in an electrically conductive and mechanically stable manner, which is located on the bending edge of the contact element KE between the two Kon ⁇ clock domains Bl, B2.
  • the first contact area Bl lies on the surface OF2 of the conductor track LB and is mechanically and electrically conductively connected to the conductor track LB via an ultrasound-welded connection UV.
  • the first contact area Bl consists of E copper (Cu-ETP) and has a low material hardness of less than 100HV (Vickers hardness).
  • the low material hardness at the first contact area Bl reduces the risk of delamination (delamination, detachment) of the interconnect LB from the circuit carrier ST1 or a material fracture at the circuit carrier ST1.
  • the second contact portion B2 is in the form of a press-fit pin and is inserted into a metallized via contact DK a further circuit carrier ST2, which forms a second circuit component of the circuit arrangement SA from ⁇ .
  • the second contact region B2 with a Metalli ⁇ tion MT on the inner wall of the feedthrough DK forms a non-positive press-fit connection PV (press-fit connection).
  • the second contact region B2 consists of a tin bronze CuSn6 with tin in a weight fraction of about 6 and has a high material hardness greater than 130 HV (Vickers hardness).
  • the high material hardness in the second contact region B2 enables a stable press-fit connection PV between the contact element KE and the circuit carrier ST2.
  • FIG. 2 a section of a copper strip KB for the production of a plurality of contact elements KE shown in FIG. 1 is shown schematically.
  • the copper tape KB is formed as a long and narrow band and includes a first elongated strip SRI made of the aforementioned first copper material, that is, E copper (Cu-ETP). Further, the copper tape KB includes a second elongated strip SR2 made of the aforementioned second copper material, namely, the tin bronze CuSn6.
  • the first and second strips SRI, SR2 are materially connected via an electron-beam welded joint EV, which extends in the longitudinal direction LR of the first and second strips SRI, SR2.
  • the contact elements KE one after the other in the longitudinal direction LR are punched out of this copper band KB, the sections punched out of the area of the first strip SRI denoting the respective first contact areas Bl of the contact elements KE and the sections stamped out of the area of the second strip SR2 form second contact areas B2 of the con ⁇ tact elements KE.
  • the punched-out contact elements KE are bent at the electron beam welded joint EV L-shaped.
  • the contact elements KE can be produced inexpensively in simple manufacturing ⁇ steps as a commodity.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Contacts (AREA)

Abstract

The invention relates to a contact element (KE) for an electric connection, comprising: a first contact region (B1) made of a first copper material for electrically connecting to a first circuit component (LB) and comprising a second contact region (B2) made of a second copper material for electrically connecting to a second circuit component (ST2), said first (B1) and second (B2) contact region having a different material hardness and being connected to each other via a bonded connection. The invention further relates to a copper strip (KB) for producing a plurality of said contact elements (KE). Such contact elements can be produced from the aforementioned copper strip in an inexpensive manner.

Description

Beschreibung description

Kontaktelement für elektrische Verbindung, Kupferband zur Herstellung einer Vielzahl von Kontaktelementen Contact element for electrical connection, copper strip for producing a plurality of contact elements

Die vorliegende Erfindung betrifft ein Kontaktelement für elektrische Verbindung sowie eine Schaltungsanordnung mit zumindest einem genannten Kontaktelement. Ferner betrifft die Erfindung ein Kupferband zur Herstellung einer Vielzahl von genannten Kontaktelementen. The present invention relates to a contact element for electrical connection and a circuit arrangement with at least one said contact element. Furthermore, the invention relates to a copper strip for producing a plurality of said contact elements.

Schaltungsanordnungen umfassen Schaltungskomponenten unterschiedlicher Typen und Ausführungen, wie z. B. Schaltungsträger, Leiterbahnen, Leistungsbauelemente oder Steckbuchsen. Diese Schaltungskomponenten müssen die miteinander elektrisch verbunden sein, damit die Schaltungsanordnungen bestimmte Funktionen durchführen können. Hierzu weisen die Schaltungsanordnungen Kontaktelemente, die zur Bildung stabiler elektrischer Verbindungen zwischen Schaltungskomponenten vorgesehen sind. Circuit arrangements include circuit components of different types and designs, such as. B. circuit board, conductors, power components or sockets. These circuit components must be electrically connected to each other so that the circuits can perform certain functions. For this purpose, the circuit arrangements have contact elements which are provided for the formation of stable electrical connections between circuit components.

Elektrische Verbindungen mit den unterschiedlichen Schaltungskomponenten erfordern entsprechend unterschiedliche Verbindungsmethoden, die wiederum unterschiedliche mechanische Anforderungen voraussetzen. Die Kontaktelemente müssen daher derart ausgeführt sein, dass diese unterschiedliche mechanische Anforderungen erfüllen. Electrical connections with the different circuit components require correspondingly different connection methods, which in turn require different mechanical requirements. The contact elements must therefore be designed such that they meet different mechanical requirements.

Wie in technischen Vorrichtungen üblich, gibt es zudem Anforderungen, die elektrischen Verbindungen zwischen den As usual in technical devices, there are also requirements that electrical connections between the

Schaltungskomponenten in einfacher Weise kostengünstig zu gestalten . To make circuit components in a simple manner cost.

Damit besteht die Aufgabe der vorliegenden Erfindung darin, eine Möglichkeit bereitzustellen, die einfache und kostengünstige elektrische Verbindungen zwischen Schaltungskomponenten ermöglicht . Diese Aufgabe wird durch Gegenstände der unabhängigen Ansprüche gelöst. Vorteilhafte Ausgestaltungen sind Gegenstand der Un¬ teransprüche . Gemäß einem ersten Aspekt der Erfindung wird ein Kontaktelement für elektrische Verbindung bereitgestellt. Das Kontaktelement umfasst einen ersten Kontaktbereich aus einem ersten, elektrisch leitenden Kupfermaterial (Kupfer oder Kupferlegierung) zur elektrischen Verbindung zu einer ersten Schaltungskomponente. Das Kompaktelement umfasst ferner einen zweiten Kontaktbereich aus einem zweiten elektrisch leitenden Kupfermaterial (Kupfer oder Kupferlegierung) zur elektrischen Verbindung zu einer zweiten Schaltungskomponente. Dabei weisen der erste und der zweite Kontaktbereich unterschiedliche Materialhärten auf. Ferner sind der erste und der zweite Kontaktbereich über eine Stoffschlüssige Verbindung miteinander verbunden. Thus, the object of the present invention is to provide a way that enables simple and inexpensive electrical connections between circuit components. This object is solved by subject matters of the independent claims. Advantageous embodiments are the subject of Un ¬ teransprüche. According to a first aspect of the invention, a contact element for electrical connection is provided. The contact element comprises a first contact region of a first, electrically conductive copper material (copper or copper alloy) for electrical connection to a first circuit component. The compact member further includes a second contact region of a second electrically conductive copper material (copper or copper alloy) for electrical connection to a second circuit component. In this case, the first and the second contact area have different material hardnesses. Furthermore, the first and the second contact region are connected to one another via a material connection.

Hierbei bedeutet der Satz: „ein Kontaktbereich besteht aus einem Kupfermaterial", dass der jeweilige Kontaktbereich das ent- sprechende Kupfermaterial im überwiegenden Gewichtsprozent¬ anteil enthält. Demnach besteht ein Kontaktelement nahezu vollständig aus einem Kupfermaterial, bis auf fertigungs¬ technisch bedingte Materialverunreinigungen oder Materialzusätze, die das Kontaktelement vor äußeren Einflüssen, wie z. B. Korrosion durch Feuchtigkeit, oder vor Materialermüdung schützen . Here, the phrase "contact area consists of a copper material" means that the respective contact area contains the corresponding end of a copper material in the predominant weight percent ¬ share Accordingly, there is a contact element almost entirely of a copper material, except for manufacturing ¬ technically related material impurities or material additives. which protect the contact element from external influences, such as corrosion by moisture, or from material fatigue.

Der Begriff „Materialhärte" bedeutet primär einen mechanischen Widerstand eines Werkstoffs, der das zuvor genannte erste oder das zuvor genannte zweite Kupfermaterial ausbildet. Entgegen der allgemein erachteten Unterscheidung zu dem Begriff „Festigkeit" kann der Begriff „Materialhärte" in dieser Anmeldung sekundär auch eine Festigkeit des Werkstoffs bedeuten, die eine Wi¬ derstandsfähigkeit des Werkstoffs, also des ersten oder des zweiten Kupfermaterials, gegenüber mechanische Verformung und Trennung darstellt. Der Textabschnitt, dass „der erste und der zweite Kontaktbereich über eine Stoffschlüssige Verbindung miteinander verbunden sind", bedeutet in dieser Anmeldung, dass die beiden Kontaktbereiche zueinander nicht zwangsläufig an der Stelle der stoffschlüssigen Verbindung angrenzen, sondern dass zwischen den beiden Kontaktbereichen durchaus ein Abschnitt des Kontakt¬ elements vorhanden sein kann, durch den sich die Stoffschlüssige Verbindung erstreckt und über den die beiden Kontaktbereiche miteinander stoffschlüssig verbunden sind. The term "material hardness" primarily means a mechanical resistance of a material forming the aforementioned first or second copper material, Contrary to the generally accepted distinction to the term "strength", the term "material hardness" in this application also secondarily includes strength of the material mean, which is a Wi ¬ derstandsfähigkeit of the material, that is the first or the second copper material against mechanical deformation and separation. The text section that "the first and the second contact area are connected to each other via a cohesive connection" means in this application that the two contact areas not necessarily adjacent to each other at the location of cohesive connection, but that between the two contact areas quite a section of the Contact ¬ elements may be present, through which the cohesive connection extends and over which the two contact areas are connected to each other cohesively.

Der erste und der zweite Kontaktbereich umfassen auf der jeweiligen kontaktierenden Seite nicht ausschließlich Flächen, die vollständig kontaktiert werden, sondern können auch freie Flächen aufweisen, die nicht kontaktiert sind. Insbesondere erstrecken sich die beiden Kontaktbereiche zueinander inThe first and second contact areas on the respective contacting side do not exclusively comprise surfaces which are completely contacted, but may also have free surfaces which are not contacted. In particular, the two contact areas extend in relation to each other

Längsrichtung des Kontaktelements flächenbündig, wobei die Längsrichtung quer bzw. schräg zur Verlaufsrichtung der stoffschlüssigen Verbindung liegt. Der Erfindung liegt der Gedanke zugrunde, dass zur Bildung elektrischer Verbindung zwischen zwei Schaltungskomponenten mit unterschiedlichen Verbindungsmethoden ein Kontaktelement mit Kontaktbereichen zur Bildung der elektrischen Verbindungen zu den jeweiligen zwei Schaltungskomponenten erforderlich ist, bei dem die beiden Kontaktbereiche unterschiedliche mechanische und materielle Anforderungen erfüllen müssen, welche die unterschiedlichen Verbindungsmethoden voraussetzen. The longitudinal direction of the contact element flush, wherein the longitudinal direction is transverse or oblique to the direction of the cohesive connection. The invention is based on the idea that to form an electrical connection between two circuit components with different connection methods a contact element with contact areas for forming the electrical connections to the respective two circuit components is required, in which the two contact areas must meet different mechanical and material requirements, which presuppose different connection methods.

Damit die beiden Kontaktbereiche diese unterschiedlichen An- forderungen erfüllen können, müssen diese unterschiedliche Materialien aufweisen, die den entsprechenden Anforderungen genügen . In order for the two contact areas to be able to fulfill these different requirements, they must have different materials which satisfy the corresponding requirements.

Wird das Kontaktelement mit zwei Kontaktbereichen mit unter- schiedlichen Materialien ausgebildet, so müssen diese beiden Kontaktbereiche miteinander mechanisch und elektrisch leitend verbunden sein, damit eine stabile elektrische Verbindung zwischen den beiden Schaltungskomponenten sichergestellt werden kann, die das Kontaktelement miteinander elektrisch verbindet. If the contact element is formed with two contact areas with different materials, then these two contact areas must be connected to one another mechanically and electrically conductively, so that a stable electrical connection can be ensured between the two circuit components, which electrically connects the contact element.

Eine mögliche Lösung, bei der die beiden Kontaktbereiche zunächst als separate Bauteile aus unterschiedlichen elektrisch leitenden Materialien hergestellt und anschließend miteinander bspw. mittels Schrauben fixiert werden, erwies sich als aufwendig und kostenintensiv. Damit die elektrischen Verbindungen zwischen Schaltungskomponenten einfach und kostengünstig gestaltet werden können, müssen die Kontaktelemente als Massenware kostengünstig und ohne großen Aufwand herstellbar sein. Im Rahmen dieser Erfindung wurde erkannt, dass eine stoff¬ schlüssige Verbindung zwischen den beiden Kontaktbereichen eines Kontaktelements eine einfache und kostengünstige Lösung dar¬ stellt. Eine Stoffschlüssige Verbindung ermöglicht eine stabile me¬ chanische Verbindung von Kontaktbereichen aus unterschiedlichen Materialien, die zudem einen sehr niedrigen Übergangswiderstand an der Verbindungsstelle aufweist. Kupfermaterialien, also Kupfer oder Kupferlegierung, erwiesen sich im Rahmen dieser Erfindung als die Materialien für Kontaktbereiche, die sowohl eine hohe elektrische Leitfähigkeit aufweisen als auch für eine Stoffschlüssige Verbindung optimal geeignet sind. Da die Kupfermaterialien in der Regel kosten- günstig erhältlich sind, können auch Kontaktelemente mit Kontaktbereichen mit unterschiedlichen Kupfermaterialien kostengünstig hergestellt werden. One possible solution, in which the two contact areas are first produced as separate components made of different electrically conductive materials and then subsequently fixed to one another by means of screws, for example, proved to be complicated and cost-intensive. Thus, the electrical connections between circuit components can be made simple and inexpensive, the contact elements must be mass-produced inexpensively and easily. In this invention, it was recognized that a material ¬ positive connection between the two contact portions of a contact element a simple and cost-effective solution ¬ represents. A cohesive connection enables a stable me ¬ chanische connection of contact areas of different materials, which also has a very low contact resistance at the junction. Copper materials, ie copper or copper alloy, have proven in the context of this invention as the materials for contact areas, which both have a high electrical conductivity and are optimally suited for a cohesive connection. Since the copper materials are generally available at low cost, contact elements with contact areas with different copper materials can be produced cost-effectively.

Damit wurde ein Kontaktelement für elektrische Verbindung bereitgestellt, die einfache und kostengünstige elektrische Verbindungen zwischen Schaltungskomponenten ermöglicht. Gemäß einer bevorzugten Ausgestaltung weist das erste Kupfermaterial eine Materialhärte bis 110 HV, insbesondere bis 100 HV, speziell bis 95 HV, auf. Hierbei bedeutet die Härteeinheit „HV" die Vickershärte . Thus, a contact element for electrical connection has been provided which enables simple and inexpensive electrical connections between circuit components. According to a preferred embodiment, the first copper material has a material hardness up to 110 HV, in particular up to 100 HV, especially up to 95 HV. Here, the hardness unit "HV" means the Vickers hardness.

Das Kupfermaterial mit einer geringen Materialhärte bis 110 HV, oder 100 HV bzw. 95 HV ermöglicht dem ersten Kontaktbereich zur Bildung einer stoffschlüssigen Verbindung mit der ersten Schaltungskomponente, ohne dabei die erste Schaltungskomponente mechanisch viel zu stark zu beeinflussen. The copper material with a low material hardness up to 110 HV, or 100 HV or 95 HV allows the first contact area to form a material connection with the first circuit component, without mechanically affecting the first circuit component too much.

Vorzugsweise ist das erste Kupfermaterial ein Roh-Kupfer nach Norm DIN EN 1976/98. Insbesondere ist das erste Kupfermaterial ein zähgepoltes Elektrolytkupfer. Vorzugsweise ist das erste Kupfermaterial ein Cu-ETP (in Englisch „Electrolytic-Tough-Preferably, the first copper material is a raw copper according to standard DIN EN 1976/98. In particular, the first copper material is a toughened electrolyte copper. Preferably, the first copper material is a Cu-ETP ("Electrolytic-Tough").

Pitch Copper") . Das Cu-ETP, das im Übrigens auch als E-Cu, ehemals auch als E-Cu58 oder E-Cu57 bezeichnet wurde, ist ein durch elektrolytische Raffination hergestelltes, sauerstoffhaltiges (zähgepoltes) Kupfer, das eine sehr hohe Leitfähigkeit für Wärme und Elektrizität aufweist und somit bestens für ein Kontakt¬ element geeignet ist. The copper-ETP, also known as E-Cu, formerly known as E-Cu58 or E-Cu57, is an oxygenated (toughened) copper produced by electrolytic refining that has a very high conductivity for heat and electricity and thus is best suited for a contact ¬ element.

Gemäß einer weiteren bevorzugten Ausgestaltung weist das zweite Kupfermaterial eine Materialhärte von mindestens 130 HV, insbesondere mindestens 150 HV, oder vorzugsweise über 170 HV auf. Vorzugsweise weist das zweite Kupfermaterial eine Mate¬ rialhärte von nicht mehr als 300 HV, insbesondere nicht mehr als 250 HV, und vorzugsweise nicht mehr als 200 HV auf. Das Kupfermaterial mit einer hohen Materialhärte von über 130 HV oder von 130-300 HV, speziell von 170 HV bis 200 HV, ermöglicht dem zweiten Kontaktbereich zur Bildung einer einfachen kraftschlüssigen Verbindung, bspw. einer Einpressverbindung ( Press-Fit-Verbindung) , mit der zweiten Schaltungskomponente, die auch eine starke mechanische Beanspruchung standhält. According to a further preferred embodiment, the second copper material has a material hardness of at least 130 HV, in particular at least 150 HV, or preferably above 170 HV. Preferably, the second copper material a Mate ¬ rialhärte of not more than 300 HV, more preferably not more than 250 HV, and preferably not more than 200 HV. The copper material with a high material hardness of more than 130 HV or 130-300 HV, especially from 170 HV to 200 HV, allows the second contact area to form a simple frictional connection, for example. Press-fit connection, with the second circuit component, which also withstands a strong mechanical stress.

Gemäß noch einer weiteren bevorzugten Ausgestaltung enthält das zweite Kupfermaterial Zinn, vorzugsweise mit einem Gewichts- prozentanteil von über 0.15%, insbesondere über 1%, speziell über 5% . Vorzugsweise enthält das zweite Kupfermaterial Zinn mit einem Gewichtsprozentanteil von bis 22%, insbesondere bis 20%, bis 15%, bis 12%, bis 10% oder bis 9%, speziell bis 7%. Vorzugsweise ist das zweite Kupfermaterial eine Zinnbronze, speziell CuSn6. Zinnbronze ist ebenfalls als kostengünstige Massenware in verschiedenen Ausführungen erhältlich. According to yet another preferred embodiment, the second copper material contains tin, preferably with a weight percentage of over 0.15%, in particular over 1%, especially over 5%. Preferably, the second copper material contains tin at a weight percentage of up to 22%, especially up to 20%, up to 15%, up to 12%, up to 10% or up to 9%, especially up to 7%. Preferably, the second copper material is a tin bronze, especially CuSn6. Tin bronze is also available as a low-cost mass-produced item in various designs.

Zusätzlich zu oder anstelle von Zinn können auch andere Zusätze, wie z. B. Magnesium, Nickel, Zink und/oder Silicium, in dem zweiten Kupfermaterial enthalten sein. In addition to or instead of tin, other additives, such as. As magnesium, nickel, zinc and / or silicon, may be contained in the second copper material.

Insbesondere können Kupferlegierungen als das zweite Kupfermaterial verwendet werden, die zur Bildung von Einpressver- bindungen (Press-fit Anschlüsse) geeignet sind. Hierzu gehören bspw. CuSn0.15, CuSn4, CuSn5, CuSn6, CuMg, CuSn3Zn9, CuNiSi. In particular, copper alloys can be used as the second copper material that are suitable for forming press-fit connections. These include, for example, CuSnO.15, CuSn4, CuSn5, CuSn6, CuMg, CuSn3Zn9, CuNiSi.

Gemäß noch einer weiteren bevorzugten Ausgestaltung sind der erste und der zweite Kontaktbereich über eine elektronen- strahlgeschweißte Verbindung miteinander stoffschlüssig ver¬ bunden . According to yet another preferred embodiment, the first and the second contact region via a electron beam welded connection with each other are cohesively ver ¬ tied.

Eine elektronenstrahlgeschweißte Verbindung zwischen den beiden Kontaktbereichen aus unterschiedlichen Kupfermaterialien weist einen elektrischen Übergangswiderstand auf, der niedriger als der elektrische Widerstand in den beiden Kontaktbereichen ist. Zudem ermöglicht die elektronenstrahlgeschweißte Verbindung eine mechanisch sehr stabile Verbindung zwischen den beiden Kontaktbereichen . An electron beam welded joint between the two contact areas of different copper materials has an electrical contact resistance which is lower than the electrical resistance in the two contact areas. In addition, the electron beam welded connection allows a mechanically very stable connection between the two contact areas.

Gemäß einem weiteren Aspekt der Erfindung wird eine Schal¬ tungsanordnung bereitgestellt. Dabei umfasst die Schaltungs¬ anordnung eine erste Schaltungskomponente und eine zweite Schaltungskomponente. Ferner umfasst die Schaltungsanordnung zumindest ein zuvor beschriebenes Kontaktelement. Dabei ist der erste Kontaktbereich des Kontaktelements über eine stoff¬ schlüssige Verbindung, insb. eine Ultraschallschweiß- oder Lötverbindung, mit der ersten Schaltungskomponente elektrisch leitend und mechanisch stabil verbunden. Der zweite Kontakt¬ bereich des Kontaktelements ist über eine kraftschlüssige Verbindung, insb. eine Einpressverbindung (Press-fit Verbindung) , mit der zweiten Schaltungskomponente elektrisch leitend und mechanisch stabil verbunden. According to a further aspect of the invention, a scarf ¬ tion arrangement is provided. In this case, the circuit ¬ arrangement comprises a first circuit component and a second circuit component. Furthermore, the circuit arrangement comprises at least one contact element described above. Here, the first contact region of the contact element via a material locking connection ¬, esp. An ultrasonic welding or solder joint, electrically connected to the first circuit component conductive and mechanically stable connected. The second contact ¬ region of the contact element is electrically connected via a frictional connection, esp. A press-fit (press-fit connection), with the second circuit component and mechanically stable.

Gemäß noch einem weiteren Aspekt der Erfindung wird ein Kupferband zur Herstellung einer Vielzahl von zuvor beschriebenen Kontaktelementen bereitgestellt. Dabei umfasst das Kupferband einen ersten länglichen Streifen aus einem ersten Kupfermaterial und einen zweiten länglichen Streifen aus einem zweiten Kupfermaterial. Das Kupferband weist ferner eine stoffschlüssige Verbindung auf, die sich in Längsrichtung des ersten und des zweiten Streifens erstreckt. Über die Stoffschlüssige Verbindung sind der erste und der zweite Streifen miteinander stoff¬ schlüssig, elektrisch leitend und mechanisch stabil verbunden. Vorzugsweise ist die Stoffschlüssige Verbindung als eine elektronenstrahlgeschweißte Verbindung ausgebildet. Aus einem derartigen Kupferband können die zuvor beschriebenen Kontaktelemente mit einer einfachen Stanzmaschine in einem einfachen Stanzvorgang ausgestanzt werden. According to yet another aspect of the invention, there is provided a copper tape for making a plurality of previously described contact elements. In this case, the copper strip comprises a first elongated strip of a first copper material and a second elongated strip of a second copper material. The copper strip also has a material connection extending in the longitudinal direction of the first and second strips. About the cohesive connection of the first and the second strip are material ¬ conclusive, electrically conductive and mechanically stable connected. Preferably, the cohesive connection is formed as an electron beam welded joint. From such a copper band, the contact elements described above can be punched out with a simple punching machine in a simple punching operation.

Vorteilhafte Ausgestaltungen des oben beschriebenen Kontakt- elements sind, soweit im Übrigen auf die oben genannte Advantageous embodiments of the above-described contact elements are, as far as the above-mentioned

Schaltungsanordnung, das oben genannte Kupferband übertragbar, auch als vorteilhafte Ausgestaltungen der Schaltungsanordnung bzw. des Kupferbandes anzusehen. Im Folgenden werden beispielhafte Ausführungsformen der Erfindung bezugnehmend auf die beiliegenden Zeichnungen näher erläutert. Es zeigen:  Circuit arrangement, the above-mentioned copper band transferable, also to be regarded as advantageous embodiments of the circuit arrangement and the copper strip. In the following, exemplary embodiments of the invention are explained in more detail with reference to the accompanying drawings. Show it:

Figur 1 eine Schaltungsanordnung mit einem Kontaktelement gemäß einer Ausführungsform der Erfindung in einer schematischen Seitenansicht; Figur 2 einen Abschnitt eines Kupferbandes gemäß einerFigure 1 shows a circuit arrangement with a contact element according to an embodiment of the invention in a schematic side view; Figure 2 shows a portion of a copper strip according to a

Ausführungsform der Erfindung in einer schematischen Draufsicht . Zunächst wird auf Figur 1 verwiesen, in der ein Abschnitt einer Schaltungsanordnung SA schematisch dargestellt ist. Embodiment of the invention in a schematic plan view. Reference is first made to Figure 1, in which a portion of a circuit arrangement SA is shown schematically.

Die Schaltungsanordnung SA umfasst einen Schaltungsträger STl, der in dieser Ausführungsform als Keramiksubstrat ausgebildet ist. Auf einer Oberfläche OF1 des Schaltungsträgers STl ist eine Leiterbahn LB zur Stromübertragung angeordnet, die eine erste Schaltungskomponente der Schaltungsanordnung SA ausgebildet. The circuit arrangement SA comprises a circuit carrier ST1, which in this embodiment is designed as a ceramic substrate. On a surface OF1 of the circuit substrate STl, a conductor track LB for current transmission is arranged, which forms a first circuit component of the circuit arrangement SA.

Auf einer dem Schaltungsträger STl abgewandten Oberfläche OF2 der Leiterbahn LB ist ein Leistungshalbleiterbauelement LH, wie z. B. Leistungstransistor, angeordnet, der über eine Lötverbindung LV mit der Leiterbahn LB mechanisch und elektrisch leitend verbunden ist. Auf der gleichen Oberfläche OF2 der Leiterbahn LB und neben dem Leistungshalbleiterbauelement LH ist ferner ein Kontaktelement KE angeordnet. On a side facing away from the circuit carrier STL surface OF2 of the conductor LB is a power semiconductor device LH, such. B. power transistor, arranged, which is mechanically and electrically conductively connected via a solder joint LV to the conductor LB. On the same surface OF2 of the conductor LB and in addition to the power semiconductor device LH, a contact element KE is further arranged.

Das Kontaktelement KE ist L-förmig ausgebildet und weist einen ersten Kontaktbereich Bl und einen zweiten Kontaktbereich B2 auf, die zueinander senkrecht liegen. Dabei sind der erste und der zweite Kontaktbereich Bl, B2 über eine elektronenstrahlge- schweißte Verbindung EV miteinander stoffschlüssig, elektrisch leitend und mechanisch stabil verbunden, die sich an der Biegekante des Kontaktelements KE zwischen den beiden Kon¬ taktbereichen Bl, B2 befindet. The contact element KE is L-shaped and has a first contact area Bl and a second contact area B2, which are perpendicular to each other. Here, the first and second contact portions Bl, B2 via a elektronenstrahlge- welded connection EV are integrally with each other in an electrically conductive and mechanically stable manner, which is located on the bending edge of the contact element KE between the two Kon ¬ clock domains Bl, B2.

Der erste Kontaktbereich Bl liegt auf der Oberfläche OF2 der Leiterbahn LB und ist über eine ultraschallgeschweißte Ver- bindung UV mit der Leiterbahn LB mechanisch und elektrisch leitend verbunden. Der erste Kontaktbereich Bl besteht aus E-Kupfer (Cu-ETP) und weist eine niedrige Materialhärte kleiner als 100HV (Vi- ckershärte) auf. Die niedrige Materialhärte bei dem ersten Kontaktbereich Bl verringert die Gefahr einer Delamination (Enthaftung, Ablösen) der Leiterbahn LB von dem Schaltungsträger ST1 bzw. eines Materialbruchs bei dem Schaltungsträger ST1. Der zweite Kontaktbereich B2 ist in Form von einem Einpressstift ausgebildet und ist in eine metallisierte Durchkontaktierung DK eines weiteren Schaltungsträgers ST2 eingesteckt, der eine zweite Schaltungskomponente der Schaltungsanordnung SA aus¬ bildet . The first contact area Bl lies on the surface OF2 of the conductor track LB and is mechanically and electrically conductively connected to the conductor track LB via an ultrasound-welded connection UV. The first contact area Bl consists of E copper (Cu-ETP) and has a low material hardness of less than 100HV (Vickers hardness). The low material hardness at the first contact area Bl reduces the risk of delamination (delamination, detachment) of the interconnect LB from the circuit carrier ST1 or a material fracture at the circuit carrier ST1. The second contact portion B2 is in the form of a press-fit pin and is inserted into a metallized via contact DK a further circuit carrier ST2, which forms a second circuit component of the circuit arrangement SA from ¬.

Dabei bildet der zweite Kontaktbereich B2 mit einer Metalli¬ sierung MT an der Innenwand der Durchkontaktierung DK eine kraftschlüssige Einpressverbindung PV ( Press-fit-Verbindung) aus . In this case, the second contact region B2 with a Metalli ¬ tion MT on the inner wall of the feedthrough DK forms a non-positive press-fit connection PV (press-fit connection).

Der zweite Kontaktbereich B2 besteht aus einer Zinnbronze CuSn6 mit Zinn in einem Gewichtsanteil von ca. 6 und weist eine hohe Materialhärte grösser als 130 HV (Vickershärte) auf. Die hohe Materialhärte bei dem zweiten Kontaktbereich B2 ermöglicht eine stabile Einpressverbindung PV zwischen dem Kontaktelement KE und dem Schaltungsträger ST2. The second contact region B2 consists of a tin bronze CuSn6 with tin in a weight fraction of about 6 and has a high material hardness greater than 130 HV (Vickers hardness). The high material hardness in the second contact region B2 enables a stable press-fit connection PV between the contact element KE and the circuit carrier ST2.

Nun wird auf Figur 2 verwiesen, in der ein Abschnitt eines Kupferbandes KB zur Herstellung einer Vielzahl von in Figur 1 dargestellten Kontaktelementen KE schematisch dargestellt. Reference is now made to FIG. 2, in which a section of a copper strip KB for the production of a plurality of contact elements KE shown in FIG. 1 is shown schematically.

Das Kupferband KB ist als ein langes und schmales Band ausgebildet und umfasst einen ersten länglichen Streifen SRI aus dem zuvor genannten ersten Kupfermaterial, also E-Kupfer (Cu-ETP) . Ferner umfasst das Kupferband KB einen zweiten länglichen Streifen SR2 aus dem zuvor genannten zweiten Kupfermaterial, nämlich der Zinnbronze CuSn6. Dabei sind der erste und der zweite Streifen SRI, SR2 über eine elektronenstrahlgeschweißte Verbindung EV stoffschlüssig verbunden, die sich in Längsrichtung LR des ersten und des zweiten Streifens SRI, SR2 erstreckt. The copper tape KB is formed as a long and narrow band and includes a first elongated strip SRI made of the aforementioned first copper material, that is, E copper (Cu-ETP). Further, the copper tape KB includes a second elongated strip SR2 made of the aforementioned second copper material, namely, the tin bronze CuSn6. In this case, the first and second strips SRI, SR2 are materially connected via an electron-beam welded joint EV, which extends in the longitudinal direction LR of the first and second strips SRI, SR2.

Aus diesem Kupferband KB werden die Kontaktelemente KE eins nach dem Anderen in dessen Längsrichtung LR ausgestanzt, wobei die aus dem Bereich des ersten Streifens SRI gestanzten Abschnitte die jeweiligen ersten Kontaktbereiche Bl der Kontaktelemente KE und die aus dem Bereich des zweiten Streifens SR2 gestanzten Abschnitte die jeweiligen zweiten Kontaktbereiche B2 der Kon¬ taktelemente KE ausbilden. The contact elements KE one after the other in the longitudinal direction LR are punched out of this copper band KB, the sections punched out of the area of the first strip SRI denoting the respective first contact areas Bl of the contact elements KE and the sections stamped out of the area of the second strip SR2 form second contact areas B2 of the con ¬ tact elements KE.

Anschließend werden die ausgestanzten Kontaktelemente KE an der elektronenstrahlgeschweißten Verbindung EV L-förmig gebogen. Subsequently, the punched-out contact elements KE are bent at the electron beam welded joint EV L-shaped.

Damit können die Kontaktelemente KE in einfachen Fertigungs¬ schritten als Massenware kostengünstig hergestellt werden. Thus, the contact elements KE can be produced inexpensively in simple manufacturing ¬ steps as a commodity.

Claims

Patentansprüche claims 1. Kontaktelement (KE) für elektrische Verbindung, umfassend - einen ersten Kontaktbereich (Bl) aus einem ersten Kupfermaterial zur elektrischen Verbindung zu einer ersten Schaltungskomponente (LB) , 1. Contact element (KE) for electrical connection, comprising - a first contact region (B1) made of a first copper material for electrical connection to a first circuit component (LB), - einen zweiten Kontaktbereich (B2) aus einem zweiten  - A second contact area (B2) from a second Kupfermaterial zur elektrischen Verbindung zu einer zweiten Schaltungskomponente (ST2),  Copper material for electrical connection to a second circuit component (ST2), - wobei der erste (Bl) und der zweite (B2) Kontaktbereich unterschiedliche Materialhärten aufweisen, und über eine Stoffschlüssige Verbindung (EV) miteinander verbunden sind .  - Wherein the first (Bl) and the second (B2) contact area have different material hardness, and are connected to each other via a cohesive connection (EV). 2. Kontaktelement (KE) nach Anspruch 1, wobei das erste Kup¬ fermaterial eine Materialhärte von bis 110 HV, insbesondere bis 100 HV, vorzugsweise bis 95 HV, aufweist. 2. Contact element (KE) according to claim 1, wherein the first Kup ¬ Fermaterial a material hardness of up to 110 HV, in particular up to 100 HV, preferably up to 95 HV. 3. Kontaktelement (KE) nach Anspruch 1 oder 2, wobei das erste Kupfermaterial ein zähgepoltes Elektrolytkupfer (Cu-ETP) ist . 3. Contact element (KE) according to claim 1 or 2, wherein the first copper material is a toughened electrolytic copper (Cu-ETP). 4. Kontaktelement (KE) nach einem der vorangehenden Ansprüche, wobei das zweite Kupfermaterial eine Materialhärte von 130 HV bis 300 HV, insbesondere von 170 HV bis 200 HV, aufweist. 4. Contact element (KE) according to one of the preceding claims, wherein the second copper material has a material hardness of 130 HV to 300 HV, in particular from 170 HV to 200 HV. 5. Kontaktelement (KE) nach einem der vorangehenden Ansprüche, wobei das zweite Kupfermaterial Zinn enthält. 5. Contact element (KE) according to one of the preceding claims, wherein the second copper material contains tin. 6. Kontaktelement (KE) nach Anspruch 5, wobei das zweite 6. Contact element (KE) according to claim 5, wherein the second Kupfermaterial Zinn mit einem Gewichtsprozentanteil von 0,15 bis 9, insbesondere von 5 bis 7, enthält.  Copper material tin with a weight percentage of 0.15 to 9, in particular from 5 to 7 contains. 7. Kontaktelement (KE) nach einem der vorangehenden Ansprüche, wobei der erste (Bl) und der zweite (B2) Kontaktbereich über eine elektronenstrahlgeschweißte Verbindung (EV) miteinander elektrisch leitend und mechanisch verbunden sind. Schaltungsanordnung (SA) , umfassend 7. contact element (KE) according to one of the preceding claims, wherein the first (Bl) and the second (B2) contact area via an electron beam welded joint (EV) are electrically conductively and mechanically connected. Circuit arrangement (SA) comprising - eine erste Schaltungskomponente (LB) ,  a first circuit component (LB), - eine zweite Schaltungskomponente (ST2),  a second circuit component (ST2), - ein Kontaktelement (KE) nach einem der vorangehenden Ansprüche,  a contact element (KE) according to one of the preceding claims, - wobei der erste Kontaktbereich (Bl) des Kontaktelements (KE) über eine Stoffschlüssige Verbindung (UV), insb. eine Ultraschallschweiß- oder Lötverbindung, mit der ersten Schaltungskomponente (LB) und der zweite Kontaktbereich (B2) des Kontaktelements (KE) über eine kraftschlüssige Verbindung (PV) , insb. eine Einpressverbindung, mit der zweiten Schaltungskomponente (ST2) elektrisch leitend und mechanisch stabil verbunden sind. 9. Kupferband (KB) zur Herstellung einer Vielzahl von Kontaktelementen (KE) nach einem der Ansprüche 1 bis 7, umfassend - Wherein the first contact region (Bl) of the contact element (KE) via a cohesive connection (UV), esp. A Ultraschallschweiß- or solder joint, with the first circuit component (LB) and the second contact region (B2) of the contact element (KE) via a non-positive connection (PV), esp. A press-in connection with the second circuit component (ST2) are electrically conductive and mechanically stable connected. 9. copper strip (KB) for producing a plurality of contact elements (KE) according to one of claims 1 to 7, comprising - einen ersten länglichen Streifen (SRI) aus dem ersten Kupfermaterial , a first elongated strip (SRI) of the first copper material, - einen zweiten länglichen Streifen (SR2) aus dem zweiten Kupfermaterial,  a second elongate strip (SR2) of the second copper material, - eine elektronenstrahlgeschweißte Verbindung (EV) , die sich in Längsrichtung (LR) des ersten (SRI) und des zweiten (SR2) Streifens erstreckt, und über die der erste (SRI) und der zweite (SR2) Streifen stoffschlüssig verbunden sind.  - An electron beam welded joint (EV) extending in the longitudinal direction (LR) of the first (SRI) and the second (SR2) strip, and over which the first (SRI) and the second (SR2) strip are materially connected.
EP15718369.0A 2014-04-30 2015-04-28 Contact element for an electric connection, copper strip for producing a plurality of contact elements Active EP3138161B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014208226.9A DE102014208226B4 (en) 2014-04-30 2014-04-30 Contact element, circuit arrangement with such a contact element and copper tape for producing a plurality of contact elements
PCT/EP2015/059229 WO2015165914A1 (en) 2014-04-30 2015-04-28 Contact element for an electric connection, copper strip for producing a plurality of contact elements

Publications (2)

Publication Number Publication Date
EP3138161A1 true EP3138161A1 (en) 2017-03-08
EP3138161B1 EP3138161B1 (en) 2018-09-19

Family

ID=53002674

Family Applications (1)

Application Number Title Priority Date Filing Date
EP15718369.0A Active EP3138161B1 (en) 2014-04-30 2015-04-28 Contact element for an electric connection, copper strip for producing a plurality of contact elements

Country Status (6)

Country Link
US (1) US9991618B2 (en)
EP (1) EP3138161B1 (en)
CN (1) CN106463853B (en)
DE (1) DE102014208226B4 (en)
ES (1) ES2703211T3 (en)
WO (1) WO2015165914A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014208226B4 (en) 2014-04-30 2020-07-23 Conti Temic Microelectronic Gmbh Contact element, circuit arrangement with such a contact element and copper tape for producing a plurality of contact elements
EP3404774B1 (en) * 2017-05-17 2021-10-06 Infineon Technologies AG Method for electrically connecting an electronic module and electronic assembly
DE102017214465B4 (en) 2017-08-18 2024-05-16 Ept Gmbh Contact pin for pressing into a circuit board and contact arrangement
US10566713B2 (en) 2018-01-09 2020-02-18 Semiconductor Components Industries, Llc Press-fit power module and related methods
DE102019209451B4 (en) * 2019-06-28 2021-04-01 Vitesco Technologies Germany Gmbh Electrical contact element, power electronics device with an electrical contact element
DE102019128085A1 (en) * 2019-10-17 2021-04-22 CCT Composite Coating Services GmbH Layer arrangement for a friction-increasing connection
DE102020209504A1 (en) 2020-07-28 2022-02-03 Mahle International Gmbh hybrid press-fit contact
DE102023209550A1 (en) * 2023-09-28 2024-09-26 Zf Friedrichshafen Ag METHOD FOR PRODUCING A CHIP ARRANGEMENT AND CHIP ARRANGEMENT
DE102024203274B3 (en) 2024-04-10 2025-09-04 Zf Friedrichshafen Ag Electronic circuit and method for producing an electronic circuit

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1177231B (en) 1962-05-25 1964-09-03 Harting Elektro W Contact piece for electrical plug connections
US6204065B1 (en) * 1997-03-27 2001-03-20 Ngk Insulators, Ltd. Conduction assist member and manufacturing method of the same
US5980335A (en) 1998-03-27 1999-11-09 Molex Incorporated Electrical terminal
US7077658B1 (en) * 2005-01-05 2006-07-18 Avx Corporation Angled compliant pin interconnector
DE102006062850B4 (en) * 2006-07-07 2013-03-28 Auto-Kabel Managementgesellschaft Mbh Electrical contact element
CH701206A2 (en) * 2009-06-02 2010-12-15 Huber+Suhner Ag Printed circuit board assembly.
DE102009025113A1 (en) * 2009-06-11 2010-12-16 Continental Teves Ag & Co. Ohg Press-in contact for connecting an electronic component to a printed circuit board and press-fit tool
US8959764B2 (en) * 2009-11-06 2015-02-24 International Business Machines Corporation Metallurgical clamshell methods for micro land grid array fabrication
WO2012158903A2 (en) * 2011-05-17 2012-11-22 Interplex Industries, Inc. Inter-board connection system with compliant flexible pin deformation prevention
DE102012213812A1 (en) * 2012-08-03 2014-02-06 Robert Bosch Gmbh Einpresskontaktierung
DE102014208226B4 (en) 2014-04-30 2020-07-23 Conti Temic Microelectronic Gmbh Contact element, circuit arrangement with such a contact element and copper tape for producing a plurality of contact elements
US9331400B1 (en) * 2014-12-19 2016-05-03 Tyco Electronics Corporation Male contact assembly

Also Published As

Publication number Publication date
US9991618B2 (en) 2018-06-05
ES2703211T3 (en) 2019-03-07
CN106463853B (en) 2020-02-14
EP3138161B1 (en) 2018-09-19
US20170054235A1 (en) 2017-02-23
WO2015165914A1 (en) 2015-11-05
DE102014208226B4 (en) 2020-07-23
CN106463853A (en) 2017-02-22
DE102014208226A1 (en) 2015-11-05

Similar Documents

Publication Publication Date Title
EP3138161B1 (en) Contact element for an electric connection, copper strip for producing a plurality of contact elements
DE102013013458B3 (en) contact element
DE102019212672A1 (en) COIL COMPONENT
WO2009100812A2 (en) Electrical connection device
EP2880717B1 (en) Press-fit contact
DE112015005230B4 (en) connector port
EP2724421B1 (en) Press-in pin for an electrical press-in connection between an electronic component and a substrate plate
DE102008030101A1 (en) solder connection
DE102014117410B4 (en) Electrical contact element, press-fit pin, socket and leadframe
EP3435482B1 (en) Connection piece with a cable assembly and a plate assembly, method for producing such a connection piece
DE60128537T2 (en) ASSEMBLY TO CONNECT AT LEAST TWO PRINTED CIRCUITS
EP3206258B1 (en) System for producing an electrical connection, electrical interconnection and method for its production
EP2038903A1 (en) Housing for accommodating an electronic component and electronic component arrangement
DE102011108937A1 (en) High current contact element for printed circuit boards
DE102009016160B4 (en) Method for producing a contact device and contact device
DE102010027149A1 (en) Bendable metal core board
DE102017117300A1 (en) Cross jumper and terminal block arrangement
WO2009062469A2 (en) Electrical conductor and stamped grid with flat webbed conductors comprising such an electrical conductor
DE102012011047B4 (en) Connection component and circuit arrangement with the connection component
DE4136031C1 (en) Double plug contact for car electric installation - consists of 2 terminal contact fins integral with strip conductor web
EP2425498B1 (en) Interconnect system for a printed circuit board
EP2709212B1 (en) Assembly for interconnecting circuit boards
DE102012223077A1 (en) Contact arrangement for a multilayer circuit carrier
DE102007018185A1 (en) Electrical safety device e.g. scrap web safety device, for motor vehicle, has melting conductor provided in melting area that is composed of zinc, and connecting part provided in connecting areas that are composed of copper
DE202011000854U1 (en) electrolytic capacitor

Legal Events

Date Code Title Description
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE

PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20161130

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

RIN1 Information on inventor provided before grant (corrected)

Inventor name: POLA, OLIVIER

DAV Request for validation of the european patent (deleted)
DAX Request for extension of the european patent (deleted)
GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: GRANT OF PATENT IS INTENDED

INTG Intention to grant announced

Effective date: 20180420

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE PATENT HAS BEEN GRANTED

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

Free format text: NOT ENGLISH

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: AT

Ref legal event code: REF

Ref document number: 1044330

Country of ref document: AT

Kind code of ref document: T

Effective date: 20181015

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

Free format text: LANGUAGE OF EP DOCUMENT: GERMAN

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 502015005974

Country of ref document: DE

REG Reference to a national code

Ref country code: SE

Ref legal event code: TRGR

REG Reference to a national code

Ref country code: NL

Ref legal event code: MP

Effective date: 20180919

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20181219

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180919

Ref country code: RS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180919

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20181219

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20181220

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180919

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG4D

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180919

Ref country code: AL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180919

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180919

REG Reference to a national code

Ref country code: ES

Ref legal event code: FG2A

Ref document number: 2703211

Country of ref document: ES

Kind code of ref document: T3

Effective date: 20190307

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180919

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180919

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180919

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190119

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180919

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190119

Ref country code: SM

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180919

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180919

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 502015005974

Country of ref document: DE

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180919

26N No opposition filed

Effective date: 20190620

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180919

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

REG Reference to a national code

Ref country code: BE

Ref legal event code: MM

Effective date: 20190430

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20190428

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20190428

Ref country code: MC

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180919

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20190430

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20190428

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20190430

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20190430

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180919

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20190428

REG Reference to a national code

Ref country code: DE

Ref legal event code: R081

Ref document number: 502015005974

Country of ref document: DE

Owner name: VITESCO TECHNOLOGIES GERMANY GMBH, DE

Free format text: FORMER OWNER: CONTI TEMIC MICROELECTRONIC GMBH, 90411 NUERNBERG, DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180919

REG Reference to a national code

Ref country code: AT

Ref legal event code: MM01

Ref document number: 1044330

Country of ref document: AT

Kind code of ref document: T

Effective date: 20200428

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: HU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO

Effective date: 20150428

Ref country code: MT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180919

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: AT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200428

REG Reference to a national code

Ref country code: DE

Ref legal event code: R081

Ref document number: 502015005974

Country of ref document: DE

Owner name: SCHAEFFLER TECHNOLOGIES AG & CO. KG, DE

Free format text: FORMER OWNER: VITESCO TECHNOLOGIES GERMANY GMBH, 30165 HANNOVER, DE

Ref country code: DE

Ref legal event code: R081

Ref document number: 502015005974

Country of ref document: DE

Owner name: VITESCO TECHNOLOGIES GERMANY GMBH, DE

Free format text: FORMER OWNER: VITESCO TECHNOLOGIES GERMANY GMBH, 30165 HANNOVER, DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180919

P01 Opt-out of the competence of the unified patent court (upc) registered

Effective date: 20230530

REG Reference to a national code

Ref country code: ES

Ref legal event code: PC2A

Owner name: VITESCO TECHNOLOGIES GERMANY GMBH

Effective date: 20240227

REG Reference to a national code

Ref country code: DE

Ref legal event code: R081

Ref document number: 502015005974

Country of ref document: DE

Owner name: SCHAEFFLER TECHNOLOGIES AG & CO. KG, DE

Free format text: FORMER OWNER: VITESCO TECHNOLOGIES GERMANY GMBH, REGENSBURG, DE

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20250430

Year of fee payment: 11

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: ES

Payment date: 20250529

Year of fee payment: 11

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: IT

Payment date: 20250424

Year of fee payment: 11

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20250425

Year of fee payment: 11

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: CZ

Payment date: 20250423

Year of fee payment: 11

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: SE

Payment date: 20250429

Year of fee payment: 11