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EP3163864A1 - Dispositif de capture d'image et véhicule - Google Patents

Dispositif de capture d'image et véhicule Download PDF

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Publication number
EP3163864A1
EP3163864A1 EP15812030.3A EP15812030A EP3163864A1 EP 3163864 A1 EP3163864 A1 EP 3163864A1 EP 15812030 A EP15812030 A EP 15812030A EP 3163864 A1 EP3163864 A1 EP 3163864A1
Authority
EP
European Patent Office
Prior art keywords
heat transfer
housing
optical system
image sensor
imaging apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP15812030.3A
Other languages
German (de)
English (en)
Other versions
EP3163864A4 (fr
EP3163864B1 (fr
Inventor
Yasushi Koshiba
Hiroshi Okada
Makoto Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of EP3163864A1 publication Critical patent/EP3163864A1/fr
Publication of EP3163864A4 publication Critical patent/EP3163864A4/fr
Application granted granted Critical
Publication of EP3163864B1 publication Critical patent/EP3163864B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R11/00—Arrangements for holding or mounting articles, not otherwise provided for
    • B60R11/04—Mounting of cameras operative during drive; Arrangement of controls thereof relative to the vehicle
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60K—ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS IN VEHICLES; AUXILIARY DRIVES FOR VEHICLES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST OR FUEL SUPPLY OF PROPULSION UNITS IN VEHICLES
    • B60K35/00—Instruments specially adapted for vehicles; Arrangement of instruments in or on vehicles
    • B60K35/20—Output arrangements, i.e. from vehicle to user, associated with vehicle functions or specially adapted therefor
    • B60K35/21—Output arrangements, i.e. from vehicle to user, associated with vehicle functions or specially adapted therefor using visual output, e.g. blinking lights or matrix displays
    • B60K35/22—Display screens
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60K—ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS IN VEHICLES; AUXILIARY DRIVES FOR VEHICLES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST OR FUEL SUPPLY OF PROPULSION UNITS IN VEHICLES
    • B60K35/00—Instruments specially adapted for vehicles; Arrangement of instruments in or on vehicles
    • B60K35/50—Instruments characterised by their means of attachment to or integration in the vehicle
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R1/00—Optical viewing arrangements; Real-time viewing arrangements for drivers or passengers using optical image capturing systems, e.g. cameras or video systems specially adapted for use in or on vehicles
    • B60R1/20—Real-time viewing arrangements for drivers or passengers using optical image capturing systems, e.g. cameras or video systems specially adapted for use in or on vehicles
    • B60R1/22—Real-time viewing arrangements for drivers or passengers using optical image capturing systems, e.g. cameras or video systems specially adapted for use in or on vehicles for viewing an area outside the vehicle, e.g. the exterior of the vehicle
    • B60R1/23—Real-time viewing arrangements for drivers or passengers using optical image capturing systems, e.g. cameras or video systems specially adapted for use in or on vehicles for viewing an area outside the vehicle, e.g. the exterior of the vehicle with a predetermined field of view
    • B60R1/26—Real-time viewing arrangements for drivers or passengers using optical image capturing systems, e.g. cameras or video systems specially adapted for use in or on vehicles for viewing an area outside the vehicle, e.g. the exterior of the vehicle with a predetermined field of view to the rear of the vehicle
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/55—Details of cameras or camera bodies; Accessories therefor with provision for heating or cooling, e.g. in aircraft
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N7/00—Television systems
    • H04N7/18—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast
    • H04N7/183—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast for receiving images from a single remote source
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60K—ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS IN VEHICLES; AUXILIARY DRIVES FOR VEHICLES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST OR FUEL SUPPLY OF PROPULSION UNITS IN VEHICLES
    • B60K2360/00—Indexing scheme associated with groups B60K35/00 or B60K37/00 relating to details of instruments or dashboards
    • B60K2360/20—Optical features of instruments
    • B60K2360/21—Optical features of instruments using cameras
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R11/00—Arrangements for holding or mounting articles, not otherwise provided for
    • B60R2011/0001—Arrangements for holding or mounting articles, not otherwise provided for characterised by position
    • B60R2011/004—Arrangements for holding or mounting articles, not otherwise provided for characterised by position outside the vehicle
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R2300/00—Details of viewing arrangements using cameras and displays, specially adapted for use in a vehicle
    • B60R2300/20—Details of viewing arrangements using cameras and displays, specially adapted for use in a vehicle characterised by the type of display used
    • B60R2300/202—Details of viewing arrangements using cameras and displays, specially adapted for use in a vehicle characterised by the type of display used displaying a blind spot scene on the vehicle part responsible for the blind spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R2300/00—Details of viewing arrangements using cameras and displays, specially adapted for use in a vehicle
    • B60R2300/30—Details of viewing arrangements using cameras and displays, specially adapted for use in a vehicle characterised by the type of image processing
    • B60R2300/301—Details of viewing arrangements using cameras and displays, specially adapted for use in a vehicle characterised by the type of image processing combining image information with other obstacle sensor information, e.g. using RADAR/LIDAR/SONAR sensors for estimating risk of collision
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R2300/00—Details of viewing arrangements using cameras and displays, specially adapted for use in a vehicle
    • B60R2300/80—Details of viewing arrangements using cameras and displays, specially adapted for use in a vehicle characterised by the intended use of the viewing arrangement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60Y—INDEXING SCHEME RELATING TO ASPECTS CROSS-CUTTING VEHICLE TECHNOLOGY
    • B60Y2400/00—Special features of vehicle units
    • B60Y2400/92—Driver displays

Definitions

  • This disclosure relates to an imaging apparatus mounted on a vehicle and the like and also to the vehicle.
  • an imaging apparatus having an electronic circuit unit which includes an image sensor.
  • a small-sized imaging apparatus including, as a package, an imaging optical system (including an optical element such as a lens) for forming a subject image captured by the image sensor is popularly used.
  • the imaging apparatus has been considered to be widely applied to, for example, a vehicle-mounted camera for assisting visibility of a driver of a vehicle, a surveillance camera used for the purpose of security, and the like and required to become smaller while securing performance thereof.
  • the imaging apparatus in order to secure performance of the electronic circuit unit, is desired to suppress temperature rise of the electronic circuit unit. Therefore, a configuration of the imaging apparatus capable of efficiently relieving heat of the electronic circuit unit has been considered.
  • PLT 1 set forth below discloses a configuration aiming at space saving by electrically connecting an electromagnetic shield circumferential wall surrounding an image sensor substrate to an external connector such that the electromagnetic shield circumferential wall functions as a radiator as well.
  • PLT2 set forth below discloses a configuration including, in order to improve heat dissipation efficiency, a soft material abutting on an outer peripheral surface of an electronic circuit unit having the image sensor, and a plate portion abutting on the soft material and an inner peripheral wall surface of an accommodation member (a housing).
  • an imaging apparatus includes:
  • a vehicle has an imaging apparatus mounted thereon, the imaging apparatus including an imaging optical system, an image sensor for capturing a subject image formed through the imaging optical system, one or more circuit boards having at least one of the image sensor and an electronic component mounted thereon, a housing having an opening for exposing the imaging optical system to a subject, the housing for supporting the imaging optical system, the image sensor, and the one or more circuit boards, a signal connection unit including a plurality of terminals for transmitting an image signal of the subject image captured by the image sensor to an outside of the housing, and a heat transfer unit having insulating properties and connected to the plurality of terminals, the heat transfer unit for transferring heat generated from at least one of the image sensor and the electronic component to the plurality of terminals.
  • an imaging apparatus includes:
  • a vehicle has an imaging apparatus mounted thereon, the imaging apparatus including an imaging optical system, an image sensor for capturing a subject image formed through the imaging optical system, one or more circuit boards having at least one of the image sensor and an electronic component mounted thereon, and a housing having an opening for exposing the imaging optical system to a subject, the housing for supporting the imaging optical system, the image sensor, and the one or more circuit boards, wherein a first heat transfer member is integrally formed with an inner wall of the housing in such a manner as to extend from any one of the circuit boards into a direction remote from the imaging optical system.
  • the imaging apparatus and the vehicle of the disclosure herein may further enhance a heat dissipation effect from an inside of the housing to the outside.
  • FIG. 1 is an arrangement diagram illustrating a mounting position of an imaging apparatus 10 on a vehicle 1 according to the present embodiment.
  • the imaging apparatus 10 is, for example, an on-vehicle camera.
  • the vehicle 1 is a vehicle such as, for example, an automobile.
  • the imaging apparatus 10 including an imaging optical system 20 is mounted on the vehicle 1 together with a display apparatus 50.
  • the imaging apparatus 10 is fixed to, for example, an external rear portion of the vehicle 1 in order to capture a surrounding image of a rear view.
  • the display apparatus 50 is provided in a visible manner from a driver's seat.
  • the imaging optical system 20 forms a subject image behind the vehicle 1 in an image sensor 31 inside the imaging apparatus 10.
  • the imaging apparatus 10 controls the image sensor 31 to capture the subject image and generates an image signal.
  • the imaging apparatus 10 outputs the image signal to the display apparatus 50 via a signal connection unit 40.
  • the display apparatus 50 displays the subject image corresponding to the image signal obtained from the signal connection unit 40.
  • FIG. 2A illustrates a plan view of an imaging optical system side of the imaging apparatus 10 according to the present embodiment.
  • FIG. 2B is a cross-sectional view taken from line A-A of the imaging apparatus illustrated in FIG. 2A .
  • a direction directing from the imaging apparatus 10 to a subject a direction indicated by an arrow of the imaging optical axis OA
  • a direction directing from "rear" to "front" a direction directing from "rear" to "front”.
  • the imaging apparatus 10 includes the imaging optical system 20, the image sensor 31, at least one circuit board (for example, a first circuit board 32 and a second circuit board 33 in the present embodiment), a housing 11, a first heat transfer member 37, a second heat transfer member 38, the signal connection unit 40, an insertion member 43, and a heat transfer unit 44.
  • the imaging optical system 20 includes the imaging optical system 20, the image sensor 31, at least one circuit board (for example, a first circuit board 32 and a second circuit board 33 in the present embodiment), a housing 11, a first heat transfer member 37, a second heat transfer member 38, the signal connection unit 40, an insertion member 43, and a heat transfer unit 44.
  • the imaging optical system 20 includes at least one optical element and is designed and formed in such a manner as to meet desired optical properties such as a focal length, a focal depth, and the like.
  • the imaging optical system 20 is accommodated in a support opening 12a of the housing 11.
  • a retainer member 22 presses the imaging optical system 20 rearward, thereby preventing the imaging optical system 20 inserted into the support opening 12a from falling off from the opening.
  • the retainer member 22 may have a screw groove in a rear end portion thereof. Note that, although individual optical elements of the imaging optical system 20 are omitted in FIG. 2B , the imaging optical system 20 includes the optical elements such as a lens, a diaphragm, and the like to meet the desired optical properties.
  • the image sensor 31 is disposed behind the imaging optical system 20 and captures the subject image formed on a light receiving surface through the imaging optical system 20, converts the subject image into an electrical signal, and outputs the electrical signal.
  • the image sensor 31 may be, for example, a CCD (Charge Coupled Device) image sensor, a CMOS (Complementary Metal Oxide Semiconductor) image sensor, or the like.
  • the imaging apparatus 10 controls the signal connection unit 40, which will be described later, to transmit the image signal based on the electrical signal from the image sensor 31 to an outside of the housing 11.
  • the image signal may be an electrical signal itself output from the image sensor 31, or a signal subjected to necessary image processing by an electronic component described later.
  • the at least one circuit board has at least one of the image sensor 31 and the electronic component mounted thereon.
  • the electronic component is, for example, a component for driving the image sensor 31 or performing signal processing to the image signal.
  • the at least one circuit board may be one or a plurality of circuit boards meeting a size constraint to be accommodated within the housing 11.
  • the imaging apparatus 10 of the present embodiment includes the first circuit board 32 and the second circuit board 33.
  • the first circuit board 32 has the image sensor 31 mounted on a surface thereof facing the imaging optical system 20, and electronic components 32a and 32b mounted on an opposite surface.
  • the second circuit board 33 has an electronic component 33a mounted on a surface thereof facing the first circuit board 32.
  • the housing 11 has an opening for exposing the imaging optical system 20 to the subject and supporting the imaging optical system 20.
  • the housing 11 accommodates and supports the image sensor 31 and the circuit board(s).
  • the housing 11 includes a front casing 12 and a rear casing 13.
  • the front casing 12 supports the optical elements constituting the imaging optical system 20 in such a manner as to define a predetermined positional relationship.
  • the rear casing 13 accommodates and supports the circuit board(s) together with the image sensor 31.
  • the rear casing 13 supports the image sensor 31 at an image-forming position of the imaging optical system 20.
  • the front casing 12 and the rear casing 13 are joined together with a packing P made of rubber, resin, or the like interposed therebetween. At this time, the packing P functions as a hermetic seal, and therefore the housing 11 of the imaging apparatus 10 forms a sealing structure.
  • the first heat transfer member 37 in the present embodiment, is integrally formed with an inner wall of the rear casing 13 of the housing 11 in such a manner as to extend from the second circuit board 33 into a direction remote from the imaging optical system 20.
  • the first heat transfer member 37 extends from a lateral side portion of the housing 11 to a bottom portion thereof.
  • heat generated from at least one of the image sensor 31 and electronic components 32a, 32b, and 33a is transferred via the second heat transfer member 38 described later.
  • the first heat transfer member 37 has a temperature gradient within the housing 11 as described later and has a function to dissipate the heat from a thin portion 13a of the lateral side portion and the bottom portion.
  • a thickness of a resin member in a portion having the first heat transfer member 37 integrally formed therewith is smaller than that in a portion where the first heat transfer member 37 is not integrally formed therewith. That is, the housing 11 has a thin portion 13a in which a thickness of the resin member is smaller as much as a thickness of the first heat transfer member 37.
  • the second heat transfer member 38 is a member for transferring the heat generated from the image sensor 31 and the like to the first heat transfer member 37.
  • the second heat transfer member 38 includes heat transfer sheets 38a and 38b and a heat transfer plate 38c.
  • the heat transfer sheet 38a connects the electronic components 32a and 32b mounted on the first circuit board 32 and the heat transfer plate 38c.
  • the heat transfer sheet 38a transfers the heat generated from the image sensor 31 and the electronic components 32a and 32b to the heat transfer plate 38c.
  • the heat transfer sheet 38b connects the electronic component 33a mounted on the second circuit board 33 and the heat transfer plate 38c.
  • the heat transfer sheet 38b transfers the heat generated from the electronic component 33a to the heat transfer plate 38c.
  • the heat transfer plate 38c transfers the heat from the heat transfer sheets 38a and 38b to the first heat transfer member 37 located in close proximity. When the heat transfer plate 38c is in direct contact with the first heat transfer member 37, the heat may be more efficiently transferred to the first heat transfer member 37. In the present embodiment, the heat transfer plate 38c may transfer the heat also to an internal heat transfer member 39. The heat transferred to the internal heat transfer member 39 is further transferred to the first heat transfer member 37 or, as described later, a plurality of terminals 41.
  • the signal connection unit 40 has heat conductivity and transmits the image signal of the subject image captured by the image sensor 31 to the outside of the housing 11.
  • the signal connection unit 40 includes the plurality of terminals 41.
  • the insertion member 43 has the heat conductivity and is inserted from the outside of the housing 11 and in contact with a portion of the first heat transfer member 37.
  • the insertion member 43 is inserted from a rear side of the bottom portion of the imaging apparatus 10 and in contact with the first heat transfer member 37.
  • the insertion member 43 instead of (or in addition to) being inserted from the bottom portion, may be inserted into the thin portion 13a on the lateral side portion of the imaging apparatus 10.
  • the number of, and an insertion position of, the insertion member 43 are not limited, and the insertion member 43 may be used as an adjustment member for obtaining a desired heat dissipation effect of the imaging apparatus 10.
  • the insertion member 43 may be inserted (e.g.
  • a mounting screw for mounting the imaging apparatus 10 on the vehicle 1 may be used as the insertion member 43, through which the heat dissipation (heat transfer) occurs from the imaging apparatus 10 to the vehicle 1.
  • a structure to seal a periphery of the insertion member 43 e.g. a structure to seal with the packing, an adhesive, or the like is preferable.
  • the heat transfer unit 44 has the heat conductivity and insulating properties, and is connected to the plurality of terminals 41 so as to transfer the heat generated from the image sensor 31 and the like to the plurality of terminals 41. Having the insulating properties, the heat transfer unit 44 does not cause a problem such as a short circuit and the like when connected to the plurality of terminals 41.
  • the heat transfer unit 44 is composed of the internal heat transfer member 39 and a sealing member 42.
  • the internal heat transfer member 39 has the heat conductivity and the insulating properties and is disposed in the housing 11 and connected to the plurality of terminals 41.
  • the internal heat transfer member 39 transfers the heat from the image sensor 31 and the like received via the second heat transfer member 38 to the plurality of terminals 41.
  • the sealing member 42 is a member for sealing between the signal connection unit 40 and the housing 11.
  • the sealing member 42 has the heat conductivity and the insulating properties and is connected to a portion of the first heat transfer member 37 which is exposed to the outside in the bottom portion of the housing 11.
  • the sealing member 42 is connected to the plurality of terminals 41 and transfers the heat generated from the image sensor 31 and the like thereto. Having the insulating properties, the sealing member 42 does not cause the problem such as the short circuit and the like when connected to the plurality of terminals 41.
  • the imaging apparatus 10 of the present embodiment has the following effects.
  • the imaging apparatus 10 since the imaging apparatus 10 includes the heat transfer unit 44 having the insulating properties and transferring the heat generated from the image sensor 31 and the like to the plurality of terminals 41, the heat inside the housing 11 transferred to the first heat transfer member 37 may be dissipated to the outside.
  • the terminal of the imaging apparatus is made of metal having high heat conductivity. Therefore, by dissipating the heat inside the housing 11 to the outside with the plurality of terminals 41 having high heat conductivity, the imaging apparatus 10 may further enhance the heat dissipation effect.
  • the imaging apparatus 10 since the imaging apparatus 10 includes the first heat transfer member 37 which transfers the heat to the heat transfer unit 44 and is integrally formed with the inner wall of the housing 11, the temperature gradient may be generated within the housing 11. Therefore, heat accumulation in the imaging optical system 20 may be effectively suppressed, suppressing deterioration of performance of the imaging optical system 20 due to temperature rise.
  • the first heat transfer member 37 is made of metal such as, for example, aluminum, copper, and the like but not limited thereto.
  • integral molding insert molding for integrating the metal and resin is performed.
  • the first heat transfer member 37 is not limited to the metal as long as having better heat conductivity than the resin member of the housing 11. That is, as a material of the first heat transfer member 37, a resin with better heat conductivity than the resin member of the housing 11 may be used.
  • integral molding two-color molding for integrating two different types of resins is performed. That is, the integral molding means integral molding of materials with different heat conductivity and includes the two-color molding as well as the insert molding.
  • the imaging apparatus 10 has the heat transfer unit 44 which includes the sealing member 42 having the function to transfer the heat to the plurality of terminals 41, the heat dissipation effect from the inside of the housing 11 to the outside may be further enhanced.
  • the sealing member 42 may be provided from the outside of the housing 11 and readily processed.
  • a material of the sealing member 42 may be a resin such as, for example, silicone, epoxy, or the like but is not limited thereto.
  • the housing 11 needs an opening (hereinafter, referred to as a connection hole) for exposing the first heat transfer member 37 to the outside.
  • the insert molding is performed as the integral molding, during which an opening for fixing the first heat transfer member 37 made of metal is formed. Since this opening required to perform the molding may be used as the connection hole, in the present embodiment a separate connection hole does not need to be prepared, and therefore manufacturing process of the imaging apparatus 10 is not increased.
  • the imaging apparatus 10 has the heat transfer unit 44 which includes the internal heat transfer member 39, the heat inside the housing 11 transferred to the first heat transfer member 37 and the second heat transfer member 38 is transferred to the plurality of terminals 41, thereby further enhancing the heat dissipation effect.
  • the internal heat transfer member 39 may be constituted by using, for example, a heat transfer sheet made of silicone, or may be made by performing heat transfer potting or the like, but is not limited thereto.
  • the housing 11 of the imaging apparatus 10 forms the sealing structure.
  • the imaging apparatus 10 has waterproof properties and dustproof properties (also referred to as sealing performance) at a joint portion. Further, in the imaging apparatus 10 of the present embodiment, since the image sensor 31 is arranged at the image-forming position of the imaging optical system 20 and integrally packaged, a user does not need to adjust the positional relationship between the image sensor 31 and the imaging optical system 20. Therefore, stable optical performance and image quality may be provided.
  • the imaging apparatus 10 includes the second heat transfer member 38 for transferring the heat to the internal heat transfer member 39 and the first heat transfer member 37.
  • the heat may be efficiently and reliably transferred from a heat source, i.e., the image sensor 31 and the electronic components 32a, 32b, and 33a to the internal heat transfer member 39 and the first heat transfer member 37.
  • the heat transfer sheets 38a and 38b are made of silicone.
  • the heat transfer plate 38c is made of metal for transferring the heat in a further distance in comparison to the heat transfer sheets 38a and 38b.
  • the metal of the heat transfer plate 38c may be, for example, aluminum, nickel silver, copper, or the like.
  • the second heat transfer member 38 may be constituted by using a combination of members having different heat conductivity depending on a heat transfer distance. Further, although in the present embodiment the second heat transfer member 38 is constituted by using a combination of the two heat transfer sheets 38a and 38b and one heat transfer plate 38c, the second heat transfer member 38 is not limited thereto. For example, the second heat transfer member constituted by using the heat transfer sheet alone may be used.
  • the imaging apparatus 10 includes the thin portion 13a where the first heat transfer member 37 is integrally formed.
  • the resin member in the thin portion 13a is thin and thus has higher heat dissipation properties than other portions.
  • the first heat transfer member 37 collecting the heat from the image sensor 31 and the like may dissipate the heat from the thin portion 13a having relatively high heat dissipation properties to the outside of the housing 11. Therefore, the imaging apparatus 10 may suppress the temperature rise inside the housing 11, preventing deterioration of the performance of the imaging optical system 20.
  • the resin member of the imaging apparatus 10 is thin in the thin portion 13a alone.
  • the imaging apparatus 10 secures a necessary thickness of the resin member for providing the packing P for the purpose of waterproof at the joint portion between the front casing 12 and the rear casing 13, and thus is capable of maintaining the waterproof properties. Also, the thin portion 13a allows the portion having the first heat transfer member 37 integrally formed therewith to avoid becoming thick. Therefore, a situation that the space inside housing 11 becomes small as much as a volume of the first heat transfer member 37 may be avoided, and thus such a structure is particularly suitable for the imaging apparatus 10 small in size.
  • the first heat transfer member 37 may collect the heat generated from at least one of the image sensor 31 and the electronic components 32a, 32b, and 33c and generate the temperature gradient within the housing 11. Therefore, the heat accumulation in the imaging optical system 20 may be effectively suppressed, suppressing the deterioration of the performance of the imaging optical system 20 due to the temperature rise.
  • the housing 11 of the imaging apparatus 10 of the present embodiment is formed by using the resin member. If metal, instead of the resin, is the material used to form the housing 11 in its entirety, the heat dissipation properties is better than the resin, possibly suppressing the deterioration of the performance of the imaging optical system 20 due to the temperature rise. However, it becomes difficult to maintain the waterproof properties similar to that of the resin.
  • the resin member may be used for the housing 11 and thus may maintain the waterproof properties.
  • the imaging apparatus 10 includes the thin portion 13a where the first heat transfer member 37 is integrally formed.
  • the resin member in the thin portion 13a is thin and thus has higher heat dissipation properties than other portions.
  • the first heat transfer member 37 collecting the heat from the image sensor 31 and the like may dissipate the heat from the thin portion 13a having relatively high heat dissipation properties to the outside of the housing 11. Therefore, the imaging apparatus 10 may suppress the temperature rise inside the housing 11, preventing deterioration of the performance of the imaging optical system 20.
  • the resin member of the imaging apparatus 10 is thin in the thin portion 13a alone.
  • the imaging apparatus 10 secures a necessary thickness of the resin member for providing the packing P for the purpose of waterproof at the joint portion between the front casing 12 and the rear casing 13, and thus is capable of maintaining the waterproof properties. Also, the thin portion 13a allows the portion having the first heat transfer member 37 integrally formed therewith to avoid becoming thick. Therefore, a situation that the space inside housing 11 becomes small as much as a volume of the first heat transfer member 37 may be avoided, and thus such a structure is particularly suitable for the imaging apparatus 10 small in size.
  • the imaging apparatus 10 includes the second heat transfer member 38 for transferring the heat to the first heat transfer member 37.
  • the second heat transfer member 38 may effectively and reliably transfer the heat from the heat source, i.e., the image sensor 31 and the electronic components 32a, 32b, and 33a to the first heat transfer member 37 and generate the temperature gradient.
  • the imaging apparatus 10 since the imaging apparatus 10 has the heat conductivity and the insulating properties and includes the sealing member 42 connecting to the portion of the first heat transfer member 37 exposed to the outside of the housing 11 and also connecting to the plurality of terminals 41, the heat inside the housing 11 transferred to the first heat transfer member 37 may be dissipated to the outside. Accordingly, the imaging apparatus 10 may enhance the heat dissipation effect.
  • the sealing member 42 also has a function to transfer heat to the plurality of terminals 41 and thus further enhances the heat dissipation effect from the inside of the housing 11 to the outside.
  • the terminal of the imaging apparatus is made of metal having high heat conductivity.
  • the sealing member 42 may be provided from the outside of the housing 11 and readily processed.
  • the material of the sealing member 42 may be, for example, the resin such as silicone, epoxy, and the like but is not limited thereto.
  • the imaging apparatus 10 since the imaging apparatus 10 includes the insertion member 43, the heat in the housing 11 transferred to the first heat transfer member 37 is further dissipated to the outside. Having the insertion member 43, the imaging apparatus 10 may further enhance the heat dissipation effect.
  • the insertion member 43 needs to have the heat conductivity alone and, for example, a metal screw or the like may be used as the insertion member 43.
  • the number of circuit boards of the imaging apparatus is not limited to two.
  • the first heat transfer member only needs to be integrally formed with the inner wall of the housing in such a manner as to extend from any one of the circuit boards into the direction remote from the imaging optical system.
  • the first heat transfer member is integrally formed in such a manner as to extend from a circuit board (the second circuit board 33 in the present embodiment) which is farthest from the imaging optical system, it may be expected to obtain the highest effect of suppressing the deterioration of the performance of the imaging optical system due to the temperature rise.
  • the first heat transfer member when the first heat transfer member is integrally formed in such a manner as to extend from a circuit board (the first circuit board 32 in the present embodiment) which is the closest to the imaging optical system, it may be expected to obtain the highest heat dissipation effect from the thin portion. Or, depending on necessary heat dissipation effect from the thin portion, the first heat transfer member may be integrally formed in such a manner as to extend from an intermediate position of these circuit boards.

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Transportation (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Electromagnetism (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Studio Devices (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Structure And Mechanism Of Cameras (AREA)
  • Cameras Adapted For Combination With Other Photographic Or Optical Apparatuses (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
EP15812030.3A 2014-06-26 2015-06-24 Dispositif de capture d'image et véhicule Active EP3163864B1 (fr)

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JP2014131782 2014-06-26
JP2014131785 2014-06-26
PCT/JP2015/003177 WO2015198598A1 (fr) 2014-06-26 2015-06-24 Dispositif de capture d'image et véhicule

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EP3163864A1 true EP3163864A1 (fr) 2017-05-03
EP3163864A4 EP3163864A4 (fr) 2018-02-14
EP3163864B1 EP3163864B1 (fr) 2019-11-06

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US12219230B2 (en) 2019-03-20 2025-02-04 Kyocera Corporation Electronic device, imaging apparatus, and mobile body
EP4510602A3 (fr) * 2019-03-20 2025-05-07 Kyocera Corporation Dispositif électronique, appareil d'imagerie et corps mobile
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WO2022216447A1 (fr) * 2021-04-09 2022-10-13 Microsoft Technology Licensing, Llc Dissipation de chaleur de dispositif accessoire par un dispositif parent
US11477352B1 (en) 2021-04-09 2022-10-18 Microsoft Technology Licensing, Llc Accessory device heat dissipation by parent device

Also Published As

Publication number Publication date
EP3163864A4 (fr) 2018-02-14
JP2018050311A (ja) 2018-03-29
JPWO2015198598A1 (ja) 2017-04-20
US10766431B2 (en) 2020-09-08
JP6505807B2 (ja) 2019-04-24
JP6234572B2 (ja) 2017-11-22
WO2015198598A1 (fr) 2015-12-30
JP2019164353A (ja) 2019-09-26
EP3163864B1 (fr) 2019-11-06
US20170129418A1 (en) 2017-05-11
JP6721745B2 (ja) 2020-07-15

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