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WO2013150621A1 - Dispositif de capture d'image - Google Patents

Dispositif de capture d'image Download PDF

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Publication number
WO2013150621A1
WO2013150621A1 PCT/JP2012/059228 JP2012059228W WO2013150621A1 WO 2013150621 A1 WO2013150621 A1 WO 2013150621A1 JP 2012059228 W JP2012059228 W JP 2012059228W WO 2013150621 A1 WO2013150621 A1 WO 2013150621A1
Authority
WO
WIPO (PCT)
Prior art keywords
housing
substrates
substrate
main body
holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2012/059228
Other languages
English (en)
Japanese (ja)
Inventor
泰弘 山下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Corp
Original Assignee
Fuji Machine Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Machine Manufacturing Co Ltd filed Critical Fuji Machine Manufacturing Co Ltd
Priority to JP2014508960A priority Critical patent/JP6000337B2/ja
Priority to PCT/JP2012/059228 priority patent/WO2013150621A1/fr
Publication of WO2013150621A1 publication Critical patent/WO2013150621A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/55—Details of cameras or camera bodies; Accessories therefor with provision for heating or cooling, e.g. in aircraft
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings

Definitions

  • the present invention relates to an imaging apparatus that images a subject and records image data.
  • Patent Document 1 discloses an FA imaging apparatus applied to the industrial field. According to the FA imaging apparatus, the electronic component mounting apparatus recognizes the board based on the acquired image data, and improves the positioning accuracy of the head that sucks the component. In such an image pickup apparatus, there is a demand for miniaturization because the external dimensions may be restricted depending on the installation location of the image pickup apparatus and the like with diversification of applications.
  • Patent Document 2 discloses a substrate holding method in which an elastic body is interposed between a plurality of substrates.
  • the present invention has been made in view of such circumstances, and an object thereof is to provide an imaging apparatus capable of improving heat dissipation while achieving downsizing.
  • An image pickup apparatus includes a housing that supports a lens unit that forms an image of subject light on an image pickup device and a plurality of electronic components, and a plurality of devices that are disposed inside the housing with a space therebetween.
  • a holding member that holds the substrate by pressing the substrate in contact with the housing, the holding member having thermal conductivity, and at least a part of an outer peripheral edge thereof is in contact with the housing.
  • heat is transferred from the substrate to be held to the housing.
  • a plurality of substrates can be pressed and held on the housing side by the holding member. Therefore, since a plurality of substrates do not require a connecting member such as a spacer for connecting each other, the number of components can be reduced to improve the assembling property, and the mounting area can be secured to reduce the size. it can. Furthermore, since at least a part of the outer peripheral edge of the holding member is in contact with the housing, heat is transferred from the substrate to the housing, and heat dissipation can be improved. In addition, since the holding member is interposed between the substrates, even when there is an electronic component that generates a lot of heat, the influence on other electronic components can be suppressed and the operation of the imaging apparatus can be stabilized.
  • the holding member includes an insulating member on both sides that are in contact with the opposing surfaces of the adjacent substrates, and a heat sink that is interposed between the insulating members on both sides and contacts the housing. You may do it.
  • the holding member can be preferably composed of a plurality of insulating members and a heat radiating plate, thereby suitably combining elasticity for holding the substrate and heat conductivity for radiating heat.
  • the holding member that contacts the substrate on which the electronic component is mounted is insulated so as not to electrically short-circuit the wiring portion.
  • thermal conductivity and electrical conductivity often show the same tendency, and it is not easy to sufficiently ensure insulation, thermal conductivity, and elasticity with the same member. Therefore, in the present invention, a material having electrical conductivity can be applied to the heat sink by making the insulating member and the heat sink separate. Thereby, the manufacturing cost as the whole apparatus can be reduced.
  • the holding member may further have elasticity in a direction orthogonal to the arrangement direction of the substrate, and may be compressed inward by the housing to maintain a contact state with the housing.
  • the holding member is further configured to have elasticity in a direction orthogonal to the arrangement direction of the substrate.
  • the holding member is interposed in a compressed state between adjacent substrates when a plurality of substrates are arranged inside the housing. For this reason, the holding member may be displaced in the arrangement direction of the substrate and the direction orthogonal to the arrangement direction with respect to the housing due to compression or the like when the imaging apparatus is assembled.
  • the contact state with the housing can be maintained in response to vibrations applied during or after assembly. Thereby, the heat transfer function from the board
  • the housing includes a detachable cover member having a side surface extending in the arrangement direction of the substrate and an inner peripheral surface facing each other, and the holding member is arranged so that the cover member is close to the side surface. By being assembled, it may be compressed inward and brought into contact with the housing.
  • the holding member is compressed to the inside of the housing by the cover member when assembled, and is brought into contact with the housing. Therefore, the holding member having elasticity in the direction orthogonal to the arrangement direction of the substrate is urged at least on the inner peripheral surface of the cover member, so that the contact state with the housing can be more reliably maintained.
  • the holding member may have a facing surface wider than the mounting area so as to cover the mounting area where the electronic component is mounted on the substrate to be held.
  • the holding member since the holding member has an opposing surface that is wider than the mounting area of the substrate, the mounting area on which the electronic component that is a heating element is mounted is reliably covered, and the heat generated by the electronic component is absorbed. be able to. And it can thermally radiate favorably by transferring heat to the housing in contact with the holding member.
  • the housing is connected to the main body member in a state in which a main body member that supports the lens portion and a laminated body in which the plurality of substrates and the holding members are alternately arranged are pressed from the back side. And a back member.
  • the housing is composed of a main body member that holds the lens portion and a back member. And this back member is connected with a main body member in the state which pressed from the back side the laminated body by which the some board
  • the imaging apparatus includes at least three or more substrates, and is positioned on one end side in the arrangement direction among the three or more substrates before the back member is connected to the main body member.
  • the substrate may be fixed to the main body member in advance, and the substrate positioned on the other end side in the arrangement direction may be fixed to the back member in advance.
  • the substrates positioned at both ends are fixed in advance to the main body member or the rear member of the housing, and the rear member is coupled to the main body member so as to compress the laminate in this state.
  • the assemblability can be further improved and the laminate can be suitably compressed.
  • one substrate is fixed to the main body member in advance, for example, a substrate on which an imaging element that requires installation accuracy with respect to the lens unit can be fixed in advance, so that it is relatively simple in later assembly. It can be a process.
  • An image pickup apparatus includes a housing that supports a lens unit that forms an image of subject light on an image pickup device and a plurality of electronic components, and a plurality of devices that are disposed inside the housing with a space therebetween.
  • a holding member that holds the substrate by pressing the substrate in contact with the housing, and the housing includes a body member that supports the lens unit, and a plurality of the substrates and the holding member alternately. And a back member connected to the main body member in a state where the arranged laminated body is pressed from the back side.
  • the housing is composed of a main body member that holds the lens portion and a back member. And this back member is connected with a main body member in the state which pressed from the back side the laminated body by which the some board
  • 1st embodiment It is the perspective view which showed the camera 1 typically. It is a side view which shows the state of the assembly
  • the camera 1 is an FA imaging device incorporated in, for example, an electronic component mounting device.
  • An electronic component mounting apparatus is an apparatus that mounts a plurality of electronic components on a printed circuit board in an integrated circuit manufacturing process. In such an electronic component mounting apparatus, for example, the mounting operation is controlled using image data captured by the camera 1 based on a command from the control apparatus.
  • the camera 1 includes a lens unit 10, a housing 20 that is a housing of the camera 1, a circuit board 30, and a plurality of holding members 40.
  • the lens unit 10 is an optical system that forms an image of subject light on the image sensor 2 and includes a lens and a lens holding member (not shown).
  • the image sensor 2 is an image sensor such as a CCD or CMOS, and is an electronic component mounted on the circuit board 30. Further, the image pickup device 2 is arranged so that the image pickup surface thereof is perpendicular to the optical axis of the lens unit 10.
  • the camera 1 converts the digital signal into a digital signal by the signal charge generated according to the intensity of the light imaged on the imaging surface of the imaging device by the lens unit 10, and images the subject.
  • the camera 1 converts the image data into image data using an integrated circuit such as a PLD based on the digital signal.
  • the circuit board 30 in the present embodiment includes a plurality of rigid boards 31 to 34, which are arranged with a space therebetween in the optical axis direction of the lens unit 10. Therefore, in the present embodiment, the “substrate arrangement direction” of the present invention corresponds to the optical axis direction of the lens unit 10.
  • the housing 20 includes a main body member 21 that supports the lens unit 10, a back member 22 that is coupled to the main body member 21, and a cover member 23 that is detachably provided.
  • the main body member 21 is formed in an L shape as an overall shape, and supports the lens unit 10 fixed on one side in the optical axis direction (left side in FIG. 2).
  • the back member 22 is connected and fixed to the main body member 21 from the other side (right side in FIG. 2) in the optical axis direction.
  • the cover member 23 is formed in a U shape, and the opening of the main body member 21 and the rear member 22 is formed from the direction orthogonal to the optical axis with respect to the main body member 21 to which the rear member 22 is connected. After being arranged so as to cover, it is detachably connected and fixed by screws or the like.
  • the cover member 23 is configured such that at least a part of the side surface 21a extending in the optical axis direction and the inner peripheral surface 23a face each other in the main body member 21 to which the back member 22 is coupled. That is, when the cover member 23 is assembled to the main body member 21, the inner peripheral surface 23 a comes close to the side surface 21 a of the main body member 21 and is fixed at a predetermined position.
  • the housing 20 includes the main body member 21, the back member 22, and the cover member 23 to form a housing that accommodates the circuit board 30 and the like therein.
  • the circuit board 30 is a rigid flexible board having a plurality of rigid boards 31 to 34 and a plurality of flexible boards 35 to 37.
  • the rigid boards 31 to 34 are rigid printed boards having a mounting area Ri, and a plurality of electronic components such as the image pickup device 2 are mounted thereon.
  • the “mounting region Ri” refers to a region on the substrate surface where electronic components are mounted, as indicated by the hatched portion in FIG.
  • these rigid substrates 31 to 34 are arranged inside the housing 20 at intervals in the optical axis direction. Further, as shown in FIG. 2, reference numerals (31 to 34) are assigned in order from the rigid substrate closest to the lens unit 10.
  • the rigid substrate 31 located on one end side (left side in FIG. 2) in the arrangement direction (optical axis direction) is mounted with the imaging device 2 and attached to the main body member 21. Before the back member 22 is connected, it is fixed to the main body member 21 in advance. Further, among the plurality of rigid substrates 31 to 34, the rigid substrate 34 located on the other end side in the arrangement direction (the right side in FIG. 2) is mounted with an interface IC (not shown), and the back member 22 is attached to the main body member 21. Before being connected, it is fixed to the back member 22 in advance.
  • This interface IC is an electronic circuit having a predetermined communication function for communicating with the control device of the electronic component mounting apparatus.
  • the flexible substrates 35 to 37 are flexible film-like substrates and electrically connect the rigid substrates 31 to 34.
  • the plurality of rigid substrates 31 to 34 are allowed to move to some extent in the arrangement direction with respect to the adjacent substrates.
  • a wire harness or the like may be used as a wiring member for electrically connecting the rigid substrates 31 to 34 while allowing the movement of the rigid substrates 31 to 34.
  • the flexible substrates 35 to 37 are used. Yes. Also, as shown in FIG. 2, reference numerals (35 to 37) are given in order from the flexible substrate closest to the lens unit 10.
  • the holding member 40 is disposed between the adjacent rigid substrates 31 to 34 (three places) as shown in FIGS.
  • the holding member 40 holds the intermediate rigid boards 32 and 33 that are not directly fixed to the housing 20 among the plurality of rigid boards 31 to 34, and also has the heat conductivity to hold the rigid boards 31 to 34 in the housing. 20 has a heat dissipation function of transferring heat.
  • the three holding members 40 are the same structures, the same sign is attached.
  • the holding member 40 closest to the lens unit 10 will be described.
  • the holding member 40 includes a plurality of insulating members 41 and 42 and a heat radiating plate 43.
  • the insulating members 41 and 42 are members that are not electrically conductive and are disposed on both sides in contact with the opposing surfaces of the adjacent rigid substrates 31 and 32. More specifically, the insulating member 41 located on the left side in FIG. 2 is in contact with the rigid substrate 31, and the insulating member 42 located on the right side in FIG. 2 is in contact with the rigid substrate 32.
  • the insulating members 41 and 42 are formed of a silicone-based resin material from the viewpoint of thermal conductivity, heat resistance, flame retardancy, and adhesion.
  • the insulating members 41 and 42 have elasticity in the thickness direction (that is, the optical axis direction) and can be compressed and deformed. Further, as shown in FIG. 3, the insulating members 41 and 42 are set to have outer diameters having opposing surfaces in a wider area than the mounting region Ri so as to cover the mounting region Ri of the rigid substrates 31 and 32 that are in contact with each other. ing. As a result, the insulating members 41 and 42 are configured to absorb heat generated when the electronic components mounted on the rigid boards 31 and 32 to be held are driven.
  • the heat radiating plate 43 is interposed between the insulating members 41 and 42 on both sides, is formed of a metal material having high thermal conductivity, and a part of the outer peripheral edge is in contact with the housing 20.
  • the heat sink 43 is comprised by the flat plate part 43a, the spring part 43b, and the contact part 43c.
  • the flat plate portion 43a has a plate shape in surface contact with the insulating members 41 and 42.
  • the flat plate portion 43a may be configured to be uneven so as to increase the surface area in order to transfer heat more efficiently with the insulating members 41 and 42.
  • the upper and lower peripheral portions of the flat plate portion 43a are respectively formed with spring portions 43b extending in the width direction of the flat plate portion 43a and having a diamond-shaped cross section.
  • the spring portion 43b has a structure having elasticity in the diagonal direction.
  • the holding member 40 becomes a structure which has the elasticity of the direction orthogonal to an optical axis direction as a whole.
  • a plate-like contact portion 43c that extends in the width direction of the flat plate portion 43a and contacts the inner peripheral surface of the housing 20 is formed.
  • the holding member 40 having such a configuration as a whole has elasticity in the arrangement direction (optical axis direction) of the substrate to be held and elasticity in a direction orthogonal to the arrangement direction. Further, the holding member 40 is formed so that a contact portion 43 c located on the outer peripheral edge can come into contact with the housing 20. As described above, in the present embodiment, the three holding members 40 have the same configuration, and the same applies to the other holding members 40.
  • the assembly of the camera 1 will be described with reference to FIGS.
  • the rigid substrate 31 on which the image pickup device 2 is mounted in the circuit board 30 is fixed to the main body member 21 of the housing 20 and assembled so that the subject light is imaged on the image pickup device 2 by the lens unit 10.
  • the rigid board 34 on which the interface IC is mounted in the circuit board 30 is fixed to the back member 22 of the housing 20. Thereby, a data transmission path is formed by a predetermined communication mode set in the camera 1, and communication with various communication protocols and communication standards becomes possible.
  • the holding member 40 is sandwiched between the rigid substrates 31 to 34 connected by the flexible substrates 35 to 37 so that the rigid substrates 31 to 34 and the holding member 40 are alternately arranged. Deploy. At this time, the width in the optical axis direction of the laminated body LC constituted by the rigid substrates 31 to 34 and the holding member 40 is larger than the width in the optical axis direction of the side surface 21 a of the body member 21 in the housing 20. Therefore, the back surface of the stacked body LC protrudes in the optical axis direction from the connecting portion of the main body member 21 and the back member 22.
  • each holding member 40 is interposed between the adjacent rigid substrates 31 to 34 in a compressed state, and holds the rigid substrates 31 to 34 that are in contact with each other by pressing them toward the housing 20 side.
  • each holding member 40 is in a compressed state so as to urge the side surface 21 a of the main body member 21 in the housing 20.
  • the cover member 23 is assembled so as to be close to the side surface 21 a of the main body member 21.
  • the upper contact portion 43c of each holding member 40 comes into contact with the inner peripheral surface of the cover member 23 and is compressed inward.
  • the upper and lower contact portions 43 c corresponding to the outer peripheral edge are maintained in contact with the housing 20.
  • Heat dissipation structure of camera 1 In the camera 1 assembled in this manner, when heat is generated by electronic components mounted on the rigid boards 31 to 34 during driving, first, the insulating members 41 and 42 that are in contact with the rigid boards 31 to 34 Absorbs heat. Furthermore, heat is transferred to the heat sink 43 interposed between the insulating members 41 and 42 on both sides.
  • the heat radiating plate 43 is transferred from the flat plate portion 43a to the contact portion 43c maintained in contact with the housing 20 via the upper and lower spring portions 43b. Thereafter, heat is transferred from each contact portion 43 c of the heat radiating plate 43 to the main body member 21 or the cover member 23 of the housing 20. With such a heat dissipation structure, the camera 1 of the present embodiment dissipates heat generated inside the apparatus.
  • the plurality of rigid substrates 31 to 34 can be held using the plurality of holding members 40. Therefore, since the plurality of rigid boards 31 to 34 do not require a connecting member such as a spacer for connecting each other, the number of parts can be reduced and the assembling property can be improved. Furthermore, since the mounting area Ri can be secured in a wider area, the overall size can be reduced.
  • a part of the contact portion 43c located on the outer peripheral edge of the holding member 40 is in contact with the housing 20 (the main body member 21 and the cover member 23).
  • heat is transferred from the rigid substrates 31 to 34 to the housing 20 through the insulating members 41 and 42 and the heat radiating plate 43, so that the heat dissipation of the camera 1 can be improved.
  • the holding member 40 is interposed between the rigid substrates 31 to 34, even if the electronic component generates heat, the influence on other electronic components can be suppressed and the operation of the camera 1 can be stabilized. .
  • the holding member 40 is constituted by a separate member composed of a plurality of insulating members 41 and 42 and a heat radiating plate 43, whereby elasticity for holding the rigid substrates 31 to 34 and heat conduction for radiating heat. Can be suitably combined. Accordingly, since the insulating members 41 and 42 ensure insulation from the rigid substrates 31 to 34, a material having electrical conductivity and excellent thermal conductivity can be applied to the heat radiating plate 43. Thereby, the manufacturing cost as the whole apparatus can be reduced.
  • the holding member 40 is configured to further have elasticity in a direction orthogonal to the arrangement direction of the rigid substrates 31 to 34 by the spring portion 43b. Thereby, the contact part 43c of the holding member 40 is maintained in contact with the housing 20 in response to vibrations applied during or after assembly. Therefore, the heat transfer function from the rigid substrates 31 to 34 to the housing 20 by the holding member 40 can be suitably exhibited.
  • the holding member 40 is compressed inside the housing 20 by the cover member 23 when assembled, and is brought into contact with the housing 20. Therefore, the holding member 40 having elasticity in a direction orthogonal to the arrangement direction of the rigid substrates 31 to 34 is urged to the inner peripheral surfaces of the main body member 21 and the cover member 23, so that the contact state with the housing 20 can be more reliably performed. Can be maintained.
  • the insulating member 41 of the holding member 40 has a facing surface in a wider area than the mounting area Ri of the rigid substrates 31 to 34. Thereby, it is possible to reliably cover the mounting area Ri where the electronic component as the heating element is mounted, and to absorb the heat generated by the electronic component. And it can thermally radiate favorably by transferring heat to the housing 20 with which the holding member 40 contacts.
  • the housing 20 is composed of a main body member 21 that holds the lens unit 10 and a back member 22.
  • the back member 22 is connected to the main body member 21 in a state where the laminated body LC in which the plurality of rigid substrates 31 to 34 and the holding members 40 are alternately arranged is pressed from the back side during assembly. That is, the back member 22 is connected to the main body member 21 in the compression direction of the holding member 40 in the stacked body LC. Therefore, since the laminated body LC can be compressed by connecting the back member 22 to the main body member 21, the assemblability can be improved.
  • the rigid substrates 31 and 34 located on both ends of the four rigid substrates 31 to 34 are fixed in advance to the main body member 21 or the back member 22 of the housing 20 during the assembly, and in this state, the laminate LC is attached.
  • the back member 22 is connected to the main body member 21 so as to be compressed. Thereby, the assemblability can be further improved and the laminate LC can be suitably compressed.
  • the rigid board 31 since the rigid board 31 is fixed to the main body member 21 in advance, the rigid board 31 that requires installation accuracy with respect to the lens unit 10 can be fixed in advance. Can do.
  • the holding member 140 in the camera of the second embodiment will be described with reference to FIG.
  • the camera of this embodiment is mainly different from the first embodiment in the configuration of the holding member. Since other common configurations are substantially the same as those in the first embodiment, detailed description thereof is omitted. Only the differences will be described below.
  • the holding member 140 in the camera of the present embodiment is configured by insulating members 41 and 42 disposed on both sides in the optical axis direction, a plurality of heat radiation plates 143 and 144, and a heat insulating member 145.
  • the holding member 140 is a member having no conductivity, and the insulating members 41 and 42 are disposed on both sides in contact with the opposing surfaces of the adjacent rigid substrates 31 and 32.
  • the plurality of heat sinks 143 and 144 are disposed between the insulating members 41 and 42 on both sides and are spaced apart from each other.
  • the heat sink 143 disposed on the left side of FIG. 5 is in contact with the insulating member 41, and the heat sink 144 disposed on the right side of FIG. 5 is in contact with the insulating member 42.
  • the heat sinks 143 and 144 are configured by a flat plate portion 43a, a spring portion 43b, and a contact portion 43c. However, since the configuration of each part is substantially the same as that of the first embodiment, detailed description thereof is omitted.
  • the heat insulating member 145 is a member with low thermal conductivity having elasticity in the optical axis direction, interposed between the two heat radiating plates 143 and 144.
  • the heat insulating member 145 is formed of a foamed resin material from the viewpoint of elasticity and thermal conductivity. As a result, the heat insulating member 145 allows a temperature difference to be generated between the heat radiating plate 143 and the heat radiating plate 144 transferred from the rigid substrate, and suppresses heat transfer between the heat radiating plates 143 and 144. Yes.
  • the holding member 140 having such a configuration as a whole has elasticity in the arrangement direction of the substrate to be held and elasticity in a direction perpendicular to the arrangement direction.
  • the heat insulating member 145 has a configuration in which the holding member 140 has elasticity in the arrangement direction, a material is selected for the insulating members 41 and 42 in the present embodiment with priority given to thermal conductivity and insulating properties over elasticity. be able to.
  • heat transfer between the heat sinks 143 and 144 is suppressed by the heat insulating member 145, heat transfer between the rigid substrates to be held can be suppressed. This can reduce the influence of the substrate that generates a lot of heat on other substrates, so that the operation of the camera can be stabilized.
  • the holding members 40 and 140 are configured by the insulating member 41 and the heat sinks 43, 143, 144, and the like.
  • the holding member only needs to have elasticity in the arrangement direction of the substrate to be held, and at least a part of the outer peripheral edge is in contact with the housing and transfers heat from the substrate to be held to the housing. That is, the holding member may be integrally formed of, for example, a single material.
  • the holding members 40 and 140 have elasticity in a direction orthogonal to the arrangement direction of the substrate by a spring portion 43b having a spring structure with a diamond-shaped cross section.
  • the spring structure may have elasticity in the direction due to the elasticity of the material forming the holding members 40 and 140 itself.
  • the structure has elasticity in the direction.
  • the contact portion 43 c is a substrate with respect to the housing 20. It is good also as a structure which forms the rail engaged with the contact part 43c in the inner peripheral surface of the housing 20 so that sliding in the arrangement direction of this is possible.
  • the insulating members 41 and 42 of the holding members 40 and 140 cover the mounting area Ri of the rigid board that comes into contact.
  • the holding member since the holding member only needs to have an area capable of holding the substrate that contacts in a compressed state, for example, the holding member is configured to have an outer diameter that is an opposing surface that covers only part of the substrate. Also good. However, in order to absorb heat from an electronic component or a substrate, a configuration that is set to an outer diameter that covers the mounting region Ri as illustrated in the embodiment is preferable.
  • SYMBOLS 1 Camera (imaging device) 2: Imaging element 10: Lens part 20: Housing 21: Main body member, 21a: Side surface, 22: Back surface member 23: Cover member, 23a: Inner peripheral surface 30: Circuit board 31-34: Rigid board, 35-37: Flexible board (wiring member) 40, 140: holding member 41, 42: insulating member, 43, 143, 144: heat sink 43a: flat plate portion, 43b: spring portion, 43c: contact portion 145: heat insulating member Ri: mounting region, LC: laminate

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Studio Devices (AREA)
  • Cameras Adapted For Combination With Other Photographic Or Optical Apparatuses (AREA)
PCT/JP2012/059228 2012-04-04 2012-04-04 Dispositif de capture d'image Ceased WO2013150621A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014508960A JP6000337B2 (ja) 2012-04-04 2012-04-04 撮像装置
PCT/JP2012/059228 WO2013150621A1 (fr) 2012-04-04 2012-04-04 Dispositif de capture d'image

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2012/059228 WO2013150621A1 (fr) 2012-04-04 2012-04-04 Dispositif de capture d'image

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WO2013150621A1 true WO2013150621A1 (fr) 2013-10-10

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WO (1) WO2013150621A1 (fr)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018137401A (ja) * 2017-02-23 2018-08-30 リズム時計工業株式会社 情報処理装置、カメラ及びカメラ装置
JP2019164353A (ja) * 2014-06-26 2019-09-26 京セラ株式会社 撮像装置および車両
JP2020155985A (ja) * 2019-03-20 2020-09-24 京セラ株式会社 電子機器、撮像装置、および移動体
WO2020189524A1 (fr) * 2019-03-20 2020-09-24 京セラ株式会社 Équipement électronique, dispositif d'imagerie, et corps mobile
CN112543264A (zh) * 2019-09-20 2021-03-23 日本电产科宝株式会社 摄像装置
JP2022116055A (ja) * 2019-03-20 2022-08-09 京セラ株式会社 電子機器、撮像装置、および移動体
JP2023183218A (ja) * 2022-06-15 2023-12-27 パナソニックＩｐマネジメント株式会社 検知装置及び検知システム
WO2024030151A1 (fr) * 2022-08-01 2024-02-08 Google Llc Sonnette à enregistrement vidéo

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